阅读说明：本技术 光阻烘烤设备 (Photoresist baking equipment ) 是由 黄帅 于 2019-03-26 设计创作，主要内容包括：本公开提供一种光阻烘烤设备,涉及半导体技术领域。该光阻烘烤设备包括烘烤炉、加热盘、支撑针、第一驱动装置、测温装置、第二驱动装置和第一控制装置。加热盘设于烘烤炉内且具有加热面和背面；支撑针可滑动地穿过加热盘；第一驱动装置与支撑针的连接端连接；测温装置设于烘烤炉内,能检测基材的温度并输出检测温度；第二驱动装置设于烘烤炉内,能驱动测温装置朝向或背向加热盘移动；第一控制装置能响应控制信号,并根据检测温度控制第一驱动装置调节支撑端伸出加热面的距离,直至检测温度满足预设条件；以及控制第二驱动装置使测温装置与支撑针同步移动,以使测温装置与支撑端在垂直于加热面方向上的距离为大于基材厚度的预设间距。(The utility model provides a photoresistance baking equipment relates to semiconductor technology field. The photoresist baking equipment comprises a baking oven, a heating plate, a supporting pin, a first driving device, a temperature measuring device, a second driving device and a first control device. The heating plate is arranged in the baking oven and is provided with a heating surface and a back surface; the supporting needle can slidably penetrate through the heating plate; the first driving device is connected with the connecting end of the supporting needle; the temperature measuring device is arranged in the baking oven and can detect the temperature of the base material and output the detected temperature; the second driving device is arranged in the baking oven and can drive the temperature measuring device to move towards or back to the heating plate; the first control device can respond to the control signal and control the first driving device to adjust the distance of the supporting end extending out of the heating surface according to the detected temperature until the detected temperature meets the preset condition; and controlling the second driving device to enable the temperature measuring device and the supporting needle to move synchronously, so that the distance between the temperature measuring device and the supporting end in the direction vertical to the heating surface is a preset distance larger than the thickness of the base material.)

1. A photoresist baking apparatus, comprising:

a baking oven;

the heating plate is arranged in the baking furnace and is provided with a heating surface and a back surface which are opposite to each other;

the supporting needle can slidably penetrate through the heating plate and is provided with a supporting end and a connecting end, and the supporting end is used for supporting the base material;

the first driving device is connected with the connecting end of the supporting needle and is used for driving the supporting needle to do reciprocating linear movement;

the temperature measuring device is arranged in the baking furnace, is opposite to the heating surface, and is used for detecting the temperature of the base material and outputting the detected temperature;

the second driving device is arranged in the baking oven, is connected with the temperature measuring device and is used for driving the temperature measuring device to move towards or back to the heating plate;

the first control device is used for responding to a control signal and controlling the first driving device to adjust the distance of the supporting end extending out of the heating surface according to the detected temperature until the detected temperature meets a preset condition; and controlling the second driving device to enable the temperature measuring device and the supporting needle to synchronously move so that the distance between the temperature measuring device and the supporting end in the direction vertical to the heating surface is a preset distance larger than the thickness of the base material.

2. The photoresist baking apparatus of claim 1, wherein the temperature measuring device comprises:

the mounting frame is connected with the second driving device and is arranged opposite to the heating surface;

a plurality of temperature detection devices fixed to the mounting frame, for detecting temperatures of a plurality of regions of the base material and outputting a plurality of detected temperatures;

the detection temperature meeting the preset conditions comprises:

the average value of the detected temperatures is equal to the target temperature; alternatively, the number of detected temperatures equal to the target temperature is not less than a threshold value.

3. The photoresist baking apparatus of claim 1, wherein the plurality of temperature sensing devices comprises a center temperature sensing device and a plurality of edge temperature sensing devices, the edge temperature sensing devices being arranged in a plurality of concentric circles around the center temperature sensing device.

