阅读说明：本技术 柔性基片微纳结构成型装置及柔性压力传感器加工系统 (Flexible substrate micro-nano structure forming device and flexible pressure sensor processing system ) 是由 刘锋 马丽筠 李世峰 雷骁 郭宣啟 吴伟光 于 2021-06-15 设计创作，主要内容包括：本申请涉及一种柔性基片微纳结构成型装置及柔性压力传感器加工系统,其包括至少两个压印滚筒,两个压印滚筒轴向平行且之间留设有供柔性基片穿过的压印间隙,其周向外壁上设有微纳压印结构；第一驱动组件,其与压印滚筒连接并驱动两个压印滚筒同步反向转动。通过柔性基片微纳结构成型装置实现可对柔性基片进行加热与表面微纳结构的压印,并在第一驱动组件驱动两压印滚筒准确转动的情况下可有效控制柔性基片表面微纳结构的精准度,实现自动化精准加工,为柔性压力传感器的大规模制备提供条件,同时,所提供的柔性压力传感器加工系统在其基础上实现了自动供料、涂胶、柔性膜贴附、烘干固化以及收料等操作,实现自动化、工业化生产柔性压力传感器。(The application relates to a flexible substrate micro-nano structure forming device and a flexible pressure sensor processing system, which comprise at least two stamping rollers, wherein the two stamping rollers are axially parallel, a stamping gap for a flexible substrate to pass through is reserved between the two stamping rollers, and a micro-nano stamping structure is arranged on the circumferential outer wall of the stamping rollers; and the first driving assembly is connected with the impression cylinders and drives the two impression cylinders to synchronously and reversely rotate. Realize heating the impression that can receive the nanostructure with the surface through flexible substrate receive the nanostructure forming device a little, and can effectively control the precision that flexible substrate surface receives the nanostructure under the accurate pivoted condition of two impression cylinders of first drive assembly drive, realize automatic accurate processing, provide the condition for flexible pressure sensor's extensive preparation, and simultaneously, the flexible pressure sensor system of processing that provides has realized operations such as automatic feed, rubber coating, flexible membrane is attached, stoving solidification and receipts material on its basis, realize automation, the flexible pressure sensor of industrial production.)

1. Flexible substrate micro-nano structure forming device, its characterized in that, it includes:

the flexible substrate stamping device comprises at least two stamping rollers (10), wherein the two stamping rollers (10) are axially parallel, stamping gaps for the flexible substrate (a) to pass through are reserved between the two stamping rollers, and micro-nano stamping structures (12) are arranged on the circumferential outer wall of the stamping rollers;

a first driving component which is connected with the impression cylinders (10) and drives the two impression cylinders (10) to synchronously rotate in opposite directions.

2. The flexible substrate micro-nano structure forming device according to claim 1, wherein a heating element is arranged in the impression cylinder (10) for heating the impression cylinder (10).

3. The flexible substrate micro-nano structure forming device according to claim 1, wherein a metal film (11) is sleeved on the circumferential outer wall of the imprinting roller (10), and the micro-nano imprinting structure (12) is arranged on the outer surface of the metal film (11).

4. Flexible pressure sensor system of processing, its characterized in that, it includes:

a supply device (2) for conveying a flexible substrate (a) to be processed;

the flexible substrate micro-nano structure forming device (1) according to any one of claims 1 to 3, which is used for heating two sides of a flexible substrate (a) and forming micro-nano structure units (b) on the two sides of the flexible substrate (a);

the gluing device (3) is used for coating colloid on two sides of the flexible substrate (a) after the micro-nano structure is formed;

an attaching device (4) for attaching a flexible film (c) having a planar electrode (d) on one side thereof to both sides of a flexible substrate (a) having a gel;

a drying device (5) for drying the flexible substrate (a);

and the material receiving device (6) is used for collecting the dried flexible substrate (a).

5. The flexible pressure sensor processing system according to claim 4, wherein a cooling section area (7) is arranged between the gluing device (3) and the flexible substrate micro-nano structure forming device (1) for cooling the flexible substrate (a) conveyed in the cooling section area (7).

6. The flexible pressure sensor processing system according to claim 4, wherein the supply device (2) is used for conveying the continuous integrated flexible substrate (a), and the receiving device (6) comprises:

a receiving roller (60) for winding and collecting the flexible substrate (a);

the second driving assembly is used for driving the material receiving roller (60) to rotate.

