阅读说明：本技术 电压调节模块 (Voltage regulation module ) 是由 熊雅红 陈绍军 金达 宿清华 于 2019-03-18 设计创作，主要内容包括：本案公开一种电压调节模块,包含印刷电路板组件、磁芯组件及塑封层。印刷电路板组件包含印刷电路板、至少一开关电路、至少一第一铜柱、至少一第二铜柱以及至少一第三铜柱,印刷电路板包含相对的第一面与第二面。第一铜柱、第二铜柱及第三铜柱设置于第二面上,开关电路设置于第一面上,磁芯组件设置于第二面上,且包含第一孔洞,以供第一铜柱穿设,使第一铜柱与磁芯组件相互配合而形成电感,塑封层对印刷电路板组件及磁芯组件双面塑封,并形成相对的第一塑封面及第二塑封面,第一铜柱、第二铜柱及第三铜柱的各端面分别暴露于第二塑封面。(The scheme discloses a voltage regulation module which comprises a printed circuit board assembly, a magnetic core assembly and a plastic package layer. The printed circuit board assembly comprises a printed circuit board, at least one switch circuit, at least one first copper column, at least one second copper column and at least one third copper column, wherein the printed circuit board comprises a first surface and a second surface which are opposite. First copper post, second copper post and third copper post set up on the second face, switch circuit sets up on first face, and magnetic core assembly sets up on the second face, and contains first hole to supply first copper post to wear to establish, make first copper post and magnetic core assembly mutually support and form the inductance, the plastic envelope layer is to printed circuit board subassembly and the two-sided plastic envelope of magnetic core assembly, and form relative first front cover and the second front cover of moulding, each terminal surface of first copper post, second copper post and third copper post exposes respectively in the second front cover of moulding.)

1. A voltage regulation module, comprising:

a printed circuit board assembly including a printed circuit board, at least one switch circuit, at least one first copper pillar, at least one second copper pillar, and at least one third copper pillar, the printed circuit board including a first surface and a second surface opposite to each other, the first copper pillar, the second copper pillar, and the third copper pillar being disposed on the second surface, the first copper pillar constituting a positive output terminal of the voltage regulation module, the second copper pillar constituting a positive input terminal of the voltage regulation module, the third copper pillar constituting a negative output terminal of the voltage regulation module, the switch circuit being disposed on the first surface;

the magnetic core assembly is arranged on the second surface and also comprises at least one first hole, and each first hole is used for the corresponding first copper column to penetrate through so that at least one first copper column and the magnetic core assembly are mutually matched to form at least one inductor; and

and the plastic packaging layer is used for carrying out double-sided plastic packaging on the printed circuit board assembly and the magnetic core assembly and forming a first plastic packaging surface and a second plastic packaging surface, the first plastic packaging surface and the second plastic packaging surface are oppositely arranged, and each end surface of the first copper column, the second copper column and the third copper column is respectively exposed on the second plastic packaging surface.

2. The voltage regulation module of claim 1 wherein the end surface of the first copper pillar is exposed to the second plastic cover and forms a positive output lead, the end surface of the second copper pillar is exposed to the second plastic cover and forms a positive input lead, and the end surface of the third copper pillar is exposed to the second plastic cover and forms a negative output lead.

3. The voltage regulation module of claim 2, wherein the area of the positive output terminal connection is greater than or equal to the cross-sectional area of the end surface of the first copper pillar, the area of the positive input terminal connection is greater than or equal to the cross-sectional area of the end surface of the second copper pillar, and the area of the negative output terminal connection is greater than or equal to the cross-sectional area of the end surface of the third copper pillar.

4. The voltage regulation module of claim 2, wherein the plastic encapsulation layer comprises a plastic encapsulation side surface between the first plastic encapsulation surface and the second plastic encapsulation surface, wherein the second copper pillar and the third copper pillar are partially exposed out of the plastic encapsulation side surface by polishing the plastic encapsulation side surface, wherein a side surface of the second copper pillar and the third copper pillar exposed out of the plastic encapsulation side surface is plated to connect with the positive input terminal connection portion and the negative output terminal connection portion, respectively.

5. The voltage regulation module of claim 1 wherein the second plastic cover is polished to expose the end surfaces of the first copper pillar, the second copper pillar, and the third copper pillar to the second plastic cover.

6. The voltage regulation module of claim 1, wherein the magnetic core assembly is formed by grinding the second plastic cover to expose a surface of the magnetic core assembly.

