阅读说明：本技术 一种基于温差发电的半导体制冷散热装置 (Semiconductor refrigeration heat abstractor based on thermoelectric generation ) 是由 李月锋 翟鑫梦 邹军 王昭 石明明 杨波波 于 2020-07-28 设计创作，主要内容包括：本发明涉及一种基于温差发电的半导体制冷散热装置,用于对热源进行散热,装置包括温差发电系统、半导体制冷系统及热管散热系统,温差发电系统及半导体制冷系统均与热源相连,热管散热系统与半导体制冷系统相连。与现有技术相比,本发明将温差发电技术与半导体制冷技术相结合,有效利用热源与环境温差发电,通过微控制器的整流、稳压后存储在锂电池中,替代外接电源为半导体发电片提供工作电压,节能环保。(The invention relates to a semiconductor refrigeration heat dissipation device based on thermoelectric generation, which is used for dissipating heat of a heat source. Compared with the prior art, the semiconductor refrigeration system has the advantages that the thermoelectric power generation technology and the semiconductor refrigeration technology are combined, the heat source and the environmental temperature difference are effectively utilized for power generation, the power is stored in the lithium battery after being rectified and stabilized by the microcontroller, the working voltage is provided for the semiconductor power generation sheet instead of an external power supply, and the semiconductor refrigeration system is energy-saving and environment-friendly.)

1. The semiconductor refrigeration heat dissipation device based on thermoelectric generation is used for dissipating heat of a heat source (8), and is characterized by comprising a thermoelectric generation system, a semiconductor refrigeration system and a heat pipe heat dissipation system, wherein the thermoelectric generation system and the semiconductor refrigeration system are connected with the heat source (8), and the heat pipe heat dissipation system is connected with the semiconductor refrigeration system.

2. The semiconductor refrigeration and heat dissipation device based on thermoelectric generation as claimed in claim 1, wherein the thermoelectric generation system comprises a thermoelectric generation element (1), a lithium battery (3) and a microcontroller (5) which are arranged on a heat source (8), and the microcontroller (5) is electrically connected with the thermoelectric generation element (1) and the lithium battery (3) respectively.

3. The semiconductor refrigeration and heat dissipation device based on thermoelectric generation as claimed in claim 2, wherein the lithium battery (3) and the microcontroller (5) are both disposed on a heat pipe heat dissipation system.

4. The semiconductor refrigeration heat dissipation device based on thermoelectric power generation as claimed in claim 3, wherein the semiconductor refrigeration system comprises at least one semiconductor refrigeration chip (2) arranged on the heat source (8), and the microcontroller (5) is electrically connected with the semiconductor refrigeration chip (2).

5. The thermoelectric power generation-based semiconductor refrigeration heat dissipation device as recited in claim 4, wherein the heat pipe heat dissipation system comprises a steam chamber (4) disposed on the semiconductor refrigeration sheet (2) and a heat pipe (6) disposed on the steam chamber (4).

6. The semiconductor refrigeration and heat dissipation device based on thermoelectric generation as claimed in claim 5, wherein the heat pipe (6) is provided with fins (7).

7. The thermoelectric power generation-based semiconductor refrigeration and heat dissipation device as claimed in claim 5, wherein the lithium battery (3) and the microcontroller (5) are both disposed on the outer wall of the steam chamber (4).

8. The semiconductor refrigeration and heat dissipation device based on thermoelectric generation as claimed in claim 5, wherein the diameter of the steam chamber (4) is gradually increased along the direction from the semiconductor refrigeration piece (2) to the heat pipe (6).

9. The semiconductor refrigeration heat dissipation device based on thermoelectric power generation as claimed in claim 5, wherein heat-conducting silicone grease is arranged between the semiconductor refrigeration piece (2) and the heat source (8) and between the semiconductor refrigeration piece (2) and the steam chamber (4).

10. The semiconductor refrigeration and heat dissipation device based on thermoelectric power generation as claimed in claim 5, wherein the inner wall of the heat pipe (6) is provided with a porous copper powder sintered layer.

Technical Field

The invention belongs to the technical field of semiconductor refrigeration, and relates to a semiconductor refrigeration heat dissipation device based on thermoelectric power generation.

Background

With the rapid development of electronic technology in China, various electronic products have gradually entered the lives of people, become an indispensable part of life and work, promote the lives of people and improve the quality of life. But at the same time presents some problems, the most significant of which is the waste heat generated during the operation of the electronic product. Along with the increase of the continuous service time of the electronic product, the temperature also rises along with the increase of the continuous service time, and the service performance and the service life of the electronic product are seriously influenced.

