阅读说明：本技术 适用于极低温的测试连接器 (Test connector suitable for extremely low temperature ) 是由 郑永倍 于 2020-04-17 设计创作，主要内容包括：公开了适用于极低温的测试连接器。提供了一种测试连接器,其包括包含氟硅橡胶的片；在片中在竖直方向上延伸并且允许电流沿竖直方向流动的导电部。测试连接器可以在极低温下具有优异的耐寒性、柔性、绝缘性和电阻稳定性。(Test connectors suitable for extremely low temperatures are disclosed. A test connector is provided that includes a sheet comprising fluorosilicone rubber; and a conductive portion that extends in the vertical direction in the sheet and allows current to flow in the vertical direction. The test connector may have excellent cold resistance, flexibility, insulation, and resistance stability at extremely low temperatures.)

1. A test connector, comprising:

a sheet comprising a fluorosilicone rubber; and

a conductive portion extending in a vertical direction in the sheet to allow current to flow in the vertical direction.

2. The test connector of claim 1, wherein the fluorosilicone rubber is prepared using a polysiloxane containing side chains substituted with one or more fluorine atoms in a repeating unit.

3. The test linker of claim 1, wherein the fluorosilicone rubber is prepared using a polymer having a structure of formula 1 below:

[ formula 1]

(wherein R, R₁、R₂And R₃Each independently selected from the group consisting of hydrogen, a linear or branched alkyl group having 1 to 10 carbon atoms, a hydroxyalkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 15 carbon atoms, an aryl group having 6 to 12 carbon atoms, an aralkyl group having 7 to 20 carbon atoms and an alkenyl group having 2 to 20 carbon atoms, and the hydrogen atom and the vinyl group are not as the same silicon atomThe presence of a substituent(s) is preferred,

R₄is fluorine or a substituent having one or more fluorine atoms,

each of m and n is an integer of 0 to 10,000 or 0 to 1,000, and o is an integer of 1 to 10,000 or 1 to 1,000).

4. The test connector of claim 3, wherein R₄Is a fluoroalkyl group having 1 to 20 carbon atoms.

5. The test connector of claim 3, wherein:

R、R₂and R₃Is methyl;

R₁is a vinyl group;

R₄is trifluoropropyl;

the sum of m and n is an integer from 300 to 500; and is

o is an integer of 500 to 800.

6. The test connector of claim 1, wherein the substituents containing fluorine atoms have a weight ratio or a molar ratio of about 30% or more with respect to the entire fluorosilicone rubber.

7. The test connector of claim 1, wherein the fluorosilicone rubber is Liquid Silicone Rubber (LSR).

8. The test connector of claim 1, wherein the sheet is formed of a mixture of one or more of a silicone rubber that does not contain fluorine atoms and/or a cross-linked polymer material that does not contain fluorine atoms and the fluorosilicone rubber,

wherein the fluorosilicone rubber in the mixture has about 30% or more of polymerized units of a polymer comprising-Si (CH) in the polymer, relative to the total weight of the mixture₃)(CH₂CH₂CF₃) -fluoro of O-.

9. The test connector of claim 1, wherein the fluorosilicone rubber is prepared with a block copolymer comprising one or more of polydialkylsiloxane, polyalkylallylsiloxane, and polydiallylsiloxane and polymethyltrifluoropropylsiloxane, or a silicone rubber consisting of a mixture thereof.

10. The test connector of claim 9, wherein the polydialkylsiloxane is a polydimethylsiloxane,

the polyalkylallylsiloxane is polymethylphenylsiloxane, and

the polydiallylsiloxane is polydiphenylsiloxane.

11. The test connector of claim 1, wherein the fluorosilicone rubber comprises:

one or more of a fluorine-based polymer, a fluorine-based crosslinking agent, and a fluorine-based plasticizer:

silica, surface-treated hydrophobic silica, or silica surface-treated with fluoropolymers or various silanes; and

one or more of a co-crosslinking agent and a crosslinking accelerator.

12. The test connector of claim 1, wherein the fluorosilicone rubber is a 2-component silicone rubber.

13. The test connector of claim 1, wherein the conductive portion comprises a conductive powder comprising one or more selected from the group consisting of gold, silver, platinum, copper, palladium, rhodium, and alloys including any one or more thereof.

Technical Field

The present disclosure relates to a test connector suitable for use in very low temperature environments.

Background

Semiconductor chips are used over a wide temperature range, including, for example, very low temperatures of-40 ℃ or less to high temperatures of 150 ℃. Therefore, it is necessary to check whether the electrical characteristics of the semiconductor chip satisfy a predetermined target performance at an extreme temperature.

