Performance evaluation device building method for reflow soldering equipment
阅读说明：本技术 用于回流焊接设备的性能评估装置搭建方法 (Performance evaluation device building method for reflow soldering equipment ) 是由 陈仕健 孟桢沛 李阳 于 2020-06-30 设计创作，主要内容包括：本发明公开了用于回流焊接设备的性能评估装置搭建方法,包括支撑框架、热容量模组、隔热保温装置和数据采集器的搭建。本发明采用独立的热容量模组,独立热容量模组可以测试得出水平方向相同热容量模组的真实热均匀差别值以及纵向不同模组之间的热均衡能力差别值,采用热导率系数不大于热容量模组的热导系数的材料作为支撑框架,具有中等强度、热膨胀系数小、良好的抗腐蚀性的特点,支撑框架和热容量模组之间无直接热传导,通过设计的超低导入系数材料作为中间过渡材料,避免框架和热容量模组之间发生热交换,可实现独立的多样性温度数据采集以及分析,测温模组之间的相互独立热数据采集。(The invention discloses a method for building a performance evaluation device for reflow soldering equipment, which comprises the building of a support frame, a thermal capacity module, a thermal insulation device and a data acquisition unit. The invention adopts the independent thermal capacity module, the independent thermal capacity module can test to obtain the real thermal uniformity difference value of the same thermal capacity module in the horizontal direction and the thermal equilibrium capacity difference value between different longitudinal modules, the material with the thermal conductivity coefficient not larger than that of the thermal capacity module is adopted as the support frame, the invention has the characteristics of medium strength, small thermal expansion coefficient and good corrosion resistance, no direct heat conduction exists between the support frame and the thermal capacity module, the ultra-low introduction coefficient material is adopted as the intermediate transition material, the heat exchange between the frame and the thermal capacity module is avoided, the independent diversified temperature data acquisition and analysis can be realized, and the mutually independent thermal data acquisition between the temperature measurement modules is realized.)
1. A performance evaluation device building method for reflow soldering equipment is characterized by comprising building of a supporting frame, a thermal capacity module, a thermal insulation device and a data acquisition unit.
2. The method of constructing a performance evaluation device for reflow soldering apparatus in claim 1, wherein the support frame is made of refractory synthetic stone or refractory fiber mixed plate or refractory carbon fiber plate material, the support frame includes a cover plate layer and a bottom plate layer, the cover plate layer is used for heat insulation and identifies the function of various size names, scale values and size of the length and width of the carrier and the name of the heat capacity module to be deployed can be identified, the bottom plate layer is used for heat insulation and deployment of corresponding thermocouple wire slots and a carrier for carrying each temperature module, the temperature modules are thermocouples used for monitoring the temperature of the heat capacity module, the thermocouples are installed on the collection plate, the cover plate layer and the bottom plate layer are combined to form the outer frame of the whole apparatus, the top is designed with a portable handle (the part can be eliminated or reserved), the middle part bears the fretwork part for the thermal capacity module, the design needs to follow the frame unanimously (design is 10mm), no matter the actual part of horizontal vertical frame is 10mm, the fretwork area can change along with the width change of design carrier, this test carrier design can be designed into different width, thermal capacity module frame peripheral frame need keep unanimous heat absorption, the frame carrier width of design is 10mm, the inside fretwork of parcel of thermal capacity module is the square fretwork frame that the limit is 40mm, the carrier lower part is for placing thermal-insulated heat preservation device.
3. The method of claim 1, wherein the thermal capacity module comprises at least 3 rows, the first row is an ambient temperature thermal capacity module, the second row is a large heat absorption module, the third row is a small heat absorption module, the module other than the ambient temperature thermal capacity module is a module that must be fixed, the other rows are made of the same material, the thermal conductivity of the support frame is not greater than the thermal conductivity of the thermal capacity module, the independent thermal capacity module is transversely designed to be the same thermal capacity module made of the same material with the same volume and the same thermal conductivity, the longitudinal direction is designed to be different thermal capacity modules made of the same material with the same thermal conductivity and different volumes, the thermal capacity module and the support frame are connected by the support rods, wherein 3 support rods are 1mm solid rods made of high temperature resistant material with medium strength, small thermal expansion coefficient and corrosion resistant material, 1 hollow rod made of 1.2-1.5mm high-temperature resistant, medium-strength, small-thermal expansion coefficient and corrosion-resistant materials, and the hollow rod can penetrate through a thermocouple and be deployed to the central point of the heat capacity module.