7. The voltage regulation module of claim 1 wherein the printed circuit board assembly comprises at least a fourth copper pillar disposed on the second surface of the printed circuit board, the fourth copper pillar forming a signal terminal of the voltage regulation module, wherein the fourth copper pillar is disposed on the second surface of the printed circuit board by a lead frame, the fourth copper pillar is partially exposed out of the side surface of the plastic package by polishing the side surface of the plastic package, and a side surface of the fourth copper pillar exposed out of the side surface of the plastic package is plated to connect with a signal lead-in portion, respectively.

8. The voltage regulation module of claim 1, wherein the core assembly is secured to the second side of the printed circuit board using a thermally conductive adhesive.

9. The voltage regulation module of claim 1, wherein a first gap is formed between an outer annular sidewall of the magnetic core element and the second and third copper pillars, and a second gap is formed between an inner annular sidewall of the magnetic core element and the first copper pillar, the voltage regulation module comprising an underfill filled in the first and second gaps.

10. The voltage regulation module of claim 1 wherein the magnetic core assembly further comprises at least one air gap.

11. The voltage regulation module of claim 1 wherein the switching circuit is exposed to the molding layer by polishing the molding layer.

12. The voltage regulation module of claim 1, wherein the printed circuit board assembly comprises two of the switching circuits and two of the first copper pillars, the two of the first copper pillars are located at a central position of the printed circuit board, the magnetic core assembly comprises two of the first holes, each of the first copper pillars is respectively inserted through the corresponding first hole to cooperate with the magnetic core assembly to form the corresponding inductor, and each of the switching circuits is connected in series to the corresponding inductor to form a phase-dropping circuit.

13. The voltage regulation module of claim 12 wherein the printed circuit board assembly comprises two of the second copper pillars disposed on opposite sides of a center position of two of the first copper pillars.

14. The voltage regulation module of claim 13, wherein the printed circuit board assembly comprises two of the third copper pillars, the two of the third copper pillars being disposed on opposite sides of a center position of the two of the first copper pillars.

15. The voltage regulation module of claim 12 wherein the core assembly comprises two toroidal cores, wherein the two toroidal cores are integrally formed to form a figure-8 shape.

16. The voltage regulation module of claim 12 wherein the voltage regulation module comprises an input capacitor disposed on the first side of the printed circuit board and between two of the switch circuits.

17. A voltage regulation module, comprising:

the printed circuit board assembly comprises a multilayer printed circuit board, at least one switching circuit and at least one first copper column, wherein the multilayer printed circuit board comprises a first surface and a second surface which are opposite, the switching circuit is arranged on the first surface, the first copper column is embedded in the multilayer printed circuit board, and the first copper column forms a positive output end of the voltage regulating module; and

and the magnetic core assembly is embedded in the multilayer printed circuit board and comprises at least one first hole, and each first hole is used for the corresponding first copper column to penetrate through so that at least one first copper column and the magnetic core assembly are mutually matched to form at least one inductor.

18. The voltage regulation module of claim 17 wherein the printed circuit board assembly comprises a positive output terminal lead electrically connected to the first copper pillar by a via, the positive output terminal lead having an area greater than or equal to a cross-sectional area of an end of the first copper pillar.

19. The voltage regulation module of claim 17 wherein the multi-layer pcb comprises an inner layer comprising at least one switch region, at least one core region, at least one negative output region, and at least one positive input region, wherein the switch region, the core region, the negative output region, and the positive input region are each connected to the switch circuit by a via.

20. The voltage regulation module of claim 19 wherein the voltage regulation module comprises at least a second copper pillar and at least a third copper pillar, the second copper pillar is embedded in the pcb and disposed and fixed at the positive input end region to form a positive input end of the voltage regulation module, the third copper pillar is embedded in the pcb and disposed and fixed at the negative output end region to form a negative output end of the voltage regulation module, the first copper pillar is disposed and fixed at the switch region, the core element is disposed and fixed at the core region, and the core region is connected to the negative output end region.

21. The voltage regulation module of claim 17, wherein the printed circuit board assembly comprises at least one positive input terminal connection and at least one negative output terminal connection, the positive input terminal connection and the negative output terminal connection being disposed on the second side of the multi-layer printed circuit board.

22. The voltage regulation module of claim 21 wherein the positive input terminal connection is electrically connected to the second copper pillar through a via, the positive input terminal connection has an area greater than or equal to a cross-sectional area of an end of the second copper pillar, the negative output terminal connection is electrically connected to the third copper pillar through another via, and the negative output terminal connection has an area greater than or equal to a cross-sectional area of an end of the third copper pillar.

23. The voltage regulation module of claim 21 wherein the multi-layer pcb comprises at least one side plating region disposed on a side of the multi-layer pcb, the side plating region being connected to the positive output terminal connection, the positive input terminal connection, and the negative output terminal connection, respectively.