In order to measure electrical characteristics of electronic products or equipment, it is necessary to measure sockets to ensure various properties including insulation, weather resistance, heat resistance, cold resistance, flame retardancy, flexibility, and the like. As a material that satisfies heat resistance and cold resistance, satisfies the ranges required for measurement of thermal shrinkage and expansion, and ensures flexibility, there is polysiloxane. However, it is difficult to use polysiloxane as a material for sockets used at extreme temperatures. For example, since a test socket made of Liquid Silicone Rubber (LSR) for a socket made of polymethylsiloxane can be generally used only at a temperature of-40 to 130 ℃, it is difficult to use at an extremely low temperature of-40 ℃ or less.

Meanwhile, LSR may be prepared by an additional reaction of methicone having a vinyl end group and polydimethylsiloxane having a hydrogen end group. In this case, since the adherent (e.g., conductive particles) cannot be precisely adhered to the LSR due to thermal expansion of the LSR, there is a problem of side effects caused by poor adhesion.

[ Prior art documents ]

[ patent document ]

(patent document 1) Korean patent application laid-open No.10-2017-0030124 (3 and 17 months in 2017)

(patent document 2) Korean patent No.10-1926588 (12 months and 10 days in 2018)

(patent document 3) Korean patent application laid-open No.10-2009-0105986(2009, 10/8)

Disclosure of Invention

The inventors of the present disclosure have found that Liquid Silicone Rubber (LSR) generally has the problem of significantly reduced flexibility and significantly increased resistance at very low temperatures, which was previously unrecognized. For example, the very low temperature may be-40 ℃ or less, and may be about-70 ℃ to-50 ℃. In particular, the test connector of the present disclosure has excellent cold resistance, flexibility, insulation, and resistance stability even at-55 ℃. Accordingly, various embodiments of the present disclosure provide a test connector having excellent cold resistance, flexibility, insulation, and resistance stability at extremely low temperatures.

A test connector according to one embodiment of the present disclosure may include a sheet including fluorosilicone rubber.

The fluorosilicone rubber of the present disclosure may be a polysiloxane containing one or more fluoro groups in a side chain.

The fluorosilicone rubber of the present disclosure may be a 1-liquid component silicone rubber, and may have physical properties particularly required for testing connectors.

The test connector according to one embodiment of the present disclosure may be used for a package test socket of a liquid crystal display, a semiconductor device, a light emitting diode, a memory chip, or the like.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and, together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.

Fig. 1 is a partial cross-sectional view of a test connector (100) according to one embodiment, wherein the test connector 100 is disposed between a device under test (10) and a testing apparatus (20).

Fig. 2 is a graph illustrating results of force characteristics according to depth at room temperature in an example and a comparative example according to an embodiment of the present disclosure.

Fig. 3 is a graph illustrating a result of force characteristics according to depth at a low temperature in an example and a comparative example according to an embodiment of the present disclosure.

Fig. 4 is a graph comparing force characteristics in an example and a comparative example according to an embodiment of the present disclosure at room temperature and low temperature.

Fig. 5 is a graph illustrating resistance properties in an example and a comparative example according to an embodiment of the present disclosure at room temperature and low temperature.

Fig. 6 is a graph illustrating the results of Differential Scanning Calorimetry (DSC) of fluorosilicone according to one embodiment of the present disclosure.

Detailed Description

The embodiments of the present disclosure are shown for the purpose of illustrating the technical idea of the present disclosure. The scope of rights according to the present disclosure is not limited to the examples or embodiments presented below or the specific description thereof.

Unless defined otherwise, all technical and scientific terms used herein include meanings or definitions that are commonly understood by one of ordinary skill in the art. All terms in the present disclosure are selected for the purpose of more clearly describing the present disclosure, and are not selected to limit the scope of the present disclosure.

As used in this disclosure, unless otherwise noted in phrases or sentences containing such expressions, expressions such as "comprising," "including," "having," and the like are to be understood as open-ended terms having the possibility of covering other embodiments.

As used in this disclosure, expressions such as "consisting only of" are to be understood as closed terms, excluding the possibility of covering other components than the respective components.

Unless otherwise indicated, singular expressions described in the present disclosure may cover plural expressions, which will also apply to singular expressions recited in the claims.

According to one embodiment of the present disclosure, the term "fluorosilicone rubber" may be used interchangeably with "fluorosilicone polymer", and may refer to a silicone rubber which is a polymer comprising an elastomer or silicone consisting only of silicon (Si) and carbon, hydrogen, or oxygen and containing one or more fluorine atoms in a side chain. Here, the fluorosilicone rubber may be (i) a silicone polymer composed only of a repeating unit containing one or more fluorine atoms in a side chain; or (ii) a copolymer or block copolymer composed of a total of two or more repeating units including a repeating unit containing one or more fluorine atoms in a side chain and a repeating unit containing no fluorine atom; and (iii) can be selected by a person of ordinary skill in the art based on common general knowledge in the corresponding field. Fluorosilicone rubber may be broadly construed to include the concept of other types of polymers as well as polymers prepared by crosslinking (i) polymers or (ii) copolymers that do not compromise the physical properties of test connectors according to the present disclosure.

