阅读说明：本技术 一种用于收集极的散热装置 (Heat dissipation device for collector ) 是由 崔建玲 曹绅 周忠正 常田颖 于 2020-07-03 设计创作，主要内容包括：本发明公开了一种用于收集极的散热装置,包括具有散热腔的基体；位于散热腔内的若干金属肋片；以及填充于所述散热腔的若干金属肋片间的相变材料；基体上包括有用以填充相变材料的加料口；基体外侧表面包括有与收集极对应形成热传导的接触面；散热装置还包括有位于所述散热腔内的热管；热管位于所述金属肋片的远离接触面的一侧。本发明结构简单可靠,适用于弹载等空间狭小处,不额外增加行波管过多负载重量,能够解决工作环境温度为85℃的弹载行波管在无环控工作条件下的散热问题。(The invention discloses a heat dissipation device for a collector, which comprises a base body with a heat dissipation cavity; a plurality of metal fins positioned in the heat dissipation cavity; the phase change material is filled among the plurality of metal fins of the heat dissipation cavity; the base body comprises a feed inlet for filling phase-change materials; the outer surface of the substrate comprises a contact surface which corresponds to the collector to form heat conduction; the heat dissipation device also comprises a heat pipe positioned in the heat dissipation cavity; the heat pipe is positioned on one side of the metal fin far away from the contact surface. The invention has simple and reliable structure, is suitable for missile-borne and other narrow spaces, does not additionally increase the excessive load weight of the traveling wave tube, and can solve the heat dissipation problem of the missile-borne traveling wave tube with the working environment temperature of 85 ℃ under the condition of no environmental control.)

1. A heat sink for a collector, the heat sink comprising:

a base having a heat dissipation cavity;

a plurality of metal fins positioned in the heat dissipation cavity; and

the phase change material is filled among the plurality of metal fins of the heat dissipation cavity;

the base body comprises a charging opening for filling the phase-change material;

the outer side surface of the substrate comprises a contact surface which corresponds to the collector to form heat conduction;

the heat dissipation device also comprises a heat pipe positioned in the heat dissipation cavity;

the heat pipe is positioned on one side of the metal fin far away from the contact surface.

2. The heat dissipating device of claim 1,

defining that the axial direction of the collector is a first direction, and the direction vertical to the first direction in the horizontal plane is a second direction;

the heat dissipation device comprises a plurality of heat pipes positioned in the heat dissipation cavity;

the heat pipe includes:

a longitudinal heat pipe arranged along a first direction; and

a transverse heat pipe disposed along a second direction.

3. The heat dissipating device of claim 1, wherein the metal fins near the fill port are absent, the absent metal fins forming a space structure near the fill port of the heat dissipating chamber configured for removal of air and sufficient filling of the phase change material in the heat dissipating chamber.

4. The heat dissipating device of claim 1, wherein the metal fins include grooves for fixing the heat pipes.

5. The heat dissipating device of claim 1, wherein said contact surface comprises a thermally conductive sheet thereon.

6. The heat sink of claim 1, wherein said contact surfaces comprise an axial contact surface corresponding to a collector sidewall surface, and a radial contact surface corresponding to a collector bottom surface;

the axial contact surface is of a cambered surface structure.

7. The heat dissipating device of claim 1, wherein the base includes a first contact surface and a second contact surface for heat conduction with the two collectors, respectively.

8. The heat dissipating device of claim 7, wherein the base comprises a first inlet and a second inlet corresponding to the two collector positions for filling the phase change material;

the metal fins near the first charging opening are missing, and the missing metal fins form a first space structure near the first charging opening of the heat dissipation cavity;

and the metal fins near the second feeding hole are absent, and the absent metal fins form a second space structure near the second feeding hole of the heat dissipation cavity.

9. The heat dissipation device of claim 1, wherein the heat pipe comprises a pipe body having an inner cavity, and an inorganic working medium filled in the inner cavity;

the phase-change material is solid-liquid phase-change material.

10. The heat sink of claim 1, wherein the contact surface side of the base includes a stepped configuration.

Technical Field

The invention belongs to the field of microwave vacuum electronic devices, and particularly relates to a heat dissipation device for a collector.

Background

The traveling wave tube is an electric vacuum device which is widely applied in the fields of electronic countermeasure, satellite communication and the like. The collector of the traveling wave tube can generate a large amount of heat in the working process, and if the heat cannot be dissipated in time and is accumulated at the heat source, the temperature of the traveling wave tube can be increased rapidly, and finally the traveling wave tube cannot work normally.