24. The voltage regulation module of claim 21 wherein the multi-layer printed circuit board includes at least one signal via electrically connected to the switch circuit and to a signal lead, the signal lead being electrically connected to the side plating region.

25. The voltage regulation module of claim 21 wherein the core assembly comprises a first copper electrode and a second copper electrode, the core assembly being electrically connected to the switch circuit through a via using the first copper electrode, the core assembly being electrically connected to the positive output terminal via a via using the second copper electrode.

26. The voltage regulation module of claim 17 wherein the voltage regulation module further comprises a molding layer that molds the printed circuit board assembly and the magnetic core assembly to form a first molding surface.

27. The voltage regulation module of claim 17 wherein the magnetic core assembly further comprises at least one air gap.

28. The voltage regulation module of claim 17 wherein the printed circuit board assembly comprises two of the switching circuits and two of the first copper posts, the two of the first copper posts are located at a center of the multi-layered printed circuit board, the magnetic core assembly comprises two of the first holes, each of the first copper posts is respectively inserted through the corresponding first hole to cooperate with the magnetic core assembly to form the corresponding inductor, and each of the switching circuits is connected in series to the corresponding inductor to form a phase-down circuit.

29. The voltage regulation module of claim 28 wherein the printed circuit board assembly comprises two of the second copper pillars disposed on opposite sides of a center position of two of the first copper pillars.

30. The voltage regulation module of claim 29 wherein the printed circuit board assembly comprises two of the third copper pillars, the two third copper pillars being disposed on opposite sides of a center position of the two first copper pillars.

31. The voltage regulation module of claim 28 wherein the core assembly comprises two toroidal cores, wherein the two toroidal cores are integrally formed to form a figure-8 shape.

32. The voltage regulation module of claim 28 wherein the voltage regulation module comprises an input capacitor disposed on the first side and between two of the switch circuits.

Technical Field

The present disclosure relates to a voltage regulator module, and more particularly, to a voltage regulator module with reduced size.

Background

Referring to fig. 1A and 1B, fig. 1A is a schematic structural diagram of a first conventional electronic device, and fig. 1B is a schematic structural diagram of a voltage regulation module shown in fig. 1A. As shown in fig. 1A and 1B, a conventional first electronic device 1 adopts a horizontal power supply structure and includes a Central Processing Unit (CPU) 11, a voltage regulating module 12, a system board 13 and an output capacitor 14. The system board 13 includes opposing first and second surfaces. The voltage regulating module 12 is configured to convert the received input voltage into a regulated voltage and provide the regulated voltage to the cpu 11, and the voltage regulating module 12 and the cpu 11 are both disposed on the first surface of the system board 13. In addition, in order to meet the requirement of load dynamic switching, the output end of the voltage regulation module 12 is close to the power supply input end of the central processing unit 11. The output capacitor 14 is disposed on the second surface of the system board 13 and adjacent to the power supply input terminal of the cpu 11.

In addition, the voltage regulation module 12 further includes a printed circuit board 15 and a magnetic component 16. The magnetic assembly 16 is disposed on the printed circuit board 15, and a switch assembly may be disposed in a gap between the printed circuit board 15 and the magnetic assembly 16. The printed circuit board 15 is disposed on a first surface of the system board 13, such that heat generated by the voltage regulating module 12 can be transmitted to the system board 13 through the printed circuit board 15, and then dissipated by a heat dissipation system (not shown) of the system board 13.

However, as the current required by the cpu 11 is larger and smaller, the size of the electronic device is smaller and smaller, and the cpu 11 and the voltage regulation module 12 shown in fig. 1A cannot meet the requirement of dynamic load switching by being disposed on the same side of the system board 13. Please refer to fig. 2, which is a schematic structural diagram of a second conventional electronic device. As shown in the figure, in order to reduce the size of the electronic device and effectively improve the dynamic switching performance of the voltage regulation module, the conventional second electronic device 1 'changes the conventional horizontal power supply structure into the vertical power supply structure, and changes the voltage regulation module 12 to be disposed on the second surface of the system board 13, so that the voltage regulation module 12 and the cpu 11 are located on the opposite surfaces of the system board 13, thereby effectively reducing the size of the electronic device 1', and further effectively improving the dynamic switching performance of the voltage regulation module 12 because the output capacitor (not shown) is disposed near the output terminal of the voltage regulation module 12 and the power supply input terminal of the cpu 11.

Although the second conventional electronic device 1 'can effectively improve the dynamic switching performance of the voltage regulating module 12, the magnetic element 16 and the switch element of the voltage regulating module 12 are both disposed on the same side of the printed circuit board 15, and the switch element is disposed in the gap between the printed circuit board 15 and the magnetic element 16, so that the magnetic element 16 of the voltage regulating module 12 cannot further optimize the structure and size thereof, and thus the voltage regulating module 12 of the second conventional electronic device 1' still has a problem of larger size, and when the system board 13 is reflowed, the voltage regulating module 12 is again heated and is prone to falling off or shifting of internal devices.