According to one embodiment of the present disclosure, the silicone rubber may be a Liquid Silicone Rubber (LSR). Here, the silicone rubber constituting the sheet in the final test connector according to one embodiment of the present disclosure may be prepared by curing the LSR. In general, LSRs may be present in a 1-liquid component type and a 2-liquid component type. The 1-liquid component silicone rubber can be cured by condensation reaction using moisture in the air even without adding a separate curing agent. Therefore, when the silicone rubber to be prepared has a large thickness, the curing speed is slow, and since it is cured by a condensation reaction, the silicone rubber excessively shrinks, so that its dimensional stability is poor and it is difficult to use as a test socket. On the other hand, 2-liquid component silicone rubber means that the main material and the curing agent (or catalyst) are separated, and means that these components must be mixed before curing. In the corresponding technical field, LSRs used for preparing test connectors generally use 2-liquid component rubbers mixed in specific proportions due to their properties. However, even the 2-liquid component rubber does not necessarily satisfy the physical properties required for the test connector, and since the 1-liquid component rubber is a room temperature curable sealant, the 2-liquid component rubber is not used in the test socket for the reasons described above. In addition, a 1-liquid component addition reaction type LSR that is stored at room temperature or lower may be prepared by adding a curing inhibitor to the 2-liquid component LSR. However, since such 2-liquid component LSR has storage limitations and bubbles are generated when silicone is cured due to volatilization of a curing inhibitor used during a curing reaction mediated by heat, the 2-liquid component LSR is not formed to have suitable physical properties for use in a socket.

Similarly, fluorosilicone rubber is also present in the 1-liquid component type and the 2-liquid component type, and this silicone rubber is cured to make the final test connector product. However, conventionally known fluorosilicone rubbers of 1-liquid component and fluorosilicone of 2-liquid component do not have physical properties necessary for use in test connectors. In order to be applied to a test connector, silicone rubber must exhibit a viscosity of 200,000 to 400,000cPs as well as magnetic smoothness, and commercially and conventionally used 2-liquid component silicone rubbers cannot satisfy all of these physical properties. However, the inventors of the present disclosure have found that a test connector including a sheet can be manufactured using an LSR synthesized from a fluorosilicone polymer, thereby completing the present disclosure.

According to an embodiment of the present disclosure, the use of the term "about" or "approximately" is intended to include slight adjustment of manufacturing process errors included in a specific numerical value or a numerical value included in the range of the technical idea of the present disclosure. For example, the term "about" or "approximately" refers to a range of ± 10%, in one embodiment ± 5%, and in another embodiment ± 2% of the value referred to. In the field of the present disclosure, approximations to the levels are suitable unless the value requires a narrower range.

As used herein, the directional indication term "upper" or "upper" refers to the direction of the terminals 11 of the device under test 10 disposed based on the test connector 100, and the directional indication term "lower" or "lower" refers to the direction in which the terminals 21 of the test apparatus 20 are disposed with respect to the test connector 100. The "thickness direction" of the test connector 100 described in the present disclosure refers to the vertical direction. This is a reference for explaining the present disclosure to facilitate clear understanding, and the terms "upper" and "lower" may also be defined differently according to the placement position of the reference.

According to one embodiment of the present disclosure, the present disclosure may relate to a test connector disposed between a device to be tested and a test apparatus to electrically connect them, the test connector including a sheet including fluorosilicone rubber; and a conductive portion extending in a vertical direction in the sheet to allow current to flow in the vertical direction. Here, the sheet may exhibit insulating properties.

According to one embodiment of the present disclosure, the fluorosilicone rubber may be a polysiloxane in which a side chain substituted with one or more fluorine atoms is included in a repeating unit.

According to one embodiment of the present disclosure, the fluorosilicone rubber may have the following formula 1.

[ formula 1]

In the chemical formula, R, R₁、R₂And R₃May each be independently selected from hydrogen, a linear or branched alkyl group having 1 to 10 carbon atoms, a hydroxyalkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 15 carbon atoms, an aryl group having 6 to 12 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, and an alkenyl group having 2 to 20 carbon atoms, wherein the hydrogen atom and the vinyl group do not exist as substituents of the same silicon atom; r₄Is fluorine or a substituent having one or more fluorine atoms; m and n are each an integer of 0 to 10,000 or 0 to 1,000, and o may be an integer of 1 to 10,000 or 1 to 1,000.

According to one embodiment of the present disclosure, the linear or branched alkyl group having 1 to 10 carbon atoms may be one or more selected from the group consisting of methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, n-pentyl, isopentyl, neopentyl, hexyl, heptyl, octyl, nonyl, and decyl, but the present invention is not limited thereto.

According to one embodiment of the present disclosure, the hydroxyalkyl group having 1 to 10 carbon atoms may be one or more selected from the group consisting of a hydroxymethyl group, a hydroxyethyl group, and a hydroxypropyl group, but the present disclosure is not limited thereto.

