阅读说明：本技术 一种贴片型固态铝电解电容器及其制备方法 (Patch type solid-state aluminum electrolytic capacitor and preparation method thereof ) 是由 张彩欣 于 2021-07-07 设计创作，主要内容包括：本发明公开了一种贴片型固态铝电解电容器及其制备方法,包括电容器内部具有单层或多层芯子的叠层结构；每层电容器芯子具有铝箔且用阻隔材料划分形成阳极和阴极；所述绝缘板内外表面的两端均覆盖有金属层；阳极的铝箔包含铝芯或覆盖有氧化铝膜的铝芯,阳极之间采用导电材料粘接、铆接或焊接,最底层的电容器芯子的阳极与覆盖在绝缘板一端表面的金属层连接；阴极依次设置覆盖有氧化铝膜的铝芯、导电聚合物层、非金属导电层及金属导电层,金属导电层之间通过导电材料连接,最底层的电容器芯子的金属导电层与覆盖在绝缘板另一端表面的金属层连接,电容器内部的所有结构均绝缘保护外壳和绝缘板所覆盖。(The invention discloses a patch type solid aluminum electrolytic capacitor and a preparation method thereof, comprising a laminated structure with a single-layer or multi-layer core in the capacitor; each layer of capacitor core is provided with aluminum foil and is divided by barrier materials to form an anode and a cathode; both ends of the inner surface and the outer surface of the insulating plate are covered with metal layers; the aluminum foil of the anode comprises an aluminum core or an aluminum core covered with an aluminum oxide film, the anodes are bonded, riveted or welded by adopting a conductive material, and the anode of the capacitor core at the bottommost layer is connected with a metal layer covered on one end surface of the insulating plate; the cathode is sequentially provided with an aluminum core covered with an aluminum oxide film, a conductive polymer layer, a nonmetal conductive layer and a metal conductive layer, the metal conductive layers are connected through a conductive material, the metal conductive layer of the capacitor core at the bottommost layer is connected with the metal layer covered on the surface of the other end of the insulating plate, and all structures inside the capacitor are covered by an insulating protective shell and the insulating plate.)

1. A patch type solid aluminum electrolytic capacitor is characterized in that the capacitor is internally provided with a laminated structure of a single-layer or multi-layer core;

each layer of capacitor core is provided with aluminum foil and is divided by a barrier material to form an anode and a cathode;

both ends of the inner surface and the outer surface of the insulating plate are covered with metal layers;

the aluminum foil of the anode comprises an aluminum core or an aluminum core covered with an aluminum oxide film; the anodes are bonded, riveted or welded by adopting a conductive material, and the anode of the capacitor core at the bottommost layer is connected with the metal layer covering the surface of one end of the insulating plate;

the cathode is sequentially provided with an aluminum core covered with an aluminum oxide film, a conductive polymer layer, a non-metal conductive layer and a metal conductive layer; the metal conducting layers of the cathodes are connected through conducting materials, and the metal conducting layer of the cathode of the capacitor core at the bottommost layer is connected with the metal layer arranged on the surface of the other end of the insulating plate;

all structures inside the capacitor are covered by an insulating protective housing and an insulating plate.

2. A chip type solid aluminum electrolytic capacitor according to claim 1, wherein the conductive material is at least one selected from the group consisting of copper, silver-coated copper, gold, tin, aluminum, nickel, zinc, platinum, graphite, graphene, silver-coated copper, carbon and niobium monoxide, preferably at least silver.

3. A patch type solid aluminum electrolytic capacitor according to claim 1 wherein the conductive polymer is at least one selected from polypyrrole and its derivatives, polythiophene and its derivatives, polyaniline and its derivatives;

the non-metal conducting layer is selected from at least one of graphite, graphene, carbon and niobium monoxide, and preferably at least contains graphite;

the metal conductive layer is selected from at least one of copper, silver-coated copper, gold, tin, aluminum, nickel, zinc and platinum, and preferably at least contains silver.

4. A chip type solid aluminum electrolytic capacitor according to claim 1, wherein the metal layer is at least one selected from the group consisting of copper, silver-clad copper, gold, tin, aluminum, nickel, zinc, and platinum;

preferably, the metal layer comprises at least two different metal layers, preferably a copper layer and a tin layer on the surface of the copper layer in sequence; more preferably a copper layer, a nickel layer on the surface of the copper layer and a tin layer on the surface of the nickel layer in this order.

