阅读说明：本技术 柔性调光面板及其制备方法 (Flexible dimming panel and preparation method thereof ) 是由 王昌银 陈娟 梁鹏 翟德深 李展 巨小倩 王瑛 张思凯 王春雷 于 2021-07-22 设计创作，主要内容包括：本公开提供一种柔性调光面板及其制备方法,属于调光面板技术领域。本公开的柔性调光面板的制备方法包括：提供调光基板,调光基板包括对盒设置的第一基板和第二基板；在第一基板和第二基板之间,调光基板设置有染料液晶层以及围绕染料液晶层的封框胶；第一基板具有第一切割线环绕的第一保留区,第一保留区具有延伸至封框胶外侧的第一焊盘区；第二基板具有第二切割线环绕的第二保留区,第二保留区具有延伸至封框胶外侧的第二焊盘区；第一切割线和第二切割线均与封框胶至少部分交叠；沿第一切割线和第二切割线分别对第一基板和第二基板进行切割。本公开提供的柔性调光面板的制备方法,能够提高柔性调光面板的良率。(The disclosure provides a flexible dimming panel and a preparation method thereof, and belongs to the technical field of dimming panels. The preparation method of the flexible dimming panel comprises the following steps: providing a dimming substrate, wherein the dimming substrate comprises a first substrate and a second substrate which are arranged opposite to each other; between the first substrate and the second substrate, the dimming substrate is provided with a dye liquid crystal layer and frame sealing glue surrounding the dye liquid crystal layer; the first substrate is provided with a first reserved area surrounded by a first cutting line, and the first reserved area is provided with a first pad area extending to the outer side of the frame sealing glue; the second substrate is provided with a second reserved area surrounded by a second cutting line, and the second reserved area is provided with a second pad area extending to the outer side of the frame sealing glue; the first cutting line and the second cutting line are at least partially overlapped with the frame sealing glue; and cutting the first substrate and the second substrate along the first cutting line and the second cutting line respectively. The preparation method of the flexible dimming panel can improve the yield of the flexible dimming panel.)

1. A method for manufacturing a flexible dimming panel, comprising:

providing a dimming substrate, wherein the dimming substrate comprises a first substrate and a second substrate which are arranged opposite to each other; between the first substrate and the second substrate, the dimming substrate is provided with a dye liquid crystal layer and frame sealing glue surrounding the dye liquid crystal layer; the first substrate comprises a first flexible substrate, a first light-transmitting electrode layer and a first orientation layer which are sequentially stacked from outside to inside; the second substrate comprises a second flexible substrate, a second light-transmitting electrode layer and a second orientation layer which are sequentially stacked from outside to inside; the first substrate is provided with a first reserved area surrounded by a first cutting line, and the first reserved area is provided with a first pad area extending to the outer side of the frame sealing glue; the second substrate is provided with a second reserved area surrounded by a second cutting line, and the second reserved area is provided with a second pad area extending to the outer side of the frame sealing glue; the first cutting line and the second cutting line are at least partially overlapped with the frame sealing glue;

and cutting the first substrate and the second substrate along the first cutting line and the second cutting line respectively.

2. The method of manufacturing a flexible dimming panel according to claim 1, wherein a portion where the first cutting line and the second cutting line coincide with each other is an integral cutting line;

the cutting the first substrate and the second substrate along the first cutting line and the second cutting line, respectively, includes:

removing the first light-transmitting electrode layer and/or the second light-transmitting electrode layer on the integral cutting line;

cutting the first substrate and the second substrate along the global cutting line by laser;

cutting the first flexible substrate along the non-integral cutting line part of the first cutting line, wherein the cutting depth does not exceed the thickness of the first flexible substrate;

tearing off the part of the first substrate outside the first cutting line;

cutting the second flexible substrate along the non-integral cutting line part of the second cutting line, wherein the cutting depth does not exceed the thickness of the second flexible substrate;

and tearing off the part of the second substrate outside the second cutting line.

3. The method according to claim 2, wherein the integral cutting line overlaps the sealant.

4. The method of manufacturing a flexible dimming panel according to claim 2, wherein the non-integral cutting line portion of the first cutting line is composed of a portion where the first cutting line overlaps the second pad region, a portion where the first cutting line is adjacent to the first pad region;

and the non-integral cutting line part of the second cutting line consists of a part of the second cutting line, which is overlapped with the first pad area, and a part of the second cutting line, which is adjacent to the second pad area.

5. The method of claim 2, wherein removing the first light-transmissive electrode layer on the global cutting line comprises:

enabling laser to transmit to the first light-transmitting electrode layer from one side of the first flexible substrate, and fusing the first light-transmitting electrode layer along the integral cutting line;

removing the second light-transmitting electrode layer on the global dicing line includes:

and transmitting laser to the second light-transmitting electrode layer from one side of the second flexible substrate, and fusing the second light-transmitting electrode layer along the integral cutting line.

6. The method of claim 1, wherein cutting the first substrate and the second substrate along the first cutting line and the second cutting line respectively comprises:

cutting the first flexible substrate along the first cutting line, wherein the cutting depth does not exceed the thickness of the first flexible substrate;

tearing off the part of the first substrate outside the first cutting line;

cutting the second flexible substrate along the second cutting line to a depth not exceeding the thickness of the second flexible substrate;

and tearing off the part of the second substrate outside the second cutting line.

7. The method of manufacturing a flexible dimming panel according to claim 1, wherein a portion where the first cutting line and the second cutting line coincide with each other is an integral cutting line;

the cutting the first substrate and the second substrate along the first cutting line and the second cutting line, respectively, includes:

punching the first substrate and the second substrate along the integral cutting line;

cutting the first flexible substrate along the non-integral cutting line part of the first cutting line, wherein the cutting depth does not exceed the thickness of the first flexible substrate;

tearing off the part of the first substrate outside the first cutting line;

cutting the second flexible substrate along the non-integral cutting line part of the second cutting line, wherein the cutting depth does not exceed the thickness of the second flexible substrate;

and tearing off the part of the second substrate outside the second cutting line.