4. The photoresist baking apparatus of claim 2, wherein the mounting frame is a mesh structure.

5. The photoresist baking apparatus of claim 1, wherein the second driving device comprises:

the base is fixed in the baking oven, is positioned on one side of the temperature measuring device, which is far away from the heating surface, and is arranged opposite to the heating surface;

the power piece is fixed on the base;

the connecting piece is simultaneously connected with the power piece and the temperature measuring device; the power part can drive the connecting piece to drive the temperature measuring device to move towards or back to the heating plate.

6. The photoresist baking apparatus of claim 2, further comprising:

the second control device is used for determining a height value corresponding to the target temperature according to the target temperature and a preset corresponding relation after responding to a starting signal containing the target temperature, controlling the first driving device according to the height value to enable the distance between the supporting end and the heating surface to be the height value, and generating a control signal;

the preset corresponding relation comprises a plurality of different target temperatures and a plurality of different height values, and the target temperatures and the height values are in one-to-one correspondence; and in any two of the height values, the height value corresponding to the larger target temperature is smaller than the height value corresponding to the smaller target temperature.

7. The photoresist baking apparatus of claim 1, further comprising:

and the exhaust pipe is communicated with the baking oven and is used for exhausting gas in the baking oven.

8. The photoresist baking apparatus according to any one of claims 1 to 5, wherein the heating plate is formed by splicing a plurality of heating parts, and each heating part independently generates heat.

9. The photoresist baking apparatus according to any one of claims 1 to 5, wherein the number of the support pins is at least three and is uniformly distributed around the center of the heating plate.

10. The photoresist baking apparatus of any one of claims 1 to 5, wherein the distance between the temperature measuring device and the substrate is greater than 0 and less than 1 mm.

Technical Field

The disclosure relates to the technical field of semiconductors, in particular to photoresist baking equipment.

Background

Photoresist is a material commonly used in the semiconductor manufacturing field, and generally needs to be baked when in use, so as to reduce the solvent content and improve the adhesion. In the fabrication of semiconductor devices such as memories, there are generally multiple processes in which a photoresist on a substrate needs to be baked for photolithography or other processes, but baking temperatures required in the different processes are different.

Disclosure of Invention

The present disclosure provides a photoresist baking apparatus, which can improve the working efficiency and reduce the cost.

According to an aspect of the present disclosure, there is provided a photoresist baking apparatus including:

a baking oven;

the heating plate is arranged in the baking furnace and is provided with a heating surface and a back surface which are opposite to each other;

the supporting needle can slidably penetrate through the heating plate and is provided with a supporting end and a connecting end, and the supporting end is used for supporting the base material;

the first driving device is connected with the connecting end of the supporting needle and is used for driving the supporting needle to do reciprocating linear movement;

the temperature measuring device is arranged in the baking furnace, is opposite to the heating surface, and is used for detecting the temperature of the base material and outputting the detected temperature;

the second driving device is arranged in the baking oven, is connected with the temperature measuring device and is used for driving the temperature measuring device to move towards or back to the heating plate;

the first control device is used for responding to a control signal and controlling the first driving device to adjust the distance of the supporting end extending out of the heating surface according to the detected temperature until the detected temperature meets a preset condition; and controlling the second driving device to enable the temperature measuring device and the supporting needle to synchronously move so that the distance between the temperature measuring device and the supporting end in the direction vertical to the heating surface is a preset distance larger than the thickness of the base material.

In an exemplary embodiment of the present disclosure, the temperature measuring device includes:

the mounting frame is connected with the second driving device and is arranged opposite to the heating surface;

a plurality of temperature detection devices fixed to the mounting frame, for detecting temperatures of a plurality of regions of the base material and outputting a plurality of detected temperatures;

the detection temperature meeting the preset conditions comprises:

the average value of the detected temperatures is equal to the target temperature; alternatively, the number of detected temperatures equal to the target temperature is not less than a threshold value.

In an exemplary embodiment of the present disclosure, the plurality of temperature detection devices includes a center temperature detection device and a plurality of edge temperature detection devices, and the edge temperature detection devices are distributed in a plurality of concentric circles around the center temperature detection device.

In an exemplary embodiment of the present disclosure, the mounting frame is a mesh structure.