5. A preparation method of a patch type solid aluminum electrolytic capacitor is characterized by comprising the following steps:

step S1: dividing the aluminum foil into an anode and a cathode by using a barrier material, and sequentially preparing a conductive polymer layer, a non-metallic conductive layer and a metal conductive layer on the surface of the cathode aluminum foil to form a single-layer capacitor core with an anode and cathode structure;

step S2: the inner surface and the outer surface of the two ends of the insulating plate are covered with metal layers, and the metal layers on the inner surface and the outer surface of the same end are electrically connected;

step S3: the anode of the capacitor core corresponds to the anode, and the cathode of the capacitor core corresponds to the cathode and the cathode lead-out terminal for lamination; the anodes of the capacitor cores on the bottommost layer are bonded, riveted or welded by adopting a conductive material, and the anode of the capacitor core on the bottommost layer is connected with the metal layer covering the surface of one end of the insulating plate; the cathode metal conducting layers of each layer of capacitor core are connected by a conducting material, and the metal conducting layer of the capacitor core at the bottommost layer is connected with the metal layer covering the other end of the surface of the insulating plate;

step S4: all structures in the capacitor are covered by the insulating plate and the insulating protective shell, and the patch type solid aluminum electrolytic capacitor is prepared.

6. The method for manufacturing a patch type solid aluminum electrolytic capacitor as claimed in claim 5, wherein the length of the anode in step S1 is 5% to 100% of the external length of the product, the length of the cathode is 40% to 98% of the external length of the product, and preferably the length of the cathode is 70% to 95% of the external length of the product.

7. The method for manufacturing a patch type solid aluminum electrolytic capacitor according to claim 5, wherein the metal layer in step S2 is manufactured by at least one of chemical plating, electroplating, physical sputtering, physical deposition, chemical deposition, spraying, coating, spraying, and printing;

the total thickness of the metal layers is 0.3-60 mu m.

8. The method for preparing a patch type solid aluminum electrolytic capacitor as claimed in claim 5, wherein the length of the surface metal layer of the insulation board in the step S2 is 5% to 45% of the external length of the product, preferably 10% to 25%; the width of the metal layer on the surface of the insulating plate is 5% -100% of the external width of the product, and preferably 50% -90%;

the insulating plate is selected from at least one of epoxy resin, polyurethane resin, phenolic resin, alkyd resin, polyester resin, amino resin, acrylic resin, organic silicon resin, hydrocarbon resin, chlorinated rubber, fluorine-based polymer, vinyl resin, polyimide resin, ceramic or inorganic/high polymer composite material.

9. The method for manufacturing a patch type solid aluminum electrolytic capacitor as claimed in claim 5, wherein in step S3, the length of the anode is 5% to 60% of the external length of the product, the length of the cathode region is 40% to 98% of the external length of the product, preferably the length of the cathode is 70% to 95% of the external length of the product;

the overlapping length of the conductive material and the cathode layer in the step S3 is 3% -98% of the external length of the product; the overlapping width of the conductive material and the cathode layer is 5% -95% of the external width of the product; the thickness of the conductive material is 0.001 mm-0.3 mm, preferably 0.01 mm-0.03 mm.

10. The method for manufacturing a patch type solid aluminum electrolytic capacitor according to claim 5, wherein the insulating protective case of step S4 is at least one selected from epoxy resin, polyurethane resin, phenolic resin, alkyd resin, polyester resin, amino resin, acrylic resin, silicone resin, hydrocarbon resin, chlorinated rubber, fluorine-based polymer, vinyl resin, polyimide resin, ceramic, and inorganic/polymeric composite material.

Technical Field

The invention belongs to the technical field of aluminum electrolytic capacitors, and particularly relates to a patch type solid aluminum electrolytic capacitor and a preparation method thereof.

Background

The capacitor is an element capable of storing electric charges, and the capacitor, the resistor and the inductor are three basic elements in a circuit, are essential basic elements in an electronic circuit, and account for about 45% of the using amount of all electronic components. The aluminum electrolytic capacitor occupies more than 30% of the market share of the capacitor due to the excellent performance and low price. In short term, the aluminum electrolytic capacitor does not have the possibility of being completely replaced, and will continue to play an important role in the fields of automobile electronics, communication, internet of things, artificial intelligence, security monitoring, consumer electronics, new energy, national defense war industry and the like in the future.