8. The method of claim 1, wherein cutting the first substrate and the second substrate along the first cutting line and the second cutting line respectively comprises:

inserting a blocking pad between the first substrate and the second substrate, the blocking pad overlapping at least the first pad region and the second pad region;

punching the first substrate along the first cutting line;

and punching the second substrate along the second cutting line.

9. The method according to claim 8, wherein a portion of the first cut line overlapping the second pad region is located outside the frame sealant; and the part of the second cutting line overlapped with the first pad area is positioned on the outer side of the frame sealing glue.

10. A flexible dimming panel is characterized by comprising a first substrate and a second substrate which are arranged opposite to each other; the flexible dimming panel is provided with a dye liquid crystal layer and frame sealing glue surrounding the dye liquid crystal layer between the first substrate and the second substrate; the first substrate comprises a first flexible substrate, a first light-transmitting electrode layer and a first orientation layer which are sequentially stacked from outside to inside; the second substrate comprises a second flexible substrate, a second light-transmitting electrode layer and a second orientation layer which are sequentially stacked from outside to inside; the first substrate comprises a first bonding pad positioned on the outer side of the frame sealing glue, and the second substrate comprises a second bonding pad positioned on the outer side of the frame sealing glue;

the overlapped part of the edge of the first substrate and the edge of the second substrate is an integral edge; the non-integral edge part of the edge of the first substrate consists of the edge of the first pad, and the overlapped part of the edge of the first substrate and the second pad; at least one of the first and second light-transmissive electrode layers does not extend to the integral edge.

Technical Field

The disclosure relates to the technical field of dimming panels, in particular to a flexible dimming panel and a preparation method thereof.

Background

The flexible dimming panel has advantages such as frivolous, flexible, intelligent interaction, can promote user's driving travelling comfort greatly, brings more intelligent mutual trip to experience. The flexible dimming panel generally includes upper and lower substrates and a dye liquid crystal layer interposed between the substrates, and is cut to form an overall profile. However, the flexible dimming panel has a high defective rate when cut, reducing the reliability of the flexible dimming panel and increasing the cost thereof.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The present disclosure is directed to overcome the above-mentioned deficiencies in the prior art, and provides a flexible light modulation panel and a method for manufacturing the same, so as to improve the yield of the flexible light modulation panel.

According to an aspect of the present disclosure, there is provided a method of manufacturing a flexible dimming panel, including:

providing a dimming substrate, wherein the dimming substrate comprises a first substrate and a second substrate which are arranged opposite to each other; between the first substrate and the second substrate, the dimming substrate is provided with a dye liquid crystal layer and frame sealing glue surrounding the dye liquid crystal layer; the first substrate comprises a first flexible substrate, a first light-transmitting electrode layer and a first orientation layer which are sequentially stacked from outside to inside; the second substrate comprises a second flexible substrate, a second light-transmitting electrode layer and a second orientation layer which are sequentially stacked from outside to inside; the first substrate is provided with a first reserved area surrounded by a first cutting line, and the first reserved area is provided with a first pad area extending to the outer side of the frame sealing glue; the second substrate is provided with a second reserved area surrounded by a second cutting line, and the second reserved area is provided with a second pad area extending to the outer side of the frame sealing glue; the first cutting line and the second cutting line are at least partially overlapped with the frame sealing glue;

and cutting the first substrate and the second substrate along the first cutting line and the second cutting line respectively.

According to one embodiment of the present disclosure, a portion where the first cutting line and the second cutting line coincide with each other is an integral cutting line;

the cutting the first substrate and the second substrate along the first cutting line and the second cutting line, respectively, includes:

removing the first light-transmitting electrode layer and/or the second light-transmitting electrode layer on the integral cutting line;

cutting the first substrate and the second substrate along the global cutting line by laser;

cutting the first flexible substrate along the non-integral cutting line part of the first cutting line, wherein the cutting depth does not exceed the thickness of the first flexible substrate;

tearing off the part of the first substrate outside the first cutting line;

cutting the second flexible substrate along the non-integral cutting line part of the second cutting line, wherein the cutting depth does not exceed the thickness of the second flexible substrate;

and tearing off the part of the second substrate outside the second cutting line.

According to an embodiment of the present disclosure, the overall cutting line overlaps the frame sealing adhesive.

According to an embodiment of the present disclosure, the non-integral cut line portion of the first cut line is composed of a portion where the first cut line overlaps the second pad region, a portion where the first cut line is adjacent to the first pad region;

and the non-integral cutting line part of the second cutting line consists of a part of the second cutting line, which is overlapped with the first pad area, and a part of the second cutting line, which is adjacent to the second pad area.

According to an embodiment of the present disclosure, removing the first light-transmitting electrode layer on the global dicing line includes:

enabling laser to transmit to the first light-transmitting electrode layer from one side of the first flexible substrate, and fusing the first light-transmitting electrode layer along the integral cutting line;

removing the second light-transmitting electrode layer on the global dicing line includes:

and transmitting laser to the second light-transmitting electrode layer from one side of the second flexible substrate, and fusing the second light-transmitting electrode layer along the integral cutting line.

According to an embodiment of the present disclosure, the cutting the first and second substrates along the first and second cutting lines, respectively, includes:

cutting the first flexible substrate along the first cutting line, wherein the cutting depth does not exceed the thickness of the first flexible substrate;

tearing off the part of the first substrate outside the first cutting line;

cutting the second flexible substrate along the second cutting line to a depth not exceeding the thickness of the second flexible substrate;

and tearing off the part of the second substrate outside the second cutting line.

According to one embodiment of the present disclosure, a portion where the first cutting line and the second cutting line coincide with each other is an integral cutting line;

the cutting the first substrate and the second substrate along the first cutting line and the second cutting line, respectively, includes:

punching the first substrate and the second substrate along the integral cutting line;

cutting the first flexible substrate along the non-integral cutting line part of the first cutting line, wherein the cutting depth does not exceed the thickness of the first flexible substrate;

tearing off the part of the first substrate outside the first cutting line;

cutting the second flexible substrate along the non-integral cutting line part of the second cutting line, wherein the cutting depth does not exceed the thickness of the second flexible substrate;

and tearing off the part of the second substrate outside the second cutting line.

