阅读说明：本技术 布线基板及其制造方法 (Wiring substrate and method for manufacturing same ) 是由 新见秀树 高野伸司 于 2020-02-17 设计创作，主要内容包括：本发明提供维持较高的散热效果,且向安装到布线基板的部件的热传导较小的布线基板及其制造方法。该布线基板具备：轴构件,形成为棒状,在一端具有直径比其他部分大的凸缘；散热板,具有插入了轴构件的第一通孔；以及基板,具有插入了轴构件的第二通孔,在散热板与基板之间的至少一部分形成有间隙。(The invention provides a wiring substrate and a manufacturing method thereof, wherein the heat conduction to a component mounted on the wiring substrate is small while a high heat dissipation effect is maintained. The wiring substrate includes: a shaft member formed in a bar shape and having a flange at one end thereof, the flange having a larger diameter than the other portion; a heat dissipation plate having a first through hole into which the shaft member is inserted; and a substrate having a second through hole into which the shaft member is inserted, wherein a gap is formed at least in a part between the heat dissipation plate and the substrate.)

1. A wiring board is characterized by comprising:

a shaft member formed in a bar shape and having a flange at one end thereof, the flange having a larger diameter than the other portion;

a heat dissipation plate having a first through hole into which the shaft member is inserted; and

a substrate having a second through hole into which the shaft member is inserted,

a gap is formed at least in a part between the heat dissipation plate and the substrate.

2. The wiring substrate according to claim 1,

a clearance is formed at least partially between the shaft member and the base plate.

3. The wiring substrate according to claim 1 or 2,

a semiconductor element or an electronic component is mounted on the substrate,

the first through hole and the second through hole are coaxially arranged,

the heat sink is in contact with one surface or the other surface of the substrate to dissipate heat from the semiconductor element, the electronic component, or the substrate,

the shaft member is inserted into the first through hole and the second through hole in a penetrating manner,

the flange has a diameter larger than the diameters of the first through hole and the second through hole and is in contact with an outer peripheral edge of one of the first through hole and the second through hole,

a pressure-bonding section formed at the other end of the shaft member by caulking the other end of the shaft member by pressing in an axial direction, the pressure-bonding section being in contact with an outer peripheral edge of the other of the first through-hole and the second through-hole,

a contact portion that contacts the flange or the crimping portion is formed on the heat dissipation plate.

4. The wiring substrate according to claim 1,

the heat dissipation plate has a front surface at least a part of which is in contact with the substrate, and a back surface on which the flange or the crimping portion is arranged;

a concave portion is formed on the back surface of the heat radiating plate around the first through hole, and the depth of the concave portion is a depth at which the flange or the crimp portion does not protrude from the back surface of the heat radiating plate.

5. The wiring substrate according to claim 4, wherein the substrate has a front surface on which an electronic part is mounted and which configures the flange or the crimping part, and a rear surface at least a part of which is in contact with the heat dissipation plate,

the flange or the crimping portion protrudes from the substrate to a lower height than an electronic component mounted on the substrate.

6. The wiring substrate according to claim 4 or 5,

a flange of the shaft member is disposed on a front surface of the substrate, and the pressure-bonding section of the shaft member is disposed on a rear surface of the heat dissipation plate.

7. The wiring substrate according to claim 1,

an opening is also formed in the substrate,

a plurality of the second through holes are arranged around the opening.

8. The wiring substrate according to claim 7,

the gap is formed in communication with the opening.

9. The wiring substrate according to claim 1,

the diameter of the first through hole is smaller than the diameter of the second through hole.

10. The wiring substrate according to claim 1,

the gap is formed over the entire circumference of the outer peripheral edge of the first through hole.

11. The wiring substrate according to claim 1,

the gap is formed at a part of the circumference of the outer periphery of the first through hole.

12. The wiring substrate according to claim 1,

the gap is formed to communicate with an outer side of the heat dissipation plate.

13. A method for manufacturing a wiring board according to claim 1, comprising:

a first step of disposing the heat dissipation plate and the substrate so that the first through-hole and the second through-hole are coaxially arranged and are in contact with each other;

a second step of inserting the shaft member so as to penetrate the second through hole and the first through hole, and positioning and temporarily fixing the heat sink and the substrate;

a third step of pressing an end portion of the inserted shaft member on the opposite side of the flange in the axial direction by a pressing device to deform the end portion, thereby caulking the substrate to the heat dissipation plate; and

and a fourth step of forming the contact portion in contact with the substrate and forming the gap between the heat sink and the substrate by caulking the substrate and the heat sink with the shaft member to deform a portion of the heat sink in close contact with the substrate.

