阅读说明：本技术 宽频振动信号传感器及其信号处理装置 (Broadband vibration signal sensor and signal processing device thereof ) 是由 高树国 相晨萌 刘宏亮 赵军 孟令明 张凡 贾云飞 于 2021-07-08 设计创作，主要内容包括：本发明提供一种宽频振动信号传感器及其信号处理装置,宽频振动信号传感器包括：包括：底座；外壳,罩设于所述底座；信号处理模块,设于所述容纳腔内或所述容纳腔外；压电组件,设于所述容纳腔内,并叠设于所述底座；压电元件,设于所述容纳腔内,并叠设于所述压电组件；以及弹性元件,设于所述容纳腔内,并叠设于所述压电元件,所述弹性元件背离所述压电元件的一侧连接于所述外壳内壁。本发明所提供的宽频振动信号传感器,通过设置压电元件和压电组件,且压电元件叠设于压电组件,能够对同一位置产生的低频振动信号和高频振动信号进行收集,减小了单独测量时因传感器安装位置不同导致的误差,使测量结果更准确。(The invention provides a broadband vibration signal sensor and a signal processing device thereof, wherein the broadband vibration signal sensor comprises: the method comprises the following steps: a base; the shell is covered on the base; the signal processing module is arranged in the accommodating cavity or outside the accommodating cavity; the piezoelectric component is arranged in the accommodating cavity and is stacked on the base; the piezoelectric element is arranged in the accommodating cavity and is superposed on the piezoelectric component; and the elastic element is arranged in the accommodating cavity and is overlapped on the piezoelectric element, and one side of the elastic element, which deviates from the piezoelectric element, is connected to the inner wall of the shell. According to the broadband vibration signal sensor provided by the invention, the piezoelectric element and the piezoelectric component are arranged, and the piezoelectric element is overlapped on the piezoelectric component, so that low-frequency vibration signals and high-frequency vibration signals generated at the same position can be collected, errors caused by different installation positions of the sensor during independent measurement are reduced, and the measurement result is more accurate.)

1. Broadband vibration signal sensor, its characterized in that includes:

a base;

the shell is covered on the base and forms an accommodating cavity together with the base;

the signal processing module is arranged in the accommodating cavity or outside the accommodating cavity;

the piezoelectric component is arranged in the accommodating cavity and is overlapped on the base, one end of the piezoelectric component is grounded, and the other end of the piezoelectric component is electrically connected with the signal processing module;

the piezoelectric element is arranged in the accommodating cavity and is overlapped on the piezoelectric assembly, one end of the piezoelectric element is grounded, and the other end of the piezoelectric element is electrically connected with the signal processing module; and

the elastic element is arranged in the accommodating cavity and is overlapped on the piezoelectric element, and one side of the elastic element, which deviates from the piezoelectric element, is connected to the inner wall of the shell.

2. The broadband vibration signal sensor according to claim 1, wherein the stacking direction of the piezoelectric element and the piezoelectric assembly is defined as an up-down direction, and the piezoelectric assembly includes:

the lower piezoelectric sheet is attached to the upper surface of the base, and the lower surface of the lower piezoelectric sheet is grounded;

the lower conducting plate is attached to the upper surface of the lower piezoelectric plate and is electrically connected with the signal processing module; and

and the upper piezoelectric sheet is attached to the upper surface of the lower conducting sheet and connected with the lower piezoelectric sheet in parallel, and the upper surface of the upper piezoelectric sheet is grounded.

3. The broadband vibration signal sensor of claim 2, wherein an upper conductive plate is disposed between the piezoelectric element and the upper piezoelectric plate, and an upper surface of the upper piezoelectric plate is grounded through the upper conductive plate.

4. The broadband vibration signal sensor of claim 3, wherein the base and the housing are made of metal, the upper conductive plate is grounded by being connected to the housing, and the lower surface of the lower piezoelectric plate is grounded by being attached to the base.