Therefore, there is a need to develop a voltage regulation module to solve the problems of the prior art.

Disclosure of Invention

The purpose of the scheme is to provide a voltage regulating module which can achieve the effect of reducing the size.

Another objective of the present disclosure is to provide a voltage regulation module, which can achieve the effect of simplifying the assembly process.

To achieve the above objective, an embodiment of the present invention provides a voltage regulation module, which includes a printed circuit board assembly, a magnetic core assembly, and a molding layer. The printed circuit board assembly comprises a printed circuit board, at least one switch circuit, at least one first copper column, at least one second copper column and at least one third copper column. The printed circuit board comprises a first surface and a second surface which are opposite. The first copper column, the second copper column and the third copper column are arranged on the second surface, the first copper column forms a positive output end of the voltage adjusting module, the second copper column forms a positive input end of the voltage adjusting module, and the third copper column forms a negative output end of the voltage adjusting module. The switch circuit is arranged on the first surface. The magnetic core assembly is arranged on the second surface and further comprises at least one first hole, and each first hole is used for the corresponding first copper column to penetrate through, so that the at least one first copper column and the magnetic core assembly are mutually matched to form at least one inductor. The plastic packaging layer is used for carrying out double-sided plastic packaging on the printed circuit board assembly and the magnetic core assembly, a first plastic packaging surface and a second plastic packaging surface are formed, the first plastic packaging surface and the second plastic packaging surface are arranged oppositely, and each end face of the first copper column, the second copper column and the third copper column is respectively exposed on the second plastic packaging surface.

To achieve the above objective, another aspect of the present invention provides a voltage regulating module, which includes a printed circuit board assembly and a magnetic core assembly. The printed circuit board assembly comprises a multilayer printed circuit board, at least one switch circuit and at least one first copper column. The multilayer printed circuit board comprises a first surface and a second surface which are opposite, and the switch circuit is arranged on the first surface. The first copper column is embedded in the multilayer printed circuit board. The first copper column forms a positive output end of the voltage regulation module. The magnetic core assembly is embedded in the multilayer printed circuit board and comprises at least one first hole. Each first hole is used for the corresponding first copper column to penetrate through, so that at least one first copper column is matched with the magnetic core assembly to form at least one inductor.

Drawings

Fig. 1A is a schematic structural diagram of a first conventional electronic device.

Fig. 1B is a schematic structural diagram of the voltage regulation module shown in fig. 1A.

Fig. 2 is a schematic structural diagram of a second conventional electronic device.

Fig. 3A is a schematic structural diagram of a voltage regulation module according to a first preferred embodiment of the present disclosure.

Fig. 3B is a schematic structural diagram of another view of the voltage regulation module shown in fig. 3A.

Fig. 3C is an exploded view of the voltage regulation module shown in fig. 3B.

Fig. 4 is an equivalent circuit diagram of the voltage regulation module shown in fig. 3A.

Fig. 5 is an exemplary block diagram illustrating the fourth copper pillar shown in fig. 3B fabricated into a lead frame.

Fig. 6 is a schematic structural diagram illustrating a plurality of lead frames shown in fig. 5 disposed in a plurality of voltage regulation modules.

Fig. 7A is a schematic structural diagram of the voltage regulation module shown in fig. 3A after a plastic package layer is disposed thereon.

Fig. 7B is a schematic structural diagram of another view angle of the voltage regulating module shown in fig. 3A.

Fig. 8 is a schematic structural diagram of the voltage regulating module shown in fig. 3A provided with a plastic encapsulation layer and a printed circuit board including an inner board.

FIG. 9 is a cross-sectional top view of the inner plate of the voltage regulation module shown in FIG. 8.

FIG. 10A is a cross-sectional view of the voltage regulation module shown in FIG. 8.

FIG. 10B is a cross-sectional view of another embodiment of the voltage regulation module shown in FIG. 8.