Technical Field

The present invention relates to a structure of a wiring board and a method for manufacturing the same.

Background

Conventionally, a lower substrate is known: after the heat dissipation plate is disposed on the first main surface of the wiring substrate so that the side surface of the convex portion of the heat dissipation plate faces the inner wall of the through hole of the wiring substrate, the groove formed in the main surface of the convex portion of the heat dissipation plate is widened, whereby a part of the side surface of the convex portion of the heat dissipation plate is brought into contact with the inner wall of the through hole of the wiring substrate, and the heat dissipation plate is fixed to the wiring substrate (patent document 1).

Disclosure of Invention

Problems to be solved by the invention

However, in patent document 1, the contact area between the heat sink and the wiring board is large, and when the amount of heat generated by the mounted semiconductor element is large, the heat sink is easily overheated, and heat conduction to the wiring board is large. Therefore, there are the following problems: since the component mounted on the wiring board is at a high temperature, the reliability of the component is lowered.

An object of one aspect of the present invention is to provide a wiring board in which heat conduction to a component mounted on the wiring board is small while maintaining a high heat dissipation effect.

Means for solving the problems

A wiring board according to one aspect of the present invention includes: a shaft member formed in a bar shape and having a flange at one end thereof, the flange having a larger diameter than the other portion; a heat dissipation plate having a first through hole into which the shaft member is inserted; and a substrate having a second through hole into which the shaft member is inserted, wherein a gap is formed at least in a part between the heat dissipation plate and the substrate.

Effects of the invention

According to the present invention, a wiring board capable of suppressing heat conduction from a heat sink to a substrate can be provided.

Drawings

Fig. 1 shows a plan view of a heat sink according to a first embodiment of the present invention (a) and a cross-sectional view taken along line a-a (b).

Fig. 2 shows a plan view of the substrate according to the first embodiment of the present invention (a) and a cross-sectional view taken along line B-B (a).

Fig. 3 shows a plan view of the temporarily fixed heat sink and substrate in the first embodiment of the present invention, in which (a) is a plan view and (b) is a cross-sectional view taken along line C-C of (a).

Fig. 4 shows a cross-sectional view of a state in which the heat sink and the substrate are caulked in the first embodiment of the present invention, and (b) shows an enlarged cross-sectional view of a left side portion of the caulked portion.

Fig. 5 is a sectional view showing a process of supplying solder paste to the substrate and the heat dissipation plate in the first embodiment of the present invention.

Fig. 6 is a sectional view showing a state where solder paste is supplied to the substrate and the heat sink in the first embodiment of the present invention.

Fig. 7 is a sectional view of a substrate on which a component is mounted according to the first embodiment of the present invention.

Fig. 8 shows a plan view of a heat sink according to a second embodiment of the present invention (a) and a cross-sectional view taken along line D-D of (a).

Fig. 9 shows a plan view of the substrate according to the second embodiment of the present invention (a) and a cross-sectional view taken along line E-E of (a).

Fig. 10 shows a plan view of the temporarily fixed heat sink and substrate in the second embodiment of the present invention, in which (a) is a plan view and (b) is a sectional view taken along line F-F of (a).

Fig. 11 shows a cross-sectional view of a state where the heat sink and the substrate are caulked together in the second embodiment of the present invention, and (b) shows an enlarged cross-sectional view of a left side portion of the caulked portion.

Fig. 12 is a sectional view showing a process of supplying solder paste to a substrate and a heat dissipation plate in a second embodiment of the present invention.

Fig. 13 is a sectional view showing a state where solder paste is supplied to the substrate and the heat sink in the second embodiment of the present invention.

Fig. 14 is a sectional view of a substrate on which a component is mounted according to a second embodiment of the present invention.

