阅读说明：本技术 在高于其分解温度下施加含有可熔聚合物的材料，特别是热熔胶粘剂的方法 (Method for applying materials containing fusible polymers, in particular hot-melt adhesives, above their decomposition temperature ) 是由 D·阿克滕 T·比斯根 J·蒂拉克 P·赖歇特 N·德乔治 M·梅尔基奥斯 W·阿尔恩特 于 2019-02-13 设计创作，主要内容包括：施加含有可熔聚合物的材料的方法,其包括步骤：从排料元件的排料口将至少部分熔融的材料的长丝施加到基底上。所述可熔聚合物具有下列性质：在≥40℃至≤120℃的范围内的熔点(DSC,差示扫描量热法；在5℃/min的加热速率下第二次加热)；在≥-70℃至≤30℃的范围内的玻璃化转变温度(DMA,根据DIN EN ISO 6721-1:2011的动态力学分析)；≥1?10<Sup>4</Sup> Pa的在比熔点高20℃下的储能模量G’(根据ISO 6721-10:2015在1/s的频率下的板/板振荡粘度计)；≤1?10<Sup>7</Sup> Pa的在预先加热到比熔点高20℃的温度和随后以1℃/min的冷却速率冷却时在比熔点低10℃下的储能模量G’(根据ISO 6721-10:2015在1/s的频率下的板/板振荡粘度计)；其中所述长丝在施加过程中具有比可熔聚合物的熔点高≥100℃的施加温度≤5分钟,且其中所述可熔聚合物还具有下列性质：所述可熔聚合物在施加过程中达到的最高施加温度下的储能模量G’(根据ISO 6721-10:2015在1/s的频率下的板/板振荡粘度计)为所述可熔聚合物在比熔点高20℃的温度下的储能模量G’(根据ISO 6721-10:2015在1/s的频率下的板/板振荡粘度计)的≤1/10。(A method of applying a material containing a fusible polymer comprising the steps of: filaments of at least partially molten material are applied to the substrate from a discharge opening of the discharge element. The fusible polymer has the following properties: a melting point in the range of from not less than 40 ℃ to not more than 120 ℃ (DSC, differential scanning calorimetry; second heating at a heating rate of 5 ℃/min); glass transition in the range of-70 ℃ to 30 ℃ inclusiveTemperature variation (DMA, dynamic mechanical analysis according to DIN EN ISO 6721-1: 2011); not less than 1 ∙ 10 4 A storage modulus G' at 20 ℃ above the melting point of Pa (plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015); less than or equal to 1 ∙ 10 7 Pa of a storage modulus G' at 10 ℃ below the melting point when preheated to a temperature 20 ℃ above the melting point and subsequently cooled at a cooling rate of 1 ℃/min (plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015); wherein the filaments have an application temperature of ≥ 100 ℃ above the melting point of the fusible polymer during application of ≤ 5 minutes, and wherein the fusible polymer further has the following properties: the storage modulus G '(plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015) of the fusible polymer at the highest application temperature reached during application is ≦ 1/10 for the storage modulus G' (plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015) of the fusible polymer at a temperature 20 ℃ above the melting point.)

1. A method of applying a material containing a fusible polymer comprising the steps of:

-applying filaments of at least partially molten material onto a substrate from a discharge opening of a discharge element;

it is characterized in that

The fusible polymer has the following properties:

a melting point in the range from ≥ 40 ℃ to ≤ 120 ℃ (DSC, differential scanning calorimetry; second heating at a heating rate of 5 ℃/min);

a glass transition temperature (DMA, dynamic mechanical analysis according to DIN EN ISO 6721-1: 2011) in the range from ≥ 70 ℃ to ≤ 30 ℃;

- ≥ 1∙10⁴a storage modulus G' at 20 ℃ above the melting point of Pa (plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015);

- ≤ 1∙10⁷pa of a storage modulus G' at 10 ℃ below the melting point when preheated to a temperature 20 ℃ above the melting point and subsequently cooled at a cooling rate of 1 ℃/min (plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015);

wherein the filaments have an application temperature of not more than 5 minutes at not less than 100 ℃ above the melting point of the fusible polymer during application, and

wherein the fusible polymer further has the following properties: the storage modulus G '(plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015) of the fusible polymer at the highest application temperature reached during application is ≦ 1/10 for the storage modulus G' (plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015) of the fusible polymer at a temperature 20 ℃ above the melting point.