According to one embodiment of the present disclosure, R₄May be a fluoroalkyl group having 1 to 20 carbon atoms. Here, the fluoroalkyl group may be one or more selected from the group consisting of trifluoropropyl group, heptafluoropentyl group, heptafluoroisopentyl group, tridecafluorooctyl group, and heptafluorohexadecyl group, but the present disclosure is not limited thereto.

According to an embodiment of the present disclosure, the cycloalkyl group having 3 to 15 carbon atoms may be one or more selected from the group consisting of cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, cycloundecyl, cyclododecyl, butylcyclopropyl, methylcyclopentyl, dimethylcyclohexyl, ethyldimethylcycloheptyl, and dimethylcyclooctyl, but the present disclosure is not limited thereto.

According to an embodiment of the present disclosure, the aryl group having 6 to 12 carbon atoms may be one or more selected from the group consisting of a phenyl group, a tolyl group, a xylyl group, and a naphthyl group, but the present disclosure is not limited thereto.

According to an embodiment of the present disclosure, the aralkyl group having 7 to 20 carbon atoms may be one or more selected from the group consisting of a methylphenyl group, an ethylphenyl group, a methylnaphthyl group, and a dimethylnaphthyl group, but the present invention is not limited thereto.

According to an embodiment of the present disclosure, the alkenyl group having 2 to 20 carbon atoms may be one or more selected from the group consisting of a vinyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group, an octenyl group, a decenyl group, a hexadecenyl group, and an octadecenyl group, but the present disclosure is not limited thereto.

R, R according to one embodiment of the present disclosure₂And R₃May be methyl, R₁May be vinyl, R₄May be a trifluoropropyl group, the sum of m and n may be an integer of 300 to 500, and o may be an integer of 500 to 800.

According to one embodiment of the present disclosure, as the weight ratio or the molar ratio of the substituent containing the fluorine atom with respect to the entire fluorosilicone rubber increases, excellent cold resistance, flexibility, insulation properties, and resistance stability at very low temperatures are improved, and thus, in order to manufacture a socket suitable for use at very low temperatures of-55 ℃, the weight ratio or the molar ratio of the fluorine substituent containing the fluorine atom is preferably about 30% or more. The substituent may refer to a side chain substituent bonded to a silicon atom in a repeating unit of a fluorosilicone polymer used to prepare a fluorosilicone rubber.

According to one embodiment of the present disclosure, the fluorosilicone rubber may be an LSR.

According to one embodiment of the present disclosure, the conductive part may be present in a form surrounded by the sheet except for the exposed part and extending in a vertical direction in the sheet while being in contact with the fluorosilicone rubber.

According to one embodiment of the present disclosure, the sheet may further comprise one or more of a silicone rubber that does not contain fluorine atoms and/or a cross-linked polymeric material that does not contain fluorine atoms. Here, the sheet may be made of one or more of a silicone rubber containing no fluorine atoms and/or a crosslinked polymer material containing no fluorine atomsAnd a mixture with fluorosilicone rubber. In the blend, the fluorosilicone rubber may be about 30% or more relative to the total weight of the blend. The fluorosilicone rubber may include about 30% or more of polymeric units comprising-Si (CH) in the polymer, relative to the total weight of the mixture, in the mixture₃)(CH₂CH₂CF₃) -fluoro of O-.

According to one embodiment of the present disclosure, examples of materials that can be used to form the curable polymer material that can be used to obtain the fluorine atom-free crosslinked polymer material include polybutadiene rubber, natural rubber, polyisoprene rubber, conjugated diene-based rubber (such as styrene-butadiene copolymer rubber or acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof), block copolymer rubber (such as styrene-butadiene-diene block copolymer rubber or styrene-isoprene block copolymer and hydrogenated products thereof), chloroprene, urethane rubber, polyester-based rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like, but the present disclosure is not limited thereto.

According to one embodiment of the present disclosure, the silicone rubber not containing a fluorine atom may be a polysiloxane, such as a condensation-type polysiloxane, an addition-type polysiloxane, or a polysiloxane containing a vinyl group or a hydroxyl group (e.g., polydimethylsiloxane, polymethylphenylsiloxane, or polydiphenylsiloxane), but the present disclosure is not limited thereto. The fluorine atom-free silicon rubber that may be used in the present disclosure may include LSR, which may be used as an insulating material by those of ordinary skill in the art within a range in which the performance of the test connector according to one embodiment of the present disclosure is not deteriorated.

According to one embodiment of the present disclosure, the fluorosilicone rubber may be a block copolymer comprising one or more of polydimethylsiloxane, polymethylphenylsiloxane, and polydiphenylsiloxane, and polymethyltrifluoropropylsiloxane.