7. The flexible pressure sensor processing system according to claim 6, wherein the feeding device (2) comprises:

and a supply roller (20) for winding out the flexible substrate (a).

8. The flexible pressure sensor processing system of claim 6, further comprising:

several sets of transport rollers (8) are provided between the devices for changing the direction of movement of the flexible substrate (a).

9. The flexible pressure sensor processing system according to claim 4, characterized in that the glue application device (3) comprises two groups of glue application components (30), the two groups of glue application components (30) being respectively used for spraying both sides of the flexible substrate (a); the gluing assembly (30) comprises:

a spray member having a spray head thereon, the spray head being directed towards the flexible substrate (a);

and the spraying template is arranged between the spray head and the flexible substrate (a), and is provided with a glue passing hole (302).

10. The flexible pressure sensor processing system according to claim 4, wherein the attaching means (4) comprises:

the two groups of attaching rollers (40) are respectively positioned at two sides of the flexible substrate (a) and are used for winding the flexible film (c);

and the third driving assembly is used for driving the two groups of attaching rollers (40) to synchronously and reversely rotate, and the linear speed of the rotation is consistent with the conveying speed of the flexible substrate (a).

Technical Field

The application relates to the field of flexible pressure sensors, in particular to a flexible substrate micro-nano structure forming device and a flexible pressure sensor processing system.

Background

The flexible capacitive pressure sensor and the flexible piezoresistive pressure sensor are used as important branches of the flexible pressure sensor, have the characteristics of simple structure, good stability, easy acquisition of signals and the like, and have wide application prospects in the fields of soft robots, human-computer interfaces, health condition monitoring, electronic skins and the like. The sensitivity is a key performance index and a research focus of the flexible capacitive pressure sensor and the flexible piezoresistive pressure sensor. The sensitivity of the flexible sensor can be effectively improved by generating micro-nano structures such as micro cones, micro columns, micro pyramids, microspheres, ridges and the like on the surface of the dielectric unit.

The accurate, large-scale and low-cost preparation of the micro-nano structure on the surface of the dielectric unit is the key of the application of the flexible pressure sensor. At present, the micro-nano structure on the flexible pressure sensor is mainly realized by transferring the micro-nano structure on the template to the flexible substrate. The micro-nano structure on the surface of the template is usually prepared by two methods, namely a photoetching process and a natural material template. Although the photoetching process can carry out precise control on the surface micro-nano structure, the process is complex, the cost is high, and large-scale preparation is not easy. The method adopts natural materials as templates, for example, lotus leaves, banana leaves, sand paper, petals and other surfaces as natural templates, but the size and the shape of the micro-nano structure cannot be designed and accurately controlled. The above methods cannot simultaneously meet the requirements of precise control, large-scale, low-cost preparation, and hinder the commercial application of flexible pressure sensors.

Disclosure of Invention

The embodiment of the application provides a flexible substrate micro-nano structure forming device and a flexible pressure sensor processing system, and aims to solve the problem that a flexible pressure sensor cannot be accurately manufactured and processed on a large scale in the related technology.

In a first aspect, a flexible substrate micro-nano structure forming device is provided, which adopts the following technical scheme:

flexible substrate micro-nano structure forming device, it includes:

the flexible substrate stamping device comprises at least two stamping rollers, wherein the two stamping rollers are axially parallel, a stamping gap for the flexible substrate to pass through is reserved between the two stamping rollers, and a micro-nano stamping structure is arranged on the circumferential outer wall of the stamping rollers;

and the first driving assembly is connected with the impression cylinders and drives the two impression cylinders to synchronously and reversely rotate.

In some embodiments, a heating element is provided within the impression cylinder for heating the impression cylinder.

In some embodiments, a metal film is sleeved on the circumferential outer wall of the imprinting roller, and the micro-nano imprinting structure is arranged on the outer surface of the metal film.

In a second aspect, a flexible pressure sensor processing system is provided, which adopts the following technical scheme:

a flexible pressure sensor processing system, comprising:

the feeding device is used for conveying the flexible substrate to be processed;

the flexible substrate micro-nano structure forming device is used for heating two sides of the flexible substrate and forming micro-nano structures on the two sides of the flexible substrate;

the gluing device is used for coating colloid on two sides of the flexible substrate after the micro-nano structure is formed;

attaching device for adhering flexible film with planar electrode on one side to both sides of flexible substrate with colloid

A drying device for drying the flexible substrate;

and the material receiving device is used for collecting the dried flexible substrate.