In an exemplary embodiment of the present disclosure, the second driving device includes:

the base is fixed in the baking oven, is positioned on one side of the temperature measuring device, which is far away from the heating surface, and is arranged opposite to the heating surface;

the power piece is fixed on the base;

the connecting piece is simultaneously connected with the power piece and the temperature measuring device; the power part can drive the connecting piece to drive the temperature measuring device to move towards or back to the heating plate.

In an exemplary embodiment of the present disclosure, the photoresist baking apparatus further includes:

the second control device is used for determining a height value corresponding to the target temperature according to the target temperature and a preset corresponding relation after responding to a starting signal containing the target temperature, controlling the first driving device according to the height value to enable the distance between the supporting end and the heating surface to be the height value, and generating a control signal;

the preset corresponding relation comprises a plurality of different target temperatures and a plurality of different height values, and the target temperatures and the height values are in one-to-one correspondence; and in any two of the height values, the height value corresponding to the larger target temperature is smaller than the height value corresponding to the smaller target temperature.

In an exemplary embodiment of the present disclosure, the photoresist baking apparatus further includes:

and the exhaust pipe is communicated with the baking oven and is used for exhausting gas in the baking oven.

In an exemplary embodiment of the present disclosure, the heating plate is formed by splicing a plurality of heating portions, and each of the heating portions independently generates heat.

In an exemplary embodiment of the present disclosure, the number of the support pins is at least three, and is uniformly distributed around the center of the heating plate.

In an exemplary embodiment of the present disclosure, the distance between the temperature measuring device and the substrate is greater than 0 and less than 1 mm.

This disclosed photoresistance toasts equipment, under the condition that does not change the heating temperature of heating plate, the accessible is adjusted the distance that the supporting pin stretches out the heating surface, changes the distance between substrate and the heating surface, realizes toasting the substrate with different temperatures, avoids adjusting the temperature of heating plate or sets up a plurality of toasting equipment to improve work efficiency, reduce cost. Meanwhile, the temperature of the base material on the supporting end of the supporting needle can be measured through the temperature measuring device, the detection temperature is output, the distance from the supporting end to the heating surface is adjusted according to the detection temperature until the detection temperature meets the preset condition, the supporting needle is adjusted according to the temperature of the base material, the temperature of the base material always meets the requirement, and the baking effect is improved. In addition, the first control device can control the supporting needle and the temperature measuring device to move synchronously, so that the distance between the temperature measuring device and the base material is constant, and the accuracy of temperature measurement is ensured.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

Fig. 1 is a schematic view of a photoresist baking apparatus in a first state according to an embodiment of the disclosure.

Fig. 2 is a schematic view of a photoresist baking apparatus in a second state according to an embodiment of the disclosure.

Fig. 3 is a schematic view of a photoresist baking apparatus in a third state according to an embodiment of the disclosure.

Fig. 4 is a schematic circuit block diagram of a photoresist baking apparatus according to an embodiment of the disclosure.

Fig. 5 is a top view of the heating plate and the support pin of the photoresist baking apparatus according to the embodiment of the disclosure.

Fig. 6 is a bottom view of a temperature measuring device of a photoresist baking apparatus according to an embodiment of the disclosure.

FIG. 7 is a diagram illustrating the relationship between the height of the supporting pins of the photoresist and the target temperature at a heating temperature according to one embodiment of the present disclosure.

Fig. 8 is a schematic view of a photoresist baking apparatus and a transfer device according to an embodiment of the disclosure.

Description of reference numerals:

100. a substrate; 1. a baking oven; 2. heating the plate; 21. heating the surface; 22. a back side; 3. a supporting needle; 4. a first driving device; 5. a temperature measuring device; 51. a mounting frame; 511. an annular strip; 512. a connecting strip; 52. a temperature detection device; 6. a second driving device; 61. a base; 62. a power member; 63. a connecting member; 7. a first control device; 8. a second control device; 9. an exhaust pipe; 10. a bracket; 11. a stopper; 12. a transfer device.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and the like are used merely as labels, and are not limiting on the number of their objects.

