阅读说明：本技术 光模块温度监控及校准方法以及装置 (Optical module temperature monitoring and calibrating method and device ) 是由 施科 彭显旭 杨辉 李林科 吴天书 杨现文 张健 于 2021-05-21 设计创作，主要内容包括：本发明提供了一种光模块温度监控及校准方法以及装置,该方法包括以下步骤：获取不同环境温度下的光模块PCBA温度以及Case温度；根据不同环境温度下的光模块PCBA温度以及Case温度获取光模块Case温度与PCBA温度之间的线性关系；通过温度传感芯片对光模块内部PCBA的温度进行监控,MCU根据温度传感芯片随PCBA温度变化的输出电压计算出PCBA监控温度；根据光模块PCBA监控温度以及上述光模块Case温度与PCBA温度之间的线性关系获取光模块Case温度作为最终的光模块工作温度上报。本发明将温度上报误差控制在一定的范围内,提高了温度上报的准确性,且方法简单可靠。(The invention provides a method and a device for monitoring and calibrating the temperature of an optical module, wherein the method comprises the following steps: acquiring PCBA temperature and Case temperature of an optical module at different environmental temperatures; acquiring a linear relation between the Case temperature and the PCBA temperature of the optical module according to the PCBA temperature and the Case temperature of the optical module at different environmental temperatures; monitoring the temperature of the PCBA in the optical module through the temperature sensing chip, and calculating the monitoring temperature of the PCBA by the MCU according to the output voltage of the temperature sensing chip along with the temperature change of the PCBA; and acquiring the optical module Case temperature as a final optical module working temperature report according to the optical module PCBA monitoring temperature and the linear relation between the optical module Case temperature and the PCBA temperature. The invention controls the temperature reporting error within a certain range, improves the accuracy of temperature reporting, and has simple and reliable method.)

1. An optical module temperature monitoring and calibrating method is characterized by comprising the following steps:

acquiring PCBA temperature and Case temperature of an optical module at different environmental temperatures;

acquiring a linear relation between the Case temperature and the PCBA temperature of the optical module according to the PCBA temperature and the Case temperature of the optical module at different environmental temperatures;

monitoring the temperature of the PCBA in the optical module through the temperature sensing chip, and calculating the monitoring temperature of the PCBA by the MCU according to the output voltage of the temperature sensing chip along with the temperature change of the PCBA;

and acquiring the optical module Case temperature as a final optical module working temperature report according to the optical module PCBA monitoring temperature and the linear relation between the optical module Case temperature and the PCBA temperature.

2. The method for monitoring and calibrating the temperature of an optical module according to claim 1, wherein: the linear relation formula between the Case temperature and the PCBA temperature of the optical module is as follows:

Temp＝T*slope+offset

wherein Temp is Case temperature, T is PCBA temperature, slope is temperature calibration coefficient, and offset is temperature compensation value.

3. The utility model provides an optical module temperature monitoring and calibrating device which characterized in that: the system comprises a test optical module, a temperature monitoring device, a temperature calibration device and a computer provided with GUI software;

the temperature monitoring device comprises a power supply chip, a temperature sensing chip and an MCU (microprogrammed control unit), wherein the power supply chip is connected with the temperature sensing chip and the MCU and used for providing working voltage for the temperature sensing chip and the MCU;

the temperature calibration device comprises a test circuit board, a temperature-adjustable closed box and a point thermometer, wherein the point thermometer is fixed on a tube shell of the test optical module and used for testing the Case temperature of the optical module, and the test optical module is inserted into the test circuit board and is arranged in the closed box;

changing the temperature in the closed box to ensure that the Case temperature of the test optical module changes between 0 ℃ and 70 ℃, adjusting the temperature calibration coefficient and the temperature compensation value of the linear relation between the Case temperature of the optical module in the GUI software and the PCBA temperature by comparing the Case temperature of the optical module measured by the point thermometers at the temperatures in different boxes with the PCBA temperature acquired by the GUI software, and acquiring the Case temperature of the optical module by the GUI software according to the PCBA monitoring temperature and the linear relation between the Case temperature of the optical module and the PCBA temperature and reporting the Case temperature.