Description of the reference numerals

1 Heat sink

1a cavity part

1b first through hole

1c front side

1d back side

1e recess

1f contact part

2 base plate

2a opening

2b first component area

2c second component area

2d second through hole

2e front side

3 rivet

3a flange

3b crimping part

7 gap

Clearance of 7a

8 Metal mask

9 solder paste

10 scraper (squeegee)

11 chip component

12 semiconductor package

21 heat sink

21a cavity part

21b first through hole

21c front surface

26 contact part

27 gap

32 base plate

32a opening

32b first component area

32c second component area

32d second through hole

32e front side

3 rivet

3b flange

c crimping part

S bearing table

P riveting punch

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. The embodiments described below are all specific examples. The numerical values, shapes, materials, constituent elements, arrangement positions and connection modes of the constituent elements, the order of the steps, and the like shown in the following embodiments are examples, and do not limit the present invention.

(first embodiment)

< Heat sink plate 1>

Fig. 1 (a) is a plan view of a heat sink 1 according to a first embodiment of the present invention. Fig. 1 (b) is a sectional view taken along line a-a of the heat radiating plate 1 according to the first embodiment of the present invention.

As shown in fig. 1a and 1b, a first through hole 1b is formed in the heat sink 1, and the first through hole 1b is used for aligning with the substrate 2 (see fig. 2) and for inserting, for example, a rivet 3 (see fig. 3) as a shaft member. The first through holes 1b are formed through the heat sink 1 at six positions in total, namely, one at each of the four corners of the heat sink 1 in a plan view (when the substrate 2 is viewed from above, the same applies hereinafter), four at each of the four corners, and two at each of the left and right sides of a position where the line a-a of the cross section crosses. The heat sink 1 has a cavity 1a formed on a front surface 1c side in contact with the substrate 2 so as to be recessed in accordance with the height of a component mounted on the substrate 2. In the heat sink 1, a recess 1e is formed in a back surface 1d of the heat sink 1 facing the front surface 1c on the substrate 2 side.

The heat sink 1 has a function of discharging heat from the semiconductor element, the electronic component, or the substrate 2. In order to efficiently discharge heat generated by the substrate 2 and the mounted components, the heat sink 1 needs to be made of a material having high thermal conductivity. The heat dissipation plate 1 is preferably a resin material or a metal material. For example, copper is used in the present embodiment. In addition, in order to mount the mounted components in a highly reliable state, a 4 μm Ni layer was formed by an electroplating method, and then a 0.05 μm Au film was formed. The heat sink 1 is not limited to the Ni film and the Au film, and may be formed of an Sn plating layer or an Ag plating layer depending on the type of surface treatment of the mounted member. In addition, the diameter of the first through hole 1b is formed to be 2.2 mm.

< substrate 2>

Fig. 2 (a) is a plan view of the substrate 2 according to the first embodiment of the present invention. Fig. 2 (B) is a cross-sectional view taken along line B-B of the substrate 2 according to the first embodiment of the present invention. As shown in fig. 2 (a) and 2 (b), a second through hole 2d is formed in the substrate 2, and the second through hole 2d is used for aligning the heat sink 1 and inserting a rivet 3 described later. The first through hole 1b and the second through hole 2d are arranged coaxially in alignment.

The substrate 2 carries a semiconductor element or an electronic component. The substrate 2 is formed with an opening 2a, a first component region 2b for mounting a chip component, and second component regions 2c for mounting a semiconductor package on the left and right sides of the opening 2a in a plan view. The opening 2a is used for mounting a component on the center of the back surface 1d of the heat sink 1 on the back surface 1d opposite to the front surface 1c side in plan view. The first component region 2b and the second component region 2c are produced by: a4 μm Ni layer was formed on a copper foil by an electroplating method, and a 0.05 μm Au film was formed thereon. The second through hole 2d has the same diameter as the first through hole 1b and is formed to have a diameter of 2.2 mm.

The diameters of the second through hole 2d of the substrate 2 and the first through hole 1b of the heat radiating plate 1 are formed larger than the diameter of the cylindrical portion of the rivet 3 so that the rivet 3 can be inserted. The diameter of the second through hole 2d is preferably formed to be, for example, 5% to 30% larger than the diameter of the cylindrical portion of the rivet 3. The diameter of the first through hole 1b is preferably 1% to 10% larger than the diameter of the cylindrical portion of the rivet 3, for example. The reason why the difference between the diameters of the second through hole 2d of the substrate 2 and the rivet 3 is larger than the difference between the diameters of the first through hole 1b and the rivet 3 is that the heat from the heat radiating plate 1 can be prevented from being transferred to the substrate 2 via the rivet 3 by forming the clearance 7a as a gap between the rivet 3 and the second through hole 2 d.