5. The broadband vibration signal sensor of claim 4, wherein an insulating sheet is disposed between the elastic element and the inner wall of the housing.

6. The broadband vibration signal sensor of claim 1, wherein the signal processing module comprises:

the first signal input interface is electrically connected with the piezoelectric component;

the first signal processing circuit is electrically connected with the first signal input interface and is used for processing the output signal of the piezoelectric component;

the second signal input interface is electrically connected with the piezoelectric element;

the second signal processing circuit is electrically connected with the second signal input interface, is connected with the first signal processing circuit in parallel and is used for processing the output signal of the piezoelectric element; and

and the signal output interface is electrically connected with the first signal processing circuit and the second signal processing circuit and is used for outputting the signals of the first signal processing circuit and the second signal processing circuit.

7. The broadband vibration signal sensor of claim 6, wherein the first signal processing circuit comprises an integrating circuit electrically connected to the first signal input interface, and a first amplifying circuit in series with the integrating circuit, the first amplifying circuit being electrically connected to the signal output interface; the second signal processing circuit comprises a second amplifying circuit electrically connected with the second signal input interface, and the second amplifying circuit is electrically connected with the signal output interface.

8. The broadband vibration signal sensor according to claim 6, wherein the signal processing module further comprises an adder, one end of the adder is electrically connected to both the first signal processing circuit and the second signal processing circuit, and the other end of the adder is electrically connected to the signal output interface, and the adder is configured to combine the amplified output signal of the piezoelectric assembly and the amplified output signal of the piezoelectric element into a single signal and output the single signal through the signal output interface.

9. The broadband vibration signal sensor of claim 1, wherein the base is provided with a mounting structure outside the receiving cavity.

10. A broadband vibration signal sensor signal processing apparatus comprising the broadband vibration signal sensor according to any one of claims 1 to 9.

Technical Field

The invention belongs to the technical field of sensors, and particularly relates to a broadband vibration signal sensor and a signal processing device thereof.

Background

The power transformer is the most core device in the power grid, and the safe operation of the power transformer is crucial to the stability of the power grid. In order to ensure the safe and stable operation of the transformer, the operation state of the transformer needs to be monitored in real time, so that the fault of the transformer can be found in time when the transformer breaks down, and the shutdown maintenance is further carried out.

When partial discharge fault occurs inside the transformer, a charge neutralization process can be generated, so that the area where the partial discharge occurs is heated instantaneously to expand, similarly to explosion, after the discharge is finished, the original area which is heated and expanded returns to the original volume, the density of the medium is changed instantaneously, ultrasonic waves are formed, and the ultrasonic waves are transmitted to the periphery. When a winding, an iron core or a structural member in the transformer fails, the lorentz force applied to the winding and the magnetostriction of the iron core change, and abnormal vibration is caused.

When the transformer is abnormal, a low-frequency vibration signal (0Hz-2000Hz) and a high-frequency vibration signal (namely, an ultrasonic signal, more than 20 kHz) are generated, the vibration frequency range is wide, in order to detect the low-frequency vibration signal and the high-frequency vibration signal, an acceleration sensor and an ultrasonic sensor are respectively used for detecting the transformer in the prior art, and the data error of the detection result is large.

Disclosure of Invention

The embodiment of the invention provides a broadband vibration signal sensor and a signal processing device thereof, and aims to solve the problem that in the prior art, in order to detect low-frequency and high-frequency vibration signals, an acceleration sensor and an ultrasonic sensor are respectively used for detecting a transformer, and the data error of a detection result is large.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

in a first aspect, the present invention provides a broadband vibration signal sensor, comprising: a base; the shell is covered on the base and forms an accommodating cavity together with the base; the signal processing module is arranged in the accommodating cavity or outside the accommodating cavity; the piezoelectric component is arranged in the accommodating cavity and is overlapped on the base, one end of the piezoelectric component is grounded, and the other end of the piezoelectric component is electrically connected with the signal processing module; the piezoelectric element is arranged in the accommodating cavity and is overlapped on the piezoelectric assembly, one end of the piezoelectric element is grounded, and the other end of the piezoelectric element is electrically connected with the signal processing module; and the elastic element is arranged in the accommodating cavity and is overlapped on the piezoelectric element, and one side of the elastic element, which deviates from the piezoelectric element, is connected to the inner wall of the shell.