In some embodiments, a cooling section area is arranged between the gluing device and the flexible substrate micro-nano structure forming device, so as to cool the flexible substrate conveyed in the cooling section area.

In some embodiments, the feeder device is for feeding a continuous, unitary flexible substrate, and the take-up device comprises:

a receiving roller for winding and collecting the flexible substrate;

and the second driving assembly is used for driving the material receiving roller to rotate.

In some embodiments, the supply device comprises:

and a supply roller for winding out the flexible substrate.

In some embodiments, the flexible pressure sensor processing system further comprises:

and the conveying rollers are arranged among the devices and used for changing the moving direction of the flexible substrate.

In some embodiments, the glue spreading device comprises two groups of glue spreading assemblies, wherein the two groups of glue spreading assemblies are respectively used for spraying two sides of the flexible substrate; the gluing component comprises:

the spraying piece is provided with a spray head, and the spray head points to the flexible substrate;

and the spraying template is arranged between the spray head and the flexible substrate, and is provided with glue passing holes.

In some embodiments, the attaching means comprises:

the two groups of attaching rollers are respectively positioned on two sides of the flexible substrate and are used for winding the flexible film;

and the third driving assembly is used for driving the two groups of attaching rollers to synchronously and reversely rotate, and the rotating linear speed is consistent with the conveying speed of the flexible substrate.

The beneficial effect that technical scheme that this application provided brought includes:

the embodiment of the application provides a flexible substrate micro-nano structure forming device and flexible pressure sensor processing system, realize heating and the quick impression shaping of surface micro-nano structure through flexible substrate micro-nano structure forming device, and can effectively control the precision of flexible substrate surface micro-nano structure under the accurate pivoted condition of two impression cylinders of first drive assembly drive, realize automated processing, provide the condition for flexible pressure sensor's extensive preparation, and simultaneously, the flexible pressure sensor processing system that provides has realized operations such as automatic feed, the rubber coating, flexible membrane is attached, stoving solidification and receipts material on its basis, realize the automation, flexible pressure sensor of industrial production.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic overall structure diagram provided in an embodiment of the present application;

fig. 2 is a schematic view of a metal film structure provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a flexible substrate according to an embodiment of the present disclosure;

fig. 4 is a schematic structural view of a glue spraying template provided in the embodiment of the present application;

fig. 5 is a schematic structural diagram of a flexible capacitive sensor processed according to an embodiment of the present application.

In the figure:

a. a flexible substrate; b. a micro-nano structure unit; c. a flexible film; d. a planar electrode;

1. a flexible substrate micro-nano structure forming device; 10. an impression cylinder; 11. a metal film; 12. micro-nano imprinting structure;

2. a feeding device; 20. a feed roller;

3. a gluing device; 30. a gluing component; 300. spraying a glue piece; 301. spraying a glue template; 302. passing through a glue hole;

4. an attaching device; 40. attaching a roller;

5. a drying device; 50. a drying box;

6. a material receiving device; 60. a material receiving roller;

7. a cooling section area;

8. and (6) conveying rollers.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a flexible substrate micro-nano structure forming device and a flexible pressure sensor processing system, and can solve the problem that a flexible pressure sensor cannot be accurately manufactured and processed on a large scale in the related technology.

The embodiment of the application provides a flexible substrate micro-nano structure forming device, it includes: at least two impression cylinders 10 and a first drive assembly. Wherein, the two impression cylinders 10 are axially parallel, an impression gap for the flexible substrate a to pass through is reserved between the two impression cylinders, and the circumferential outer wall of the two impression cylinders is provided with a micro-nano impression structure 12; the first drive assembly is then connected to the impression cylinder 10 and drives the two impression cylinders 10 in synchronous counter-rotation.

Referring to fig. 1 and 3, in this embodiment, there are two impression cylinders 10, the first driving assembly includes two driving motors (not shown in the drawings) respectively connected to the two impression cylinders 10, the two driving motors are connected to the same control unit for cooperation, in other embodiments, the first driving assembly may further include one driving motor and a transmission chain disposed between the ends of the two impression cylinders 10, and the driving motor is connected to one of the impression cylinders 10 to synchronously drive the two impression cylinders 10 to rotate.