< rivet 3>

The rivet 3 has a cylindrical shape, and a flange 3a is formed at one end (one end), the flange 3a having a larger diameter than the cylindrical portion, and the flange 3a having a larger diameter than the second through hole 2d and the first through hole 1 b. The rivet 3 has an insertion tip formed at the other end thereof and inserted into the second through hole 2d and the first through hole 1 b. Further, since the other end of the rivet 3 is swaged to contact the heat sink 1, the linear expansion coefficient of the rivet 3 is preferably close to that of the heat sink 1. Therefore, the rivet 3 is preferably made of a resin material or a metal material, and is preferably made of the same material as the heat sink 1, as in the heat sink 1. For example, copper is used in the present embodiment.

Further, since the heat sink l directly mounts components, the heat sink 1 is subjected to surface treatment in order to mount the mounted components in a highly reliable state. However, since the rivet 3 is used for a member inserted into the first through hole 1b without mounting a component, surface treatment such as plating treatment may be omitted. The diameter of the cylindrical portion of the rivet 3 is set to 2.0mm, and a margin of 0.2mm is provided for the diameter of the first through hole 1b of 2.2mm and the diameter of the second through hole 2d of 2.2 mm.

[ Table 1]

Table 1 shows the dimensions of the first through hole 1b of the heat sink 1, the second through hole 2d of the substrate 2, and the rivet 3. In order to clarify the difference from the first embodiment, the dimensions of the first through hole 21b of the heat sink 21, the second through hole 32d of the substrate 32, and the rivet 3 are also described in relation to the second embodiment to be described later. The difference in the respective dimensions will be described in detail in the following description of the steps.

< laminating, positioning, and temporary fixing step >

Fig. 3 to 7 are diagrams illustrating a method of manufacturing a wiring substrate according to a first embodiment of the present invention. Fig. 3 (a) is a plan view of the heat sink 1 and the substrate 2 that are positioned and temporarily fixed in the first embodiment of the present invention. Fig. 3 (b) is a cross-sectional view taken along line C-C of fig. 3 (a) of the temporarily fixed heat sink 1 and substrate 2 according to the first embodiment of the present invention. Fig. 4 (a) is a cross-sectional view of the heat sink 1 and the substrate 2 in the first embodiment of the present invention after caulking. Fig. 4 (b) is a riveted portion and is an enlarged sectional view of a left portion of fig. 4.

As shown in fig. 3 (a) and 3 (b), the heat sink 1 is laminated such that the front surface 1c faces the surface opposite to the front surface 2e of the substrate 2.

Then, the heat dissipation plate 1 and the substrate 2 are arranged so that the six first through holes 1b and the six second through holes 2d corresponding thereto communicate with each other, by performing the positional alignment of the heat dissipation plate 1 and the substrate 2 so that the first through holes 1b and the second through holes 2d communicate with each other.

Then, the rivet 3 is inserted from the front surface 2e side of the substrate 2 into the second through hole 2d and the first through hole 1b, and the heat dissipation plate 1 and the substrate 2 are temporarily fixed while being aligned with each other.

< crimping step >

Fig. 4 (a) is a cross-sectional view of the heat sink 1 and the substrate 2 in the first embodiment of the present invention after caulking. Fig. 4 (b) is a riveted portion and is an enlarged sectional view of a left side portion of fig. 4 (a).

As shown in fig. 4 (a), the rivet 3 is inserted into the first through hole 1b and the second through hole 2d, the heat sink 1 and the substrate 2 in a temporarily fixed state are mounted on, for example, a stage S of a press machine, and the other end of the rivet 3 where the flange 3a is not formed is pressed in the stage (axial direction) direction with a load of 3t by, for example, a caulking punch P. Although the rivet 3 is pressed toward the substrate 2 by the caulking punch P, the flange 3a abuts against the surface of the stage S, and therefore the rivet 3 itself does not move. Since the rivet 3 cannot move in the direction of the substrate 2, the other end portion to be pressed is deformed from a cylindrical shape by the pressure in the axial direction from the upper surface of the caulking punch P. Specifically, the other end of the rivet 3 deforms so as to contact the peripheral edge of the first through-hole 1b, and presses the peripheral edge of the first through-hole 1b toward the substrate 2. On the other hand, since the flange 3a of the rivet 3 cannot move, the heat sink 1 and the substrate 2 can be caulked by the deformed portion (hereinafter, referred to as "pressure-bonded portion 3 b") of the flange 3a and the other end (the other end). By forming the above-described pressure-bonding section 3b, the heat sink 1 and the substrate 2 can be firmly fixed.