In recent years, with the rapid development of smart phones, new communication technologies, and new energy vehicles, active chips have been rapidly developed, and aluminum electrolytic capacitors as passive elements have been developed in the directions of thinning, miniaturization, large capacity, low Equivalent Series Resistance (ESR), low leakage current, and high reliability. The conventional liquid aluminum electrolytic capacitor cannot satisfy the requirements of thinning and miniaturization in particular, and therefore, the laminated polymer aluminum electrolytic capacitor has been rapidly developed in recent years as a solution for thinning and miniaturization.

The conventional chip-type solid aluminum electrolytic capacitor uses lead frame materials as lead-out terminals of an anode and a cathode, and although the Equivalent Series Resistance (ESR) is reduced, the requirement of thinning cannot be further solved.

Therefore, how to design a novel structure of the chip-type solid aluminum electrolytic capacitor, how to further perform a thin design, how to reduce the usage of lead frame materials and improve the product performance has become an urgent technical problem to be solved.

Disclosure of Invention

The invention aims to provide a patch type solid-state aluminum electrolytic capacitor and a preparation method thereof, so as to solve the problems in the background technology.

In order to realize the purpose, the technical scheme is as follows:

a chip-type solid aluminum electrolytic capacitor comprising: the capacitor inner core 1 has a laminated structure of single-layer or multi-layer cores, each layer of capacitor core 1 is provided with aluminum foil and is divided by a barrier material 12 to form an anode 11 and a cathode 13; both ends of the inner surface and the outer surface of the insulating plate 4 are covered with metal layers; the aluminum foil 11 of the anode comprises an aluminum core or an aluminum core covered with an aluminum oxide film, the anodes 11 of the capacitor cores are bonded, riveted or welded by adopting a conductive material, and the anode 11 of the capacitor core at the bottommost layer is connected with the metal layer 5 covered on the surface of one end of the insulating plate 4; the cathode 13 is sequentially provided with an aluminum core 131 covered with an aluminum oxide film, a conductive polymer layer 132, a non-metal conductive layer 133 and a metal conductive layer 134, the cathode metal conductive layer 134 of the capacitor core is connected with the metal conductive layer 134 through a conductive material 2, and the cathode metal conductive layer 134 of the capacitor core at the bottommost layer is connected with a metal layer 5 covered on the surface of the other end of the insulating plate 4; all structures inside the capacitor are covered by an insulating protective envelope 6 and an insulating plate 4.

The conductive material is at least one selected from copper, silver-coated copper, gold, tin, aluminum, nickel, zinc, platinum, graphite, graphene, carbon and niobium monoxide, preferably at least contains silver, and is more preferably prepared by solidifying a silver paste.

The conductive polymer layer is selected from at least one of polypyrrole and derivatives thereof, polythiophene and derivatives thereof, polyaniline and derivatives thereof, preferably at least one of polypyrrole, poly (3, 4-ethylenedioxythiophene) and polyaniline, and the thickness of the conductive polymer layer is preferably 0.01 mm-0.2 mm. The non-metal conducting layer is selected from at least one of graphite, graphene, carbon and niobium monoxide, and preferably at least contains graphite; preferably, the thickness is 0.01 mm-0.1 mm. The metal conducting layer is selected from at least one of copper, silver-coated copper, gold, tin, aluminum, nickel, zinc and platinum, and preferably at least contains silver; preferably, the thickness is 0.01 mm-0.2 mm. The metal layer is selected from at least one of copper, silver-coated copper, gold, tin, aluminum, nickel, zinc and platinum; preferably, the metal layer comprises at least two different metal layers, preferably a copper layer and a tin layer on the surface of the copper layer in sequence; more preferably a copper layer, a nickel layer on the surface of the copper layer and a tin layer on the surface of the nickel layer in this order.

A manufacturing method of a patch type solid aluminum electrolytic capacitor comprises the following steps:

step S1: dividing the aluminum foil into an anode and a cathode by using a barrier material, and sequentially preparing a conductive polymer layer, a non-metallic conductive layer and a metal conductive layer on the surface of the cathode aluminum foil to form a single-layer capacitor core with an anode and cathode structure;

step S2: the inner surface and the outer surface of the two ends of the insulating plate are covered with metal layers, and the metal layers on the inner surface and the outer surface of the same end are electrically connected;

step S3: the anode of the capacitor core corresponds to the anode, and the cathode of the capacitor core corresponds to the cathode and the cathode lead-out terminal for lamination; the anodes of the capacitor cores on the bottommost layer are bonded, riveted or welded by adopting a conductive material, and the anode of the capacitor core on the bottommost layer is connected with the metal layer covering the surface of one end of the insulating plate; the cathode metal conducting layers of each layer of capacitor core are connected by a conducting material, and the metal conducting layer of the capacitor core at the bottommost layer is connected with the metal layer covering the other end of the surface of the insulating plate;

step S4: all structures in the capacitor are surrounded by the insulating plate and the insulating protective shell, and the chip type solid aluminum electrolytic capacitor is prepared.