In one possible implementation, a stacking direction of the piezoelectric element and the piezoelectric assembly is defined as an up-down direction, and the piezoelectric assembly includes: the lower piezoelectric sheet is attached to the upper surface of the base, and the lower surface of the lower piezoelectric sheet is grounded; the lower conducting plate is attached to the upper surface of the lower piezoelectric plate and is electrically connected with the signal processing module; and the upper piezoelectric sheet is attached to the upper surface of the lower conducting sheet and connected with the lower piezoelectric sheet in parallel, and the upper surface of the upper piezoelectric sheet is grounded.

In a possible implementation manner, an upper conductive sheet is arranged between the piezoelectric element and the upper piezoelectric sheet, and the upper surface of the upper piezoelectric sheet is grounded through the upper conductive sheet.

In a possible implementation manner, the base and the housing are made of metal, the upper conducting strip is connected with the housing and grounded, and the lower surface of the lower piezoelectric strip is grounded by being attached to the base.

In a possible implementation manner, an insulation sheet is arranged between the elastic element and the inner wall of the shell.

In one possible implementation, the signal processing module includes: the first signal input interface is electrically connected with the piezoelectric component; the first signal processing circuit is electrically connected with the first signal input interface and is used for processing the output signal of the piezoelectric component; the second signal input interface is electrically connected with the piezoelectric element; the second signal processing circuit is electrically connected with the second signal input interface, is connected with the first signal processing circuit in parallel and is used for processing the output signal of the piezoelectric element; and the signal output interface is electrically connected with the first signal processing circuit and the second signal processing circuit and is used for outputting the signals of the first signal processing circuit and the second signal processing circuit.

In one possible implementation, the first signal processing circuit includes an integrating circuit electrically connected to the first signal input interface, and a first amplifying circuit connected in series to the integrating circuit, the first amplifying circuit being electrically connected to the signal output interface; the second signal processing circuit comprises a second amplifying circuit electrically connected with the second signal input interface, and the second amplifying circuit is electrically connected with the signal output interface.

In a possible implementation manner, the signal processing module further includes an adder, one end of the adder is electrically connected to both the first signal processing circuit and the second signal processing circuit, and the other end of the adder is electrically connected to the signal output interface, and the adder is configured to combine the amplified output signal of the piezoelectric component and the amplified output signal of the piezoelectric element into one path of signal and output the signal through the signal output interface.

In one possible implementation, the base is provided with a mounting structure outside the receiving cavity.

Compared with the prior art, the broadband vibration signal sensor provided by the embodiment of the invention has the advantages that the piezoelectric element and the piezoelectric component are arranged, and the piezoelectric element is overlapped on the piezoelectric component, so that the low-frequency vibration signal and the high-frequency vibration signal generated at the same position can be collected, errors in data acquisition caused by different installation positions of the sensor during independent measurement are reduced, and the measurement result is more accurate; the piezoelectric element is stacked on the piezoelectric assembly, the elastic element is stacked on the piezoelectric element, the elastic element can provide certain preload for the piezoelectric element, the preload can eliminate gaps among parts, the overall rigidity is improved, and the signal detection is more accurate; piezoelectric element can play the effect of quality piece when piezoelectric assembly gathers low frequency vibration signal, and piezoelectric element also can measure high frequency vibration signal simultaneously, so set up, has integrated traditional two independent sensors, not only can detect high frequency vibration signal and low frequency vibration signal simultaneously, can also reduce part quantity, reduces the volume of sensor.