At present, the main method for solving the phenomenon of overhigh working temperature at the collector of the traveling wave tube is to adopt an external conduction cooling device, the external conduction device generally needs to provide an air cooling or water cooling system by using an application platform, although the external air cooling and water cooling system can better realize the heat dissipation of the traveling wave tube in work, the heat dissipation mode needs to occupy larger space and simultaneously increases the weight of the platform, so the external conduction cooling mode is suitable for platforms and equipment with sufficient space and weight allowance, such as ground, carrier-borne, airborne and the like. However, in a platform with a narrow space and a heavy weight requirement, such as a missile-borne platform, the external conduction cooling method is not preferable.

Disclosure of Invention

In view of the above problems, an object of the present invention is to provide a heat dissipating device for a collector. The device can solve the heat dissipation problem at the traveling wave tube collector position in a narrow space on the premise of not additionally increasing excessive load weight.

In order to achieve the purpose, the invention adopts the following technical scheme:

according to one aspect of the present invention, there is provided a heat dissipating device for a collector, the heat dissipating device comprising:

a base having a heat dissipation cavity;

a plurality of metal fins positioned in the heat dissipation cavity; and

the phase change material is filled among the plurality of metal fins of the heat dissipation cavity;

the base body comprises a charging opening for filling the phase-change material;

the outer side surface of the substrate comprises a contact surface which corresponds to the collector to form heat conduction;

the heat dissipation device also comprises a heat pipe positioned in the heat dissipation cavity;

the heat pipe is positioned on one side of the metal fin far away from the contact surface.

Furthermore, it is preferable to define that the collector axial direction is a first direction, and a direction perpendicular to the first direction in a horizontal plane is a second direction;

the heat dissipation device comprises a plurality of heat pipes positioned in the heat dissipation cavity;

the heat pipe includes:

a longitudinal heat pipe arranged along a first direction; and

a transverse heat pipe disposed along a second direction.

Furthermore, it is preferable that the metal fins near the charging opening are absent, and the absent metal fins form a space structure near the charging opening of the heat dissipation chamber, the space structure being configured to remove air in the heat dissipation chamber and to sufficiently fill the phase change material.

In addition, it is preferable that the metal rib includes a groove for fixing the heat pipe.

Furthermore, it is preferable that the contact surface includes a heat conductive sheet.

Furthermore, it is preferable that the contact surface includes an axial contact surface corresponding to a collector side wall surface, and a radial contact surface corresponding to a collector bottom surface;

the axial contact surface is of a cambered surface structure.

In addition, it is preferable that the substrate includes a first contact surface and a second contact surface that are thermally conductive with respect to the two collectors, respectively.

In addition, it is preferable that the substrate includes a first feeding port and a second feeding port corresponding to the two collector positions, respectively, for filling the phase-change material;

the metal fins near the first charging opening are missing, and the missing metal fins form a first space structure near the first charging opening of the heat dissipation cavity;

and the metal fins near the second feeding hole are absent, and the absent metal fins form a second space structure near the second feeding hole of the heat dissipation cavity.

In addition, preferably, the heat pipe comprises a pipe body with an inner cavity and inorganic working medium filled in the inner cavity;

the phase-change material is solid-liquid phase-change material.

Furthermore, it is preferable that the contact surface side of the base includes a step structure.

The invention has the following beneficial effects:

the invention has simple and reliable structure, is suitable for small space such as missile-borne, does not additionally increase excessive load weight of the traveling wave tube, can solve the problem of heat dissipation of the missile-borne traveling wave tube with the working environment temperature of 85 ℃ under the condition of no environmental control, and can quickly conduct and dissipate a large amount of heat generated at the collector when the traveling wave tube works, thereby keeping the working temperature of the traveling wave tube stable, effectively protecting the traveling wave tube and improving the stability of the traveling wave tube.

Drawings

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Fig. 1 is a schematic diagram illustrating an external structure of a heat dissipation device according to the present invention.

Fig. 2 shows a schematic diagram of the structure of the metal fin inside the heat sink provided by the present invention.

FIG. 3 is a schematic diagram of the metal fins and heat pipes in the heat dissipation device according to the present invention.

Fig. 4 shows a cross-sectional view of the internal structure of the heat sink provided by the present invention.