As shown in fig. 4 (a) and 4 (b), the rivet 3 is pressed from the upper surface toward the lower surface by the clinching punch P. Therefore, the peripheral edge of the first through hole 1b of the heat sink 1 is pressed downward by the pressure-bonding section 3b of the other end of the rivet 3. Therefore, the contact portion 1f is formed at a position of the front surface 1c of the heat sink 1 where the peripheral edge of the first through hole 1b strongly contacts the surface opposite to the front surface 2e of the substrate 2.

In the heat sink 1, the peripheral edge of the first through hole 1b is pressed downward by caulking and is crushed at a position farther from the peripheral edge of the first through hole 1b than the contact portion 1 f. Therefore, the surface of the heat sink 1 in contact with the substrate 2 is deformed so as to warp in a direction away from the substrate 2. By this deformation, in the heat sink 1, the gap 7 not in contact with the substrate 2 is formed at a position farther from the first through hole 1b than the contact portion 1f in contact with the substrate 2. Although not shown in detail in the drawings, the gap 7 is formed so that the distance from the substrate 2 gradually increases and the gap spreads radially outward from the periphery of the contact portion 1f, for example. The gap 7 is formed over the entire periphery of the contact portion 1 f. However, the gap 7 may not be formed over the entire periphery of the contact portion 1 f. The gap 7 is formed to communicate with the cavity 1a of the heat sink 1 and the opening 2a of the substrate 2, for example, so that heat from an overheated semiconductor or the like is not conducted to the heat sink 1 through the rivet 3. In addition, the gap 7 communicates with the outside of the heat sink 1 in order to suppress an increase in the temperature of the heat sink 1. However, the gap 7 may not communicate with the outside of the heat sink 1.

In the above-described caulking process, the other end of the rivet 3 is inserted through the second through hole 2d of the substrate 2, and the heat sink 1 and the substrate 2 are caulked by pressing the other end from the heat sink 1 side toward the substrate 2. However, the heat sink 1 and the substrate 2 may be riveted by inserting the other end of the rivet 3 from the first through hole 1b of the heat sink 1 and pressing the other end toward the heat sink 1 from the substrate 2 side.

A recess 1e is provided in the back surface 1d of the heat sink 1. By providing the concave portion 1e, the pressure-bonding section 3b, which is deformed by pressing and has no flange 3a, is accommodated in the concave portion 1e of the heat radiating plate 1. Accordingly, since there is no portion protruding from the back surface 1d of the heat sink 1, for example, a heat sink (not shown) can be disposed on the back surface 1d of the heat sink 1 so as to be in contact with the back surface 1d, and an effective heat radiation path can be easily ensured.

< mounting Process of Components >

Fig. 5 is a sectional view showing a process of supplying solder paste 9 to the first component block 2b and the second component block 2c arranged on the front surface 2e of the substrate 2 and the cavity portion 1a of the heat sink 1 according to the first embodiment of the present invention.

As shown in fig. 5, the metal mask 8 is aligned with the first component block 2b and the second component block 2c disposed on the front surface 2e of the substrate 2, and with the cavity 1a of the heat sink 1. Then, the solder paste 9 is supplied to the front surface 2e of the substrate 2 and the cavity portion 1a of the heat sink 1 by a method such as printing using the squeegee 10, for example. A metal mask having the same cavity structure is used as the metal mask 8 so as to correspond to the recess of the cavity portion 1a of the heat sink 1. However, when a plate-like solder material is used instead of the solder paste 9 in the cavity 1a of the heat sink 1, the solder paste 9 may be supplied only to the first component block 2b and the second component block 2c disposed on the front surface 2e of the substrate 2, and the metal mask 8 may not have a cavity structure.

Fig. 6 is a cross-sectional view showing a state where solder paste 9 is supplied to the first component block 2b and the second component block 2c disposed on the front surface 2e of the substrate 2 and the cavity 1a of the heat sink 1 in the first embodiment of the present invention.