4. A temperature monitoring and calibration device for optical modules according to claim 3, characterized in that: the model of the power supply chip is ADP196, the model of the temperature sensing chip is LM94023BITM, and the model of the MCU is ADuC7023 or ADuCM320 i.

5. The optical module temperature monitoring and calibrating device of claim 4, wherein: the 2V5 voltage output by the VREF pin of the MCU is used for providing working voltage for the temperature sensing chip, and the relation between the output voltage V of the temperature sensing chip and the temperature T of the PCBA is as follows:

V＝-8.2(mV/℃)*T(℃)+B

wherein V is the output voltage, T is the PCBA temperature, and B is a constant;

and the MCU calculates the PCBA monitoring temperature according to the output voltage by using the relational expression.

6. A temperature monitoring and calibration device for optical modules according to claim 3, characterized in that: the temperature calibration device further comprises a simulation optical module, a simulation test circuit board and an optical fiber, wherein the simulation optical module is placed on the simulation test circuit board, the test optical module is connected with the simulation optical module through the optical fiber, and after the simulation optical module works normally, the PRBS code pattern is sent to the test optical module, so that a simulated normal working scene is provided for the test optical module.

7. The optical module temperature monitoring and calibrating device of claim 6, wherein: the temperature calibration device also comprises a first switching power supply and a second switching power supply, wherein the first switching power supply is connected with the test circuit board and the test optical module and is used for providing working voltage for the test circuit board and the test optical module; the second switching power supply is connected with the analog circuit board and the analog optical module and used for providing working voltage for the analog circuit board and the analog optical module.

8. A temperature monitoring and calibration device for optical modules according to claim 3, characterized in that: the temperature-adjustable closed box is a temperature-adjustable incubator.

9. A temperature monitoring and calibration device for optical modules according to claim 3, characterized in that: the temperature-adjustable sealed box is a wooden sealed box, and the temperature in the wooden sealed box is changed through the rapid temperature impact box.

Technical Field

The invention belongs to the field of optical modules, and particularly relates to an optical module temperature monitoring and calibrating method and device.

Background

The working temperature of the optical module is generally between 0 ℃ and 70 ℃, and exceeds the working temperature range, so that various working performances and indexes of the optical module can be deteriorated, and internal components of the optical module can be seriously damaged. Therefore, the PCBA Temperature inside the optical module needs to be monitored in real time, and since the actual working Temperature of the optical module generally uses the Case Temperature (Case Temperature) as a standard, the Case Temperature of the optical module needs to be measured to calibrate the Temperature reported by the GUI software, so that the Temperature reporting error is controlled within a certain range.

Disclosure of Invention

The invention aims to provide a method and a device for monitoring and calibrating the temperature of an optical module, which aim to realize real-time monitoring of the temperature of a PCBA (printed circuit board assembly) in the optical module and calibrate the reported temperature, so that the reported error of the temperature is controlled within a certain range.

The invention is realized by the following steps:

in one aspect, the invention provides an optical module temperature monitoring and calibrating method, which includes the following steps:

acquiring PCBA temperature and Case temperature of an optical module at different environmental temperatures;

acquiring a linear relation between the Case temperature and the PCBA temperature of the optical module according to the PCBA temperature and the Case temperature of the optical module at different environmental temperatures;

monitoring the temperature of the PCBA in the optical module through the temperature sensing chip, and calculating the monitoring temperature of the PCBA by the MCU according to the output voltage of the temperature sensing chip along with the temperature change of the PCBA;

and acquiring the optical module Case temperature as a final optical module working temperature report according to the optical module PCBA monitoring temperature and the linear relation between the optical module Case temperature and the PCBA temperature.

Further, the linear relation formula between the Case temperature and the PCBA temperature of the optical module is as follows:

Temp＝T*slope+offset

wherein Temp is Case temperature, T is PCBA temperature, slope is temperature calibration coefficient, and offset is temperature compensation value.