Specifically, the flexible substrate a passing between the two impression cylinders 10 can be smoothly molded on two sides under the action of the micro-nano impression structure 12 to obtain the micro-nano structure units b, and the micro-nano structure units b on two sides of the flexible substrate a are accurately molded under the synchronous reverse rotation of the two impression cylinders 10, so that the automatic processing of the flexible substrate a is realized, and the industrial large-scale production of the flexible pressure sensor is facilitated.

Further, a heating member is provided in the impression cylinder 10 for heating the impression cylinder 10.

In the present embodiment, the heating member is a heating resistor (not shown) disposed inside the impression cylinder 10, and the impression cylinder 10 is made of steel with good thermal conductivity.

Specifically, the impression cylinder 10 can heat and plasticize the flexible substrate a in contact with the impression cylinder 10 by heating the impression cylinder 10 through the heating resistance wire, so that the equipment structure is simplified while the micro-nano structural unit b is formed by impression conveniently, and a heating and plasticizing device is not required to be additionally arranged to process the flexible substrate a.

Further, referring to fig. 2, a metal film 11 is sleeved on the circumferential outer wall of the impression cylinder 10, and the micro-nano impression structure 12 is arranged on the outer surface of the metal film 11.

In this embodiment, when the molding operation of the imprinted structure is performed on the metal film 11, the laser direct writing technology is used to realize the molding, and in other embodiments, the chemical etching, rolling, plasma etching, and other technologies may be selected to realize the molding.

Specifically, after the micro-nano imprinting structure 12 is formed on the outer surface of the metal film 11, the micro-nano imprinting structure 12 is sleeved and connected to the circumferential outer wall of the imprinting roller 10, so that the operation of setting the micro-nano imprinting structure 12 on the imprinting roller 10 is simpler and more feasible, the micro-nano imprinting structure 12 is not required to be directly formed on the surface of the imprinting roller 10, meanwhile, the strength of the micro-nano imprinting structure 12 is also guaranteed by adopting the metal film 11 to form the micro-nano imprinting structure 12, and the processing stability is better. In addition, the micro-nano structure on the surface of the metal film 11 on the impression cylinder 10 is easy to adjust through processing, so that the obtained flexible pressure sensor has adjustability in sensitivity.

Referring to fig. 1, the application further provides a flexible pressure sensor processing system, which includes a feeding device 2, a flexible substrate micro-nano structure forming device, a gluing device 3, an attaching device 4, a drying device 5 and a receiving device 6. Wherein, the feeding device 2 is used for conveying a flexible substrate a to be processed; the flexible substrate micro-nano structure forming device is used for heating two sides of a flexible substrate a and forming micro-nano structures on the two sides of the flexible substrate a; the gluing device 3 is used for coating glue on two sides of the flexible substrate a after the micro-nano structure is formed; the attaching device 4 is used for attaching the flexible film c with the planar electrode d on one side to the two sides of the flexible substrate a with the colloid; the drying device 5 is used for drying the flexible substrate a; the material receiving device 6 is used for collecting the dried flexible substrate a.

Specifically, on the basis of the flexible substrate micro-nano structure forming device, the operations of automatic feeding, gluing, attaching of the flexible film c and the planar electrode d, drying, curing, material receiving and the like are carried out in front and at the back of the flexible substrate micro-nano structure forming device, and finally, the flexible pressure sensor is produced automatically and industrially. When the flexible substrate a is a flexible substrate with conductivity, such as a PANI film or a PPy film, the flexible piezoresistive sensor in the flexible pressure sensor can be manufactured; when the flexible substrate a specifically selects a non-conductive flexible substrate, such as a PU film, a PC film and the like, the preparation of the flexible capacitance sensor in the flexible pressure sensor can be realized, and further, the method has better practical effect and industrial popularization significance.

Referring to fig. 1, further, a cooling section area 7 is arranged between the gluing device 3 and the flexible substrate micro-nano structure forming device, so as to cool the flexible substrate a conveyed in the cooling section area 7.

In this embodiment, the flexible substrate a moved to the cooling zone area 7 is naturally cooled during the conveying process. In addition, in other embodiments, the length of the cooling section area 7 between the flexible substrate a wiener structure forming device and the gluing device 3 can be reduced by arranging a refrigerating box which can be penetrated in the end area, and the flexible substrate a can be cooled rapidly.

Further, the supply device 2 is used for conveying the continuous integrated flexible substrate a, and the material receiving device 6 includes a receiving roller 60 and a second driving assembly. Wherein, the receiving roller 60 is used for winding and collecting the flexible substrate a; the second drive assembly is used to drive the take-up roller 60 to rotate.