Wherein the reference numerals are as follows:

1. 1': electronic device

11: central processing unit

12: voltage regulation module

13: system board

14: output capacitor

15: printed circuit board

16: magnetic assembly

2: voltage regulation module

21：Dr.MOS

L: inductance

Cin: input capacitance

Cout: output capacitor

SW: first end

Vin +: positive input end

Vin-: negative input terminal

Vo +: positive output terminal

Vo-: negative output end

D: control circuit

PWM1, PWM 2: pulse width control signal

20: printed circuit board assembly

30: magnetic core assembly

30 a: surface of

30 b: a first hole

30 c: air gap

30 d: outer ring side wall

30 e: inner ring side wall

30 f: upper surface of

30g of: lower surface

31: annular magnetic core

4: voltage regulation module

4 a: semi-finished product of voltage regulating module

20: printed circuit board assembly

22: printed circuit board

22 a: first side

22 b: second surface

22 c: side wall

21：Dr.MOS

23: first gap

24: second gap

51: first copper column

51 a: first bonding pad

52: second copper column

52 a: second bonding pad

53: third copper column

53 a: third bonding pad

54: fourth copper column

54 a: fourth bonding pad

55: lead frame

56: outer frame

60: plastic packaging layer

60 a: first plastic sealing surface

60 b: second plastic sealing surface

60 c: plastic package side

60 d: side plating area

80: inner layer board

81: switching area

82: magnetic core region

83: positive input end region

84: negative output terminal area

91: first through hole

92: second through hole

93: third through hole

94: fourth through hole

Detailed Description

Exemplary embodiments that embody features and advantages of this disclosure are described in detail below in the detailed description. It will be understood that the present invention is capable of various modifications in various respects, all without departing from the scope of the present invention, and that the description and drawings are to be taken as illustrative in nature and not as restrictive.

Referring to fig. 3A, fig. 3B, fig. 3C and fig. 4, wherein fig. 3A is a schematic structural diagram of a voltage regulation module according to a first preferred embodiment of the present disclosure, fig. 3B is a schematic structural diagram of another view angle of the voltage regulation module shown in fig. 3A, fig. 3C is an exploded structural diagram of the voltage regulation module shown in fig. 3B, and fig. 4 is an equivalent circuit diagram of the voltage regulation module shown in fig. 3A. As shown in the figure, the voltage regulating module 2 of the present embodiment can be applied in an electronic device and electrically connected to a system board (not shown) in the electronic device by soldering, and the voltage regulating module 2 further includes at least one phase-down converting circuit. In the circuit structure, the voltage regulation module 2 includes at least one switching circuit, such as a Driver and metal-Oxide-Semiconductor Field-Effect Transistor (mos) unit 21 (hereinafter referred to as "dr. mos 21"), at least one inductor L, at least one input capacitor Cin, and at least one output capacitor Cout. For meeting the requirement of a large current of a cpu in an electronic device, the voltage regulating module 2 of the present embodiment may be a multi-phase buck converter circuit to effectively increase the output current capability of the voltage regulating module 2, for example, as shown in fig. 4, the voltage regulating module 2 of the present embodiment is a two-phase buck converter circuit, and the corresponding voltage regulating module 2 is a two-phase buck converter circuit, where the voltage regulating module 2 includes two dr.

Each dr.mos21 is connected in series to the first end SW of the corresponding inductor L to form a phase voltage drop (Buck) circuit, the first end of the phase voltage drop (Buck) circuit is electrically connected in parallel to the input capacitor Cin of the voltage regulating module 2 to form the input end (including the positive input end Vin + and the negative input end Vin-) of the voltage regulating module 2, and the second end of the phase voltage drop (Buck) circuit (i.e., the second end of each inductor L) is electrically connected in parallel to the output capacitor Cout to form the output end (including the positive output end Vo + and the negative output end Vo-, wherein the negative input end Vin-and the negative output end Vo-are connected in a short circuit) of the voltage regulating module 2. A first terminal of the output capacitor Cout may constitute a positive output Vo + of the voltage regulating module 2, and a second terminal of the output capacitor Cout may constitute a negative output Vo-of the voltage regulating module 2. The first end of the input capacitor Cin is electrically connected to the positive input terminal Vin + of the voltage regulation module 2, and the second end of the input capacitor Cin is electrically connected to the negative input terminal Vin-of the voltage regulation module 2.

Mos21 includes a transistor switch and a driver for driving the transistor switch in some embodiments. The voltage regulating module 2 further comprises a control circuit D, the control circuit D generates two sets of pulse width control signals PWM1 and PWM2 by sampling the output voltage of the voltage regulating module 2 and the output current of each phase voltage-dropping circuit, wherein the two sets of pulse width control signals are out of phase by 180 degrees, the pulse width control signal PWM1 is used for controlling one phase voltage-dropping circuit, and the pulse width control signal PWM2 is used for controlling the other phase voltage-dropping circuit.

