阅读说明：本技术 用于回流焊接设备的性能评估及测试设备 (Performance evaluation and test equipment for reflow soldering equipment ) 是由 陈仕健 孟桢沛 李阳 于 2020-06-30 设计创作，主要内容包括：本发明公开了用于回流焊接设备的性能评估及测试设备,包括支撑框架、热容量模组、隔热保温装置和数据采集器,所述支撑框架由盖板层和底板层组合构成且中间部分为所述热容量模组承载镂空部分,所述热容量模组的边框载具下部分为放置的所述隔热保温装置,所述热容量模组分为3行,第一行为空气模组,第二行为大容量模组,第三行为小容量模组,模组之间通过设置的支撑竿导热,所述隔热保护装置的内部设置由所述数据采集器。本发明提供的用于回流焊接设备的性能评估及测试设备对回流炉性能测试设备的多样性,不统一性,是一种能对回流炉的性能进行标定,且不会随着载具的宽度变化或多次连续测试而改变。(The invention discloses performance evaluation and test equipment for reflow soldering equipment, which comprises a supporting frame, a thermal capacity module, a thermal insulation device and a data collector, wherein the supporting frame is formed by combining a cover plate layer and a bottom plate layer, the middle part of the supporting frame is a hollow part for bearing the thermal capacity module, the lower part of a frame carrier of the thermal capacity module is the thermal insulation device, the thermal capacity module is divided into 3 rows, the first row is an air module, the second row is a large-capacity module, the third row is a small-capacity module, heat is conducted between the modules through a supporting rod, and the data collector is arranged in the thermal insulation protection device. The performance evaluation and test equipment for reflow soldering equipment provided by the invention has diversity and non-uniformity on reflow furnace performance test equipment, can calibrate the performance of the reflow furnace, and cannot change along with the width change of a carrier or multiple continuous tests.)

1. A performance evaluation and test equipment for reflow soldering equipment, including braced frame (1), thermal capacity module (2), thermal-insulated heat preservation device (3) and data collection station (4), its characterized in that, braced frame (1) comprises apron layer (5) and bottom plate layer (6) combination and mid portion and is thermal capacity module (2) bear the fretwork part, the frame carrier lower part of thermal capacity module (2) is placed thermal-insulated heat preservation device (3), thermal capacity module (2) divide into 3 rows, and first row is air module (7), and second action large capacity module (8), third action small capacity module (9), support rod (10) heat conduction through setting up between the module, the inside setting of thermal-insulated protection device (3) by data collection station (4).

2. The apparatus for performance evaluation and testing of reflow soldering apparatus in accordance with claim 1, wherein the thermal capacity module (2) carrying hollow area is variable with the width of the design carrier.

3. The performance evaluation and testing apparatus for reflow soldering apparatus in accordance with claim 1, wherein the large-capacity module (8) and the small-capacity module (9) are made of the same material.

4. The performance evaluation and testing apparatus for reflow soldering apparatus in accordance with claim 1, wherein the number of the support rods (10) is 4, 3 of the support rods (10) are 1mm solid rods with medium strength, small thermal expansion coefficient and corrosion resistant material, and 1 is 1.2-1.5mm hollow rods with medium strength, small thermal expansion coefficient and corrosion resistant material, which can be deployed through a thermocouple to the center point of the heat capacity module.

5. The performance evaluation and testing apparatus for reflow soldering apparatus in accordance with claim 1, wherein the cover board layer (5) outer frame edge is provided with a scale.

Technical Field

The invention relates to the field of reflow soldering, in particular to performance evaluation and test equipment for reflow soldering equipment.

Background

In the field of SMT hot air reflow soldering production, professional tests for evaluating reflow furnace equipment of production equipment are lacked at present, which mainly reflects that the test method is not strict and the calibration of a test fixture is lacked in unified specification, so that the test evaluation of the equipment is prone to be deviated. The performance test adopted in the industry is that a plurality of temperature measuring points are arranged on the whole aluminum plate or a PCBA plate is utilized to carry out 5-30 times of continuous temperature tests, and CPK is calculated to be used for evaluating the performance of the reflow furnace, and the test has a great evaluation leak.

At present, the performance evaluation of reflow furnace equipment is carried out by testing and verifying respective reflow furnace manufacturers by adopting an aluminum plate test or PCBA (printed Circuit Board Assembly), and the temperature data difference of the test is taken as a judgment standard. At present, no third-party standard test carrier can give consideration to the rigor of a test control group, an accurate test carrier and a high-precision data acquisition instrument matched with multi-temperature-point test. Under the condition that the test carrier and the instrument are not unified, the tested data can not be used for evaluating the performance of the reflow furnaces of different manufacturers, and even a data set tested between the reflow furnaces of different types of the same reflow furnace equipment has no strict comparison significance of a reference set.

In order to solve the above problems and the diversity and non-uniformity of reflow oven performance testing equipment, so that the above problems need to be avoided when designing performance evaluation and testing equipment for reflow oven soldering equipment, an equipment capable of calibrating the performance of the reflow oven and not changing with the width change of a carrier or multiple continuous tests is designed as the equipment for evaluating and testing the performance of the reflow oven.

An effective solution to the problems in the related art has not been proposed yet.

Disclosure of Invention

The present invention is directed to a performance evaluation and testing apparatus for a reflow soldering apparatus, which solves the above problems of the related art.

In order to achieve the purpose, the invention provides the following technical scheme: a performance aassessment and test equipment for reflow soldering equipment, including braced frame, thermal capacity module, thermal-insulated heat preservation device and data collection station, its characterized in that, braced frame comprises apron layer and bottom plate layer combination and mid portion and is in the thermal capacity module bears the fretwork part, the frame carrier lower part of thermal capacity module is placed thermal-insulated heat preservation device, the thermal capacity module divide into 3 lines, and first line is the air module, and second line is the large capacity module, and the third line is the small capacity module, and the support pole heat conduction through setting up between the module, thermal-insulated protection device's inside setting by data collection station.