4. The method for constructing a performance evaluation device for reflow soldering apparatus in accordance with claim 1, wherein the thermal insulation and preservation device has a function of designing the cold end of the thermocouple and the collection plate of the thermocouple, preserving heat of the data acquisition device, and designing a sufficient cavity inside to place the data acquisition device that is not resistant to temperature into the thermal insulation device.
5. The method for constructing a performance evaluation device for reflow soldering equipment as claimed in claim 1, wherein the data collector is hinged to one end of the thermal insulation device, the data collector is used for collecting the data temperature measured by the thermocouple of each thermal capacity module, and the requirement that the thermocouple wires are not easy to replace due to the limited thermal insulation space and the requirement of multi-test continuous test plugging is met, so that during design, a special plug-in design is adopted, the data collected by the cold end of the thermocouple is placed inside the thermal insulation box and fixed on an independent circuit board, and then a special small plug is used for connection, and the data of temperature measurement points of more than 20 channels are transmitted to the data collector for data processing and analysis.
Technical Field
The invention relates to the field of SMT hot air reflow soldering production, in particular to a method for building a performance evaluation device for reflow soldering equipment.
Background
In the field of SMT hot air reflow soldering production, professional tests for evaluating reflow furnace equipment of production equipment are lacked at present, which mainly reflects that the test method is not strict and the calibration of a test fixture is lacked in unified specification, so that the test evaluation of the equipment is prone to be deviated. The performance test adopted in the industry is that a plurality of temperature measuring points are arranged on the whole aluminum plate or a PCBA plate is utilized to carry out 5-30 times of continuous temperature tests, and CPK is calculated to be used for evaluating the performance of the reflow furnace, and the test has a great evaluation leak.
At present, the performance evaluation of reflow furnace equipment is carried out by testing and verifying respective reflow furnace manufacturers by adopting an aluminum plate test or PCBA (printed Circuit Board Assembly), and the temperature data difference of the test is taken as a judgment standard. At present, no third-party standard test carrier can give consideration to the rigor of a test control group, an accurate test carrier and a high-precision data acquisition instrument matched with multi-temperature-point test. Under the condition that the test carrier and the instrument are not unified, the tested data can not be used for evaluating the performance of the reflow furnaces of different manufacturers, and even a data set tested between the reflow furnaces of different types of the same reflow furnace equipment has no strict comparison significance of a reference set.
Aiming at the defect of lack of professional tests for the evaluation of reflow furnace equipment of production equipment at present, the defects that the test method is not strict and the calibration of a test fixture is lack of unified standards are mainly reflected, the test evaluation of the equipment is easy to deviate, and the defects are mainly reflected as follows:
firstly, the aluminum plate absorbs heat uniformly, the real condition of temperature difference of different transverse point positions cannot be reflected in the test, and deployed temperature measuring points cannot simulate different longitudinal heat absorption components.
And secondly, when the PCBA is selected for repeated high-temperature test of the material, although the evaluation of the PCBA of a real product is easy, the nature of the PCBA material is changed, and the repeatability test of the material is infeasible when the PCBA is selected for the selection of a test fixture.
Assessing the unicity of data analysis, adopting an aluminum plate or PCBA as a carrier to deploy temperature measuring points at present, wherein the temperature measuring points do not evaluate the temperature of modules with different heat capacities for the aluminum plate; there was no evaluation of the temperature of the control group for the PCBA repeatability test. The data analysis is also limited to the evaluation test of the temperature difference, and the diversity data analysis of the test module when the rotating speed of the hot air motor of the reflow oven equipment is adjusted is not carried out.
And fourthly, the temperature measurement module on the test carrier has no independence, and the evaluation of the temperature data can not form the independent evaluation of a control group along with the size change of the aluminum plate or the size change of the PCBA product.
The aluminum plate is adopted for testing, false alarm of a test result of a temperature measuring point is easily caused, the aluminum plate absorbs heat quickly, heat is transferred quickly in the aluminum plate, temperature difference of different horizontal point positions is small in the test, the temperature of one side, close to the track, of a produced product is actually lower than the temperature of the center positions of the tracks on two sides in actual production, the aluminum plate is used for testing, heat transfer of the aluminum plate is fast and uniform, and the real temperature difference relation is ignored. Therefore, independent temperature measurement modules are required to be used in the test and are independent from each other.