At present, the commonly used heat dissipation technologies of electronic devices mainly include natural convection heat dissipation, forced air cooling heat dissipation, liquid cooling, heat pipes, micro-channel cooling, integrated heat circuits, thermoelectric refrigeration and the like, but with the rapid development of microelectronic technologies, electronic products are continuously developing towards high-density packaging and multi-functionalization, and the commonly used heat dissipation technologies have certain limitations. In order to meet the requirement of electronic technology development, a thermoelectric power generation technology and a semiconductor refrigeration technology are well developed.

The Chinese patent invention with publication number CN110425766A (a semiconductor refrigeration system) solves the problem of low heat exchange efficiency in the prior art, increases the joint area of the cold guide block and the metal aluminum liner, but fails to fully utilize the temperature difference, and has single radiator fin and unobvious refrigeration effect.

The invention discloses a Chinese patent with a publication number of CN109974331A (a semiconductor refrigerating device), which solves the problems of low heat exchange efficiency and low refrigerating efficiency in the prior art, well controls noise, arranges a fan in the middle of radiating fins of a radiating unit, improves the space utilization rate of the refrigerating device, is beneficial to miniaturization design, but the radiating mode of the radiating fins is single, and can not achieve the best refrigerating effect.

Disclosure of Invention

The semiconductor refrigeration heat dissipation device can effectively utilize the temperature difference between a heat source and the environment to generate electricity, replaces an external power supply to provide working voltage for a semiconductor refrigeration piece, is energy-saving and environment-friendly, and solves the problem that the conventional semiconductor refrigeration piece needs to be connected with an external power supply.

The purpose of the invention can be realized by the following technical scheme:

the semiconductor refrigeration heat dissipation device comprises a temperature difference power generation system, a semiconductor refrigeration system and a heat pipe heat dissipation system, wherein the temperature difference power generation system and the semiconductor refrigeration system are connected with a heat source, and the heat pipe heat dissipation system is connected with the semiconductor refrigeration system.

Furthermore, the thermoelectric generation system comprises a thermoelectric generation element, a lithium battery and a microcontroller which are arranged on the heat source, wherein the microcontroller is electrically connected with the thermoelectric generation element and the lithium battery respectively.

Furthermore, the lithium battery and the microcontroller are both arranged on the heat pipe cooling system.

Furthermore, the semiconductor refrigeration system comprises at least one semiconductor refrigeration piece arranged on the heat source, and the microcontroller is electrically connected with the semiconductor refrigeration piece.

Furthermore, the heat pipe heat dissipation system comprises a steam chamber arranged on the semiconductor refrigeration piece and a heat pipe arranged on the steam chamber.

Furthermore, the heat pipe is provided with fins.

Furthermore, the lithium battery and the microcontroller are both arranged on the outer wall of the steam chamber.

Further, the diameter of the steam chamber is gradually increased along the direction from the semiconductor refrigeration piece to the heat pipe.

Furthermore, heat-conducting silicone grease is arranged between the semiconductor refrigerating piece and the heat source and between the semiconductor refrigerating piece and the steam chamber.

Furthermore, a porous copper powder sintering layer is arranged on the inner wall of the heat pipe.

The invention provides a semiconductor refrigeration heat dissipation device based on thermoelectric generation.A thermoelectric generation element is tightly attached to a heat source, and when temperature difference exists at the cold end and the hot end, direct current generated by the thermoelectric generation element is stored in a lithium battery after being rectified and stabilized by a microcontroller so as to provide working voltage for a semiconductor refrigeration piece. The cold end of the semiconductor refrigeration piece is tightly attached to the heat source, the hot end of the semiconductor refrigeration piece is connected with the steam chamber, and the middle of the semiconductor refrigeration piece is coated with heat-conducting silicone grease to enhance the heat-conducting effect. The steam chamber has a large area at one end and a small area at the other end, and the heat exchange efficiency is enhanced. The heat pipe is welded on the steam chamber in an array shape, the cold ends of the array are connected with the hot end of the steam chamber in space, and meanwhile the fins are superposed on the heat pipe to enhance the heat dissipation effect.