Furthermore, the hollow-out area of the thermal capacity module can be changed along with the width change of the design carrier.

Furthermore, the large-capacity module and the small-capacity module are made of the same material.

Further, there are 4 support rods, 3 of which are 1mm solid rods with medium strength, small thermal expansion coefficient and corrosion resistance, and 1 hollow rods with medium strength, small thermal expansion coefficient and corrosion resistance, which are 1.2-1.5mm high temperature resistant rods and hollow rods with medium strength, small thermal expansion coefficient and corrosion resistance, and can be deployed to the central point of the heat capacity module through the thermocouple.

Furthermore, the edge of the outer frame of the cover plate layer is provided with scales.

Compared with the prior art, the invention has the following beneficial effects:

(1) the performance evaluation and test equipment for the reflow soldering equipment provided by the invention adopts the independent heat capacity module to test and obtain the real heat uniformity difference value of the modules with the same heat capacity in the horizontal direction and the heat balance capacity difference value between different modules in the longitudinal direction.

(2) The performance evaluation and test equipment for the reflow soldering equipment provided by the invention adopts the material with the thermal conductivity coefficient not larger than that of the thermal capacity module as the support frame without direct heat conduction between the module and the frame, and avoids heat exchange between the frame and the thermal capacity module by using the designed ultralow lead-in coefficient material as the intermediate transition material.

(3) The performance evaluation and test equipment for the reflow soldering equipment provided by the invention uses the thermal capacity module and the frame to realize independent diversified temperature data acquisition and analysis.

(4) The performance evaluation and test equipment for the reflow soldering equipment adopts different independent thermal capacity modules to form transverse temperature acquisition and analysis, and forms independent thermal capacity module analysis with reference contrast significance.

(5) The performance evaluation and test equipment for the reflow soldering equipment provided by the invention adopts a material which can meet the requirements of long-term temperature resistance below 450 ℃, can be repeatedly tested for multiple times, does not deform, has medium strength, small thermal expansion coefficient and good corrosion resistance as a frame, and adds an ultralow lead-in coefficient material as an intermediate transition material to avoid heat exchange between the frame and a thermal capacity module. Thereby satisfying the mutual independent thermal data acquisition between the temperature measurement module.

(6) The performance evaluation and test equipment for reflow soldering equipment provided by the invention utilizes three groups of different thermal capacity modules which are deployed, namely a. ambient temperature thermal capacity modules; b. a large heat absorption module; c. a small heat absorption module; the analysis of thermal shock is realized through different modules of a and b, and the evaluation of the heating efficiency of the reflow oven and the heat transfer rate brought by forced convection is realized through different modules of a, b and c.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic diagram of a performance evaluation and testing apparatus for a reflow soldering apparatus according to an embodiment of the present invention;

fig. 2 is a top view of a performance evaluation and testing apparatus for a reflow soldering apparatus in accordance with an embodiment of the present invention.

Reference numerals:

1. a support frame; 2. a thermal capacity module; 3. a heat insulation device; 4. a data acquisition unit; 5. a cover plate layer; 6. a floor layer; 7. an air module; 8. a large-capacity module; 9. a small-capacity module; 10. a rod is supported.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-2, a performance evaluation and testing apparatus for reflow soldering apparatus according to an embodiment of the present invention includes a supporting frame 1, a thermal capacity module 2, a thermal insulation and heat preservation device 3 and a data collector 4, wherein the supporting frame 1 is formed by combining a cover plate layer 5 and a bottom plate layer 6, the middle part of the supporting frame is a hollow part carried by the thermal capacity module 2, the lower part of a frame carrier of the thermal capacity module 2 is the thermal insulation and heat preservation device 3 placed thereon, the thermal capacity module 2 is divided into 3 rows, the first row is an air module 7, the second row is a large-capacity module 8, the third row is a small-capacity module 9, heat is conducted between the modules through a support rod 10, the data collector 4 is disposed inside the thermal insulation and protection device 3, the data collector 4 adopts a specific plug-in design, the cold end data of a thermocouple is placed inside the thermal insulation box and fixed on an independent circuit board, then, the temperature measurement point data of more than 20 channels are transmitted to an RCMK data acquisition unit for data processing and analysis by using a special small plug for connection.

Through the scheme of the invention, the hollow area borne by the thermal capacity module 2 can be changed along with the width change of the designed carrier.

Through the scheme of the invention, the large-capacity module 8 and the small-capacity module 9 are made of the same material.

With the above solution of the present invention, there are 4 support rods 10, wherein 3 support rods 10 are 1mm solid rods with high temperature resistance, medium strength, small thermal expansion coefficient and corrosion resistance, and 1 hollow rod with 1.2-1.5mm high temperature resistance, medium strength, small thermal expansion coefficient and corrosion resistance, and the hollow rod can be deployed to the central point of the thermal capacity module through the thermocouple.

According to the scheme, the scales are arranged on the edge of the outer frame of the cover plate layer 5, the scale values of the length and the width of the carrier and the size of the carrier and the name of the deployed heat capacity module can be identified, the supporting frame 1 has the advantages of insulation, small heat conductivity coefficient, medium strength, small thermal expansion coefficient, easiness in processing and good corrosion resistance, and the bottom plate layer 6 is a carrier for insulating heat, deploying corresponding thermocouple wire grooves and bearing each temperature measurement module.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that various changes, modifications and substitutions can be made without departing from the spirit and scope of the invention as defined by the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.