阅读说明：本技术 基于微带天线的温度传感器及系统 (Temperature sensor and system based on microstrip antenna ) 是由 不公告发明人 于 2020-07-06 设计创作，主要内容包括：本发明涉及基于微带天线的温度传感器及系统,具体而言,涉及温度传感领域。本发明提供了一种基于微带天线的温度传感器包括：辐射贴片、绝缘衬底和金属底板；绝缘衬底设置在金属底板的一侧,辐射贴片设置在绝缘衬底远离金属底板的一侧,辐射贴片设挖设有第一孔洞、第二孔洞、第三孔洞和第四孔洞内均填充有热膨胀材料,天线谐振频率对辐射贴片的形变非常敏感,当外界温度变化时,本申请提供的温度传感器第一孔洞、第二孔洞、第三孔洞和第四孔洞的体积均发生变化,使得辐射贴片上的电流路径改变,从而导致温度传感器的天线谐振频率的变化,通过该温度传感器的天线谐振频率偏移量的变化与温度的对应关系,得到环境温度。(The invention relates to a temperature sensor and a system based on a microstrip antenna, in particular to the field of temperature sensing. The invention provides a temperature sensor based on a microstrip antenna, which comprises: a radiation patch, an insulating substrate and a metal base plate; insulating substrate sets up the one side at metal substrate, the radiation paster sets up the one side of keeping away from metal substrate at insulating substrate, the radiation paster is established to dig and is equipped with first hole, the second hole, it has thermal expansion material all to fill in third hole and the fourth hole, antenna resonant frequency is very sensitive to the deformation of radiation paster, when ambient temperature changes, the first hole of temperature sensor that this application provided, the second hole, the volume of third hole and fourth hole all changes, make the current path change on the radiation paster, thereby lead to temperature sensor's antenna resonant frequency's change, the change of antenna resonant frequency offset through this temperature sensor and the corresponding relation of temperature, obtain ambient temperature.)

1. A microstrip antenna based temperature sensor, the temperature sensor comprising: a radiation patch, an insulating substrate and a metal base plate; the radiation patch is arranged on one side, away from the metal base plate, of the insulating substrate, the radiation patch is provided with a first hole, a second hole, a third hole and a fourth hole in an excavated mode, the first hole, the second hole, the third hole and the fourth hole are axisymmetric patterns, the symmetry axis of the first hole is perpendicular to the symmetry axis of the second hole, the symmetry axis of the third hole is perpendicular to the symmetry axis of the fourth hole, the symmetry axis of the first hole is parallel to the symmetry axis of the third hole, the symmetry axis of the second hole is parallel to the symmetry axis of the third hole, and thermal expansion materials are filled in the first hole, the second hole, the third hole and the fourth hole.

2. The microstrip antenna based temperature sensor according to claim 1, wherein the first aperture, the second aperture, the third aperture and the fourth aperture are in any one of a rectangular shape, an isosceles triangle shape and an isosceles trapezoid shape.

3. The microstrip antenna based temperature sensor according to claim 2, wherein the first hole and the third hole have equal cross-sectional areas, and the second hole and the fourth hole have equal cross-sectional areas.

4. The microstrip antenna based temperature sensor according to claim 3, wherein the radiating patch has a size of 35mm x 2mm, the insulating substrate has a size of 35mm x 1mm, and the metal bottom plate has a size of 35mm x 5 mm.

5. A microstrip antenna based temperature sensor according to any of claims 1-4, wherein the thermal expansion material is polymethyl methacrylate.

6. A microstrip antenna based temperature sensor according to any one of claims 1-4, wherein the material of the radiating patch is any one of gold, silver and copper.

7. A microstrip antenna based temperature sensor according to any one of claims 1-4, wherein the metal base plate is made of any one of gold, silver and copper.

8. A microstrip antenna based temperature sensor according to any one of claims 1-4 wherein the insulating substrate is made of any one of silicon dioxide and aluminum oxide.

9. A microstrip antenna based temperature sensor system, the temperature sensor system comprising: a spectrum analyzer and a temperature sensor as claimed in any one of claims 1 to 8, said spectrum analyzer being adapted to detect the frequency spectrum of said temperature sensor.

Technical Field

The invention relates to the field of temperature sensing, in particular to a temperature sensor and a system based on a microstrip antenna.

Background

A temperature sensor (temperature transducer) refers to a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument and has a plurality of varieties. The sensor is classified into a thermal resistor and a thermocouple according to the characteristics of the sensor material and the electronic component.

The thermal resistance is a resistance value of metal which changes along with temperature. For different metals, the resistance value changes differently for each degree of temperature change, and the resistance value can be directly used as an output signal. The thermal resistance is divided into two variation types of positive temperature coefficient and negative temperature coefficient.

The thermocouple consists of two wires of different materials, welded together at the ends. The temperature of the heating point can be accurately known by measuring the ambient temperature of the unheated part. It is called a thermocouple because it must have conductors of two different materials. Thermocouples made of different materials are used in different temperature ranges, and their sensitivity is different.