On the other hand, the invention also provides an optical module temperature monitoring and calibrating device, which comprises a test optical module, a temperature monitoring device, a temperature calibrating device and a computer provided with GUI software;

the temperature monitoring device comprises a power supply chip, a temperature sensing chip and an MCU (microprogrammed control unit), wherein the power supply chip is connected with the temperature sensing chip and the MCU and used for providing working voltage for the temperature sensing chip and the MCU;

the temperature calibration device comprises a test circuit board, a temperature-adjustable closed box and a point thermometer, wherein the point thermometer is fixed on a tube shell of the test optical module and used for testing the Case temperature of the optical module, and the test optical module is inserted into the test circuit board and is arranged in the closed box;

changing the temperature in the closed box to ensure that the Case temperature of the test optical module changes between 0 ℃ and 70 ℃, adjusting the temperature calibration coefficient and the temperature compensation value of the linear relation between the Case temperature of the optical module in the GUI software and the PCBA temperature by comparing the Case temperature of the optical module measured by the point thermometers at the temperatures in different boxes with the PCBA temperature acquired by the GUI software, and acquiring the Case temperature of the optical module by the GUI software according to the PCBA monitoring temperature and the linear relation between the Case temperature of the optical module and the PCBA temperature and reporting the Case temperature.

Further, the model of the power supply chip is ADP196, the model of the temperature sensing chip is LM94023BITM, and the model of the MCU is ADuC7023 or ADuCM320 i.

Further, the operating voltage is provided for the temperature sensing chip by using the 2V5 voltage output by the VREF pin of the MCU, and the relation between the output voltage V of the temperature sensing chip and the PCBA temperature T is as follows:

V＝-8.2(mV/℃)*T(℃)+B

wherein V is the output voltage, T is the PCBA temperature, and B is a constant;

and the MCU calculates the PCBA monitoring temperature according to the output voltage by using the relational expression.

Furthermore, the temperature calibration device also comprises an analog optical module, an analog test circuit board and an optical fiber, wherein the analog optical module is placed on the analog test circuit board, the test optical module is connected with the analog optical module through the optical fiber, and after the analog optical module works normally, the PRBS code pattern is sent to the test optical module, so that a simulated normal working scene is provided for the test optical module.

Furthermore, the temperature calibration device also comprises a first switching power supply and a second switching power supply, wherein the first switching power supply is connected with the test circuit board and the test optical module and is used for providing working voltage for the test circuit board and the test optical module; the second switching power supply is connected with the analog circuit board and the analog optical module and used for providing working voltage for the analog circuit board and the analog optical module.

Further, the temperature-adjustable airtight box is a temperature-adjustable incubator.

Further, the temperature-adjustable sealed box is a wooden sealed box, and the temperature in the wooden sealed box is changed through the rapid temperature impact box.

Compared with the prior art, the invention has the following beneficial effects:

according to the optical module temperature monitoring and calibrating method and device, the temperature of the PCBA in the optical module is monitored through the temperature sensing chip, the PCBA monitoring temperature is calculated by the MCU according to the output voltage of the temperature sensing chip changing along with the temperature of the PCBA, real-time monitoring of the temperature of the PCBA of the optical module is achieved, the Case temperature of the optical module is obtained as a final working temperature report of the optical module according to the monitoring temperature of the PCBA of the optical module and a linear relation formed between the Case temperature of the optical module and the PCBA temperature, the reported temperature is made to be close to the actual working temperature of the optical module to the maximum extent, temperature reporting errors are controlled within a certain range, accuracy of temperature report is improved, and the method is simple and reliable.

Drawings

Fig. 1 is a circuit diagram of a temperature monitoring device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a temperature calibration device according to an embodiment of the present invention;

fig. 3 is a relationship between voltage sampled by the MCU before and after calibration and temperature reported by GUI software according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The embodiment of the invention provides an optical module temperature monitoring and calibrating method, which comprises the following steps:

s1, acquiring PCBA temperature and Case temperature of the optical module at different environmental temperatures;

s2, acquiring a linear relation between the Case temperature and the PCBA temperature of the optical module according to the PCBA temperature and the Case temperature of the optical module under different environmental temperatures;

s3, monitoring the temperature of the PCBA inside the optical module through the temperature sensing chip, and calculating the PCBA monitoring temperature by the MCU according to the output voltage of the temperature sensing chip changed along with the temperature of the PCBA;

and S4, acquiring the optical module Case temperature as the final optical module working temperature report according to the optical module PCBA monitoring temperature and the linear relation between the optical module Case temperature and the PCBA temperature.