Step S1 is further configured to: the length of the anode is 5% -100% of the external length of the product, the length of the cathode is 40% -98% of the external length of the product, and preferably the length of the cathode is 70% -95% of the external length of the product.

The conductive polymer layer is selected from at least one of polypyrrole and derivatives thereof, polythiophene and derivatives thereof, polyaniline and derivatives thereof, preferably at least one of polypyrrole, poly (3, 4-ethylenedioxythiophene) and polyaniline, and preferably has a thickness of 0.01-0.2 mm.

The non-metal conducting layer is selected from at least one of graphite, graphene, carbon and niobium monoxide, and preferably at least comprises graphite; optionally, the material is prepared by solidifying graphite slurry and graphene/graphene composite slurry. Preferably, the thickness of the cured non-metal conducting layer is 0.01 mm-0.1 mm.

The metal conductive layer is selected from at least one of copper, silver-coated copper, gold, tin, aluminum, nickel, zinc and platinum, and preferably at least comprises silver; and optionally adopting silver paste and silver-clad copper paste for curing. Preferably, the thickness of the material is 0.01 mm-0.2 mm.

Step S2 of the present invention is further configured as follows: the metal layer is at least one selected from copper, silver-coated copper, gold, tin, aluminum, nickel, zinc and platinum; preferably, the metal layer comprises at least two different metal layers, preferably a copper layer and a tin layer on the surface of the copper layer in sequence; more preferably a copper layer, a nickel layer on the surface of the copper layer and a tin layer on the surface of the nickel layer in this order. More specifically, physical sputtering or physical deposition is adopted to prepare a copper layer on the anode notch and the notch of the cathode lead-out terminal and the nearby position, and then a nickel layer and a tin layer are prepared on the surface of the copper layer through electroplating or chemical plating to be used as electrode terminals capable of being pasted and welded on the upper plate. In order to maintain good conductivity and solderability, the metal layer preferably has a thickness of 0.3 μm to 60 μm, optionally 0.3 μm, 1.0 μm, 3.0 μm, 5.0 μm, 8.0 μm, 10.0 μm, 15.0 μm, 20.0 μm, 25.0 μm, 30.0 μm, 35.0 μm, 40.0 μm, 45.0 μm, 50.0 μm, 55.0 μm, 60.0 μm, preferably 3.0 μm to 20 μm. Preferably, the length of the surface metal layer of the insulating board is 5% -45% of the external form length of the product, optionally 5%, 8%, 10%, 12%, 16%, 20%, 25%, 30%, 35%, 40%, 45% of the external form length of the product, and preferably 10% -25% of the external form length of the product; the width of the surface metal layer of the insulating board is 5% -100% of the external form width of the product, optionally 5%, 15%, 25%, 35%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 100% of the external form width of the product, and preferably 50% -90% of the external form width of the product. The insulating plate is selected from at least one of epoxy resin, polyurethane resin, phenolic resin, alkyd resin, polyester resin, amino resin, acrylic resin, organic silicon resin, hydrocarbon resin, chlorinated rubber, fluorine-based polymer, vinyl resin, polyimide resin, ceramic or inorganic/high polymer composite material.

Step S3 of the present invention is further configured as follows: the length of the anode after lamination is 5% -60% of the requirement of the external length dimension of the product, the length of the cathode area is 40% -98% of the requirement of the external length dimension of the product, and the length of the cathode is 70% -95% of the external length of the product. Preferably, the length of the overlapping of the conductive material and the cathode layer is 3% -98% of the external length of the product; the overlapping width of the conductive material and the cathode layer is 5% -95% of the external width of the product; the thickness of the conductive material is 0.001 mm-0.3 mm, preferably 0.01 mm-0.03 mm. Preferably, the conductive material is at least one selected from copper, silver-coated copper, gold, tin, aluminum, nickel, zinc, platinum, graphite, graphene, carbon, and niobium monoxide, preferably silver, and more preferably a silver paste, and is cured. Preferably, the lamination post-curing comprises airing, drying or combination of the airing and the drying, wherein the drying temperature is 40-300 ℃, and the drying time is 0.01-2 h. Preferably, the anode is bonded, riveted or welded by using a conductive material.