Fig. 5 shows a table of axial distance versus axial temperature for different materials.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In order to solve the technical problem that the external conduction cooling method is not preferable for the collector of the traveling wave tube in the platform with narrow space and strict requirement on weight, such as missile-borne platform, the invention provides a heat dissipation device for the collector, which is shown in fig. 1 to 4, it is to be noted that the base structure of the heat dissipation device provided by the invention includes a top wall portion forming a heat dissipation cavity, but in order to clearly embody the internal structure of the heat dissipation device, the top wall portion of the base is not shown in fig. 2 to 4, but a person skilled in the art can understand that the base should include a complete external structure because the heat dissipation cavity inside the base is filled with a phase change material, but in the practical application process, for convenience of processing and manufacturing, the base may be designed to include a base body with an opening portion and a cover body (top wall portion) hermetically fixed at the opening portion of the base body, the invention is not limited thereto. In combination with the schematic structure, it is defined that the axial direction of the collector cooperating with the heat dissipation device is a first direction, the direction perpendicular to the first direction in the horizontal plane is a second direction, and the direction perpendicular to both the first direction and the second direction is a third direction.

Specifically, the heat dissipation device of the present invention includes:

a base body 1 having a heat dissipation cavity;

a plurality of metal fins 2 positioned in the heat dissipation cavity; and

the phase change material is filled among the plurality of metal fins 2 of the heat dissipation cavity; preferably, the phase-change material is a solid-liquid phase-change material;

in the invention, in order to facilitate the filling of the phase-change material, a charging hole 3 is reserved on one side of a base body 1 of the heat dissipation device, namely the base body 1 comprises a charging hole 3 for filling the phase-change material; as can be understood by those skilled in the art, the charging port 3 includes a feeding port for injecting the phase-change material into the heat dissipation chamber and a discharging port corresponding to the feeding port for replacing the phase-change material;

the outer surface of the substrate 1 includes a contact surface 11 for heat conduction corresponding to the collector 7.

Referring to fig. 2 to 4, in the structure of the heat dissipation device provided by the present invention, the heat dissipation device further includes a heat pipe 4 located in the heat dissipation cavity; the heat pipe 4 is located on the side of the metal fin 2 remote from the contact surface. In order to facilitate the assembly and fixation of the heat pipe 4, the metal fin 2 preferably includes a groove 21 for fixing the heat pipe 4. The heat pipe 4 comprises a pipe body with an inner cavity and inorganic working media filled in the inner cavity. The heat pipe 4 is an inorganic heat transfer heat pipe, and the element takes an inorganic working medium as a medium, is injected into various metal or nonmetal tubular sandwich plate cavities, and is formed into an element with a heat conduction characteristic after being formed in a closed mode. In the heat conduction process, the thermal resistance of the inorganic liquid mixture serving as a medium tends to zero, the vibration and the friction of molecules are generated after the inorganic liquid mixture is heated and excited, and the heat energy generated by excitation is rapidly transmitted in a wave shape from the heated end to the cold end along the cavity wall. In the whole heat transfer process, the surface of the element presents the characteristic that the thermal resistance tends to zero, the axial temperature difference tends to zero, and the heat conversion efficiency is extremely high. The inorganic heat transfer heat pipe used by the invention has the main characteristics of quick start and high heat conduction speed; the thermal resistance is small, the temperature uniformity is good, and the equivalent heat conductivity coefficient is 10-14 MW/m DEG C; high heat transfer capacity and axial heat flux density of 27.2MW/m²Radial heat flux density 158kW/m². Compared with the heat transfer performance of a pure metal material, the inorganic heat pipe has better heat transfer performance, as shown in fig. 5, the comparison of the heat transfer performance of the inorganic heat pipe and the metal shows that the temperature of the inorganic heat pipe along the length direction of the pipe is basically unchanged, and the temperature of other metal materials along the length direction of the pipe is obviously reduced according to the calculation of 3kW heat transferred per unit area. The use of the inorganic heat transfer heat pipe can further improve the conduction of the phase change material in the heat dissipation cavityThe heat capacity, especially to the phase change material of the side of the metal fin far away from the contact surface, realizes the full utilization of the heat storage performance of the phase change material.