As shown in fig. 6, solder paste 9 for connecting components is supplied to the first component block 2b and the second component block 2c disposed on the front surface 2e of the substrate 2 and the cavity 1a of the heat sink 1.

Fig. 7 is a sectional view of a substrate 2 according to the first embodiment of the present invention on which a component is mounted.

On the first component area 2b to which the solder paste 9 has been supplied, chip components 11 are mounted using a mounter (not shown). Similarly, the semiconductor package 12 is mounted on the substrate 2 and the heat sink 1 by using a mounting device. Thereafter, the substrate 2 and the heat sink 1 are heated to 245 degrees by using a reflow furnace (not shown), and the solder paste 9 supplied to the heat sink 1 and the substrate 2 is melted, whereby the chip components 11 and the semiconductor packages 12 are fixed to the substrate 2 and the heat sink 1.

It is preferable that the height of the flange 3a of the rivet 3 protruding from the substrate 2 is set to be lower than the height of the protrusion of the chip component 11, the semiconductor package 12, or the like mounted on the substrate 2. With this configuration, the height at which the flange 3a of the rivet 3 protrudes from the substrate 2 does not affect the size of the substrate 2 on which the heat sink 1 is mounted and the size of a module on which the substrate 2 on which the heat sink 1 is mounted.

Further, as in the first embodiment, it is preferable that the flange 3a of the rivet 3 is disposed on the front surface 2e side of the substrate 2, and the pressure-bonding section 3b of the rivet 3 is disposed on the back surface 1d of the heat sink 1. Since the pressure-bonding section 3b of the rivet 3 is formed by pressing from above, the projecting height is likely to vary. On the other hand, since the protruding height of the flange 3a is uniform from the beginning, the front surface 2e of the substrate 2 on which the flange 3a is disposed does not become extremely uneven. Thus, compared to the case where the pressure-bonding section 3b is disposed on the front surface 2e of the substrate 2, the influence on the printing process of the solder paste on the front surface 2e of the substrate 2 and the mounting process of the component on the front surface 2e of the substrate 2 is relatively small.

< effects >

Through the above-described steps, the heat sink 1 and the substrate 2 are pressed and caulked from the top and bottom by the flange 3a of the rivet 3 and the pressure-bonding section 3b of the other end, and can be firmly fixed. The heat sink 1 and the substrate 2 are in contact with each other at a contact portion 1f formed by the caulking.

In addition, a clearance 7a of, for example, 0.03 to 0.5mm is formed between the rivet 3 and the second through hole 2d in the substrate 2 in a state of being caulked.

As described above, the gap 7 is formed between the heat sink 1 and the wiring substrate 2, and the clearance 7a is formed between the rivet 3 and the second through hole 2d of the substrate 2. Since the heat sink 1 is in contact with the substrate 2 through the contact portion 1f, heat can be transferred from the substrate 2 and dissipated to the outside. Further, since the range of the heat sink 1 in contact with the substrate 2 is the contact portion 1f having a narrow area, even when the semiconductor package 12 generates heat during operation, for example, heat conduction from the heat sink 1 to the substrate 2 can be suppressed, and thus heat can be efficiently dissipated.

Further, since the clearance 7a is formed between the rivet 3 and the second through hole 2d, heat is not directly conducted, and heat conduction to the substrate 2 via the rivet 3 can be suppressed. Even when the substrate 2 expands or contracts due to a change in the environmental temperature, a difference in linear expansion caused by a difference in material from the heat sink 1 can be absorbed by the clearance 7a, and therefore, a highly reliable bonding can be achieved.

Further, either one or both of the gap 7 and the clearance 7a may be formed.

(second embodiment)

The second embodiment is substantially the same as the first embodiment, and detailed description of the same portions will be omitted, and different portions will be mainly described. In the second embodiment, the diameter of the first through hole 21b (see table 1 and fig. 8) of the heat dissipation plate 21 is different from the diameter of the first through hole 1b in the first embodiment.