The optical module temperature monitoring and calibrating method provided by the embodiment of the invention monitors the temperature of the PCBA in the optical module through the temperature sensing chip, the MCU calculates the PCBA monitoring temperature according to the output voltage of the temperature sensing chip changing along with the temperature of the PCBA, realizes the real-time monitoring of the PCBA temperature of the optical module, as the actual working temperature of the optical module generally takes the Case temperature as the standard, therefore, the Case temperature of the optical module needs to be measured to calibrate the originally reported PCBA temperature, the embodiment of the invention acquires the Case temperature of the optical module as the final working temperature report of the optical module according to the monitoring temperature of the PCBA of the optical module and the linear relation between the Case temperature of the optical module and the PCBA temperature, the reporting temperature is close to the actual working temperature of the optical module to the maximum extent, the reporting error of the temperature is controlled within a certain range, the accuracy of temperature reporting is improved, and the method is simple and reliable.

Through a great deal of research, the inventor finds that the Case temperature of the optical module and the PCBA temperature obtained by the temperature sensing chip and the MCU are in a linear relationship, and the formula is as follows:

Temp＝T*slope+offset

wherein Temp is Case temperature, T is PCBA temperature, slope is temperature calibration coefficient, and offset is temperature compensation value.

Therefore, the optical module Case temperature can be acquired according to the optical module PCBA temperature by utilizing the linear relation and reported as the final working temperature of the optical module.

To implement the above method, as shown in fig. 1 and fig. 2, an embodiment of the present invention further provides an optical module temperature monitoring and calibrating device, which includes a test optical module, a temperature monitoring device, a temperature calibrating device, and a computer with GUI software installed therein.

As shown in fig. 1, the temperature monitoring device includes a power chip, a temperature sensing chip and an MCU, in the preferred embodiment, the power chip employs a power chip ADP196 of ADI corporation, the temperature sensing chip employs a temperature sensing chip LM94023BITM of TI corporation, the MCU employs an ADuC7023 of ADI corporation or an MCU chip of ADuCM320i series, and the MCU chip, the temperature sensing chip and the power chip are all soldered on a PCB inside the optical module. The power chip is connected with the temperature sensing chip and the MCU, and the power chip provides 3V 3's supply voltage for the MCU, utilizes the 2V5 voltage of MCU's VREF pin output (this pin drive current of MCU is 1mA) to provide operating voltage for the temperature sensing chip (operating current is microampere level), the temperature sensing chip is connected with the MCU, the output voltage of temperature sensing chip is along with the temperature variation of the inside PCBA of test optical module, MCU samples in real time and calculates PCBA control temperature according to output voltage and transmits for GUI software.

The temperature sensing chip LM94023BITM has small packaging size, occupies small PCB area, has working voltage of 1.5V-5.5V and typical working current value of 5.4uA, and can work within the range of-50 ℃ to 150 ℃. Within the range of-50 ℃ to 150 ℃, the output voltage V of the temperature sensing chip LM94023BITM is in linear relation with the temperature T. MCU samples the output voltage V of temperature sensing chip LM94023BITM, through sampling the different voltage value of within the 0 ~ 70 ℃ temperature interval internal output, through curve fitting, can obtain that the relation of output voltage V and PCBA temperature T that MCU sampled is linear relation:

wherein V is in mV; the unit of T is; (T1, V1) and (T2, V2) are two arbitrary points in the temperature range of 0-70 ℃.