The embodiment of the present disclosure provides a photoresist baking apparatus for baking a photoresist on a substrate, where the substrate may be a wafer used for manufacturing semiconductor devices such as a memory, and the substrate is not particularly limited herein as long as the substrate is used for carrying the photoresist to be baked.

As shown in fig. 1 and 4, the photoresist baking apparatus includes a baking oven 1, a heating plate 2, a supporting pin 3, a first driving device 4, a temperature measuring device 5, a second driving device 6 and a first control device 7, wherein:

the heating plate 2 is disposed in the baking oven 1 and has a heating surface 21 and a back surface 22 opposite to each other. The support pin 3 slidably penetrates the heating plate 2, and has a support end for supporting the substrate 100 and a connection end. The first driving device 4 is connected with the connecting end of the supporting needle 3 and is used for driving the supporting needle 3 to do reciprocating linear movement. The temperature measuring device 5 is disposed in the baking oven 1, and is disposed opposite to the heating surface 21, and is configured to detect the temperature of the substrate 100 and output a detection temperature.

The second driving device 6 is arranged in the baking oven 1, is connected with the temperature measuring device 5, and is used for driving the temperature measuring device 5 to move towards or back to the heating plate 2. The first control device 7 is used for responding to a control signal and controlling the first driving device 4 to adjust the distance of the supporting end extending out of the heating surface 21 according to the detected temperature until the detected temperature meets the preset condition; and controlling the first driving device 4 and the second driving device 6 to move synchronously so that the distance between the temperature measuring device 5 and the substrate 100 is a preset distance.

For convenience of description, in this specification, the distance by which the supporting end of the supporting pin 3 protrudes from the heating surface 21 is defined as the height of the supporting pin 3; the heating temperature of the heating plate 2 is the temperature of the heating surface 21 of the heating plate 2; the detected temperature is the detected temperature of the substrate 100.

The photoresistance baking equipment of the embodiment of the disclosure, under the condition that does not change the heating temperature of heating plate 2, the accessible is adjusted the height of supporting pin 3, changes the distance between substrate 100 and the heating surface 21, realizes toasting substrate 100 with different temperatures, avoids adjusting the temperature of heating plate 2 or sets up a plurality of baking equipment to improve work efficiency, reduce cost. Meanwhile, the temperature of the substrate 100 on the supporting end of the supporting pin 3 can be measured through the temperature measuring device 5, the detection temperature is output, the height of the supporting pin 3 is adjusted according to the detection temperature until the preset condition of the detection temperature is met, the supporting pin 3 is adjusted according to the temperature of the substrate 100, the temperature of the substrate 100 meets the requirement all the time, and the baking effect is improved. In addition, when the supporting needle 3 moves, the first control device 7 can control the temperature measuring device 5 and the supporting needle 3 to move synchronously, so that the distance between the temperature measuring device 5 and the base material 100 is constant, and the accuracy of temperature measurement is ensured.

As shown in FIGS. 1 to 3, FIG. 1 shows a first state of the photoresist baking apparatus, in which the supporting pins 3 have a height h₁I.e. the distance between the substrate 100 and the heating surface 21 is h₁(ii) a The distance between the temperature measuring device 5 and the base material 100 is L; at this time, the temperature of the substrate 100 detected by the temperature measuring device 5, i.e., the detected temperature, is assumed to be T₁。

The second state of the resist baking apparatus is shown in FIG. 2, in which the height of the supporting pins 3 is h₂I.e. the distance between the substrate 100 and the heating surface 21 is h₂(ii) a The distance between the temperature measuring device 5 and the base material 100 is still L; at this time, the temperature of the substrate 100 detected by the temperature measuring device 5, i.e., the detected temperature, is assumed to be T₂。

Fig. 3 shows the photoresist baking apparatus in a third state, in which the height of the supporting pins 3 is 0, i.e. the substrate 100 is attached to the heating surface 21; the distance between the temperature measuring device 5 and the base material 100 is still L; at this time, the temperature of the substrate 100 detected by the temperature measuring device 5, i.e., the detected temperature, is assumed to be T₃。