According to an embodiment of the present disclosure, the cutting the first and second substrates along the first and second cutting lines, respectively, includes:

inserting a blocking pad between the first substrate and the second substrate, the blocking pad overlapping at least the first pad region and the second pad region;

punching the first substrate along the first cutting line;

and punching the second substrate along the second cutting line.

According to an embodiment of the present disclosure, a portion where the first cutting line and the second pad region overlap is located outside the frame sealing glue; and the part of the second cutting line overlapped with the first pad area is positioned on the outer side of the frame sealing glue.

According to another aspect of the present disclosure, there is provided a flexible dimming panel including a first substrate and a second substrate provided to a cartridge; the flexible dimming panel is provided with a dye liquid crystal layer and frame sealing glue surrounding the dye liquid crystal layer between the first substrate and the second substrate; the first substrate comprises a first flexible substrate, a first light-transmitting electrode layer and a first orientation layer which are sequentially stacked from outside to inside; the second substrate comprises a second flexible substrate, a second light-transmitting electrode layer and a second orientation layer which are sequentially stacked from outside to inside; the first substrate comprises a first bonding pad positioned on the outer side of the frame sealing glue, and the second substrate comprises a second bonding pad positioned on the outer side of the frame sealing glue;

the overlapped part of the edge of the first substrate and the edge of the second substrate is an integral edge; the non-integral edge part of the edge of the first substrate consists of the edge of the first pad, and the overlapped part of the edge of the first substrate and the second pad; at least one of the first and second light-transmissive electrode layers does not extend to the integral edge.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

Fig. 1 is a schematic top view of a dimming substrate according to an embodiment of the present disclosure.

Fig. 2 is a schematic cross-sectional structure diagram of a dimming substrate according to an embodiment of the present disclosure.

Fig. 3 is a schematic cross-sectional view of the dimming substrate in fig. 1 at a location of MN.

Fig. 4 is a schematic top view of a flexible light modulation panel according to an embodiment of the present disclosure.

Fig. 5 is a schematic cross-sectional view of the flexible dimming panel of fig. 4 at the location of MN according to an embodiment.

Fig. 6 is a schematic structural diagram illustrating a blocking spacer inserted between a first substrate and a second substrate according to an embodiment of the present disclosure.

Fig. 7 is a schematic cross-sectional view of the flexible dimming panel of fig. 4 at the location of MN according to an embodiment.

Fig. 8 is a schematic top view of a light-modulating substrate with a patterned first light-transmitting electrode layer and/or a patterned first light-transmitting electrode layer according to an embodiment.

Fig. 9 is a schematic cross-sectional view of the dimming substrate shown in fig. 8 at the position of MN according to an embodiment.

Fig. 10 is a schematic cross-sectional view of the flexible dimming panel of fig. 4 at the location of MN according to an embodiment.

FIG. 11 is a schematic diagram of a cut formed when the first flexible substrate is cut, according to one embodiment.

FIG. 12 is a schematic diagram of a cut formed when cutting the second flexible substrate, according to one embodiment.

Fig. 13 is a schematic flow chart illustrating a method for manufacturing a flexible dimming panel according to an embodiment.

Description of reference numerals:

PNL, flexible dimming panel; PNL0, light modulating substrate; 100. a first substrate; 110. a first flexible substrate; 120. a first light-transmitting electrode layer; 130. a first alignment layer; l100, a first cutting line; l101, a non-integral cut line portion of the first cut line; l102, integral cutting line portion of the first cutting line; a111, a first pad region; e100, an edge of the first substrate; e101, a non-integral edge portion of an edge of the first substrate; e102, integral edge portions of the edges of the first substrate; p100, a first pad; 200. a second substrate; 210. a second flexible substrate; 220. a second light-transmitting electrode layer; 230. a second alignment layer; l200, a second cutting line; l201, a non-integral cut line portion of the second cut line; l202, integral cut line portion of second cut line; a211 and a second pad area; e200, an edge of the second substrate; e201, a non-integral edge portion of an edge of the second substrate; e202, integral edge portion of the edge of the second substrate; p200, a second pad; 300. a dye liquid crystal layer; 400. sealing the frame glue; 500. a blocking spacer; LL, integral cutting line; EE. Integral edges.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

The present disclosure provides a flexible light modulation panel and a manufacturing method thereof, so as to improve the yield of the flexible light modulation panel, further improve the reliability of the flexible light modulation panel and reduce the manufacturing cost thereof. Referring to fig. 13, a method for manufacturing a flexible dimming panel provided by the present disclosure includes:

step S110, referring to fig. 1 and 2, provides a dimming substrate PNL 0. The dimming substrate PNL0 includes a first substrate 100 and a second substrate 200 provided to the cartridge; between the first substrate 100 and the second substrate 200, the dimming substrate PNL0 is provided with a dye liquid crystal layer 300 and a frame sealing adhesive 400 surrounding the dye liquid crystal layer 300; the first substrate 100 includes a first flexible substrate 110, a first transparent electrode layer 120 and a first alignment layer 130, which are sequentially stacked from outside to inside; the second substrate 200 includes a second flexible substrate 210, a second transparent electrode layer 220 and a second alignment layer 230, which are sequentially stacked from outside to inside; the first substrate 100 has a first reserved region surrounded by a first cutting line L100, and the first reserved region has a first pad region a111 extending to the outer side of the frame sealing glue 400; the second substrate 200 has a second reserved region surrounded by the second cutting line L200, and the second reserved region has a second pad region a211 extending to the outside of the frame sealing glue 400; referring to fig. 3, the first cutting line L100 and the second cutting line L200 are at least partially overlapped with the sealant 400.

In step S120, referring to fig. 4, the first substrate 100 and the second substrate 200 are respectively cut along the first cutting line L100 and the second cutting line L200 to form a desired flexible dimming panel PNL.

In the method for manufacturing the flexible dimming panel PNL provided by the present disclosure, the first cutting line L100 and the second cutting line L200 are at least partially overlapped with the frame sealing adhesive 400. Thus, referring to fig. 5, at the cutting position, at least a portion of the first transparent electrode layer 120 and at least a portion of the second transparent electrode layer 220 are isolated by the sealant 400, which can reduce the short circuit caused by the electrical connection between the first transparent electrode layer 120 and the second transparent electrode layer 220 at the cutting position, thereby improving the yield of the flexible dimming panel PNL.