When the GS pin of the temperature sensing chip LM94023BITM is connected with 2V5, namely GS is high level, the linear coefficient is-8.2 mV/DEG C, and the relation between the output voltage V of the temperature sensing chip and the temperature T of the PCBA is as follows:

V＝-8.2(mV/℃)*T(℃)+B

wherein V is the output voltage, T is the PCBA temperature, and B is a constant;

and the MCU calculates the PCBA monitoring temperature according to the output voltage by using the relational expression. Within the range of 0-70 ℃, the precision error of the temperature T acquired by the temperature sensing chip LM94023BITM is within +/-1.8 ℃.

As shown in fig. 2, the temperature calibration device includes a test circuit board, a temperature adjustable sealed box, and a point thermometer. The point thermometer is fixed on the tube shell of the test optical module and used for testing the Case temperature of the optical module, and particularly, a wire end of the point thermometer can be wound in the middle of the metal tube shell of the test optical module by using a high-temperature adhesive tape; the test optical module (1# optical module) is inserted into the test circuit board (1# test circuit board) and is placed in the sealed box, the sealed box with the adjustable temperature can be a temperature-adjustable incubator, or the sealed box with the adjustable temperature is a wooden sealed box, and the temperature in the wooden sealed box is changed through the rapid temperature impact box. Preferably, the temperature calibration device further comprises an analog optical module (2# optical module), an analog test circuit board (2# test circuit board) and an optical fiber, the analog optical module is placed on the analog test circuit board, the test optical module is connected with the analog optical module through the optical fiber, and after the analog optical module works normally, the PRBS code pattern is sent to the test optical module, so that a simulated normal working scene is provided for the test optical module. Furthermore, the temperature calibration device also comprises a first switching power supply and a second switching power supply, wherein the first switching power supply is connected with the test circuit board and the test optical module and is used for providing working voltage for the test circuit board and the test optical module; the second switching power supply is connected with the analog circuit board and the analog optical module and used for providing working voltage for the analog circuit board and the analog optical module.

The temperature in the closed box is changed, so that the Case temperature of the test optical module is changed between 0 ℃ and 70 ℃, the temperature calibration coefficient and the temperature compensation value of the linear relation between the Case temperature of the optical module and the PCBA temperature in the GUI software are adjusted by comparing the Case temperature of the optical module measured by the point thermometer at the temperature in different boxes with the PCBA temperature obtained by the GUI software, the GUI software obtains the Case temperature of the optical module according to the PCBA monitoring temperature and the linear relation between the Case temperature of the optical module and the PCBA temperature and reports the Case temperature to the GUI software, and finally the monitoring temperature reported by the GUI software is basically consistent with the Case temperature of the optical module measured by the point thermometer and is within an acceptable error range.

Specifically, a USB interface of a computer is utilized, a test optical module on a test circuit board is accessed through an IIC, the reported temperature of the optical module can be monitored through a GUI software interface, and a temperature calibration coefficient and a temperature compensation value of the optical module are set. Before calibration, when the difference between the monitored temperature reported by the GUI software and the Case temperature of the optical module measured by the thermometer is large, the temperature calibration coefficient needs to be adjusted, and temperature compensation is carried out. According to the sampling characteristics of the MCU, the ADC sampling value Temp of the temperature reported by the GUI software and the ADC sampling value of the temperature T before calibration are in a linear relation, and the following formula is shown:

Temp＝T*slope+offset

slope is a temperature calibration coefficient, and a temperature monitoring value can be greatly changed; the offset is a temperature compensation value, and can be used for fine adjustment of a temperature monitoring value.

As shown in fig. 3, the upper and lower straight lines are respectively a relationship between the voltage v (mv) sampled by the MCU before and after calibration and the temperature T (deg.c) reported by the GUI software, and the discrete point is the CASE temperature of the optical module tested by the point thermometer after calibration, so that the calibration error is small.

As shown in the following table, Monitor Temp (. degree. C.) is the reported temperature displayed by the GUI software, Case Real Temp (. degree. C.) is the actual optical module shell temperature measured by the point thermometer, and Error (. degree. C.) is the difference between them.

As can be seen from the above table, the errors of the reported temperature displayed by the GUI and the temperature of the optical module shell obtained by the optical module temperature monitoring and calibrating method and apparatus according to the embodiments of the present invention are within ± 2 ℃, and meet the specification requirements.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.