< Heat sink plate 21>

Fig. 8 (a) is a plan view of the heat sink 21 according to the second embodiment of the present invention. Fig. 8 (b) is a cross-sectional view taken along line D-D of the heat radiating plate 21 according to the second embodiment of the present invention. A first through hole 21b is formed in the heat dissipation plate 21, and the first through hole 21b is used for alignment with the substrate 32 (see fig. 9) and for insertion of the rivet 3. Further, in the heat sink 21, a cavity portion 21a recessed so as to correspond to the height of a component mounted on the substrate 32 is formed on the front surface 21c side in contact with the substrate 32. In addition, as shown in table 1, in the second embodiment, the diameter of the first through hole 21b is 2.05 mm. In the first embodiment, the diameter of the first through hole 1b is 2.2 mm. The diameter of the first through hole 21b in the second embodiment is formed thinner by 0.15mm than the first through hole 1b in the first embodiment. The material and plating method of the heat sink 21 are the same as those of the first embodiment, and therefore, the description thereof is omitted.

< substrate 32>

Fig. 9 (a) is a plan view of the substrate 32 according to the second embodiment of the present invention. Fig. 9 (b) is a cross-sectional view taken along line E-E of the substrate 32 according to the second embodiment of the present invention.

The substrate 32 is provided with a second through hole 32d as in the first embodiment. The substrate 32 has an opening 32a, a first component region 32b for mounting a chip component, and a second component region 32c for mounting a semiconductor package, which are formed on the front surface 21c side, as in the first embodiment. The plating method of the first component region 32b and the second component region 32c is the same as that of the first embodiment, and therefore, the description thereof is omitted.

The diameter of the second through hole 32d of the substrate 32 is 2.2mm, and is formed larger than the diameter of the first through hole 21b of the heat dissipation plate 21. In the first embodiment, the second through hole 2d and the first through hole 1b are formed to have the same diameter, but in the second embodiment, the second through hole 32d and the first through hole 21b have different diameters.

< production method >

Fig. 10 to 14 are process views showing a method of manufacturing a wiring board according to a second embodiment of the present invention.

< laminating, positioning, and temporary fixing step >

Fig. 10 (a) is a plan view of the heat sink 21 and the substrate 32 in the second embodiment of the present invention temporarily fixed to each other. Fig. 10 (b) is a sectional view taken along line F-F of fig. 10 (a). As shown in fig. 10 (a) and 10 (b), the heat dissipation plate 21 is laminated such that the front surface 21c faces the surface of the substrate 32 opposite to the front surface 32 e. Then, the heat dissipation plate 21 and the substrate 32 are aligned and arranged so that the first through hole 21b and the second through hole 32d communicate with each other.

Thereafter, the rivet 3 is inserted from the front surface 32e side of the substrate 32 into the second through hole 32d and the first through hole 21b, and the heat dissipation plate 21 and the substrate 32 are temporarily fixed while being aligned with each other.

As shown in table 1, the diameter of the cylindrical portion of the rivet 3 is 2.0mm, with a margin of 0.05mm with respect to the diameter of 2.05mm of the first through hole 21b of the heat dissipation plate 21. The second embodiment forms the rivet 3 with a smaller margin from the first through hole 21b than the first embodiment. The second through hole 32d of the base plate 32 has a diameter of 2.2mm with a margin of 0.2mm with respect to the diameter of the cylindrical portion of the rivet 3. The first through hole 21b is formed to have a smaller diameter than the second through hole 32 d. By reducing the margin as described above compared to the first embodiment, the occurrence of backlash between the first through hole 21b and the rivet 3 can be avoided. Therefore, the accuracy of the positional alignment of the heat sink 21 and the substrate 32 is further improved as compared with the first embodiment, and the both can be joined with high accuracy.

< crimping step >

Fig. 11 (a) is a cross-sectional view of a state in which the heat sink 21 and the substrate 32 are caulked in the second embodiment of the present invention. Fig. 11 (b) is an enlarged cross-sectional view of the caulked portion and the left side portion of fig. 11 (a). As shown in fig. 11 (a) and 11 (b), the rivet 3 is inserted into the first through hole 21b and the second through hole 32d, the heat sink 21 and the substrate 32 which are temporarily fixed are mounted on the stage S, for example, and the other end of the rivet 3 where the flange 3b is not formed is pressed in the stage (axial direction) direction by a caulking punch P with a load of 3t, for example. Although the rivet 3 is pressed toward the substrate 32 by the caulking punch P, the flange 3b abuts against the surface of the stage S, and therefore the rivet 3 itself does not move. Since the rivet 3 cannot move in the direction of the base plate 32, the other end portion to be pressed is deformed from a cylindrical shape by the pressure from the upper surface of the caulking punch P. Specifically, the other end of the rivet 3 deforms so as to contact the peripheral edge of the first through-hole 21b, and presses the peripheral edge of the first through-hole 21b toward the substrate 32. On the other hand, since the flange 3b of the rivet 3 cannot move, the heat sink 21 and the substrate 32 can be caulked by the deformed portion of the flange 3b and the other end (hereinafter, referred to as a "pressure-bonded portion 33 c"). By forming the above-described pressure-bonding section 33c, the heat sink 21 and the substrate 32 can be firmly fixed.

