一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用

文档序号:1009027 发布日期:2020-10-23 浏览:6次 >En<

阅读说明:本技术 一种聚硅氧烷粉体填料的制备方法、由此得到的聚硅氧烷粉体填料及其应用 (Preparation method of polysiloxane powder filler, polysiloxane powder filler obtained by preparation method and application of polysiloxane powder filler ) 是由 陈树真 李锐 于 2019-09-29 设计创作,主要内容包括:本发明涉及一种聚硅氧烷粉体填料的制备方法,提供包括至少60wt%的T单位的聚硅氧烷,其中,T单位=R&lt;Sub&gt;1&lt;/Sub&gt;SiO&lt;Sub&gt;3&lt;/Sub&gt;-,R&lt;Sub&gt;1&lt;/Sub&gt;为氢原子或可独立选择的碳原子1至18的有机基;以及在惰性气体氛围或真空条件下,对该聚硅氧烷进行热处理,热处理温度为250度以上至750度以下,以使得聚硅氧烷中的硅羟基发生缩合以得到真密度大于等于1.33g/cm&lt;Sup&gt;3&lt;/Sup&gt;,更佳的大于等于1.34g/cm&lt;Sup&gt;3&lt;/Sup&gt;的聚硅氧烷粉体填料。本发明还提供一种根据上述的制备方法得到的聚硅氧烷粉体填料。本发明又提供一种根据上述的聚硅氧烷粉体填料的应用。本发明提供的聚硅氧烷粉体填料具有低诱电率、低诱电损失和低放射性。(The invention relates to a method for preparing a polysiloxane powder filler, and provides polysiloxane containing at least 60 wt% of T units, wherein the T units are R 1 SiO 3 ‑,R 1 An organic group which is a hydrogen atom or an independently selected carbon atom of 1 to 18; and heat-treating the polysiloxane under an inert gas atmosphere or vacuum condition, wherein the heat-treating temperature is more than 250 ℃ and less than 750 ℃, so that silicon hydroxyl groups in the polysiloxane are condensed to obtain a true density of more than or equal to 1.33g/cm 3 More preferably 1.34g/cm or more 3 The polysiloxane powder filler. The invention also provides a preparation method for the compoundThe polysiloxane powder filler. The invention also provides an application of the polysiloxane powder filler. The polysiloxane powder filler provided by the invention has low dielectric constant, low dielectric loss and low radioactivity.)

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