In the course of the travelling wave tube's work, the heat distribution on the travelling wave tube collector is inhomogeneous, because phase change material's thermal conductivity is relatively poor, and travelling wave tube subassembly during operation heat distribution is inhomogeneous, thereby cause only partial phase change material in effectual operating condition, consequently, in order to make full use of phase change material's heat-retaining performance, must use heat transfer structure to lead the heat to the lower region of temperature (the one side that deviates from travelling wave tube collector 7 in heat dissipation chamber promptly), under the prerequisite of guaranteeing phase change heat reservoir capacity, metal fin 2 is in heat abstractor base member heat dissipation intracavity and is followed the third direction setting (be longitudinal distribution structure), the passageway that supplies phase change material to fill among a plurality of metal fins 2 extends along the first direction. The invention can effectively disperse the heat concentrated in the heated area (the heat at one side of the contact surface) by matching the metal fins 2 and the heat pipe 4, and the heat is transferred to the surrounding area of the heat dissipation cavity along the metal fins 2 and the heat pipe 4, so that the phase-change material can quickly absorb the heat, the temperature distribution is more uniform, and the structural design can solve the problem that part of the phase-change material does not work due to the non-uniform temperature of the collector to a certain extent.

The phase change material selected by the invention is a non-toxic and non-corrosive compound, so that a base body structure made of a metal material is considered, and from the heat conduction property, copper with the heat conduction coefficient of 390W/(m.K) is selected, but the density of the copper is 3.3 times that of aluminum, the traveling wave tube component has a strict requirement on weight, and aluminum with the heat conduction coefficient of 220W/(m.K) is selected as the material of the base body, and meanwhile, the aluminum metal is convenient for argon arc welding. When the base body is manufactured, firstly, in order to facilitate processing and manufacturing, the base body can be designed into a base body main body comprising an opening part and a cover body which is hermetically fixed at the opening part of the base body main body, the cover body is embedded into the opening part of the base body main body, then the base body main body and the cover body are welded by argon arc welding, the base body main body and the cover body are subjected to leak detection after welding, and the leak rate is smaller than 5 multiplied by 10^-3Pa·m³And s. After the phase change material is melted, the phase change material is fed from any screw feed portIs injected into the heat dissipation cavity; 3. the feed port was screwed in and tightened using an M4 screw. And finishing the packaging of the whole structure of the heat dissipation device. The packaging method can reliably package the phase-change material, and the phase-change material does not leak after being subjected to phase change under the working condition of the traveling wave tube assembly.

The invention selects phase-change materials, which are also called latent heat energy storage materials, and belongs to the field of energy materials. The phase-change material stores or dissipates energy by utilizing the property that a phase-change substance releases or absorbs a large amount of heat during phase change, and therefore the temperature of a working area is controlled, and the energy dissipated or absorbed in the phase-change process is called latent heat of phase change. The phase change forms of the phase change materials mainly include the following four forms: solid-solid, solid-gas, liquid-gas, solid-liquid. Solid-solid phase transition is a phase transition process in which the crystalline form of a phase change material changes, generally isothermal or approximately isothermal; solid-gas, liquid-gas and solid-liquid phase change processes respectively generate physical phenomena such as sublimation, evaporation, melting (melting) and the like, and the latent heat of phase change is gradually reduced due to the difference of phase change forms. The material with two phase change forms of solid-gas and liquid-gas has higher latent heat of phase change, but the gas generated by the phase change of the two forms occupies larger volume, and the platform used in combination with the invention has miniaturization requirement, so the two phase change forms are not considered. Although the phase change latent heat of the solid-liquid phase change form is smaller than that of the solid-gas phase change and the liquid-gas phase change, the volume change of the material in the phase change process is small, so that the phase change material of the solid-liquid phase change is an energy storage carrier capable of meeting the requirements of the invention. Calculating the volume of the phase-change material according to the relation V ═ P_dX t x rho/delta H, where V is the volume of the phase change material and P_dThe heat consumption of a heat source is adopted, t is the working time of the traveling wave tube, rho is the density of the phase change material, and deltaH is the latent heat of phase change of the phase change material. The maximum heat consumption of the target traveling wave tube is 240W, the non-environment-control working time is required to be 140s, the phase-change latent heat of the selected phase-change material is 330j/g, and the density is 1.5d/cm³. The volume of the phase change material obtained by the calculation was 67.87cm³The invention should make the capacity of the heat dissipation cavity larger than the value in the structural design of the heat dissipation device.

Travelling wave tube during operation collector utmost point produces a large amount of heats, and for realizing thermal dissipation, the heat that the travelling wave tube during operation produced will conduct to heat abstractor, and when the device temperature reached phase change material's phase change temperature, phase change material will take place the phase transition because of being heated, can absorb a large amount of phase change latent heats at its phase change in-process to the realization is to the quick conduction dissipation of a large amount of heats that collector utmost point produced. According to the requirements of practical application, the selected matrix structure should have physicochemical properties such as phase change temperature, phase change latent heat, density and no toxicity, which meet the application requirements, the using environment temperature of the traveling wave tube assembly using the invention is as high as 85 ℃, and the temperature of the heat insulation material under the collector of the traveling wave tube is required to be below 135 ℃, so the phase change temperature of the selected phase change material should be slightly lower than 135 ℃.