In the present embodiment, the voltage regulating module 2 includes a printed circuit board assembly 20 and a magnetic core assembly 30 (as shown in fig. 3C). The pcb assembly 20 of the voltage regulating module 2 includes a pcb 22, at least one dr.mos21, at least one first copper pillar 51, at least one second copper pillar 52, and at least one third copper pillar 53. The printed circuit board 22 includes a first surface 22a and a second surface 22b opposite to each other, and a sidewall 22c between the first surface 22a and the second surface 22 b. All the dr.mos21 and all the input capacitors Cin are disposed on the first surface 22a of the printed circuit board 22 by soldering or conductive adhesive (as shown in fig. 3A), and all the input capacitors Cin are further electrically connected to the dr.mos 21. In some embodiments, the two dr.mos21 are disposed on the first surface 22a in opposite directions, such that the input voltage pins of the two dr.mos21 are adjacent to each other, and all the input capacitors Cin may be disposed between the two dr.mos21, i.e., between the input voltage pins of the two dr.mos21, such that the two dr.mos21 can share the input capacitors Cin, and the input voltage pins of the two dr.mos21 are electrically connected to the input capacitors Cin, respectively, without additional wires, so as to achieve the effect of reducing the number of the input capacitors Cin.

In the present embodiment, the first copper pillar 51, the second copper pillar 52 and the third copper pillar 53 may be disposed on the second surface 22b of the printed circuit board 22 by a solder soldering method or a conductive adhesive adhering method, and a part of the side surface of the second copper pillar 52 and a part of the side surface of the third copper pillar 53 are coplanar with the sidewall 22c of the printed circuit board 22, wherein the first copper pillar 51 constitutes a positive output terminal of the voltage adjusting module 2, the second copper pillar 52 constitutes a positive input terminal of the voltage adjusting module 2, and the third copper pillar 53 constitutes a negative output terminal of the voltage adjusting module 2.

In some embodiments, the pcb assembly 20 of the voltage regulation module 2 further includes at least one fourth copper pillar 54, such as a plurality of fourth copper pillars 54 shown in fig. 3B and 3C, a portion of the side surface of the fourth copper pillar 54 is coplanar with the side wall 22C of the pcb 22, and the plurality of fourth copper pillars 54 are disposed on the second surface 22B 'of the pcb 22' by solder welding or conductive adhesive bonding, and can form a signal terminal of the voltage regulation module 2, when the voltage regulation module 2 is soldered to a system board (not shown), the voltage regulation module 2 can perform signal transmission with the system board by using the fourth copper pillars 54.

In the embodiment, the voltage regulating module 2 can be soldered to the system board by using the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 of the pcb assembly 20, and the voltage regulating module 2 is soldered to the system board by using the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54.

In the embodiment, the magnetic core assembly 30 is disposed on the second surface 22b of the printed circuit board 22 and includes at least one annular magnetic core 31, wherein the two-phase step-down converting circuit corresponds to the voltage regulating module 2, so the magnetic core assembly 30 includes two annular magnetic cores 31, each of the annular magnetic cores 31 includes a corresponding first hole 30b, when the magnetic core assembly 30 is disposed on the second surface 22b of the printed circuit board 22, the first copper pillar 51 can pass through the corresponding first hole 30b of the magnetic core assembly 30, so that each of the first copper pillars 51 and the magnetic core assembly 30 cooperate with each other to form the inductor L.

In some embodiments, the magnetic core assembly 30 further includes at least one air gap 30C, for example, as shown in fig. 3B and 3C, the magnetic core assembly 30 includes two air gaps 30C, and the two air gaps 30C are respectively formed on the corresponding annular magnetic cores 31 and located at two opposite sides of the magnetic core assembly 30. In some embodiments, the two annular magnetic cores 31 of the magnetic core assembly 30 may be integrally formed to form an 8-shape, but not limited thereto, the two annular magnetic cores 31 may also be independent assemblies respectively, and assembled to form the magnetic core assembly 30.

In the present embodiment, the shape of the first hole 30b of the magnetic core assembly 30 is circular, and the protrusion 222 penetrating the first hole 30b is also correspondingly circular, however, the present invention is not limited thereto, the shape of the first hole 30b may also be square or any shape, the shape of the protrusion 222 also has different embodiments corresponding to the shape of the first hole 30b, and in addition, the shape of the outer ring sidewall 30d of the magnetic core assembly 30 is circular, but of course, may also be square or any shape.