Step S4 of the present invention is further configured as follows: the insulating protective shell is selected from at least one of epoxy resin, polyurethane resin, phenolic resin, alkyd resin, polyester resin, amino resin, acrylic resin, organic silicon resin, hydrocarbon resin, chlorinated rubber, fluorine-based polymer, vinyl resin, polyimide resin, ceramic or inorganic/high-molecular composite material.

According to the invention, the novel structure is adopted to remove the traditional lead frame material, so that the use of the traditional lead frame material is greatly reduced, the waste of resources is reduced, the integral thickness of the product is reduced, the effective area of the cathode of the internal capacitor is increased, and the product capacity is increased. In addition, the invention can prepare products with traditional large size and products with extremely micro size which can not be related by the traditional method, and has the advantages of simple production process, greatly reduced production cost, low leakage current, low equivalent series resistance, better high temperature and high humidity resistance, better ripple current resistance and the like.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is an overall schematic view of a capacitor core of each layer of the embodiment.

FIG. 2 is a schematic diagram showing the division of the cathode and anode of each layer of capacitor core in the embodiment.

FIG. 3 is a schematic view showing the composition of the cathode of each layer of the capacitor element according to the embodiment.

Fig. 4 is a schematic view of an overall structure of a product according to the first embodiment, the fourth embodiment, and the fifth embodiment to the forty-first embodiment.

Fig. 5 is a schematic view of the overall structure of the second product of this embodiment.

Fig. 6 is a schematic view of the overall structure of the three products of the present embodiment.

FIG. 7 is an overall schematic view of a capacitor core of each layer of a comparative example.

FIG. 8 is a schematic diagram showing the division of the cathode and anode of each capacitor element of comparative example.

FIG. 9 is a schematic view showing the composition of the cathode of each capacitor element of comparative example.

FIG. 10 is a schematic diagram of the overall structure of the first comparative example, and the fifth to the forty-one comparative examples.

Fig. 11 is a schematic view of the overall structure of the comparative example product.

Fig. 12 is a schematic view of the overall structure of a comparative example triplet.

Description of the reference numerals

1 single layer capacitor core.

2 conductive material.

3 anode connection.

4 insulating plates.

5 a metal layer.

6 insulating protective shell.

11 an anode.

12 barrier material.

13 cathode.

131 are covered with an aluminium core of aluminium oxide film.

132 a conductive polymer layer.

133 a non-metallic conductive layer.

134 metal conductive layer.

A 100 single layer capacitor core.

200 anodic bonding.

300 of electrically conductive material.

400 cathode lead-out terminal.

500 insulating protective housing.

600 anode lead-out terminal.

110 anode.

120 barrier material.

130 cathode.

1310 an aluminum core covered with an aluminum oxide film.

1320 a conductive polymer layer.

1330 a non-metallic conductive layer.

1340 a metal conducting layer.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and embodiments, it being understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the present invention described above may be combined with each other as long as they do not conflict with each other.

Example one

Step S1: an anode 11 and a cathode 13 are formed by dividing an aluminum foil into a barrier material 12, a poly 3, 4-ethylenedioxythiophene layer is prepared on the surface of the aluminum foil 131 of the cathode 13 to serve as a conductive polymer layer 132, a graphite layer is prepared on the surface of the conductive polymer layer 132 to serve as a non-metal conductive layer 133 by adopting graphite slurry, and a silver layer is prepared on the surface of the non-metal conductive layer 133 to serve as a metal conductive layer 134 by adopting silver slurry, so that the single-layer capacitor core 1 is prepared. Wherein, the external length of the capacitor is 7.3mm, the external width of the capacitor is 4.3mm, the length of the anode is 5.1mm (70% of the external length of the product), and the length of the cathode is 6.57mm (90% of the external length of the product); the aluminum foil is an aluminum core with the surface comprising an aluminum oxide film, the average thickness of the poly 3, 4-ethylenedioxythiophene layer is 0.05mm, the average thickness of the non-metal conductive layer 133 is 0.02mm, and the average thickness of the metal conductive layer 134 is 0.08 mm.