The sensitivity of the thermocouple refers to the variation of the output potential difference when the temperature of the heating point changes by 1 ℃. For most metal-supported thermocouples, this value is between about 5 and 40 microvolts/deg.C.

Both the thermal resistor and the thermocouple sensor convert temperature signals into electrical signals, but when sound is converted into the electrical signals in the prior art, the loss is large, so that the temperature measurement is inaccurate.

Disclosure of Invention

The present invention is directed to provide a temperature sensor and a system based on a microstrip antenna, which solve the problems that both a thermistor and a thermocouple sensor in the prior art convert a temperature signal into an electrical signal, but the prior art has a large loss when converting sound into the electrical signal, so that temperature measurement is inaccurate.

In order to achieve the above purpose, the embodiment of the present invention adopts the following technical solutions:

in a first aspect, the present application provides a microstrip antenna based temperature sensor, the temperature sensor comprising: a radiation patch, an insulating substrate and a metal base plate; the insulating substrate is arranged on one side of the metal base plate, the radiation patch is arranged on one side of the insulating substrate far away from the metal base plate, the radiation patch is provided with a first hole, a second hole, a third hole and a fourth hole, the first hole, the second hole, the third hole and the fourth hole are axisymmetric patterns, the symmetry axis of the first hole is perpendicular to the symmetry axis of the second hole, the symmetry axis of the third hole is perpendicular to the symmetry axis of the fourth hole, the symmetry axis of the first hole is parallel to the symmetry axis of the third hole, the symmetry axis of the second hole is parallel to the symmetry axis of the third hole, and thermal expansion materials are filled in the first hole, the second hole, the third hole and the fourth hole.

Optionally, the shape of the first hole, the second hole, the third hole, and the fourth hole is any one of a rectangle, an isosceles triangle, and an isosceles trapezoid.

Optionally, the first and third holes have equal cross-sectional areas, and the second and fourth holes have equal cross-sectional areas.

Optionally, the radiating patch has a size of 35mm x 2mm, the insulating substrate has a size of 35mm x 1mm, and the metal bottom plate has a size of 35mm x 5 mm.

Optionally, the thermally expansive material is polymethyl methacrylate.

Optionally, the material of the radiation patch is any one of gold, silver and copper.

Optionally, the material of the metal base plate is any one of gold, silver and copper.

Optionally, the insulating substrate is made of any one of silicon dioxide and aluminum oxide.

In a second aspect, the present invention further provides a microstrip antenna-based temperature sensor system, where the temperature sensor system includes: a spectrum analyser and the temperature sensor of any one of the first to the second aspects, the spectrum analyser being arranged to detect the frequency spectrum of the temperature sensor.

The invention has the beneficial effects that:

the invention provides a temperature sensor based on a microstrip antenna, which comprises: a radiation patch, an insulating substrate and a metal base plate; the insulating substrate is arranged on one side of the metal base plate, the radiation patch is arranged on one side of the insulating substrate far away from the metal base plate, the radiation patch is provided with a first hole, a second hole, a third hole and a fourth hole which are dug, the first hole, the second hole, the third hole and the fourth hole are in axisymmetric patterns, the symmetry axis of the first hole is perpendicular to the symmetry axis of the second hole, the symmetry axis of the third hole is perpendicular to the symmetry axis of the fourth hole, the symmetry axis of the first hole is parallel to the symmetry axis of the third hole, the symmetry axis of the second hole is parallel to the symmetry axis of the third hole, thermal expansion materials are filled in the first hole, the second hole, the third hole and the fourth hole, the working principle of the microstrip antenna shows that the antenna resonant frequency is very sensitive to deformation of the radiation patch, and when the external temperature changes, the first hole of the temperature sensor provided by the application is very sensitive to deformation of the radiation patch, The thermal expansion materials in the second hole, the third hole and the fourth hole expand, so that the volumes of the first hole, the second hole, the third hole and the fourth hole are changed, the current path on the radiation patch is changed, the antenna resonant frequency of the temperature sensor is changed, and accurate temperature can be obtained through the corresponding relation between the change of the antenna resonant frequency offset of the temperature sensor and the temperature. In addition, the temperature sensor converts the temperature into the change of the resonant frequency, so that the temperature obtained by measuring the resonant frequency is more accurate, and meanwhile, the temperature sensor has the advantages of low cost, light weight and easiness in integration due to the structural design based on the microstrip antenna.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic cross-sectional view of a microstrip antenna-based temperature sensor according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a radiation patch of a temperature sensor based on a microstrip antenna according to an embodiment of the present invention;

fig. 3 is a schematic view of a radiation patch of another microstrip antenna-based molecular detector according to an embodiment of the present invention;

fig. 4 is a schematic view of a radiation patch of another microstrip antenna-based molecular detector according to an embodiment of the present invention.

Icon: 1-radiation patch; 11-a first hole; 12-a second hole; 13-third holes; 14-fourth hole; 2-an insulating substrate; 3-metal bottom plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiment is a metal plate embodiment of the present invention, and not all embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In order to make the implementation of the present invention clearer, the following detailed description is made with reference to the accompanying drawings.