The structure, principle and effect of the flexible dimming panel PNL and the method for manufacturing the same provided by the present disclosure are further explained and illustrated below with reference to the accompanying drawings.

In step S110, a dimming substrate PNL0 to be cut may be provided. By cutting the dimming substrate PNL0, a desired flexible dimming panel PNL can be obtained.

Referring to fig. 2, the dimming substrate PNL0 includes a first substrate 100, a dye liquid crystal layer 300, and a second substrate 200, which are sequentially stacked, wherein a frame sealing adhesive 400 surrounding the dye liquid crystal layer 300 is further disposed between the first substrate 100 and the second substrate 200. The first substrate 100, the second substrate 200 and the frame sealing adhesive 400 form a liquid crystal cell, and the dye liquid crystal is filled in the liquid crystal cell to form a dye liquid crystal layer 300.

In some embodiments, the frame sealing adhesive 400 may have a width of 4-10 mm in order to ensure a good sealing effect and facilitate cutting. Of course, the width of the frame sealing adhesive 400 may also be adjusted according to actual requirements.

In some embodiments, in order to maintain the thickness of the liquid crystal cell, spacers may be disposed between the first substrate 100 and the second substrate 200, and the spacers may be particles (e.g., plastic balls, etc.) independent of the first substrate 100 and the second substrate 200, or support pillars formed on the first substrate 100 or the second substrate 200, which is not limited in this disclosure. In one embodiment of the present disclosure, the spacers between the first substrate 100 and the second substrate 200 may be plastic balls, which may have certain elasticity, and support the first substrate 100 and the second substrate 200 and may also deform when the flexible dimming panel PNL is bent, thereby preventing the first substrate 100 and the second substrate 200 from being punctured or damaged due to too much hardness.

In some embodiments, a spacer, for example, a silicon ball, may be added to the frame sealing adhesive 400. Thus, the spacers in the sealant 400 can better maintain the distance between the first substrate 100 and the second substrate 200.

In the present disclosure, the first substrate 100 includes a first flexible substrate 110, a first light-transmitting electrode layer 120, and a first alignment layer 130, which are sequentially stacked from outside to inside. The outer side of the first substrate 100 refers to a side away from the dye liquid crystal layer 300; accordingly, the inner side of the first substrate 100 refers to a side close to the dye liquid crystal layer 300.

Alternatively, the material of the first flexible substrate 110 may be a flexible organic transparent material, for example, a transparent organic polymer such as PET (polyethylene terephthalate), PI (polyimide), PEN (polyethylene naphthalate), or other flexible resin. Illustratively, in one embodiment of the present disclosure, the first flexible substrate 110 is a PET layer. Of course, in other embodiments of the present disclosure, the first flexible substrate 110 may also include multiple flexible organic material layers and an inorganic layer sandwiched between the flexible organic material layers, and the flexible organic material layers and the inorganic layer are both made of light-transmitting materials.

The thickness of the first flexible substrate 110 may be determined according to design requirements, so that the first flexible substrate 110 meets requirements in terms of light transmission performance, mechanical properties, and the like. Alternatively, the thickness of the first flexible substrate 110 may be between 100 micrometers and 2000 micrometers, and in particular may be between 300 micrometers and 600 micrometers.

Alternatively, the material of the first light-transmitting electrode layer 120 may be an organic conductive material, an organic/inorganic conductive composite material, or an inorganic conductive material, and particularly may be a conductive metal oxide, and for example, may be Indium Gallium Zinc Oxide (IGZO), Indium Gallium Oxide (IGO), Indium Zinc Oxide (IZO), Indium Tin Zinc Oxide (ITZO), tin oxide (SnO2), zinc oxide (ZnO), Indium Tin Oxide (ITO), or the like. Illustratively, in one embodiment of the present disclosure, the first light-transmissive electrode layer 120 is an ITO layer.

Alternatively, the first light-transmitting electrode layer 120 may be an entire electrode layer without being hollowed out or formed with a specific pattern. Of course, in other embodiments of the present disclosure, the first light-transmitting electrode layer 120 may also be a hollow electrode, and particularly, a portion overlapping with the dye liquid crystal layer 300 may be a hollow electrode.

The first alignment layer 130 is used to contact the dye liquid crystal layer 300 so that the liquid crystal molecules are aligned at a certain angle and direction. The first alignment layer 130 may be made of a flexible organic material, for example, a polyimide material. In one embodiment of the present disclosure, the first alignment layer 130 may have a thickness of 20 to 100 nm so as to align liquid crystal molecules at a predetermined angle and direction. Illustratively, in one embodiment of the present disclosure, the thickness of the first alignment layer 130 may be in a range of 30 to 50 nanometers.

In the present disclosure, the second substrate 200 includes a second flexible substrate 210, a second light-transmitting electrode layer 220, and a second alignment layer 230, which are sequentially stacked from the outside to the inside. The outer side of the second substrate 200 refers to a side away from the dye liquid crystal layer 300; accordingly, the inner side of the second substrate 200 refers to a side close to the dye liquid crystal layer 300.

Alternatively, the material of the second flexible substrate 210 may be a flexible organic transparent material, for example, a transparent organic polymer such as PET (polyethylene terephthalate), PI (polyimide), PEN (polyethylene naphthalate), or other flexible resin. Illustratively, in one embodiment of the present disclosure, the second flexible substrate 210 is a PET layer. Of course, in other embodiments of the present disclosure, the second flexible substrate 210 may also include multiple flexible organic material layers and an inorganic layer sandwiched between the flexible organic material layers, and both the flexible organic material layers and the inorganic layer are made of a light-transmitting material.

The thickness of the second flexible substrate 210 may be determined according to design requirements, so that the second flexible substrate 210 meets requirements in light transmittance, mechanical properties, and the like. Alternatively, the thickness of the second flexible substrate 210 may be between 100 micrometers and 2000 micrometers, and particularly may be between 300 micrometers and 600 micrometers.