Wherein the heating temperature of the heating surface 21 is constant, L is constant, and T is constant₃＞T₂＞T₁。

The following describes each part of the photoresist baking apparatus according to the embodiment of the present disclosure in detail:

as shown in fig. 1 to 3, the oven 1 may have an oven cavity, and the shape and size thereof are not particularly limited thereto. The oven cavity of the oven 1 may accommodate the heating plate 2, the substrate 100, and the like therein, and the oven 1 has an opening that can be opened and closed to carry in or out the substrate 100.

In order to facilitate the exhaust of the gas in the baking oven 1, an exhaust pipe 9 may be disposed on the baking oven 1, the exhaust pipe 9 may be communicated with the oven cavity for guiding the exhaust of the gas in the oven cavity, and the gas in the baking oven 1 may be pumped by an exhaust pump or other pumping devices.

In order to facilitate the transfer of the substrate 100, as shown in fig. 8, a transfer device 12 may be disposed at one side of the photoresist baking apparatus, the substrate 100 may be placed on the heating plate 2 in the furnace cavity by the transfer device 12, and the substrate 100 on the heating plate 2 may also be moved out of the furnace cavity, and the specific structure of the transfer device 12 is not particularly limited as long as the transfer of the substrate 100 is achieved.

As shown in fig. 1-3 and 5, the heating plate 2 can be disposed in the baking oven 1 and can generate heat to bake the substrate 100. In order to fix the heating plate 2, a bracket 10 may be provided in the baking oven 1, and the heating plate 2 may be fixed to the bracket 10, and the specific structure of the bracket 10 is not particularly limited as long as the heating plate 2 can be mounted.

The shape of the heating pan 2 may be circular, rectangular, or other shapes, and is not particularly limited herein. Meanwhile, the heating plate 2 has a heating surface 21 and a back surface 22 opposite to each other, and during heating, the substrate 100 may be disposed opposite to the heating surface 21, that is, the substrate 100 is disposed on a side of the heating surface 21 away from the back surface 22, and an orthographic projection of the substrate 100 on a plane of the heating surface 21 is located in the heating surface 21, so that the heating surface 21 radiates heat to the substrate 100. When the heating plate 2 is horizontally fixed to the baking oven 1, the heating surface 21 is an upper surface of the heating plate 2, the back surface 22 is a lower surface thereof, and the substrate 100 may be positioned above the heating surface 21.

The specific structure and heating principle of the heating plate 2 are not particularly limited, as long as the heating function can be achieved, for example, the heating plate 2 may include a housing and a heating circuit in the housing, and after the heating circuit is powered on, the housing can be powered on to generate heat. In addition, the temperature of the heating plate 2 can be adjusted, for example, by adjusting the input current or voltage, the heating temperature of the heating plate 2 can be adjusted, and the heating temperature can be 90 ℃ to 400 ℃, and of course, can be more than 400 ℃ or less than 90 ℃.

The heating plate 2 may be formed by splicing a plurality of heating units, and each heating unit may independently generate heat, so that a plurality of heating temperatures may be simultaneously output, and when the substrate 100 is attached to the heating surface 21, different regions of the substrate 100 may be heated at different temperatures. Of course, the heating plate 2 can also be of an integral structure, i.e. only one heating temperature can be output at a time.

In addition, as shown in fig. 3, when the supporting end of the supporting pin 3 is completely retracted into the heating plate 2, the substrate 100 is attached to the heating surface 21, and in order to limit the position of the substrate 100 and prevent the substrate 100 from shifting along the heating surface 21, a plurality of stoppers 11 may be disposed on the heating surface 21, each stopper 11 may surround the side of the substrate 100 to limit the position of the substrate 100, and meanwhile, in order to facilitate the taking and placing of the substrate 100, the stoppers 11 may be telescopically connected to the heating plate 2, and the stoppers 11 may be driven by a telescopic device to extend or retract into the heating surface 21.