Step S2: copper layers with an average thickness of 0.5 μm are first prepared on both ends of the inner and outer surfaces of the insulating plate 4 by a sputtering method, and then a tin layer with an average thickness of 4.5 μm is coated on the surfaces of the copper layers by an electroplating method to prepare the metal layer 5. The metal layers on the inner surface and the outer surface of the same end of the insulating plate 4 are electrically connected, the average thickness of the copper layer is 0.5 μm, the average thickness of the tin layer is 5 μm, the insulating plate 4 is made of epoxy resin, the length of the metal layer 5 on the inner surface and the outer surface of the insulating plate is 1.46mm (20% of the external length of the product), and the width of the metal layer 5 on the inner surface and the outer surface of the insulating plate is 4.09mm (95% of the external width of the product).

Step S3: correspondingly laminating the anode 11 and the anode 11 of the 2-layer capacitor core prepared in the step S1, and the cathode 13, wherein the anodes of the two-layer capacitor core 1 are connected with the metal layer 5 covering the surface of one end of the insulating plate 4 through welding; the cathode metal conductive layers 134 of the two-layer capacitor core 1 are connected by the conductive material 2, the cathode metal conductive layer 134 of the capacitor core 1 at the bottommost layer is connected with the metal layer 5 covering the other end surface of the insulating plate 4 by the conductive material 2, and then dried at 100 ℃ for 1h and cured. The conductive material 2 is prepared by solidifying silver paste, the overlapping length of the conductive material 2 and the cathode layer 13 is 3.65mm (namely 50% of the external length of the product), the overlapping width of the conductive material 2 and the cathode layer is 3.8 mm (namely 88.4% of the external width of the product), and the thickness of the conductive material is 0.05 mm.

Step S4: and covering the capacitor core to form an insulating protective shell 6 to obtain the patch type solid aluminum electrolytic capacitor. All structures inside the capacitor are covered by an insulating protective shell 6 and an insulating plate 4, and the insulating protective shell 6 is made of epoxy resin.

Through the above steps, the external dimension of the novel patch type solid-state aluminum electrolytic capacitor shown in fig. 4 is 7.3mm in length, 4.3mm in width and 1.9mm in height.

Example two

A chip type solid aluminum electrolytic capacitor and a preparation method thereof are disclosed, as shown in figure 5, the number of laminated layers is one, an anode 11 is connected with a metal layer 5 at an anode end on the inner surface of an insulating plate 4 through riveting, a conductive material 2 is gold paste, a non-metal conductive layer 133 is a graphene/graphite composite layer, the insulating plate 4 is polyurethane, an insulating protective shell 6 is polyurethane, and the lengths of the metal layer 5 on the inner surface and the outer surface of the insulating plate are both 1.46mm (20% of the external length dimension requirement of the product) to form an electrode terminal which can be subjected to chip welding on the upper plate below, and the rest is the same as the first embodiment.

EXAMPLE III

A chip type solid aluminum electrolytic capacitor and a preparation method thereof are disclosed, as shown in figure 6, the number of laminated layers is three, anodes 11 are aluminum cores, the anodes 11 are connected with a metal layer 5 on an insulating plate 4 through conductive materials 2, the conductive materials 2 are copper paste, a non-metal conductive layer 133 is a carbon fiber layer, the insulating plate 4 is epoxy resin, an insulating protective shell 6 is polyimide resin, the metal layer 5 is a three-layer structure, a copper layer with the thickness of 0.5 mu m is firstly covered by adopting a sputtering method, a nickel layer with the thickness of 1 mu m is then covered by adopting an electroplating method, and a tin layer with the thickness of 5 mu m is finally covered by adopting the electroplating method, and the rest is the same as the first embodiment.

Example four

Step S1: the aluminum foil is divided into an anode 11 and a cathode 13 by using a barrier material 12, a polypyrrole layer is prepared on the surface of the aluminum foil 131 of the cathode 13 to serve as a conductive polymer layer 132, a graphite layer is prepared on the surface of the conductive polymer layer 132 by using graphite slurry to serve as a nonmetal conducting layer 133, a silver-clad copper layer is prepared on the surface of the nonmetal conducting layer 133 by using silver-clad copper slurry to serve as a metal conducting layer 134, and the single-layer capacitor core 1 is prepared. Wherein the length of the anode is 0.1mm (5% of the external length of the product), the length of the cathode is 0.08mm (40% of the external length of the product), the average thickness of the polypyrrole layer 132 is 0.01mm, the average thickness of the non-metal conductive layer 133 is 0.01mm, and the average thickness of the metal conductive layer 134 is 0.01 mm.

