阅读说明：本技术 一种耐高温的高分子铝固体电容器 (High temperature resistant polymer aluminium solid capacitor ) 是由 颜翰菁 王坤亮 张钟 朱敏 于 2020-07-15 设计创作，主要内容包括：本发明涉及一种耐高温的高分子铝固体电容器,解决了现有技术中高分子固体电容器的耐高温强度差和抗震性能差的问题。一种耐高温的高分子铝固体电容器,包括素子,所述素子的芯包上,由内向外依次包设有第一高分子导电聚合层、环氧树脂层、第二高分子导电聚合层、环氧树脂抗震层和铝壳,所述环氧树脂抗震层由含有微珠的环氧树脂溶液固化形成。本发明通过双层环氧树脂的设置,环氧树脂对导电高分子链形成保护,利用环氧树脂的自身特性,降低了高分子铝固体电容器漏电的可能性,提高了高分子铝固体抗高温抗老化的性能,从而提高了高分子铝固体电容器的使用寿命,实现了一种耐高温的高分子铝固体电容器。(The invention relates to a high-temperature-resistant high-molecular aluminum solid capacitor, which solves the problems of poor high-temperature-resistant strength and poor anti-seismic performance of the high-molecular solid capacitor in the prior art. The utility model provides a high temperature resistant polymer aluminum solid capacitor, includes the plain son, the core of plain son is wrapped, wraps in proper order from inside to outside and is equipped with the conductive polymerization layer of first polymer, epoxy layer, the conductive polymerization layer of second polymer, epoxy antidetonation layer and aluminum hull, epoxy antidetonation layer is formed by the epoxy solution solidification that contains the microballon. According to the invention, through the arrangement of the double-layer epoxy resin, the epoxy resin protects the conductive polymer chain, the possibility of electric leakage of the polymer aluminum solid capacitor is reduced by utilizing the self characteristics of the epoxy resin, and the high-temperature resistance and ageing resistance of the polymer aluminum solid are improved, so that the service life of the polymer aluminum solid capacitor is prolonged, and the high-temperature resistant polymer aluminum solid capacitor is realized.)

1. The utility model provides a high temperature resistant polymer aluminium solid capacitor, includes plain son (1), its characterized in that, on the core package of plain son (1), wrap up first polymer conductive polymer layer (2), epoxy layer (3), second polymer conductive polymer layer (4), epoxy antidetonation layer (5) and aluminum hull (6) from inside to outside in proper order, epoxy antidetonation layer (5) are formed by the epoxy solution solidification that contains the microballon.

2. The high-temperature-resistant polymer aluminum solid capacitor as claimed in claim 1, wherein the element (1) comprises two pins (101), a positive aluminum foil (102) and a negative aluminum foil (103) respectively wound around the two pins (101), an inner layer of electrolytic paper (104) with two ends respectively wound around the positive aluminum foil (102) and the negative aluminum foil (103), and an outer layer of electrolytic paper (105) wrapped outside the inner layer of electrolytic paper (104).

3. The high-temperature-resistant polymer aluminum solid capacitor according to claim 1, wherein the first polymer conductive polymer layer (2) is formed by impregnating the element (1) with one or more of a conductive polymer monomer, an oxidizing agent and a dispersion under pressure and then drying the impregnated element.

4. The high-temperature-resistant polymeric aluminum solid capacitor according to claim 1, wherein the epoxy resin layer (3) is formed by impregnating the element (1) covered with the first polymeric conductive polymeric layer (2) with at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, and aliphatic hydrocarbon epoxy resin under pressure and then drying.

5. The high-temperature-resistant polymeric aluminum solid capacitor according to claim 1, wherein the second polymeric conductive polymer layer (4) is formed by impregnating the element (1) covered with the epoxy resin layer (3) with one or more of a conductive polymer monomer, an oxidizing agent and a dispersion under pressure and then drying the impregnated element.

6. The high-temperature-resistant polymeric aluminum solid capacitor as claimed in claim 1, wherein the epoxy resin anti-seismic layer (5) is formed by impregnating a base material (1) covered with the second polymeric conductive polymeric layer (4) with pressure after incorporating microbeads into at least one of glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, and aliphatic hydrocarbon type epoxy resin, and drying the impregnated base material.

7. The high temperature resistant polymer aluminum solid capacitor according to claim 1, wherein the beads are composed of any one or more of ceramic beads, glass beads or glass beads.

Technical Field

The invention relates to a high-temperature-resistant high-molecular aluminum solid capacitor.

Background

The polymer solid capacitor is also called a polymer electrolytic capacitor, and is a solid electrolytic capacitor which replaces the traditional electrolyte with a polymer conductive material (PEDT), and the polymer solid electrolytic capacitor and the polymer solid tantalum electrolytic capacitor are two types at present.

The polymer solid capacitor is a main heat-generating device when in work, but if excessive heat is generated in work, the heat damage of the capacitor and other electronic elements can be influenced, so that the high temperature resistance of the polymer solid capacitor is improved, and the problem which needs to be solved is always solved; in addition, the working environment of the polymer solid capacitor is complex, and if the components of the bearing capacitor are accidentally knocked down, the fixed capacitor is extruded, so that a high-strength solid capacitor with certain shock resistance is lacked;

therefore, a high-temperature-resistant polymer aluminum solid capacitor is proposed, which improves the high-temperature resistance and the shock strength of the polymer aluminum solid capacitor, thereby improving the service life of the polymer aluminum solid capacitor.