In a second aspect, the present invention further provides a broadband vibration signal sensor signal processing apparatus, including the broadband vibration signal sensor in any one of the above embodiments.

The signal processing device of the broadband vibration signal sensor provided by the embodiment of the invention comprises the broadband vibration signal sensor in any one of the embodiments, and by adopting the signal processing device of the broadband vibration signal sensor provided by the embodiment of the invention, the low-frequency vibration signal and the high-frequency vibration signal can be collected and processed at the same time, so that the difficulty in installation and collection of equipment is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a broadband vibration signal sensor according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a signal processing module according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a wideband vibration signal sensor signal processing apparatus according to an embodiment of the present invention.

Description of reference numerals:

1. wide-frequency vibration signal sensor

100. Base 110, mounting structure 200, shell

300. Signal processing module 310, first signal input interface 320, first signal processing circuit

321. Integrating circuit 322, first amplifying circuit 330, and second signal input interface

340. Second signal processing circuit 350, signal output interface 360, adder

400. Piezoelectric component 410, lower piezoelectric plate 420, lower conducting plate

430. Upper piezoelectric sheet 440, upper conductive sheet 500, and piezoelectric element

600. Elastic element 700, insulating sheet 800, and lead wire

2. Signal processing device of broadband vibration signal sensor

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to," "secured to," or "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on," "disposed on" another element, it can be directly on the other element or intervening elements may also be present. "plurality" means two or more. "at least one" refers to one or more quantities.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Referring to fig. 1 and fig. 2, an embodiment of the invention provides a broadband vibration signal sensor 1, including: a base 100; the shell 200 is covered on the base 100 and forms an accommodating cavity together with the base 100; the signal processing module 300 is arranged in the accommodating cavity or outside the accommodating cavity; the piezoelectric assembly 400 is arranged in the accommodating cavity and is overlapped on the base 100, one end of the piezoelectric assembly 400 is grounded, and the other end of the piezoelectric assembly 400 is electrically connected with the signal processing module 300; the piezoelectric element 500 is arranged in the accommodating cavity and is overlapped on the piezoelectric assembly 400, one end of the piezoelectric element 500 is grounded, and the other end of the piezoelectric element is electrically connected with the signal processing module 300; and the elastic element 600 is arranged in the accommodating cavity and is overlapped on the piezoelectric element 500, and one side of the elastic element 600, which is far away from the piezoelectric element 500, is connected to the inner wall of the shell 200.

In the embodiment of the present invention, the piezoelectric assembly 400 and the piezoelectric element 500 are both made of piezoelectric materials, and according to the piezoelectric effect of the piezoelectric materials, when a force acts on the piezoelectric materials, there is an electric charge or an electric voltage output. Specifically, the piezoelectric element 400 may detect a low-frequency vibration signal (0Hz to 2000Hz) generated when the transformer is abnormal, and convert the low-frequency vibration signal into an electric charge signal, and the piezoelectric element 500 may detect a high-frequency vibration signal (i.e., an ultrasonic signal, over 20000 Hz) generated when the transformer is abnormal, and convert the high-frequency vibration signal into a voltage signal, and output the voltage signal. It should be noted that the piezoelectric material may be selected according to actual use requirements, and the use of the piezoelectric material is not limited in the embodiments of the present invention.

When the broadband vibration signal sensor 1 provided by the embodiment of the invention is installed, the broadband vibration signal sensor is fixed at a position to be detected through the base 100, when a transformer fails and generates a low-frequency vibration signal and a high-frequency vibration signal, the low-frequency vibration signal and the high-frequency vibration signal are transmitted to the piezoelectric assembly 400 and the piezoelectric element 500 through the base 100, the piezoelectric assembly 400 can collect the low-frequency vibration signal, the piezoelectric element 500 can collect the high-frequency vibration signal, and the specific working principle is as follows:

a low-frequency vibration signal is transmitted to the inside of the housing 200 through the base 100, the same vibration as that of the base 100 and the piezoelectric element 400 is sensed by the piezoelectric element 500, the piezoelectric element 500 is subjected to an inertial force opposite to the acceleration direction, so that the piezoelectric element 500 has a force proportional to the acceleration acting on the piezoelectric element 400 to generate charges on the surface of the piezoelectric element 400, the charge signals generated by the piezoelectric element 400 are input to the signal processing module 300, the signals are collected and processed by the signal processing module 300, and the signal processing module 300 is usually arranged in the accommodating cavity in order to make the structure more compact; the high-frequency vibration signal is transmitted to the inside of the housing 200 through the base 100, the lower surface and the upper surface of the piezoelectric element 500 generate a voltage signal, the lower surface of the piezoelectric element 500 is grounded, the voltage signal generated by the upper surface of the piezoelectric element 500 is transmitted to the signal processing module 300, and the signal is collected and processed by the signal processing module 300.

It should be noted that, in order to improve the signal acquisition effect, when the broadband vibration signal sensor 1 is installed, an ultrasonic coupling agent may be coated between the base 100 and the connection surface of the position to be measured, so that the attenuation of ultrasonic waves can be reduced, and the sensitivity can be improved. In order to increase the interference resistance of the sensor and prevent the strain of the base 100 from being transmitted to the piezoelectric assembly 400, the base 100 is generally thickened or made of a material with higher rigidity. In order to facilitate the installation and fixation of the piezoelectric assembly 400, the base 100 can be further provided with an installation groove, the overall dimension of the installation groove is matched with the overall dimension of the piezoelectric assembly 400, the piezoelectric assembly 400 is arranged in the installation groove, and the inner wall of the installation groove can play a limiting role.

Compared with the prior art, the broadband vibration signal sensor 1 provided by the embodiment of the invention has the advantages that the piezoelectric element 500 and the piezoelectric component 400 are arranged, and the piezoelectric element 500 is stacked on the piezoelectric component 400, so that the low-frequency vibration signal and the high-frequency vibration signal generated at the same position can be collected, errors in data acquisition caused by different mounting positions of the sensors during independent measurement are reduced, and the measurement result is more accurate.

In the embodiment of the invention, the piezoelectric element 500 is stacked on the piezoelectric assembly 400, the elastic element 600 is stacked on the piezoelectric element 500, the elastic element 600 can provide a certain preload for the piezoelectric element 500, the preload can eliminate the gap between parts, the integral rigidity is improved, and the signal detection is more accurate; piezoelectric element 500 can play the effect of quality piece when piezoelectric assembly 400 gathers low frequency vibration signal, and piezoelectric element 500 also can measure high frequency vibration signal simultaneously, so sets up, has integrated two traditional independent sensors, not only can detect high frequency vibration signal and low frequency vibration signal simultaneously, can also reduce part quantity, reduces the volume of sensor.

Referring to fig. 1, in some possible embodiments, the stacking direction of the piezoelectric element 500 and the piezoelectric element 400 is defined as an up-down direction, and the piezoelectric element 400 includes: a lower piezoelectric plate 410 attached to the upper surface of the base 100, and the lower surface of the lower piezoelectric plate 410 is grounded; a lower conductive sheet 420 attached to the upper surface of the lower piezoelectric sheet 410 and electrically connected to the signal processing module 300; and an upper piezoelectric plate 430 attached to the upper surface of the lower conductive plate 420 and connected in parallel with the lower piezoelectric plate 410, wherein the upper surface of the upper piezoelectric plate 430 is grounded. The lower piezoelectric plate 410 and the base 100, the lower piezoelectric plate 410 and the lower conductive plate 420, the lower conductive plate 420 and the upper piezoelectric plate 430, and the upper piezoelectric plate 430 and the piezoelectric element 500 can be bonded by conductive adhesives, so that the relative position fixation is ensured, and the conduction between adjacent contact surfaces is also ensured.