In one embodiment of the present disclosure, the first flexible substrate 110 and the second flexible substrate 210 are identical in structure, thickness, and material. In other words, the first flexible substrate 110 and the second flexible substrate 210 may be the same flexible substrate.

Alternatively, the material of the second light-transmitting electrode layer 220 may be an organic conductive material, an organic/inorganic conductive composite material, or an inorganic conductive material, and particularly may be a conductive metal oxide, and may be, for example, Indium Gallium Zinc Oxide (IGZO), Indium Gallium Oxide (IGO), Indium Zinc Oxide (IZO), Indium Tin Zinc Oxide (ITZO), tin oxide (SnO2), zinc oxide (ZnO), Indium Tin Oxide (ITO). Illustratively, in one embodiment of the present disclosure, the second light-transmissive electrode layer 220 is an ITO layer.

Alternatively, the second light-transmitting electrode layer 220 may be a full-surface electrode layer without being hollowed out or formed with a specific pattern. Of course, in other embodiments of the present disclosure, the second light-transmitting electrode layer 220 may also be a hollow electrode, and particularly, a portion overlapping with the dye liquid crystal layer 300 may be a hollow electrode.

In one embodiment of the present disclosure, the first light-transmitting electrode layer 120 and the second light-transmitting electrode layer 220 are the same in structure, thickness, and material. In other words, the first light-transmitting electrode layer 120 and the second light-transmitting electrode layer 220 may be the same light-transmitting electrode layer.

The second alignment layer 230 is used to contact the dye liquid crystal layer 300 so that the liquid crystal molecules are aligned at a certain angle and direction. The second alignment layer 230 may use a flexible organic material, for example, a polyimide material. In one embodiment of the present disclosure, the second alignment layer 230 may have a thickness of 20 to 100 nm so as to align liquid crystal molecules at a predetermined angle and direction. Illustratively, in one embodiment of the present disclosure, the thickness of the second alignment layer 230 may be in the range of 30 to 50 nm.

In one embodiment of the present disclosure, the first alignment layer 130 and the second alignment layer 230 are the same in structure, thickness, and material. In other words, the first alignment layer 130 and the second alignment layer 230 may be the same alignment layer.

In one embodiment of the present disclosure, the first substrate 100 and the second substrate 200 may be the same substrate.

In the present disclosure, referring to fig. 1 to 5, the dimming substrate PNL0 needs to be cut to form the required flexible dimming panel PNL, and in particular, the first substrate 100 and the second substrate 200 need to be cut to remove the redundant portions of the first substrate 100 and the second substrate 200 and to cut the pads on the first substrate 100 and the second substrate 200.

In the present disclosure, a cutting trace of the first substrate 100 is a first cutting line L100; after the first substrate 100 is cut along the first cutting line L100, a portion outside the first cutting line L100 is removed, and a portion inside the first cutting line L100 is reserved to the flexible dimming panel as a reserved region (i.e., a first reserved region) of the first substrate 100. The first reserved area is the first substrate 100 of the flexible dimming panel PNL. After the cutting, the first pad area a111 extends to the outside of the frame sealing adhesive 400 to be used as a first pad P100 on the first substrate 100. The first pad P100 can be bound to a circuit board so that the circuit board supplies power to the first light-transmissive electrode layer 120. In one embodiment of the present disclosure, the circuit board has a plurality of first pins for binding with the first pad P100, and the first pins can penetrate through the first alignment layer 130 and the first light-transmitting electrode layer 120 and penetrate into the first flexible substrate 110 at the position of the first pad P100, so as to electrically connect with the first pad P100.

Accordingly, in the present disclosure, the cutting path of the second substrate 200 is the second cutting line L200; after the second substrate 200 is cut along the second cutting line L200, the portion outside the second cutting line L200 is removed, and the portion inside the second cutting line L200 is reserved to the flexible dimming panel as a reserved region (i.e., a second reserved region) of the second substrate 200. The second reserved area is the second substrate 200 of the flexible dimming panel PNL. After the cutting, the second pad region a211 extends to the outside of the frame sealing adhesive 400 so as to be used as a second pad P200 on the second substrate 200. The second pad P200 can be bound to a circuit board so that the circuit board supplies power to the second light-transmissive electrode layer 220. In one embodiment of the present disclosure, the circuit board has a plurality of second pins for binding with the second pad P200, and the second pins can penetrate through the second alignment layer 230 and the second transparent electrode layer 220 and penetrate into the second flexible substrate 210 at the position of the second pad P200, so as to electrically connect with the second pad P200.

Referring to fig. 1, the first pad region a111 and the second pad region a211 do not overlap each other. As such, referring to fig. 4, the first pad P100 and the second pad P200 of the flexible dimming panel PNL do not overlap with each other, so as to facilitate binding connection of the first pin and the second pin with the first pad P100 and the second pad P200, respectively.

Referring to fig. 1 and 3, the first cutting line L100 and the second cutting line L200 partially coincide to facilitate the cutting of the dimming substrate PNL0 and to enable the flexible dimming panel PNL to have a relatively flat edge. In the present disclosure, a portion where the first cut line L100 and the second cut line L200 overlap each other is defined as an overall cut line LL. At the global cutting line LL, the first substrate 100 and the second substrate 200 may be cut simultaneously or may be cut separately. In the flexible dimming panel PNL collection formed by cutting, referring to fig. 1 and 4, an edge formed at the integral cutting line LL may be defined as an integral edge EE. It can be understood that, in the flexible dimming panel PNL, a portion where the edge of the first substrate 100 and the edge of the second substrate 200 coincide with each other is an entire edge EE of the flexible dimming panel PNL.

Referring to fig. 1 and 3, a portion of the first cutting line L100 that is not coincident with the second cutting line L200 may be a non-integral cutting line portion L101 of the first cutting line L100. The non-integral cut line portion L101 of the first cut line L100 and the integral cut line portion L102 of the first cut line L100 complement each other to form a closed trajectory. In the second cut line L200, a portion that does not overlap with the first cut line L100 may be a non-integral cut line portion L201 of the second cut line L200. The non-integral cut line portion L201 of the second cut line L200 and the integral cut line portion L202 of the second cut line L200 complement each other to form a closed trajectory.