In some embodiments, all or a portion of the copper pillars in the fourth copper pillars 54 may be pre-fabricated as a lead frame, such that the lead frame including the copper pillars may be easily soldered to the printed circuit board 22 to implement the installation and installation of the copper pillars. Of course, the first copper pillar 51, the second copper pillar 52, and the third copper pillar 53 may also be pre-fabricated with a lead frame, respectively, as the fourth copper pillar 54, for installation and installation. For convenience of description, only the fourth copper pillar 54 is used as a lead frame for illustration. Referring to fig. 5 and 6, fig. 5 is a schematic diagram illustrating an exemplary structure of a lead frame fabricated by using the fourth copper pillar shown in fig. 3B, and fig. 6 is a schematic diagram illustrating a plurality of lead frames shown in fig. 5 disposed in a plurality of voltage regulation modules. As shown in fig. 5, the fourth copper pillars 54 of the voltage regulating module 2 may be pre-fabricated into a lead frame 55, wherein the lead frame 55 includes an outer frame 56, and inner edges of the outer frame 56 may be respectively connected to the fourth copper pillars 54. When the voltage regulating module 2 is assembled, the lead frame 55 including the plurality of fourth copper pillars 54 can be easily disposed and soldered on the printed circuit board 22, so as to quickly complete the installation and disposition of the fourth copper pillars 51. In some embodiments, as shown in fig. 6, when the voltage regulating module 2 is manufactured and assembled, a printed circuit board including a plurality of printed circuit boards 22 is provided, each printed circuit board 22 is fixedly connected to the corresponding magnetic core assembly 30 to form a plurality of voltage regulating module semi-finished products 4a, then a plurality of lead frames 55 are disposed on the second surface 22b of the corresponding printed circuit board 22, and the fourth copper pillars 54 of each lead frame 55 are respectively soldered to the second surface 22b of the printed circuit board 22 of the corresponding voltage regulating module semi-finished product 4 a. Since the fourth copper pillars 54 are fixed by the lead frame 55 and then soldered to the corresponding printed circuit board 22, the fourth copper pillars 54 can be prevented from shifting when soldered to the printed circuit board 22 or after subsequent processing steps, such as shifting when the voltage adjustment module 2 is molded. In addition, the first copper pillar 51, the second copper pillar 52 and the third copper pillar 53 may be disposed on the second surface 22b of the printed circuit board 22 before the lead frame 55 is fixedly soldered to the corresponding printed circuit board 22. Of course, the first copper pillar 51, the second copper pillar 52 and the third copper pillar 53 may also be fixed and welded on the second surface 22b of the printed circuit board 22 after the lead frame 55 is fixed and welded on the printed circuit board 22, and then the first copper pillar 51, the second copper pillar 52 and the third copper pillar 53 are fixed and welded together or respectively on the second surface 22b of the printed circuit board 22. In addition, after the plurality of voltage regulating module semi-finished products 4a shown in fig. 6 are molded, the connection between the outer frame 56 and the fourth copper pillar 54 on each voltage regulating module semi-finished product 4a can be cut, and the continuous printed circuit board can be cut at the same time, so as to form a plurality of independent voltage regulating modules 2.

Referring to fig. 7A and 7B, fig. 7A is a schematic structural diagram of the voltage regulation module shown in fig. 3A after a plastic package layer is disposed thereon, and fig. 7B is a schematic structural diagram of another view angle of the voltage regulation module shown in fig. 7A. As shown in the figure, in the present embodiment, the voltage adjusting module 2 further includes a plastic package layer 60 for performing double-sided plastic package on the first surface 22a of the printed circuit board 22, components disposed on the first surface 22a, such as all dr. mos21 and all input capacitors Cin, the second surface 22b, and components disposed on the second surface 22b, such as the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54, and the plastic package layer 60 further includes a first plastic package cover 60a, a second plastic package cover 60b and a plastic package side 60 c. The first plastic cover 60a of the plastic package layer 60 and the first surface 22a of the printed circuit board 22 are located on the same side of the printed circuit board 22, the second plastic cover 60b of the plastic package layer 60 and the second surface 22b of the printed circuit board 22 are located on the same side of the printed circuit board 22, the first plastic cover 60a and the second plastic cover 60b are disposed opposite to each other, and the plastic package side 60c of the plastic package layer 60 is located between the first plastic cover 60a and the second plastic cover 60 b. In some embodiments, the first plastic cover 60a of the plastic package layer 60 is polished with the first surface 22a of the printed circuit board 22 as a reference to modulate the thermal resistance of the heating devices, such as dr. mos21 and the input capacitor Cin, on the first plastic cover 60a of the plastic package layer 60, and the surface of each dr. mos21 is exposed out of the first plastic cover 60a of the plastic package layer 60 by polishing, and is further attached to the chassis of the electronic device through a heat sink or directly by the heat sink, thereby facilitating further reducing the thermal resistance and enhancing the heat dissipation effect.