According to one embodiment of the present disclosure, a fluorosilicone rubber may comprise: one or more of a fluorine-based polymer, a fluorine-based crosslinking agent, and a fluorine-based plasticizer; silica, surface-treated hydrophobic silica, silica surface-treated with fluoropolymers or various types of silanes; and one or more of a co-crosslinking agent and a crosslinking accelerator.

According to one embodiment of the present disclosure, a co-crosslinking agent may be included to increase crosslinking efficiency and uniform crosslinking during crosslinking of the fluorosilicone rubber. Specifically, trimethylolpropane trimethacrylate (TMPTMA), trimethylolpropane triacrylate (TMPTA), or the like may be used as the co-crosslinking agent, but the present disclosure is not limited thereto. These may be used alone or in a combination of two or more thereof. When the co-crosslinking agent is used, crosslinking can be performed with excellent crosslinking efficiency and uniformity.

According to one embodiment of the present disclosure, the co-crosslinking agent may be included in an amount of 0.1 to 30 parts by weight, relative to 100 parts by weight of the fluorine-based polymer. When included within the above range, the scorch phenomenon may be prevented without inhibiting the physical properties of the present disclosure, and crosslinking may be uniformly performed. When the co-crosslinking agent is included at less than 0.1 parts by weight, appearance and mechanical properties may be deteriorated in the formation of the insulator of the present disclosure, and when the co-crosslinking agent is included at more than 30 parts by weight, physical properties of the present disclosure (such as heat resistance and cold resistance) may be deteriorated. For example, the co-crosslinking agent may be included in 1 to 25 parts by weight. For example, the co-crosslinking agent may be included in 2 to 20 parts by weight.

According to one embodiment of the present disclosure, a property-imparting agent may be added to improve heat resistance or heat dissipation of the fluorosilicone rubber. As the property imparting agent, zinc oxide (ZnO) or aluminum oxide (Al) can be used₂O₃) And magnesium oxide (MgO). These may be contained alone or in a combination of two or more thereof. According to one embodiment of the invention, the property-imparting agent may be present in a ratio of 1: 0.1 to 1: 5 weight ratio comprising zinc oxide, aluminum oxide and magnesium oxide. When the material is contained in the above range, excellent heat resistance and heat dissipation can be exhibited. For example, the ratio of 1: 0.5 to 1: the weight ratio of 1.5 contains material. In one embodiment of the present disclosure, the fluorine-based polymer is used in an amount of 100 parts by weightThe property-imparting agent (E) may be contained in an amount of 1 to 500 parts by weight. Within the above range, excellent heat resistance or heat dissipation efficiency may be exhibited without impairing the physical properties of the present disclosure. For example, the property-imparting agent may be contained in an amount of 2 to 300 parts by weight. In another example, the property imparting agent may be included at 5 to 150 parts by weight.

According to one embodiment of the present disclosure, the fluorosilicone rubber may be a 2-liquid component silicone rubber.

According to one embodiment of the present disclosure, the conductive part may include a conductive powder containing one or more selected from the group consisting of gold, silver, platinum, copper, palladium, rhodium, and an alloy including any one or more thereof.

According to one embodiment of the present disclosure, the alloy may be an alloy formed by adding a different material (for example, phosphorus) to any one of the conductive particles (gold, silver, platinum, palladium, and rhodium), or an alloy formed of at least two or more of the conductive particles.

According to one implementation of the present disclosure, the conductive powder may include magnetic core particles and conductive particles (one or more selected from the group consisting of gold, silver, platinum, copper, palladium, rhodium, and alloys including one or more thereof) covering surfaces of the core particles.

According to an embodiment of the present disclosure, the magnetic particles may include one or more selected from the group consisting of cobalt, nickel, iron, and an alloy including any one or more thereof, but the present disclosure is not limited thereto. Therefore, according to the following manufacturing method, using the property that the magnetic particles are magnetized in the magnetic field, the conductivity of the conductive portion 130 can be improved, and the manufacturability can be improved. According to one embodiment of the present disclosure, the alloy may be an alloy formed by adding a different material (for example, copper) to any one of the magnetic materials (cobalt, nickel, and iron) or an alloy formed of at least two or more thereof.

According to one embodiment of the present disclosure, referring to fig. 1, the device under test 10 may be a semiconductor device or the like. The device to be tested 10 comprises a plurality of terminals 11. A plurality of terminals 11 are provided on the lower surface of the device to be tested 10. When the device to be tested 10 is tested, the plurality of terminals 11 may be in contact with the upper surface of the test connector 100.

The test device 20 includes a plurality of terminals 21. The plurality of terminals 21 correspond to the plurality of terminals 11. A plurality of terminals 21 are provided on the upper surface of the test device 20. When the device to be tested 10 is tested, the plurality of terminals 21 may be in contact with the lower surface of the test connector 100.

According to one embodiment of the present disclosure, each of the plurality of terminals 21 is disposed at a position facing each of the plurality of terminals 11 in the vertical direction. Although not shown, in another embodiment in which the plurality of conductive portions 130 are inclined with respect to the vertical direction, each of the plurality of terminals 21 may be disposed at a position facing each of the plurality of terminals 11 in the direction in which the plurality of conductive portions 130 are inclined.