As shown in fig. 1 to 3 and 5, the support pin 3 may have a support end and a connection end, and the support pin 3 passes through the heating plate 2 and is perpendicular to the heating plate 2; the supporting pins 3 can be slidably fitted to the heating plate 2 so as to be reciprocally movable with respect to the heating plate 2, so that the height of the supporting pins 3 can be adjusted, thereby adjusting the distance between the base material 100 and the heating plate 2. Specifically, the length of the supporting pin 3 is greater than the thickness of the heating plate 2, the supporting end extends to the heating surface 21 side of the heating plate 2 along with the movement of the supporting pin 3, the connecting end extends to the back surface 22 side of the heating plate 2, and the distance that the supporting end can penetrate out of the heating surface 21 along with the movement of the supporting pin 3 is greater than 0 or equal to 0, that is, the supporting pin extends out of or retracts into the heating plate 2, the supporting pin can support the substrate 100 when extending out of the heating surface 21, and the heating surface 21 can support the substrate 100 when retracting into the heating plate 2.

As shown in fig. 5, the number of the supporting pins 3 is at least three, such as three, four, etc., each supporting pin 3 can be uniformly distributed around the center of the heating plate 2, and the supporting end of each supporting pin 3 extends out of the heating surface 21 by the same amount, so that the substrate 100 is parallel to the heating surface 21, and the substrate 100 can be heated uniformly all over. Of course, the number of the supporting pins 3 may be two or one as long as the substrate 100 can be supported.

As shown in fig. 1-3, the first driving device 4 can be connected to the connecting end of the supporting pin 3 and can drive the supporting pin 3 to move linearly and reciprocally to adjust the distance between the substrate 100 and the heating surface 21, and the supporting pin 3 can be stopped at a plurality of positions by controlling the first driving device 4.

For example, the first driving means 4 may include a connection frame and a linear motor, which may be connected to the supporting needle 3 through the connection frame and may drive the supporting needle 3 to reciprocate. Of course, the first driving device 4 may have other structures as long as it can perform the reciprocating linear movement of the supporting needle 3 and can stay at a plurality of positions.

As shown in fig. 1 to 3, the temperature measuring device 5 may be disposed in the baking oven 1 and opposite to the heating surface 21, and the substrate 100 may be disposed between the temperature measuring device 5 and the heating plate 2, and the temperature measuring device 5 may detect the temperature of the substrate 100 and output the detected temperature. For example, as shown in fig. 6, the temperature measuring device 5 may include a mounting frame 51 and a plurality of temperature detecting means 52, wherein:

the mounting bracket 51 may be disposed opposite the heating surface 21. The mounting frame 51 may also be a net structure such that the air flow can pass through the mounting frame 51 to facilitate the exhaust of the oven 1, for example, the mounting frame 51 may include a plurality of ring-shaped strips 511 and a plurality of connecting strips 512, the plurality of ring-shaped strips 511 have different diameters and are concentrically arranged, each connecting strip 512 is radially arranged around the center of the ring-shaped strip 511 and converges at the center of the ring-shaped strip 511, and each connecting strip 512 is simultaneously cross-connected with each ring-shaped strip 511. Alternatively, the mounting frame 51 may be a flat plate structure with a plurality of through holes.

Of course, the mounting frame 51 is not a net structure, but may be a solid structure, for example, the mounting frame 51 is a solid flat plate.

Each temperature detection device 52 is fixed to the mounting frame 51, and can detect the temperature of a plurality of regions of the base material 100 corresponding to a plurality of different regions of the base material 100, and each temperature detection device 52 can output one detection temperature, so that the temperature measuring device 5 can output a plurality of detection temperatures. The temperature detection device 52 may be a temperature sensor, such as an infrared temperature sensor, a thermal resistance temperature sensor, or the like, as long as it can detect the temperature of the substrate 100.