Specifically, among the components of the apparatus of the present invention:

the thermoelectric generation element is tightly attached to the heat source, when temperature difference exists at the cold end and the hot end, direct current generated by the thermoelectric generation element is stored in the lithium battery after rectification and voltage stabilization of the microcontroller, so that working voltage is provided for the semiconductor refrigeration piece. The thermoelectric power generation element can be selected as a thermoelectric couple, when temperature difference is generated at the cold end and the hot end, the heat movement of a cavity at the hot end of the P-type semiconductor material is higher than that at the cold end, and the cavity is diffused from the high-temperature end to the low-temperature end to form potential difference; the thermal motion of the electrons at the hot end of the N-type semiconductor material is higher than that at the cold end, and then the electrons diffuse from the high-temperature end to the low-temperature end to form a potential difference. In the formed loop, when a temperature difference exists between the two ends of the composite semiconductor material, an electromotive force is generated to form a current.

The microcontroller is installed in steam chamber one side, and inside is equipped with rectifier circuit, electric capacity, steady voltage charging circuit etc. and is connected with thermoelectric generation component, lithium cell and semiconductor refrigeration piece electricity.

The lithium battery is arranged on the other side of the steam chamber and is mainly used for storing electric energy generated by the thermoelectric generation element and providing working voltage for the semiconductor refrigeration piece. The unit of the lithium battery is milliampere (mAh), and when the capacity of the lithium battery is 1000mA and the output current is 1mA, the current can be output for 1000 h. The lithium battery preferably has a capacity of 100 AH.

The cold end of the semiconductor refrigeration piece is tightly attached to the heat source, the hot end of the semiconductor refrigeration piece is connected with the steam chamber, and the middle of the semiconductor refrigeration piece is coated with heat-conducting silicone grease to enhance the heat-conducting effect. The semiconductor refrigeration piece is also called as a thermoelectric semiconductor refrigeration assembly, because the refrigeration piece is divided into two sides, one side absorbs heat and is called as a hot side, the other side dissipates heat and is called as a cold side, and the refrigeration piece only plays a heat conduction role and is a heat transfer tool. The semiconductor refrigerating sheet can be applied to occasions with limited space, high reliability requirement and no refrigerant pollution.

The heat-conducting silicone grease is coated between the semiconductor refrigeration sheet and the steam chamber, and mainly used for enhancing the heat conductivity.

The steam chamber (VC) is arranged on the semiconductor refrigerating sheet and mainly used for transferring heat. The vapor chamber is also called as a vacuum chamber vapor chamber, and after absorbing the heat of the chip, the liquid at the bottom of the vacuum chamber is evaporated and diffused into the vacuum chamber, the heat is conducted to the other end, and then the liquid is condensed into the liquid to return to the bottom, and the heat is conducted by utilizing phase change. The areas of the two ends of the steam chamber are different, and the heat exchange efficiency is improved.

The heat pipe is arranged on the steam chamber and realizes heat transfer by the phase change of working liquid in the heat pipe. The heat pipes are arranged on the steam chamber in an array shape, the cold ends of the array are connected with the hot end of the steam chamber in space, and meanwhile the fins are superposed on the heat pipes to enhance the heat dissipation effect. The tube core of the heat pipe is sintered with copper powder, and the porous sintering layer can enhance the evaporation process and the thermal property of the heat pipe.

Compared with the prior art, the invention has the following characteristics:

1) the semiconductor refrigeration system combines a thermoelectric power generation technology and a semiconductor refrigeration technology, effectively utilizes a heat source and environmental temperature difference to generate power, is stored in the lithium battery after being rectified and stabilized by the microcontroller, replaces an external power supply to provide working voltage for the semiconductor power generation chip, and is energy-saving and environment-friendly;

2) the steam chamber in the invention is designed into a variable cross-section form, thereby improving the heat exchange efficiency;

3) the invention mainly aims at high-power electronic equipment, the heat pipes are welded on the steam chamber in an array shape, the cold ends of the array are connected with the hot end of the steam chamber in space, and meanwhile, the fins are superposed on the heat pipes, so that the heat dissipation effect is enhanced.

4) The tube core of the heat pipe of the invention is sintered with copper powder, and the porous sintering layer can enhance the evaporation process and the thermal property of the heat pipe.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

the notation in the figure is:

1-thermoelectric power generation element, 2-semiconductor refrigeration piece, 3-lithium battery, 4-steam chamber, 5-microcontroller, 6-heat pipe, 7-fin, 8-heat source.

Detailed Description

The invention is described in detail below with reference to the figures and specific embodiments. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.