According to an embodiment of the present disclosure, the test connector 100 is formed to be disposed between the device under test 10 and the testing apparatus 20 to be electrically connected to each other. The test connector 100 comprises a plate 110 and a conductive portion 130, the conductive portion 130 being configured to electrically connect a terminal 11 of the device under test 10 with a terminal 21 of the testing apparatus 20.

According to one embodiment of the present disclosure, the sheet 110 has a thickness in a vertical direction. The thickness (length in the thickness direction) of the sheet 110 is smaller than the length in the direction perpendicular to the thickness direction of the sheet 110.

According to one embodiment of the present disclosure, the sheet 110 may be formed of fluorosilicone rubber. The sheet 110 thus formed exhibits electrical insulation and elastically deformable properties.

According to one embodiment of the present disclosure, the conductive part 130 may extend in a vertical direction. The conductive portion 130 may extend in a vertical direction in the sheet 110 to allow current to flow in the vertical direction.

According to one embodiment of the present disclosure, the conductive part 130 may be disposed in the sheet 110. The conductive portion 130 may be supported by the sheet 110.

According to one embodiment of the present disclosure, the plurality of conductive parts 130 are spaced apart from each other in a horizontal direction perpendicular to the vertical direction. The plurality of conductive portions 130 may be disposed to be spaced apart substantially at regular intervals.

According to one embodiment of the present disclosure, the vertical ends of the conductive portions 130 are exposed at the upper and lower surfaces of the sheet 110. An upper portion of the conductive portion 130 is exposed at an upper surface of the sheet 110, and a lower portion of the conductive portion 130 is exposed at a lower surface of the sheet 110. The upper portion of the conductive portion 130 is formed to be able to contact the terminal 11 of the device to be tested 10, and the lower portion of the conductive portion 130 is formed to be able to contact the terminal 21 of the testing apparatus 20.

According to one embodiment of the present disclosure, the conductive part 130 includes an exposed part (not shown) that is exposed at a surface of the sheet 110 (which means a surface of the conductive part 130). The exposed portions are exposed at both ends of the conductive portion 130. The sheet 110 may be formed to surround the conductive part 130 except for the exposed part. The conductive part 130 may be manufactured in a protruding shape or a recessed shape based on the upper surface or the lower surface of the sheet 110 according to design requirements. When the conductive portion 130 protrudes, the protruding portion of the conductive portion 130 may not be surrounded by the sheet. Here, the conductive part 130 may be in contact with the sheet 110 (e.g., fluorosilicone rubber) in the surrounded portion. Fig. 1 schematically shows the conductive portion 130 provided in the sheet 110, and an inner contact surface of the conductive portion, which is in contact with the sheet, may have an irregular shape.

The test linker according to one embodiment of the present disclosure may be manufactured by a method that may be generally adopted by those of ordinary skill in the relevant art. For example, the sheet 110 may be formed and manufactured by: the previously manufactured conductive part 130 is disposed at a specific position in a mold, and then the fluorosilicone rubber according to one embodiment of the present disclosure is injected into the mold and the mold is cured. In addition, instead of using a mold, the following method may be employed: a plurality of through holes are formed in the vertical direction of the silicone rubber sheet, and a mixture in which a crosslinking material and conductive particles are stirred is injected into the through holes and then cured. Here, the crosslinking material may be a fluorosilicone rubber, a silicone rubber containing no fluorine atoms, or a crosslinked polymer containing no fluorine atoms according to one embodiment of the present disclosure.

In another embodiment, for example, the test connector may be manufactured by a method comprising: (a) injecting a mixture of fluorosilicone rubber and conductive powder according to one embodiment of the present disclosure into a mold; (b) generating a magnetic field to arrange the conductive powder at a predetermined position; (c) the sheet 110 is formed by curing fluorosilicone rubber. The conductive powder may flow in the fluorosilicone rubber to be disposed at a predetermined position by the magnetic field generated in step (b). The arranged conductive powder extends in the vertical direction and allows current to flow in the vertical direction, thereby forming the conductive portion 130.

Depending on the manufacturing method, the boundary between the sheet 110 and the conductive portion 130 may not be clear. For example, the silicone rubber contained in the conductive portion 130 may be the same as the silicone rubber of the sheet 110. Further, in the method of injecting a mixture of fluorosilicone rubber and conductive powder into a mold and applying a magnetic field, the conductive part 130 may not be manufactured in a smooth cylindrical shape, some parts may be convex or concave, and the boundary of the conductive part 130 may not be clear, according to the density variation of the magnetic field generated in the vertical direction of the sheet 110 and the viscosity of the LSR. In the present disclosure, although these components are distinguished by the terms conductive portion 130 and sheet 110, this is merely for explaining the description of the present disclosure and is not intended to limit the scope of the claims. The present disclosure includes a case where the conductive portion 130 and the sheet 110 are integrally manufactured and a case where the conductive portion 130 and the sheet 110 are separated by a clear boundary.