In one embodiment, the heat dissipation device comprises a plurality of heat pipes 4 located in the heat dissipation chamber;

the heat pipe 4 comprises a longitudinal heat pipe 41 arranged along a first direction; and a transverse heat pipe 42 disposed in a second direction. The longitudinal heat pipes 41 distributed longitudinally further enhance the temperature balance in the axial direction of the collector in the heat dissipation chamber, and the use of the transverse heat pipes 42 is beneficial to the heat conduction to each area of the heat dissipation chamber, so that the phase change material in the whole heat dissipation chamber can be uniformly heated, and the heat storage performance of the phase change material can be more fully utilized.

In one embodiment, as shown in fig. 3 and 4, the metal fins near the feeding port 3 are absent, and the absent metal fins form a space structure 5 near the feeding port of the heat dissipation chamber, the space structure 5 is configured to remove air from the heat dissipation chamber and sufficiently fill the phase-change material, and the space structure 5 can reduce the resistance of the phase-change material to filling the heat dissipation chamber, so that the phase-change material can be sufficiently injected and filled in the heat dissipation chamber.

In one embodiment, in order to ensure good contact between the collector 7 of the traveling wave tube and the substrate 1 and ensure heat conduction of the collector of the traveling wave tube, a heat conducting sheet 6 is designed between the contact surface 11 of the collector 7 and the substrate 1, and the heat conducting sheet 6 uses a copper sheet with double-sided embossing, and the embossing is fine so as to ensure good thermal contact between the contact surface of the substrate and the collector. The invention is not limited thereto.

As shown, in one particular embodiment, the contact surface 11 includes an axial contact surface 111 corresponding to a collector sidewall surface, and a radial contact surface 112 corresponding to a collector bottom surface; the axial contact surface 111 is an arc surface structure. To increase the heat transfer area between the substrate 1 and the collector in a limited space.

In the pattern structure provided by the invention, the appearance structure of the heat dissipation device is designed according to the appearance of the dual-channel traveling wave tube assembly, and the substrate comprises two contact surfaces which respectively correspond to the two collectors to form heat conduction. And a reasonable wiring channel is designed, and the channel between the two collector mounting positions can form the wiring channel so as to facilitate the passing and mounting of the high-voltage wire of the traveling wave tube component during mounting. Furthermore, in order to facilitate the filling of the phase-change material, two sets of charging openings which are respectively corresponding to the two collectors and used for filling the phase-change material are reserved on one side of the base body of the heat dissipation device; a metal fin near a charging opening is absent, and the absent metal fin forms a space structure near the charging opening of the heat dissipation cavity; the metal fins near the other filling opening are missing, and the missing metal fins form another space structure near the filling opening of the heat dissipation cavity.

The heat dissipation device structure provided by the invention is used in a dual-channel traveling wave tube assembly, and two traveling wave tubes do not work simultaneously, so that the difference of the transverse temperature distribution of the assembly is larger, and in order to solve the phenomenon, the heat tube with good heat conduction performance is used. The longitudinal heat pipes distributed along the first direction further strengthen the balance of the longitudinal temperature of the phase-change material in the heat dissipation cavity, and the transverse heat pipes distributed along the second direction are favorable for heat conduction to all areas of the heat dissipation cavity, so that the phase-change material in the whole heat dissipation cavity can be uniformly heated, and the heat storage performance of the phase-change material can be more fully utilized.

Referring to the attached drawings, in order to facilitate the installation of the heat dissipation device on the traveling wave tube structure, provide installation space and avoidance for the collector, and enable the collector to meet the use requirement in a narrow space, one side of the contact surface of the substrate comprises a step structure 12.

The test shows that when the temperature of the collector is 130 ℃, the phase-change material starts to change phase and melt, the temperature of the phase-change material is about 120 ℃, after 200s, the phase-change material is basically melted, the temperature of the collector of the traveling wave tube rises by 2 ℃ slowly in the process, and the test proves that the heat dissipation device provided by the invention can realize the control of the temperature of the collector of the traveling wave tube and realize the purpose that a large amount of heat generated at the collector can be quickly conducted and dissipated when the traveling wave tube works.

It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.