As shown in fig. 6, the plurality of temperature detecting devices 52 may include a center temperature detecting device and a plurality of edge temperature detecting devices, which are distributed in a plurality of concentric circles around the center temperature detecting device. For example, for the mounting frame 51 including the annular strip 511 and the connecting strip 512, the central temperature detecting device may be disposed at a point where the connecting strips 512 converge, and the edge temperature detecting devices 52 may be disposed at intersections of the annular strip 511 and the connecting strips 512 in a one-to-one correspondence manner.

Of course, the plurality of temperature detecting devices 52 may be distributed in other manners, for example, the plurality of temperature detecting devices 52 may be distributed in a rectangular array, and the like.

As shown in fig. 1 to 3, the second driving device 6 is disposed in the baking oven 1 and connected to the temperature measuring device 5, and can drive the temperature measuring device 5 to move toward or away from the heating plate 2, and when the heating plate 2 is horizontally placed, the second driving device 6 drives the temperature measuring device 5 to vertically reciprocate. For example, the second driving device 6 comprises a base 61, a power member 62 and a connecting member 63, wherein:

the base 61 can be fixed in the baking oven 1, and is located on one side of the temperature measuring device 5 away from the heating surface 21, and is opposite to the heating surface 21, and the specific structure of the base 61 is not particularly limited herein.

The power member 62 can be fixed on the base 61, and the power member 62 can be a linear motor, a pneumatic cylinder or other devices capable of outputting linear motion, which is not listed here, of course, the power member 62 can also include a rotary motor and a transmission assembly capable of converting the rotation output by the rotary motor into linear motion, for example, the transmission assembly can be a screw-nut mechanism or the like.

The connecting member 63 can be connected to both the power member 62 and the temperature measuring device 5, for example, to the mounting frame 51 of the temperature measuring device 5, so that the power member 62 can drive the temperature measuring device 5 to move toward or away from the heating plate 2 through the connecting member 63. The connecting member 63 may be a rigid connecting rod or a flexible chain, so long as the temperature measuring device 5 is driven to move.

Of course, the second driving device 6 may also be of other structures, for example, the second driving device 6 may be a cylinder or a hydraulic cylinder, etc., which can be directly connected with the temperature measuring device 5 to drive the temperature measuring device 5 to move towards or away from the heating plate 2.

As shown in fig. 4, the first control device 7 can receive the detected temperature and a control signal outputted by the temperature measuring device 5, and in response to the control signal, control the first driving device 4 to adjust the distance that the supporting end of the supporting pin 3 extends out of the heating surface 21 according to the detected temperature, i.e. adjust the height of the supporting pin 3 until the detected temperature meets a preset condition, at which time, it indicates that the temperature of the substrate 100 meets the requirement. The first control device 7 may be a control device such as a single chip microcomputer or a programmable logic controller, or may be a computer or other equipment as long as the above functions are realized.

In one embodiment, the thermometric apparatus 5 includes a plurality of temperature detecting devices 52, and detecting that the temperature satisfies the preset condition includes: the average value of the respective detected temperatures is equal to the target temperature. The target temperature is the temperature required for baking the photoresist set according to the baking standard, and if the average value of all the detected temperatures is equal to the target temperature, the heating temperature can be judged to meet the requirement. Specifically, if the average value of the detected temperatures is greater than the target temperature, the first control device 7 may control the first driving device 4 to increase the height of the supporting pins 3 and move the substrate 100 away from the heating surface 21 to lower the detected temperature to be equal to the target temperature; if the average value of the detected temperatures is smaller than the target temperature, the first control device 7 may control the first driving device 4 to decrease the height of the supporting pins 3 to bring the substrate 100 closer to the heating surface 21, so as to increase the detected temperature to be equal to the target temperature.

In another embodiment, the preset conditions include: the number of detected temperatures equal to the target temperature is not less than a threshold value. For example, the target temperature is 100 ℃, the number of detected temperatures is 10, and the threshold value is 8; if 8 detected temperatures are equal to 100 ℃, judging that the detected temperatures meet preset conditions; and if 7 detected temperatures are equal to 100 ℃, judging that the detected temperatures do not meet the preset conditions.