The evaluation of thermal shock and forced heat transfer rate to temperature points was omitted in the aluminum plate or PCBA test: a. when the temperature difference of each test point is large, the revolution number of a motor fan is often changed to reduce the temperature difference of the test points, but although the temperature difference can be reduced by the changing mode, the rotating speed of a forced convection hot air motor of reflow furnace equipment is increased to accelerate the heat transfer rate, so that when the real production is easily caused, large impact thermal stress caused by overlarge temperature difference of the surface of the PCBA or the component is caused due to the fact that the temperature change is increased, and once large thermal shock is caused, the generated thermal stress can exceed the yield limit of materials, and the component is damaged. b. In addition, when the rotation number of the motor fan is changed, the measured air ambient temperature does not change, but the traditional test of the heat transfer rate brought by forced convection cannot obtain a result, so that the quantitative and the contrast of the evaluation of the performance of the reflow oven are really carried out in the performance evaluation of the reflow oven, and the heating efficiency and the heat compensation efficiency of different types of reflow ovens cannot be evaluated.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
In order to solve the above problems and the diversity and non-uniformity of reflow oven performance testing equipment, so that the above problems need to be avoided when designing performance evaluation and testing equipment for reflow oven soldering equipment, an equipment capable of calibrating the performance of the reflow oven and not changing with the width change of a carrier or multiple continuous tests is designed as the equipment for evaluating and testing the performance of the reflow oven.
In order to achieve the purpose, the invention provides the following technical scheme: the method for building the performance evaluation device for the reflow soldering equipment comprises the building of a supporting frame, a thermal capacity module, a thermal insulation device and a data acquisition unit.
Further, the support frame is made of high temperature resistant synthetic stone or high temperature resistant fiber mixed plate or high temperature resistant carbon fiber plate material, the support frame comprises a cover plate layer and a bottom plate layer, the cover plate layer is used for insulating heat and marking various size names, the scale value of the length and width of the carrier and the size of the carrier and the name of the deployed heat capacity module can be marked, the bottom plate layer is used for insulating heat and deploying a corresponding thermocouple wire slot and a carrier for bearing each temperature measurement module, the temperature measurement modules are thermocouples used for monitoring the temperature of the heat capacity module, the thermocouples are installed on the aggregation plate, the cover plate layer and the bottom plate layer are combined to form an external frame of the whole instrument, a handheld handle is designed at the uppermost part (the part can be cancelled or reserved), the middle part is a hollow part for bearing the heat capacity module, the design needs to follow that the frames are consistent (designed, no matter the actual part of horizontal vertical frame is 10mm, the fretwork area can change along with the width change of design carrier, and this test carrier design can be designed into different widths, and the peripheral frame of thermal capacity module frame need keep unanimous heat absorption capacity, and the frame carrier width of design is 10mm, and the inside fretwork of parcel of thermal capacity module is the square fretwork frame that the limit is 40mm, and the carrier lower part is for placing thermal-insulated heat preservation device.
Furthermore, the heat capacity module is at least 3 rows, the first row is an environment temperature heat capacity module, the second row is a large heat absorption module, the third row is a small heat absorption module, except the environment temperature heat capacity module which is a module which needs to be fixed, the other rows of modules are made of the same material, the heat conductivity coefficient of the support frame is not more than that of the heat capacity module, the independent heat capacity module is transversely designed to be the same heat capacity module made of the same material with the same volume and the same heat conductivity coefficient, the longitudinal design is different heat capacity modules made of the same material with the same heat conductivity coefficient and different volumes, the heat capacity module is connected with the support frame through support rods, wherein 3 support rods are 1mm high-temperature resistant solid rods with medium strength, small heat expansion coefficient and corrosion resistant material, and 1 hollow rod is 1.2-1.5mm high-temperature resistant with medium strength, small heat expansion coefficient and corrosion resistant material, the hollow rod may be deployed through a thermocouple to the center point of the thermal capacity module.