In this embodiment, the upper piezoelectric plate 430 and the lower piezoelectric plate 410 have the same size, and the cross section thereof may be circular, square or other shapes, which is not limited in this embodiment. In order to ensure stable output of charge signals, the positions of the centers of gravity of the piezoelectric element 500, the upper piezoelectric sheet 430, the lower conductive sheet 420, and the lower piezoelectric sheet 410 correspond in the vertical direction. In order to ensure that all charge signals generated by the piezoelectric assembly 400 can be transmitted, the outline size of the lower conductive sheet 420 is larger than the outline sizes of the upper piezoelectric sheet 430 and the lower piezoelectric sheet 410, so as to ensure that the lower surface of the upper piezoelectric sheet 430 and the upper surface of the lower piezoelectric sheet 410 can be completely attached to the lower conductive sheet 420.

In practical applications, because the output charge amount of a single piezoelectric sheet is small, in a low-frequency vibration environment, the single piezoelectric sheet may not generate enough surface charges, which affects the sensitivity of signal acquisition. The piezoelectric assembly 400 in this embodiment adopts a parallel arrangement of the upper piezoelectric sheet 430 and the lower piezoelectric sheet 410, which can increase the charge amount of the piezoelectric assembly 400 and improve the sensitivity of low-frequency vibration signal acquisition.

It should be noted that, in this embodiment, the upper piezoelectric plate 430 and the lower piezoelectric plate 410 are connected in parallel, the upper surface of the upper piezoelectric plate 430 and the lower surface of the lower piezoelectric plate 410 are both anodes or both cathodes, and the upper surface and the lower surface of the lower piezoelectric plate 430 and the lower surface of the lower piezoelectric plate 410 are both connected by the wire 800 and then grounded, and the lower conductive plate 420 is electrically connected to the signal processing module 300 by the wire 800, so as to transmit the charge signals, which are output by the upper piezoelectric plate 430 and the lower piezoelectric plate 410 and used for representing the low-frequency vibration signals, to the signal processing module 300.

It is noted that in order to increase the sensitivity of the piezoelectric assembly 400, the upper piezoelectric sheet 430 and the lower piezoelectric sheet 410 should have uniform performance. In practical use, the upper piezoelectric sheet 430 and the lower piezoelectric sheet 410 may be made of the same type and production batch, so as to ensure the consistency of their performances. In order to improve the collecting effect of the vibration signal, the surface of the position to be measured, the upper surface and the lower surface of the base 100 should have high parallelism and surface smoothness, so as to avoid generating a gap between the base 100 and the surface of the position to be measured or the lower piezoelectric plate 410, which affects the transmission of the vibration signal.

Referring to fig. 1, in some possible embodiments, an upper conductive sheet 440 is disposed between the piezoelectric element 500 and the upper piezoelectric sheet 430, the upper surface of the upper piezoelectric sheet 430 is grounded through the upper conductive sheet 440, and the contour size of the upper conductive sheet 440 is larger than the contour sizes of the piezoelectric element 500 and the upper piezoelectric sheet 430, so as to ensure that the lower surface of the piezoelectric element 500 and the upper surface of the upper piezoelectric sheet 430 can be completely attached to the upper conductive sheet 440.

The present embodiment simplifies the arrangement by providing the upper conductive sheet 440 between the piezoelectric element 500 and the upper piezoelectric sheet 430, and the upper conductive sheet 440 can ground the upper piezoelectric sheet 430 and the piezoelectric element 500 at the same time. Similarly, in order to fix the position of the upper conductive sheet 440, the upper conductive sheet 440 and the piezoelectric element 500, and the upper conductive sheet 440 and the upper piezoelectric sheet 430 may be connected by bonding with conductive adhesives.

Referring to fig. 1, in some possible embodiments, the base 100 and the housing 200 are made of metal, the upper conductive sheet 440 is grounded by being connected to the housing 200, and the lower surface of the lower piezoelectric sheet 410 is grounded by being attached to the base 100.