The configuration and effect of the present disclosure will be described in more detail below with reference to examples and experimental examples. However, the following examples and experimental examples are provided only to illustrate the present disclosure to facilitate understanding thereof, and the scope of the present disclosure is not limited thereto.

Further, examples of the present disclosure will be described with reference to the accompanying drawings. In the drawings, the same reference numerals may be assigned to the same or corresponding components. Further, in the description of the following examples, a repeated description of the same or corresponding components will be omitted. However, although descriptions of components are omitted, it is not intended that such components be included in any embodiment.

[ EXAMPLES ] preparation of Fluorosilicone Polymer and Fluorosilicone rubber (LSR)

One mole of octamethylcyclotetrasiloxane is added2 moles of 1,3, 5-tris [ (3,3, 3-trifluoropropyl) methyl group]Cyclotrisiloxane, 0.01 mol of 1,1,3, 3-tetramethyl-1, 3-divinyldisiloxane and 0.01 mol of HO^--Si(Me)₂-N-(CH₃)⁴⁺(used as a methyl seed) and reacted to obtain a fluorosilicone polymer, Vi-Si (Me)₂)-O-{[-Si(Me₂)-O]₄}₁₀₀- { [ Si (Me) (trifluoropropyl) -O]₃}₂₀₀-Si(Me₂) -a Vi polymer. Here, "Vi" means vinyl.

One mole of octamethylcyclotetrasiloxane and 2 moles of 1,3, 5-tris [ (3,3, 3-trifluoropropyl) methyl]Cyclotrisiloxane, 0.01 mol of 1,1,3, 3-tetramethyl-1, 3-dihydrodisiloxane and 0.01 mol of HO^--Si(Me)₂-N-(CH₃)⁴⁺(used as a methyl seed) and reacted to obtain a fluorosilicone polymer, H-Si (Me)₂)-O-{[-Si(Me₂)-O]₄}₁₀₀- { [ Si (Me) (trifluoropropyl) -O]₃}₂₀₀-Si(Me₂) -H polymer.

Fluorosilicone rubber (LSR) as a 2-liquid component rubber was prepared with part A (main material) and part B (curing agent) using Vi-Si (Me)₂)-O-{[-Si(Me₂)-O]₄}₁₀₀- { [ Si (Me) (trifluoropropyl) -O]₃}₂₀₀-Si(Me₂) Preparation of the main Material with the Vi Polymer, the platinum-based catalyst and additives other than silica, and use of Vi-Si (Me)₂)-O-{[-Si(Me₂)-O]₄}₁₀₀- { [ Si (Me) (trifluoropropyl) -O]₃}₂₀₀-Si(Me₂) The polymer Vi and H-Si (Me)₂)-O-{[-Si(Me₂)-O]₄}₁₀₀- { [ Si (Me) (trifluoropropyl) -O]₃}₂₀₀-Si(Me₂) -H polymer and additives other than silica. Addition reaction type 2-liquid component fluorosilicone rubber (LSR) is used to manufacture sockets prepared by storing and mixing together main materials and curing agents (divided into part a and part B). Here, the additive means a coupling agent or the like that imparts adhesive strength, and may be used as needed. Further, the vinyl polymer or the hydrogen polymer may be a polymer havingWith various polymers of molecular weight or viscosity.

Comparative example preparation of general-purpose silicon Polymer and Silicone rubber

Siloxanes having vinyl and hydrogen groups were prepared and used as LSR by the same method as in the above example except for 1,3, 5-tris [ (3,3, 3-trifluoropropyl) methyl ] cyclotrisiloxane.

The silicone rubber of the comparative example was an addition reaction type 2-liquid component LSR. The addition reaction type 2-liquid component is used for manufacturing a socket prepared by storing a main material and a solidified material (divided into a part a and a part B) and mixing them together. Here, part a is a main material consisting of a siloxane having a vinyl group, a platinum-based catalyst, a filler and an additive, and part B is a curing agent which is a suitable mixture of a siloxane having a vinyl group, a siloxane having a hydrogen group, a filler and an additive. Here, the additive means a coupling agent that imparts adhesive strength, and may be used as needed. In addition, a vinyl polymer or a hydrogen polymer may be used by mixing various polymers having different molecular weights or viscosities.

Experimental example 1 measurement of force characteristics relating to flexibility

The test connectors were manufactured by a conventional method using the silicones of examples and comparative examples as components of the insulating sheet.

Specifically, the gold particles in the above examples and comparative examples were mixed in an appropriate ratio to form a pattern on the test connector. Here, in order to easily form the pattern, the temperature is adjusted to 20 to 50 ℃ to reduce the viscosity of the silicone, and the pattern is formed, and then the curing process is performed. The test connector is of the type used for testing DDR 200-0.65x0.8p chips. The basic connector includes a PI film, a SUS frame, silicone, and conductive powder (gold particles).