Step S2: the insulating plate 4 is made of phenolic resin, copper layers with the average thickness of 0.1 mu m are prepared on the two ends of the inner surface and the outer surface of the insulating plate 4 by vapor deposition, and then tin layers with the thickness of 0.2 mu m are covered on the surfaces of the copper layers by an electroplating method to prepare metal layers 5, wherein the metal layers on the inner surface and the outer surface of the same end of the insulating plate 4 are electrically connected.

The average thickness of the copper layer is 0.1 μm, and the average thickness of the gold layer is 0.2 μm; the length of the metal layer 5 on the inner surface and the outer surface of the insulating plate is 0.1mm (5% of the external length of the product), and the width is 0.0625mm (5% of the external width of the product).

Step S3: correspondingly laminating the anode 11 and the anode 11 of the 2-layer capacitor core prepared in the step S1, and the cathode 13, wherein the metal conducting layers 134 of the two-layer capacitor core 1 are connected by using a conducting material 2, the metal conducting layer 134 of the capacitor core 1 at the bottommost layer is connected with the metal layer 5 covering the insulating plate 4 by using the conducting material 2, the conducting material 2 is prepared by solidifying gold paste, the overlapping length of the conducting material 2 and the cathode layer 13 is 0.06mm (namely 3% of the external shape length of the product), the overlapping width of the conducting material 2 and the cathode layer is 0.063 mm (namely 5% of the external shape width of the product), and the average thickness of the conducting material 2 is 0.001 mm; the anodes are connected with the metal layer 5 which covers the anode end on the inner surface of the insulating plate 4 through welding, and after lamination, drying is carried out for 2h and solidification at 40 ℃.

Step S4: all structures inside the capacitor, except for the metal layer 5 covering the lower side of the insulating plate 4, are covered by an insulating protective shell 6, the insulating protective shell 6 being selected from epoxy resins.

Through the above steps, a novel patch type solid aluminum electrolytic capacitor shown in fig. 4 is obtained, wherein the external dimension of the capacitor is 2mm in length, 1.25mm in width and 0.8mm in height. .

EXAMPLE five

Step S1: the aluminum foil is divided into an anode 11 and a cathode 13 by using a barrier material 12, a polyaniline layer is prepared on the surface of the aluminum foil 131 of the cathode 13 to serve as a conductive polymer layer 132, a graphite layer is prepared on the surface of the conductive polymer layer 132 by using graphite slurry to serve as a non-metal conductive layer 133, a silver layer is prepared on the surface of the non-metal conductive layer 133 by using silver slurry to serve as a metal conductive layer 134, and the single-layer capacitor core 1 is prepared. Wherein, the length of the anode is 7.3mm (100% of the external length of the product), the length of the cathode is 6.935mm (95% of the external length of the product), the average thickness of the polyaniline layer is 0.2mm, the average thickness of the non-metal conductive layer 133 is 0.1mm, and the average thickness of the metal conductive layer 134 is 0.2 mm.

Step S2: copper layers with an average thickness of 5 μm are first prepared on both ends of the inner and outer surfaces of the insulating plate 4 by a sputtering method, and then a tin layer with a thickness of 55 μm is coated on the surfaces of the copper layers by a coating method to prepare the metal layer 5. The metal layers on the inner surface and the outer surface of the same end of the insulating plate 4 are electrically connected, and the length of the metal layer 5 on the inner surface and the outer surface of the insulating plate is 3.285mm (namely 45% of the external form length of the product and 6.1mm in width (namely 100% of the external form width of the product).

Step S3: correspondingly laminating an anode 11 and an anode 11 of the 2-layer capacitor core, and correspondingly laminating a cathode 13 and a cathode 13; the anodes are connected with a metal layer 5 which covers the surface of one end of the insulating plate 4 through welding; the cathode metal conducting layers 134 of the two layers of capacitor cores 1 are connected by using a conducting material 2, and the cathode metal conducting layer 134 of the capacitor core 1 at the bottommost layer is connected with a metal layer 5 covering the surface of the other end of the insulating plate 4 by using the conducting material 2; and drying at 40 ℃ for 2h after lamination and curing to form the single-layer or multi-layer structure capacitor meeting the electrical property requirement of the product. The conductive material 2 is prepared by solidifying silver paste, the overlapping length of the conductive material 2 and the cathode layer 13 is 6.935mm (namely 95% of the external length of the product), the overlapping width of the conductive material 2 and the cathode layer is 5.795 mm (namely 95% of the external width of the product), and the thickness of the conductive material 2 is 0.3 mm.