As shown in fig. 1-3, the first control device 7 can control the second driving device 6 to move the temperature measuring device 5 and the supporting pin 3 synchronously while controlling the supporting pin 3 to move, so that the distance between the temperature measuring device 5 and the supporting end in the direction perpendicular to the heating surface 21 is always kept at a predetermined distance, the predetermined distance is greater than the thickness of the substrate 100, for example, the substrate 100 is a wafer, and the predetermined distance is greater than the thickness of the wafer, thereby ensuring the accuracy of temperature detection. On the premise of not affecting the surface of the substrate 100, the temperature measuring device 5 should be as close to the substrate 100 as possible, and the distance between the temperature measuring device 5 and the substrate 100 is greater than 0 and not greater than 1mm, such as 0.5mm, 1mm, etc., of course, the distance between the temperature measuring device 5 and the substrate 100 may also be greater than 1 mm.

In order to further improve the working efficiency, as shown in fig. 4, in an embodiment, the photoresist baking apparatus of the present disclosure may further include a second control device 8, where the second control device 8 receives a start signal, the start signal may be sent by an external device or input directly to the photoresist baking apparatus through an input device by a user, and the start signal includes the target temperature.

The second control device 8 is capable of responding to the start signal, determining a height value corresponding to the target temperature according to the target temperature and a preset corresponding relation, controlling the first driving device 4 to enable the height of the supporting needle 3 to be the height value according to the height value, and generating the control signal input to the first control device 7. The second control device 8 may be a control device such as a single chip microcomputer or a programmable logic controller, or a computer, as long as the above functions are realized. Meanwhile, the second control device 8 and the first control device 7 can be integrated in the same singlechip, programmable logic controller and other control devices, or integrated in the same computer and other equipment.

The preset corresponding relation can comprise a plurality of different target temperatures and a plurality of different height values, the plurality of target temperatures and the plurality of height values are in one-to-one correspondence, and in any two height values, the height value corresponding to the larger target temperature is smaller than the height value corresponding to the smaller target temperature. Meanwhile, the height value in the preset corresponding relationship includes 0, the supporting end of the supporting pin 3 can be completely retracted into the heating surface 21 at a certain preset temperature, and the target temperature corresponding to 0 may be the temperature of the heating surface 21. As shown in fig. 7, the relationship between the target temperature T and the height value h at a heating temperature is shown in fig. 7, and it can be seen that each target temperature T corresponds to a height value h, for example: the target temperature T is 300 deg.c and the corresponding target height h is 0, and at this time, as shown in fig. 3, the support ends of the support pins 3 are retracted into the heating plate 2, and the base material 100 is attached to the heating surface 21. For another example: the target temperature T is 100 deg.c and the corresponding target height h is 20mm, and at this time, the height of the supporting pins 3 is 20mm, that is, the supporting pins 3 extend 20mm from the heating surface 21, so that the distance between the substrate 100 and the heating surface 21 is 20 mm.

During operation, the second control device 8 can drive the first driving device 4 to move the supporting pins 3 to make the height of the supporting pins 3 be a height value determined according to the target temperature, and generate control signals, and then the first control device 7 can control the first driving device 4 and the second driving device 6 according to the detection temperature of the temperature measuring device 5 to finely adjust the height of the supporting pins 3, so that the detection temperature of the base material 100 meets the preset condition. This can further improve the work efficiency.

The predetermined relationship may be determined experimentally, for example, by selecting a heating temperature at which the height values of the supporting pins 3 are associated when the temperature of the substrate 100 reaches a plurality of target temperatures. Note that the height values corresponding to the same target temperature are different for different heating temperatures.

In another embodiment, the photoresist baking apparatus of the present disclosure does not include the second control device 8, and the control signal may be sent by the user through an input device or other external device, instead of being output by the second control device 8. The first driving device 4 can be directly controlled by the first control device 7 according to the detected temperature of the temperature measuring device 5, and the distance that the supporting end of the supporting needle 3 extends out of the heating surface 21 is adjusted until the detected temperature meets the preset condition, which has been described above and will not be described again.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.