2. The process as claimed in claim 1, characterized in that the filaments are applied at a speed of > 150 mm/s.

3. The method as claimed in claim 1 or 2, characterized in that the fusible polymer is selected such that, after storage for a period of ≦ 1 hour at the maximum application temperature reached, the storage modulus G '(DMA, dynamic mechanical analysis at a frequency of 1/s according to DIN EN ISO 6721-1:2011, in particular a plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015) increases by more than a factor of two, or the storage modulus G' (DMA, dynamic mechanical analysis at a frequency of 1/s according to DIN EN ISO 6721-1:2011, in particular a plate/plate oscillation viscometer at a frequency of 1/s according to ISO6721-10: 2015) decreases to a value of less than half of the starting value.

4. A method as claimed in any one of claims 1 to 3, characterized in that the material is heated from a temperature of 40 ℃ or less to the maximum application temperature within 5 minutes or less before the material is applied.

5. A method as claimed in any of claims 1 to 4, characterized in that the material is heated in the discharge element to a maximum application temperature set so that the viscosity of the material at this temperature is reduced to 1/10 at most.

6. A method as claimed in any of claims 1 to 5, characterized in that the distance between the surface of the substrate and the discharge opening of the discharge element is ≦ 1 mm.

7. A method as claimed in any of claims 1 to 6, characterized in that the discharge element and its discharge opening are driven over the substrate in contact with the substrate at constant pressure.

8. A method as claimed in any one of claims 1 to 7, characterized in that the material is applied to the substrate at a pressure of 0.5 bar or more.

9. The method according to any one of claims 1 to 8, wherein the fusible polymer is selected from the group consisting of: polyurethane, polyester, polyalkylene oxide, plasticized PVC, polyamide, polyvinyl acetate, polyethylene, polypropylene, protein, or a combination of at least two thereof.

10. The method according to claim 9, wherein the fusible polymer comprises a polyurethane obtainable from the reaction of a polyisocyanate component and a polyol component, wherein the polyol component comprises a polyester polyol having a pour point (astm d 5985) of 25 ℃.

11. The process as claimed in any of claims 1 to 10, characterized in that the fusible polymer, after heating to 20 ℃ above its melting point and cooling to 20 ℃ at a cooling rate of 4 ℃/min, has a storage modulus G '(measured with a plate/plate oscillatory viscometer according to ISO6721-10:2015 at a frequency of 1/s at the temperature in each case) of > 100 kPa to < 10 MPa in the temperature interval of 25 ℃ to 40 ℃ for >1 minute and a storage modulus G' (measured with a plate/plate oscillatory viscometer according to ISO6721-10:2015 at a frequency of 1/s at 20 ℃) of > 20 MPa after cooling to 20 ℃ and storage at 20 ℃ for 120 minutes.

12. A method as claimed in any one of claims 1 to 11, characterized in that the applied material is brought into contact with a second substrate.

13. A method as claimed in claim 12, characterized in that the second substrate is provided with a hot-melt adhesive and said hot-melt adhesive is brought into contact with the applied material.

14. A method according to any one of claims 1 to 13, characterized in that the method is a method of manufacturing an article from the material and that the method comprises the steps of:

I) applying said at least partially molten filaments of material onto a carrier to obtain a layer of material corresponding to a first selected cross-section of the article;

II) applying the filaments of the at least partially molten material onto the previously applied layer of material to obtain a further layer of material corresponding to a further selected cross-section of the article and engaging the previously applied layer;

III) repeating step II) until an article is formed.

15. A method according to any one of claims 1 to 14, wherein the substrate is a textile, foil, paper, cardboard, foam, a moulded article, a component of a shoe, a circuit board of an electronic circuit, an electronic device housing component or an electronic component.