Step S4: and covering the capacitor core to form an insulating protective shell to obtain the patch type solid aluminum electrolytic capacitor. Wherein all structures inside the capacitor are covered by an insulating protective shell 6 and an insulating plate 4, the protective shell 6 being epoxy resin.

Through the above steps, the external dimensions of the novel patch-type solid-state aluminum electrolytic capacitor shown in fig. 4 are 7.3mm in length, 6.1mm in width and 3.5mm in height.

Examples sixty to fifteen

A chip type solid aluminum electrolytic capacitor and a method for manufacturing the same, the length of the conductive material overlapping the cathode layer is adjusted to be 5%, 10%, 15%, 25%, 35%, 45%, 55%, 65%, 75%, 85% of the external length of the product, and the other embodiments are the same.

Examples sixteen to twenty-four

A patch type solid aluminum electrolytic capacitor and a method for manufacturing the same, the same as the first embodiment except that the overlapping width of the conductive material and the cathode layer is adjusted to 10%, 15%, 25%, 35%, 45%, 55%, 65%, 75% and 85% of the external width of the product.

Example twenty-five to twenty-nine

A patch type solid aluminum electrolytic capacitor and a method for manufacturing the same, the same as the first embodiment except that the thickness of the conductive material is adjusted to 0.005 mm, 0.08mm, 0.1mm, 0.2mm, 0.3 mm.

Examples of thirty to thirty-four

A chip type solid aluminum electrolytic capacitor and a method for manufacturing the same are provided, except that the average thickness of the copper layer in the metal layer of step S5 is 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, respectively, as in the first embodiment.

Examples of thirty-five to forty-one

A patch type solid aluminum electrolytic capacitor and a method for manufacturing the same are provided, except that the average thickness of the nickel layer in the metal layer of step S5 is 2 μm, 10 μm, 15 μm, 20 μm, 30 μm, 40 μm, 50 μm, respectively, the same as the first embodiment.

The capacitor test method comprises the following steps: the capacity, ESR, ripple current resistance, 105 ℃ high-temperature storage resistance and 60 ℃/90RH steady-state humidity and heat resistance of the capacitor are tested according to national standards GB/T6346.25-2018 and GB/T6346.2501-2018. The capacitance is tested by a digital bridge LCR at the frequency of 120Hz, and the ESR is tested at the frequency of 1 kHz; and testing the leakage current by using a leakage current tester.

Comparative examples 1 to forty one

Step S1: a single layer capacitor core was fabricated in the same manner as in example step S1; no embodiment step S2;

step S3: the same as step S3 of the embodiment except that a conventional lead frame material is used as the cathode lead terminal 400 and the anode lead terminal 600, the lead frame is covered with a metal layer, and the anode lead terminal 600 is connected to the anode aluminum foil 110 by welding;

step S4: and covering the inner core of the capacitor after lamination to prepare the traditional patch type solid-state aluminum electrolytic capacitor.

The performance comparison ratios of the patch type solid-state aluminum electrolytic capacitors prepared in examples one to forty one and comparative examples one to forty one are shown in table 1.

TABLE 1 Properties of Patch type solid aluminum electrolytic capacitor

As can be seen from table 1, the heights of the outer shapes of the products of the comparative examples were all larger than those of the corresponding examples, and the lengths and widths of the outer shapes were equal to those of the corresponding examples, except that the fourth comparative example could not be prepared by the conventional method. Compared with the first comparative examples, the performance of the patch type solid aluminum electrolytic capacitor prepared in the first comparative example is obviously superior to that of the first comparative example, and specifically, the patch type solid aluminum electrolytic capacitor has the advantages of smaller size, higher capacity and ripple current resistance, lower ESR and leakage current, and better durability and steady-state wet and heat performance.

In conclusion, the invention has the following beneficial effects: according to the invention, the novel structure and the preparation method are adopted to remove the traditional lead frame material, so that the use of the traditional lead frame material is greatly reduced, the waste of resources is reduced, the integral thickness of the product is reduced, the effective area of the cathode of the internal capacitor is increased, and the product capacity is increased. In addition, the invention can prepare products with traditional large size and products with extremely micro size which can not be related by the traditional method, and has the advantages of simple production process, greatly reduced production cost, low leakage current, low equivalent series resistance, better high temperature and high humidity resistance, better ripple current resistance and the like.

It is apparent that the above-described embodiments are only examples for more clearly describing and not limiting the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. All embodiments need not be exemplified, nor can they be exemplified. Obvious changes or modifications can be made without departing from the scope of the invention.