In this embodiment, the housing 200 protects internal components, and during assembly, the housing 200 and the base 100 may be connected by a snap, a screw, a welding, or an adhesive. The base 100 and the housing 200 are made of metal, and by utilizing the conductive property of the metal material, the lower surface of the lower piezoelectric plate 410 is directly contacted with the base 100 to realize grounding, and the upper conductive plate 440 is connected with the housing 200 through the wire 800 to realize grounding.

Referring to fig. 1, in some possible embodiments, an insulation sheet 700 is disposed between the elastic element 600 and the inner wall of the housing 200. In this embodiment, by providing the insulating sheet 700, when the housing 200 is made of a metal material, the charge of the piezoelectric element 500 can be prevented from flowing away through the elastic element 600 and the housing 200, and of course, the insulating sheet 700 can be further disposed between the piezoelectric element 500 and the elastic element 600 to prevent the charge from being transferred from the piezoelectric element 500 to the elastic element 600. Specifically, the piezoelectric element 500 in this embodiment may adopt a spring, and for the convenience of mounting and fixing the spring, the inner wall of the housing 200 may be provided with a guide post, and the guide post is sleeved with the spring.

Referring to fig. 1 and 2, in some possible embodiments, the signal processing module 300 includes: a first signal input interface 310 electrically connected to the piezoelectric element 400; a first signal processing circuit 320 electrically connected to the first signal input interface 310 for processing the output signal of the piezoelectric assembly 400; a second signal input interface 330 electrically connected to the piezoelectric element 500; a second signal processing circuit 340 electrically connected to the second signal input interface 330 and connected in parallel to the first signal processing circuit 320 for processing the output signal of the piezoelectric element 500; and a signal output interface 350 electrically connected to both the first signal processing circuit 320 and the second signal processing circuit 340, for outputting signals of the first signal processing circuit 320 and the second signal processing circuit 340.

The signal processing module 300 in this embodiment can process the electrical signals output by the piezoelectric element 500 and the piezoelectric assembly 400, so that the broadband vibration signal sensor 1 provided by this embodiment can simultaneously detect and process the low-frequency vibration signal and the high-frequency vibration signal. The first signal input interface 310 and the second signal input interface 330 are electrically connected to the piezoelectric assembly 400 and the piezoelectric element 500, respectively, transmit electrical signals to the associated first signal processing circuit 320 and second signal processing circuit 340, and output processed signals via the signal output interface 350.

Referring to fig. 1 and fig. 2, in some possible embodiments, the first signal processing circuit 320 includes an integrating circuit 321 electrically connected to the first signal input interface 310, and a first amplifying circuit 322 connected in series to the integrating circuit 321, the first amplifying circuit 322 being electrically connected to the signal output interface 350; the second signal processing circuit 340 includes a second amplifying circuit electrically connected to the second signal input interface 330, and the second amplifying circuit is electrically connected to the signal output interface 350.

Since the electrical signals directly output by the piezoelectric assembly 400 and the piezoelectric element 500 are weak, the present embodiment can integrate and amplify the electrical signal (output by the lower conductive sheet 420) generated by the piezoelectric assembly 400 and used for representing the low-frequency vibration signal by providing the integrating circuit 321 and the first amplifying circuit 322, and then output by the signal output interface 350. Specifically, the integrating circuit 321 may be constituted by an operational amplifier and an RC circuit. The second amplification circuit includes a voltage amplifier, and by providing the second amplification circuit, the electric signal for representing the high-frequency vibration signal (ultrasonic signal) generated by the piezoelectric element 500 can be amplified and then output by the signal output interface 350.