Accordingly, referring to fig. 4, for the flexible dimming panel PNL formed by cutting, of the edge E100 of the first substrate 100, a portion that is not overlapped with the edge E200 of the second substrate 200 may be a non-integral edge portion E101 of the first substrate 100. The non-integral edge portion E101 of the first substrate 100 and the integral edge portion E102 of the first substrate 100 complement each other to form a closed edge. For the flexible dimming panel PNL formed by cutting, of the edge E200 of the second substrate 200, a portion that is not overlapped with the edge E100 of the first substrate 100 may be a non-integral edge portion E201 of the second substrate 200. The non-integral edge portion E201 of the second substrate 200 and the integral edge portion E202 of the second substrate 200 complement each other to form a closed edge.

In one embodiment of the present disclosure, referring to fig. 1, the non-integrally cut portion L101 of the first cutting line L100 is composed of a portion where the first cutting line L100 overlaps the second pad region a211, and a portion where the first cutting line L100 is adjacent to the first pad region a 111. In this manner, in the formed flexible dimming panel PNL, referring to fig. 4, the non-integral edge portion E101 of the first substrate 100 is composed of the overlapping portion of the edge E100 of the first substrate 100 and the second pad P200, and the edge of the first pad P100.

In one embodiment of the present disclosure, the non-integral-cut-line portion L201 of the second cut line L200 is composed of a portion of the second cut line L200 overlapping the first pad region a111, and a portion of the second cut line L200 adjacent to the second pad region a 211. In this manner, in the formed flexible dimming panel PNL, the non-integral edge portion E201 of the second substrate 200 is composed of the overlapping portion of the edge E200 of the second substrate 200 and the first pad P100, and the edge of the second pad P200.

In one embodiment of the present disclosure, referring to fig. 3, the global cutting line LL overlaps the sealant 400. Thus, at the position of the global cutting line LL, when the first substrate 100 and the second substrate 200 are cut simultaneously, the first transparent electrode layer 120 and the second transparent electrode layer 220 can be isolated by the sealant 400, so as to avoid the short circuit failure caused by the mutual electrical connection between the first transparent electrode layer 120 and the second transparent electrode layer 220 of the flexible dimming panel PNL at the global edge EE portion.

In step S120, the first and second substrates 100 and 200 may be cut along the first and second cutting lines L100 and L200, respectively. As such, the remaining portion of the dimming substrate PNL0 may serve as the flexible dimming panel PNL of the present disclosure.

According to the manufacturing method of the present disclosure, referring to fig. 5, the flexible dimming panel PNL is formed to include a first substrate 100 and a second substrate 200 provided to a case; between the first substrate 100 and the second substrate 200, the flexible dimming panel PNL is provided with a dye liquid crystal layer 300 and a frame sealing adhesive 400 surrounding the dye liquid crystal layer 300; the first substrate 100 includes a first flexible substrate 110, a first transparent electrode layer 120 and a first alignment layer 130, which are sequentially stacked from outside to inside; the second substrate 200 includes a second flexible substrate 210, a second transparent electrode layer 220 and a second alignment layer 230, which are sequentially stacked from outside to inside; the first substrate 100 includes a first pad P100 located outside the frame sealing adhesive 400, and the second substrate 200 includes a second pad P200 located outside the frame sealing adhesive 400. Wherein, at least a part of the edge of the first substrate 100 is flush with the edge of the frame sealing glue 400; at least a part of the edge of the second substrate 200 is flush with the edge of the frame sealing adhesive 400.

In the present disclosure, the step S120 may be implemented by a plurality of different methods, so as to further reduce the defects generated in the cutting process and improve the yield of the flexible dimming panel PNL.

In the first embodiment of the present disclosure, step S120 may be implemented by the methods shown in step S210 to step S260.

Step S210, referring to fig. 8, removing the first transparent electrode layer 120 and/or the second transparent electrode layer 220 on the global cutting line LL; in fig. 8, the region where the transparent electrode layer (the first transparent electrode layer 120 and/or the second transparent electrode layer 220) is removed is indicated by the oblique line filling region DD, and the position where the sealant 400 is removed is indicated by the dot filling region.

Step S220, referring to fig. 9, cutting the first substrate 100 and the second substrate 200 by laser along the global cutting line LL;

in step S230, referring to fig. 9, the first flexible substrate 110 is cut along the non-integral cutting line portion L101 of the first cutting line L100 to a depth not exceeding the thickness of the first flexible substrate 110. Referring to fig. 11, the first flexible substrate 110 is not cut at the cuts CC formed by cutting the first flexible substrate 110.

Step S240, tearing off a portion of the first substrate 100 outside the first cutting line L100;

step S250, referring to fig. 9, cutting the second flexible substrate 210 along the non-integral cutting line portion L201 of the second cutting line L200 to a depth not exceeding the thickness of the second flexible substrate 210; referring to fig. 12, the second flexible substrate 210 is not cut at the cuts CC formed by cutting the second flexible substrate 210.

In step S260, a portion of the second substrate 200 outside the second cutting line L200 is torn off.

In step S210, the first light-transmitting electrode layer 120 on the global cutting line LL may be removed alone, or the second light-transmitting electrode layer 220 on the global cutting line LL may be removed alone. Of course, both the first light-transmitting electrode layer 120 and the second light-transmitting electrode layer 220 on the global cutting line LL may be removed. Thus, there are no two light-transmitting electrode layers on the global cutting line LL, which are respectively located on the two substrates (the first substrate 100 or the second substrate 200); that is, at most one light-transmitting electrode layer exists on the global cutting line LL. In step S220, when the first substrate 100 and the second substrate 200 are simultaneously cut along the global cutting line LL by using laser, the two transparent electrode layers are not connected to each other after being melted, so that the short circuit is not caused, and the risk of poor short circuit is further reduced. Specifically, if the light-transmitting conductive layer is not present on the global cutting line LL, the melted conductive material does not appear during the cutting process. If only one light-transmitting electrode layer is provided on the global cutting line LL, even if the light-transmitting conductive layer is melted to form a puncture or the like during laser cutting, a short circuit between the two light-transmitting electrode layers is not caused. Accordingly, referring to fig. 10, in the formed flexible dimming panel PNL, at least one of the first and second transmittive electrode layers 120 and 220 does not extend to the entire edge EE.