Further, the function that thermal-insulated heat preservation device possessed is with the cold junction design of the aggregation board of thermocouple and thermocouple, and data collection station keeps warm, and inside design has sufficient cavity, can put into this heat preservation device with the data collection station that does not resist temperature.
Further, data collection station passes through the hinge with thermal-insulated heat preservation device's one end and articulates, data collection station is used for gathering the data temperature that each thermal capacity module's thermocouple measured, because the heat preservation space is limited, and need satisfy many surveys continuous test and pull out and insert, the difficult demand of changing of thermocouple line, so when the design, the peculiar plug-in components design of adoption, put the cold junction collection data of thermocouple on being fixed in independent circuit board in the heat preservation box is inside, then the dedicated small and exquisite plug connection of reuse, transmit the more than 20 passageway temperature measurement point data to data collection station and carry out data processing analysis.
Compared with the prior art, the invention has the following beneficial effects aiming at the existing 6 problems:
(1) the invention adopts an independent thermal capacity module, and the module needs to have the characteristics of medium strength, small thermal expansion coefficient and good corrosion resistance, and can repeatedly test the material without deformation for a plurality of times at the temperature of 450 ℃ for a long time; and the thermal conductivity coefficient is not more than the material of the thermal conductivity coefficient of thermal capacity module as braced frame, and independent thermal capacity module is the same thermal capacity module of the same thermal conductivity coefficient of the same material of the same volume in horizontal design, and vertical design is the different thermal capacity modules of the different volumes of the same material of the same thermal conductivity coefficient. The designed independent heat capacity module can be used for testing to obtain the real heat uniformity difference value of the same heat capacity module in the horizontal direction and the heat balance capacity difference value between different modules in the longitudinal direction.
(2) The material with the thermal conductivity coefficient not larger than that of the thermal capacity module is used as the support frame, the support frame needs to meet the requirement of long-term temperature resistance below 450 ℃, the material can be tested repeatedly for multiple times without deformation, and the support frame has the characteristics of medium strength, small thermal expansion coefficient and good corrosion resistance; there is not direct heat-conduction between braced frame and the thermal capacity module, and the ultralow leading-in coefficient material through the design is as middle transition material, avoids taking place the heat exchange between frame and the thermal capacity module.
(3) The thermal capacity module and the supporting frame which are deployed in the invention realize independent diversified temperature data acquisition and analysis.
(4) The different independent heat capacity modules form transverse temperature acquisition and analysis to form independent heat capacity module analysis with reference contrast significance.
(5) The material which can meet the long-term temperature resistance below 450 ℃ and can be repeatedly tested for many times is not deformed, the material with medium strength, small thermal expansion coefficient and good corrosion resistance is used as the supporting frame, the material with ultralow lead-in coefficient is added as the intermediate transition material, and the heat exchange between the frame and the thermal capacity module is avoided. Thereby satisfying the mutual independent thermal data acquisition between the temperature measurement module.
(6) The invention utilizes three groups of different thermal capacity modules which are arranged, namely a thermal capacity module of environmental temperature; b. a large heat absorption module; c. a small heat absorption module; the analysis of thermal shock is realized through different modules of a and b, and the evaluation of the heating efficiency of the reflow oven and the heat transfer rate brought by forced convection is realized through different modules of a, b and c.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic view of an assembly structure of a performance evaluation device for a reflow soldering apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of a support frame of the performance evaluation device for the reflow soldering apparatus according to the embodiment of the present invention.
Fig. 3 is a schematic view of an installation structure of a heat insulation and preservation device and a data acquisition unit for a performance evaluation device building method of reflow soldering equipment according to an embodiment of the present invention.
Reference numerals:
1. a support frame; 2. a thermal capacity module; 3. a heat insulation device; 4. and a data acquisition device.
Detailed Description
The invention is further described with reference to the following drawings and detailed description:
referring to fig. 1-3, a method for constructing a performance evaluation device for reflow soldering equipment according to an embodiment of the present invention includes constructing a
Supporting frame 1: the
Thermal capacity module 2: the
Heat insulation and preservation device 3: the function that thermal-insulated
And the data acquisition unit 4:
The test module can design standard test carrier kits with different widths according to different types of products required to be produced by customers, and can also deploy test kits with different numbers of
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that various changes, modifications and substitutions can be made without departing from the spirit and scope of the invention as defined by the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
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