Disclosure of Invention

The invention aims to provide a high-temperature-resistant high-molecular aluminum solid capacitor, which solves the problems of poor high-temperature-resistant strength and poor anti-seismic performance of the high-molecular solid capacitor in the prior art.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a high temperature resistant polymer aluminum solid capacitor, includes the plain son, the core of plain son is wrapped, wraps in proper order from inside to outside and is equipped with the conductive polymerization layer of first polymer, epoxy layer, the conductive polymerization layer of second polymer, epoxy antidetonation layer and aluminum hull, epoxy antidetonation layer is formed by the epoxy solution solidification that contains the microballon.

Preferably, the element comprises two pins, a positive aluminum foil and a negative aluminum foil which are respectively wound on the two pins, inner-layer electrolytic paper with two ends respectively wound on the positive aluminum foil and the negative aluminum foil, and outer-layer electrolytic paper wrapped outside the inner-layer electrolytic paper.

Preferably, the first polymer conductive polymer layer is formed by impregnating a conductive polymer monomer, an oxidizing agent and one or more of a dispersion liquid with an element under pressure and then drying the impregnated conductive polymer monomer, oxidizing agent and dispersion liquid.

Preferably, the epoxy resin layer is formed by impregnating a base material covering the first polymer conductive polymer layer with at least one of a glycidyl ether type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, and an aliphatic hydrocarbon type epoxy resin under pressure, and then drying the impregnated base material.

Preferably, the second polymer conductive polymer layer is formed by impregnating a base material covered with the epoxy resin layer with one or more of a conductive polymer monomer, an oxidizing agent and a dispersion liquid under pressure and then drying the impregnated base material.

Preferably, the epoxy resin anti-seismic layer is formed by mixing microbeads with at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin and aliphatic hydrocarbon epoxy resin, immersing the element covered with the second polymer conductive polymer layer in the solution under pressure, and drying.

Preferably, the micro-beads are composed of any one or more of ceramic micro-beads, vitrified micro-beads or glass micro-beads.

The manufacturing method of the high-temperature-resistant polymer aluminum solid capacitor comprises the following steps of:

s1: manufacturing a biscuit, cutting the anode aluminum foil, the cathode aluminum foil and the electrolytic paper according to the design size through a rolling machine, respectively riveting the anode pin and the cathode pin on the anode aluminum foil and the cathode aluminum foil, then winding two ends of the inner layer of electrolytic paper outside the anode aluminum foil and the cathode aluminum foil, then winding the outer layer of electrolytic paper outside the inner layer of electrolytic paper, winding the outer layer of electrolytic paper into a circular or square shape, and finally winding a high-temperature-resistant insulating adhesive tape on the periphery of the circular or square shape to fix the outer layer of electrolytic paper to form the biscuit;

s2: a first impregnation stage, in which the element is impregnated in any one or more of a conductive polymer monomer, an oxidant or a dispersion liquid, and a pressurized impregnation environment is set to accelerate the impregnation efficiency of the solution and the element, and after impregnation, a first high molecular conductive polymer layer is formed by drying treatment;

s3: a second impregnation step of impregnating the element subjected to the treatment of the step S2 in at least one of a glycidyl ether epoxy resin, a glycidyl ester epoxy resin, a glycidyl amine epoxy resin, and an aliphatic hydrocarbon epoxy resin under a pressurized atmosphere, and then drying the impregnated element to form an epoxy resin anti-seismic layer;

s4: a third impregnation stage, in which the element treated in the step S3 is impregnated in any one or more of a conductive polymer monomer, an oxidant or a dispersion liquid under a pressurized environment, and is dried to form a second polymer conductive polymer layer;

s5: in the fourth impregnation stage, micro bead particles are added into at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin and aliphatic hydrocarbon epoxy resin, the micro beads consist of any one or more of ceramic micro beads, vitrified micro beads or glass micro beads, and then the element treated in the step S4 is impregnated in the solution under a pressurized environment and then is dried to form an epoxy resin anti-seismic layer;

s6: and packaging the element processed in the step S5 with an aluminum shell.

The invention has at least the following beneficial effects:

1. through double-deck epoxy's setting, epoxy forms the protection to electrically conductive polymer chain, utilizes epoxy's self characteristic, has reduced the possibility of polymer aluminium solid capacitor electric leakage, has improved the high temperature resistance ageing resistance's of polymer aluminium solid performance to improve polymer aluminium solid capacitor's life, realized a high temperature resistant polymer aluminium solid capacitor.

2. Through being in the interior doping of outer epoxy resin antidetonation layer with the microballon, no matter ceramic microballon, glass bead or glass bead all have very strong thermal-insulated fire prevention and rebound's performance to improve polymer aluminum solid capacitor's heat-resisting degree and intensity, the power of microballon degradable conduction to the condenser, with the damage that greatly reduced equipment brought because of vibrations for the condenser, improve the shock resistance of condenser, thereby improved polymer aluminum solid's life.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is an expanded view of the internal structure of the element;

fig. 2 is a schematic sectional view of the internal structure of the capacitor.

In the figure: 1. a prime; 101. a pin; 102. a positive aluminum foil; 103. a negative aluminum foil; 104. inner layer electrolytic paper; 105. outer layer electrolytic paper; 2. a first polymer conductive polymer layer; 3. an epoxy resin layer; 4. a second polymer conductive polymer layer; 5. an epoxy resin anti-seismic layer; 6. and (4) an aluminum shell.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.