In one possible manner, the first light-transmitting electrode layer 120 on the global cutting line LL may be removed by: laser is transmitted from the first flexible substrate 110 side to the first light-transmitting electrode layer 120, and the first light-transmitting electrode layer 120 is fused along the global cutting line LL. In this manner, by using the difference in material between the first light-transmitting electrode layer 120 and the first flexible substrate 110, the laser light is selectively irradiated onto the first light-transmitting electrode layer 120 by adjusting the parameters (such as wavelength, power, and the like) of the laser light. As such, patterning of the first light-transmitting electrode layer 120 is achieved without damaging or cutting the first flexible substrate 110.

In one possible manner, the second light-transmitting electrode layer 220 on the global cutting line LL may be removed by: laser is transmitted from the second flexible substrate 210 side to the second transparent electrode layer 220, and the second transparent electrode layer 220 is fused along the global cutting line LL. In this manner, by using the difference in material between the second light-transmitting electrode layer 220 and the second flexible substrate 210, the laser light is selectively irradiated onto the second light-transmitting electrode layer 220 by adjusting the parameters (such as wavelength, power, and the like) of the laser light. In this manner, patterning of the second light-transmitting electrode layer 220 is achieved without damaging or cutting the second flexible substrate 210.

In step S230, the first flexible substrate 110 may be cut from the outer side of the first substrate 100, and the first transparent electrode layer 120 is prevented from being damaged by cutting the first flexible substrate 110. Wherein, in some possible ways, the cutting can be performed by laser. The cutting of the first flexible substrate 110 is achieved by adjusting parameters (e.g., wavelength, power, etc.) of the laser such that the laser selectively irradiates the first flexible substrate 110 and melts the first flexible substrate 110 sequentially from outside to inside. By controlling the laser power, the irradiation time, and the like, the control of the cutting depth is achieved, and the first light-transmitting electrode layer 120 is prevented from being damaged by completely cutting off the first flexible substrate 110.

In step S240, a portion (portion to be removed) of the first substrate 100 outside the first cutting line L100 may be grasped and separated from the first remaining region of the first substrate 100 by tearing. For example, the portion to be removed may be manually grasped by a cutting person to be torn off, or may be held by a tearing mechanism provided specifically for the cutting apparatus and torn off.

In step S250, the second flexible substrate 210 may be cut from the outer side of the second substrate 200, and the second transparent electrode layer 220 is prevented from being damaged by cutting the second flexible substrate 210. Wherein, in some possible ways, the cutting can be performed by laser. The cutting of the second flexible substrate 210 is achieved by adjusting parameters (e.g., wavelength, power, etc.) of the laser such that the laser selectively irradiates the second flexible substrate 210 and melts the second flexible substrate 210 from outside to inside in sequence. By controlling the laser power, the irradiation time, and the like, the control of the cutting depth is achieved, and the second transparent electrode layer 220 is prevented from being damaged by completely cutting off the second flexible substrate 210.

In step S260, a portion (portion to be removed) of the second substrate 200 outside the second cutting line L200 may be grasped and separated from the second reserved region of the second substrate 200 by tearing. For example, the portion to be removed may be manually grasped by a cutting person to be torn off, or may be held by a tearing mechanism provided specifically for the cutting apparatus and torn off.

In one possible approach, step S240 and step S260 may be performed simultaneously after step S230 and step S250 are completed. Specifically, the portion to be removed of the first substrate 100 and the portion to be removed of the second substrate 200 may be simultaneously held, and then the portion to be removed of the first substrate 100 and the portion to be removed of the second substrate 200 may be simultaneously removed by tearing.

In the second embodiment of the present disclosure, step S120 may be implemented by the methods shown in steps S310 to S340.

Step S310, cutting the first flexible substrate 110 along the first cutting line L100, wherein the cutting depth does not exceed the thickness of the first flexible substrate 110; referring to fig. 11, the first flexible substrate 110 is not cut at the cuts CC formed by cutting the first flexible substrate 110.

In step S320, a portion of the first substrate 100 outside the first cutting line L100 is torn.

Step S330, cutting the second flexible substrate 210 along the second cutting line L200, wherein the cutting depth does not exceed the thickness of the second flexible substrate 210; referring to fig. 12, the second flexible substrate 210 is not cut at the cuts CC formed by cutting the second flexible substrate 210.

In step S340, a portion of the second substrate 200 outside the second cutting line L200 is torn off.

In step S310, the first flexible substrate 110 may be cut from the outer side of the first substrate 100, and the first light-transmitting electrode layer 120 is prevented from being damaged by cutting the first flexible substrate 110. Wherein, in some possible ways, the cutting can be performed by laser. The cutting of the first flexible substrate 110 is achieved by adjusting parameters (e.g., wavelength, power, etc.) of the laser such that the laser selectively irradiates the first flexible substrate 110 and melts the first flexible substrate 110 sequentially from outside to inside. By controlling the laser power, the irradiation time, and the like, the control of the cutting depth is achieved, and the first light-transmitting electrode layer 120 is prevented from being damaged by completely cutting off the first flexible substrate 110. Of course, in other embodiments of the present disclosure, the first flexible substrate 110 may be cut in other manners, for example, the first flexible substrate 110 may be cut from the outer side of the first flexible substrate 110 by using a knife wheel.

In step S320, a portion (portion to be removed) of the first substrate 100 outside the first cutting line L100 may be grasped and separated from the first remaining region of the first substrate 100 by tearing. For example, the portion to be removed may be manually grasped by a cutting person to be torn off, or may be held by a tearing mechanism provided specifically for the cutting apparatus and torn off.