Thereafter, the force characteristics according to temperature were measured under the following conditions:

-temperature: room temperature (25 ℃), Low temperature (-55 ℃)

-test samples: e1 type (applied from silicone)

Experimental PKG: 200-0.65x0.8p

Experimental method: force was measured by varying the test depth (stroke) according to the Stroke Control Mechanism (SCM) (range: 0 to 0.22 mm/recommended: 0.20 mm).

-saturation time: the chamber is shown 1 hour after the applied temperature.

The force measurement results are shown in tables 1 to 3 and fig. 2 to 4.

[ Table 1]

[ Table 2]

[ Table 3]

	Comparative example	Examples of the invention
			25℃	32.93gf	37.18gf
-55℃	63.73gf	47.43gf
			Variations inPercentage (%)	93.52％	27.58％

From the above results, it can be seen that when the conventional silicone is used, the force change rate at a very low temperature is increased 93.52% based on a stroke of 0.2mm, and thus flexibility is significantly reduced. When the flexibility is reduced like this, when conventional silicone is repeatedly used at extremely low temperatures, the durability of the connector is rapidly reduced, and as its life becomes shorter, the connector must be frequently replaced. In addition, when the flexibility of the insulating sheet is reduced, the conductive particles present in the sheet may fall off from the silicone rubber, so that the device to be tested is not electrically connected to the testing apparatus. On the other hand, in the example using the fluorosilicone rubber according to one embodiment of the present disclosure, the force change rate was 27.58%, and it could be confirmed that flexibility was considerably maintained at an extremely low temperature as compared to room temperature, and it could be confirmed that the force change rate was significantly and largely improved by 65% points as compared to the comparative example.

Experimental example 2 resistance measurement

Using the connectors, the resistance characteristics according to temperature of the test connectors manufactured as described in experimental example 1 were measured under the following conditions and methods.

-temperature: room temperature (25 ℃), Low temperature (-55 ℃)

-experimental samples: e1 type (applied from silicone)

Experimental PKG: 200-0.65x0.8p

Experimental method: connector resistance was measured by applying 30g/pin in the same manner to apply an appropriate force according to the Force Control Mechanism (FCM).

-saturation time: the chamber is shown 1 hour after the applied temperature.

The resistance measurement results are shown in table 4 and fig. 5. All resistance values below are in m Ω.

[ Table 4]

According to the above results, in the comparative example using the conventional silicone, the average resistance value was increased by about 3.5 times compared to room temperature at an extremely low temperature, whereas in the example of the present disclosure, the average resistance value was increased by about 1.7 times, confirming that excellent conductivity and resistance stability were exhibited at an extremely low temperature, and thus, the performance of the connector was excellently and stably maintained. Further, in the examples of the present disclosure, the minimum resistance value and the maximum resistance value are lower at room temperature and significantly lower even at extremely low temperatures, as compared with the comparative examples. However, in the comparative example, the maximum resistance value at an extremely low temperature generally exceeds 300m Ω required for the test connector, and thus cannot satisfy the specification of the test connector.

[ Experimental example 3] differential scanning calorimetry

To confirm the physical properties of the fluorosilicone polymer according to one embodiment of the present disclosure, differential scanning calorimetry was performed using a relaxation resistant (Netzsch) -DSC200F 3. Specifically, the example fluorosilicone polymer was placed in an analyzer, and heat flow according to temperature was measured, and the results are shown in fig. 6. According to the results, it was confirmed that the crystallization temperature (Tc) and the melting temperature (Tm) at the time of heating or cooling were not observed in the fluorosilicone rubber according to one embodiment of the present disclosure. Due to this property, it is considered that the fluorosilicone rubber according to one embodiment of the present disclosure exhibits excellent flexibility and resistance stability at very low temperatures, as compared to conventional silicones.

When a test connector is manufactured using the fluorosilicone rubber according to an aspect of the present disclosure, excellent cold resistance, flexibility, insulation, and resistance stability may be exhibited at very low temperatures. For example, the test connectors of the present disclosure have excellent cold resistance, flexibility, insulation, and resistance stability at-40 ℃ or less, more specifically, at a temperature range of about-70 ℃ to-50 ℃, particularly at-55 ℃. In addition, such polymers can have high crosslink density and low shrinkage at very low temperatures.

This effect of the present disclosure is believed to be due to the characteristics of fluorosilicone rubber in which the crystallization temperature (Tc) and melting temperature (Tm) are not observed.

Although the present disclosure has been described with respect to some embodiments, it should be noted that various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the present disclosure. Further, such modifications and variations are to be construed as falling within the scope of the claims appended hereto.

[ description of reference numerals ]

10 device to be tested 20 testing apparatus

100 test connector 110 wafer 130 conductive part