Referring to fig. 1 and fig. 2, in some possible embodiments, the signal processing module 300 further includes an adder 360, one end of the adder 360 is electrically connected to both the first signal processing circuit 320 and the second signal processing circuit 340, and the other end of the adder 360 is electrically connected to the signal output interface 350, and the adder 360 is configured to combine the amplified output signal of the piezoelectric element 400 and the amplified output signal of the piezoelectric element 500 into a single signal and output the single signal through the signal output interface 350.

In this embodiment, by providing the adder 360, the signals with different frequency ranges output by the first amplifying circuit 322 and the second amplifying circuit 313 can be combined and output as one electrical signal.

Referring to fig. 1, in some possible embodiments, the base 100 is provided with a mounting structure 110 outside the accommodating cavity, and the sensor is fixed at the position to be measured through the mounting structure 110.

Specifically, the mounting structure 110 of this embodiment fixes the sensor in the position to be measured for seting up the fixed screw at base 100 through the bolt, and threaded connection installation is all convenient with the dismantlement, leads to base 100 and the position surface production clearance that awaits measuring in order to prevent that the bolt is not hard up, can also increase lock washer. In order to improve the transmission effect of the vibration signal, a fixing screw hole may be formed at a central position of the base 100, and the piezoelectric element 500 and the piezoelectric element 400 may be formed at a central position of a side of the base 100 opposite to the fixing screw hole.

Based on the same inventive concept, referring to fig. 1 and fig. 3, an embodiment of the invention provides a signal processing apparatus 2 for a broadband vibration signal sensor, including the broadband vibration signal sensor 1 according to any one of the above embodiments. It can be understood that the broadband vibration signal sensor signal processing apparatus 2 provided in the embodiment of the present invention further includes a signal conditioner electrically connected to the signal processing module 300, and a signal acquisition card electrically connected to the signal conditioner.

According to the embodiment of the invention, the signal conditioner is arranged, so that the voltage signal input into the signal conditioner can be processed, and the error is reduced. The signal acquisition card is connected behind the signal conditioner and can obtain the digital quantity of the voltage signal, and then the signal is output through the filter or the digital filtering technology, so that the embodiment of the invention can simultaneously collect and process the low-frequency vibration signal and the high-frequency vibration signal, and the difficulty of installation and collection of equipment is reduced.

The use method of the broadband vibration signal sensor signal processing device 2 provided by the embodiment of the invention comprises the following steps: fixing the broadband vibration signal sensor 1 at a position to be detected by using a magnetic clamp or a bolt; the signal processing module 300 is connected with a signal conditioner, and the signal conditioner can process signals; the rear end of the signal conditioner is connected with a signal acquisition card, and then a filter or a digital filtering technology is used for separating the voltage signal into a low-frequency vibration signal and a high-frequency ultrasonic signal. The signal conditioner has the capabilities of constant current power supply and high-frequency filtering, and is connected with the signal conditioner to supply power to the broadband vibration signal sensor 1 on the one hand and filter high-frequency noise above 200kHz on the other hand, so that the acquisition precision of a subsequent signal acquisition card is improved. The rear end of the signal conditioner is connected with a signal acquisition card for acquiring voltage signals.

In order to separate signals acquired by a signal acquisition card, the embodiment of the invention provides the following two solutions:

in the first scheme, after a signal acquisition card obtains the digital quantity of a voltage signal, digital filtering is carried out to separate the voltage signal into a low-frequency (lower than 2kHz) vibration signal and a high-frequency (20kHz-200kHz) ultrasonic signal;

and in the second scheme, two filters are connected behind the signal conditioner and then connected with two interfaces of the signal acquisition card, and the two filters are used for respectively taking out and measuring low-frequency and high-frequency signals in the signals.

The two modes can separate the signals collected by the signal collecting card, and can be selected according to actual conditions during operation.

It is to be understood that, in the foregoing embodiments, various parts may be freely combined or deleted to form different combination embodiments, and details of each combination embodiment are not described herein again, and after this description, it can be considered that each combination embodiment has been described in the present specification, and can support different combination embodiments.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.