Further, since the cylindrical portion of the rivet 3 is compressed by the pressure from the upper surface, the diameter of the cylindrical portion becomes larger than that in the state before caulking. In the second embodiment, the margin between the first through hole 21b and the rivet 3 is reduced by 0.05mm as compared with the first embodiment. Since the diameter of the cylindrical portion of the rivet 3 is increased by the caulking, the above-mentioned margin is lost or becomes extremely small after the caulking. Therefore, the rivet 3 is in contact with the inner wall of the first through hole 21b over substantially the entire surface. Since the rivet 3 is suppressed from moving horizontally in the first through hole 21b in addition to the pressing in the vertical direction by the caulking, the heat dissipation plate 21 is more firmly fixed to the substrate 32 than in the first embodiment.

On the other hand, as shown in table 1, since the second through hole 32d is provided with an allowance of 0.2mm in diameter with respect to the diameter of the rivet 3, even if the diameter of the cylindrical portion of the rivet 3 is increased by caulking, the cylindrical portion of the rivet 3 does not entirely contact the inner wall of the second through hole 32 d. Therefore, even if the material of the rivet 3 is different from the material of the substrate 32, a bonding failure due to a difference in linear expansion caused by the difference in material does not occur.

As shown in table 1, the difference between the diameters of the second through hole 32d and the rivet 3 is larger than the difference between the diameters of the first through hole 21b and the rivet 3, for the same reason as in the first embodiment.

Note that the point and the function of forming the contact portion 26 and the void 27 by caulking the rivet 3 are the same as those of the first embodiment described above, and therefore, the description thereof is omitted.

In the caulking step, the other end of the rivet 3 is inserted through the second through hole 32d, and the heat sink 21 and the substrate 32 are caulked by pressing the other end from the heat sink 21 side toward the substrate 32. However, the heat sink 1 and the substrate 32 may be caulked by inserting the other end of the rivet 3 through the first through hole 21b and pressing the other end toward the heat sink 21 from the substrate 32 side.

< mounting Process of Components >

Fig. 12 is a sectional view showing a process of supplying solder paste 9 to the first component block 32b and the second component block 32c disposed on the front surface 32e of the substrate 32 and the cavity 21a of the heat sink 21 in the second embodiment of the present invention.

Fig. 13 is a cross-sectional view showing a state where solder paste 9 is supplied to the first component block 32b and the second component block 32c disposed on the front surface 32e of the substrate 32 and the cavity 21a of the heat sink 21 in the second embodiment of the present invention.

Fig. 14 is a sectional view of a substrate 32 according to a second embodiment of the present invention on which a component is mounted.

The arrangement of the first component block 32b, the second component block 32c, and the cavity 21a, the supply of the solder paste 9, and the fixation of the first component block 32b, the second component block 32c, and the cavity 21a to the heat sink 1 and the substrate 32 are the same as those in the first embodiment described above, and therefore, the description thereof is omitted.

< effects >

The heat dissipation plate 21 and the substrate 32 are firmly fixed by caulking the rivets 3 through the above-described steps in the second embodiment, which is the same as the first embodiment, and therefore, the description thereof is omitted.

In addition, since the clearance 7a of, for example, 0.03 to 0.5mm is formed between the rivet 3 and the second through hole 32d in the substrate 32 in the riveted state, the same effect as that of the first embodiment described above is obtained, and therefore, the description thereof is omitted.

Furthermore, the method is simple. Either one or both of the gap 27 and the clearance 7a may be formed.

Industrial applicability

The wiring board of the present invention is generally useful in an apparatus in which a power device is mounted on a heat sink.