In this embodiment, the second driving member adopts a servo motor (not shown in the figure) connected with the rotating shaft of the material receiving roller 60, and the rotating speed of the second driving member is consistent with that of the first driving member in the micro-nano structure of the flexible substrate a, so that the flexible substrate a can be stably driven to move, and the processed flexible capacitive sensor can be wound and stored.

Specifically, flexible substrate a adopts continuous integral type processing, realizes that whole processing system's structure can be simpler, and flexible substrate a's transport and processing are more stable, can ensure flexible substrate a and be in more stable state at the tensioning degree of course of working after setting up material collecting device 6's material receiving speed simultaneously, do benefit to the processing preparation of flexible capacitive sensor.

Further, the supply device 2 includes a supply roller 20 for winding out the flexible substrate a.

In this embodiment, the feeding device 2 further includes a control motor (not shown in the figure) in transmission connection with the rotating shaft of the feeding roller 20, and the control motor is electrically connected with the second driving member and the first driving member to realize the matching rotation of the two members, so that the flexible substrate a can be stably sent out, transferred and rolled after being processed.

Further, the flexible pressure sensor processing system further includes a plurality of sets of transfer rollers 8 provided between the devices for changing the moving direction of the flexible substrate a.

Specifically, the moving direction of the flexible substrate a is changed by the conveying roller 8, so that the space in a factory can be effectively utilized, and the problem that the cost is too high and difficult to control due to the fact that too large area is occupied during linear conveying processing is avoided.

Further, referring to fig. 1 and 4, the glue spreading device 3 includes two groups of glue spreading assemblies 30, and the two groups of glue spreading assemblies 30 are respectively used for spraying two sides of the flexible substrate a; the gluing component 30 comprises a spraying piece and a spraying template, wherein the spraying piece is provided with a nozzle which points to the flexible substrate a; the spraying template is arranged between the spray head and the flexible substrate a, and is provided with glue passing holes 302.

Specifically, the opening position of the glue passing hole 302 on the spraying template corresponds to the internal gap of the micro-nano structure unit b formed on the flexible substrate a, and then quantitative coating of the packaging glue on the gap between the micro-nano structure units b on the two sides of the flexible substrate a is realized by means of the spraying piece and the spraying template, so that the flexible substrate a can be adhered with the flexible film c with the planar electrode d smoothly in the follow-up process.

Further, the attaching device 4 comprises two groups of attaching rollers 40 and a third driving assembly, wherein the two groups of attaching rollers 40 are respectively positioned at two sides of the flexible substrate a and used for winding a flexible film c with a planar electrode d; the third driving assembly is used to drive the two sets of attaching rollers 40 to rotate in opposite directions synchronously and the linear speed of rotation is the same as the conveying speed of the flexible substrate a.

In this embodiment, the flexible film c with the planar electrode d on one side is a continuous integrated structure and is concavely disposed on the attaching roller 40, the third driving component is two driving motors in accordance with the first driving component, so as to drive the two groups of attaching rollers 40 to rotate, and the rotational linear speed is in accordance with the conveying speed of the flexible substrate a, so that the planar electrode d on the flexible film c can smoothly align with the micro-nano structure units b on the two sides of the flexible substrate a and be adhered and connected to form the flexible capacitive sensor when the flexible substrate a passes through the two groups of attaching rollers 40, as shown in fig. 5.

Further, the drying device 5 is a drying box 50 with an inlet and an outlet respectively formed on both sides, and a heating resistor is arranged in the drying box, so that the flexible substrate a which penetrates through the drying box and is provided with the flexible film c is cured, the flexible capacitive sensor is finally manufactured, and the flexible capacitive sensor is subsequently coiled and collected.

In the description of the present application, it is to be understood that the forward direction of "X" in the drawings represents the right direction, and correspondingly, the reverse direction of "X" represents the left direction; the forward direction of "Y" represents forward, and correspondingly, the reverse direction of "Y" represents rearward; the forward direction of "Z" represents the upward direction, and correspondingly, the reverse direction of "Z" represents the downward direction, and the directions or positional relationships indicated by the terms "X", "Y", "Z", etc. are based on the directions or positional relationships shown in the drawings of the specification, and are only for convenience of describing and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular direction, be constructed and operated in a particular direction, and thus should not be construed as limiting the present application. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.