In step S330, the second flexible substrate 210 may be cut from the outer side of the second substrate 200, and the second transparent electrode layer 220 is prevented from being damaged by cutting the second flexible substrate 210. Wherein, in some possible ways, the cutting can be performed by laser. The cutting of the second flexible substrate 210 is achieved by adjusting parameters (e.g., wavelength, power, etc.) of the laser such that the laser selectively irradiates the second flexible substrate 210 and melts the second flexible substrate 210 from outside to inside in sequence. By controlling the laser power, the irradiation time, and the like, the control of the cutting depth is achieved, and the second transparent electrode layer 220 is prevented from being damaged by completely cutting off the second flexible substrate 210. Of course, in other embodiments of the present disclosure, the second flexible substrate 210 may be cut in other manners, for example, the second flexible substrate 210 may be cut from the outer side of the second flexible substrate 210 by using a knife wheel.

In step S340, a portion (portion to be removed) of the second substrate 200 outside the second cutting line L200 may be grasped and separated from the second reserved region of the second substrate 200 by tearing. For example, the portion to be removed may be manually grasped by a cutting person to be torn off, or may be held by a tearing mechanism provided specifically for the cutting apparatus and torn off.

In the second embodiment, the first cut line L100 and the second cut line L200 are torn to cut the first transparent electrode layer 120 and the second transparent electrode layer 220, respectively, and the first transparent electrode layer 120 and the second transparent electrode layer 220 are not melted and electrically contacted, so that the risk of poor short circuit can be further reduced.

In one possible approach, step S320 and step S340 may be performed simultaneously after step S310 and step S330 are completed. Specifically, the portion to be removed of the first substrate 100 and the portion to be removed of the second substrate 200 may be simultaneously held, and then the portion to be removed of the first substrate 100 and the portion to be removed of the second substrate 200 may be simultaneously removed by tearing.

In the third embodiment of the present disclosure, step S120 may be implemented by the methods shown in steps S410 to S450.

Step S410, punching the first substrate 100 and the second substrate 200 along the entire cutting line LL;

step S420, cutting the first flexible substrate 110 along the non-integral cutting line portion L101 of the first cutting line L100, wherein the cutting depth does not exceed the thickness of the first flexible substrate 110; referring to fig. 11, the first flexible substrate 110 is not cut at the cuts CC formed by cutting the first flexible substrate 110.

Step S430, tearing off a portion of the first substrate 100 outside the first cutting line L100;

step S440, cutting the second flexible substrate 210 along the non-integral cutting line portion L201 of the second cutting line L200, wherein the cutting depth does not exceed the thickness of the second flexible substrate 210;

in step S450, the portion of the second substrate 200 outside the second cutting line L200 is torn off.

In this third embodiment, the quick cutting may be achieved by die cutting in step S410. In step S410, since laser melting of the first light-transmitting electrode layer 120 and the second light-transmitting electrode layer 220 is not required, the die cutting process does not cause electrical connection of the first light-transmitting electrode layer 120 and the second light-transmitting electrode layer 220 at the position, and thus the risk of poor short circuit can be further reduced.

In a possible manner, steps S420 to S450 can be performed with reference to the methods shown in steps S230 to S460, and the disclosure is not repeated herein.

In the fourth embodiment of the present disclosure, step S120 may be implemented by the methods shown in steps S510 to S530.

Step S510, referring to fig. 6, inserting a blocking pad 500 between the first substrate 100 and the second substrate 200, the blocking pad 500 overlapping at least the first pad region a111 and the second pad region a 211;

step S520, punching the first substrate 100 along the first cutting line L100;

in step S530, the second substrate 200 is die cut along the second cutting line L200.

Wherein, in step S510, the blocking pad 500 may be inserted between the first substrate 100 and the second substrate 200. In this way, if the punching is performed at the position of the pad at the time of punching, the substrate (the first substrate 100 or the second substrate 200) below the pad is not damaged. In this way, in step S520, the blocking pad 500 protects the second pad region a211 to prevent the second transparent electrode layer 220 of the second pad region a211 from being damaged due to punching. Accordingly, in step S530, the blocking pad 500 protects the first pad region a111 and prevents the first transparent electrode layer 120 of the first pad region a111 from being damaged due to the punching.

In this embodiment, the first substrate 100 and the second substrate 200 are cut by die cutting, so that short circuit caused by melting of the first light-transmitting electrode layer 120 and the second electrode layer is avoided, and the risk of poor short circuit is further reduced.

In one possible embodiment, the barrier pad 500 may overlap only the first and second pad regions a111 and a 211. As such, the blocking pad 500 may pertinently protect the first and second pads P100 and P200 of the flexible dimming panel PNL. Illustratively, the number of the barrier spacers 500 is two, and the two barrier spacers 500 overlap the first and second pad regions a111 and a211, respectively.

In other embodiments, the barrier pad 500 may not only overlap the first and second pad regions a111 and a211, but also extend to a region between the first and second pad regions a111 and a 211; further, the barrier pad 500 may also extend toward the first pad area a111 away from the second pad area a211, and toward the second pad area a211 away from the first pad area a 111. In this way, the protection range of the blocking pad 500 is larger than the first pad area a111 and the second pad area a211, so that the alignment requirement of the blocking pad 500 during insertion can be reduced, and the process window for inserting the blocking pad 500 is increased.

In a possible implementation manner of the fourth embodiment, referring to fig. 6, the blocking pad 500 may be inserted between the first substrate 100 and the second substrate 200, and is not inserted into the frame sealing adhesive 400. The overlapped part of the first cutting line L100 and the second pad area a211 is located outside the frame sealing glue 400; the overlapping portion of the second cutting line L200 and the first pad area a111 is located outside the frame sealing adhesive 400. As such, the barrier pad 500 may provide protection to the first pad region a111 and the second pad region a 211. Accordingly, referring to fig. 7, in the formed flexible dimming panel PNL, a portion overlapping the second pad P200 in the non-integral edge portion E101 of the first substrate may protrude to an outer side of the frame sealing adhesive 400. Accordingly, a portion of the non-integral edge portion E201 of the second substrate, which overlaps the first pad P100, may extend to the outer side of the frame sealing adhesive 400.

It should be noted that although the steps of the method for making a flexible dimming panel of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that the steps must be performed in that particular order, or that all of the depicted steps must be performed to achieve the desired results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.