In other embodiments, the second plastic cover 60b of the plastic package layer 60 may also be polished, so that the end surfaces of the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 are exposed to the second plastic cover 60b of the plastic package layer 60 and are coplanar with the second plastic cover 60 b. In addition, the end surfaces of the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 exposed on the second molding surface 60b of the molding layer 60 may be further chemically plated, so that the end surfaces of the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 exposed on the second molding surface 60b of the molding layer 60 have pads with larger areas. As shown in fig. 7A and 7B, the first copper pillar 51 is a first pad 51a on the end surface of the second plastic cover 60B to form a positive output end conductive connection portion, the first pad 51a is a strip shape on the second plastic cover 60B, two ends of the strip shape of the first pad 51a are respectively connected to two corresponding sides of the plastic cover side 60c, and two side plating regions 60d are formed by plating on the two connected sides, so that when the voltage regulating module 2 is reflow-soldered to a system board, the side plating region 60d can provide side solder-climbing to improve the soldering strength between the voltage regulating module 2 and the system board. In addition, the second copper pillar 52 is a second pad 52a on the end surface of the second plastic cover 60b to form the positive input lead. The third copper pillar 53 is a third pad 53a on the end surface of the second plastic cover 60b to form a negative output terminal connection portion. The fourth copper pillar 54 is a fourth pad 54a on the end surface of the second plastic cover 60b to form a signal connection portion. The side electroplating area 60d, the second bonding pad 52a, the third bonding pad 53a and the fourth bonding pad 54a can increase the area of the whole bonding pad, reduce the average stress of the welding points on the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54, enhance the strength of the welding points, reduce the weight born by a unit welding surface, diffuse current and reduce loss. Furthermore, as mentioned above, since the first and second plastic covers 60a and 60b of the plastic package layer 60 can be polished, the tolerance of the total height of the voltage regulating module 2 can be adjusted. In the above embodiment, the area of the first pad 51a (i.e., the positive output terminal connection portion) is greater than or equal to the cross-sectional area of the end surface of the first copper pillar 51, the area of the second pad 52a (i.e., the positive input terminal connection portion) is greater than or equal to the cross-sectional area of the end surface of the second copper pillar 52, and the area of the third pad 53a (i.e., the negative output terminal connection portion) is greater than or equal to the cross-sectional area of the end surface of the third copper pillar 53.

In another embodiment, the second plastic cover 60b may be polished to expose a surface of the magnetic core assembly 30, so that when the voltage regulating module 2 is welded and fixed to the system board, the exposed surface of the magnetic core assembly 30 may be directly attached to the system board, thereby enhancing the heat dissipation capability of the magnetic core assembly 30.

In some embodiments, the molding side 60c of the voltage adjusting module 2 may further be polished to expose the annular surface portions of the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 to the molding side 60c of the molding layer 60. In some embodiments, the side surfaces of the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 exposed on the molding side 60c of the molding layer 60 may be further chemically plated, so that the second copper pillar 52 exposed on the molding side 60c after being plated is connected to the second pad 52a (i.e., the positive input terminal conducting portion), the third copper pillar 53 exposed on the molding side 60c after being plated is connected to the third pad 53a (i.e., the negative output terminal conducting portion), and the fourth copper pillar 54 exposed on the molding side 60c after being plated is connected to the fourth pad 54a (i.e., the signal conducting portion). Therefore, when the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 of the voltage regulating module 2 are reflow-soldered to the system board, the plating areas on the side surfaces of the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 can provide side solder-climbing, so as to improve the soldering strength between the voltage regulating module 2 and the system board.

In the present embodiment, as shown in fig. 3B and 3C, the printed circuit board 22 of the voltage regulating module 2 includes two first copper pillars 51 and two second copper pillars 52, the two first copper pillars 51 are located at a central position of the printed circuit board 22, and the two second copper pillars 52 are disposed at two sides of the central position between the two first copper pillars 51, symmetrically disposed on the second surface 22B of the printed circuit board 22 at the central position between the two first copper pillars 51, and adjacent to the region between the two first copper pillars 51. The printed circuit board 22 includes two third copper pillars 53, the second surface 22b of the printed circuit board 22 has four end corners, two opposite end corners symmetrical to the center point of the second surface 22b form a first diagonal line, the other two opposite end corners symmetrical to the center point of the second surface 22b form a second diagonal line, and the two third copper pillars 53 are disposed on the two end corners of the first diagonal line of the second surface 22b of the printed circuit board 22 and disposed on two sides of the center position between the two first copper pillars 51. Some of the fourth copper pillars 54 and the rest of the fourth copper pillars 54 in the plurality of fourth copper pillars 54 are respectively disposed on two end corners of a second diagonal line of the second surface 22b of the printed circuit board 22, and when the voltage regulating module 2 is connected to the system board by welding, the voltage regulating module 2 can perform signal transmission with the system board by using a signal terminal.

In some embodiments, the magnetic core element 30 can be further fixed on the second surface 22b of the printed circuit board 22 by using a thermal conductive adhesive, thereby increasing the heat dissipation capability of the magnetic core element 30. In addition, in the embodiment, the first gap 23 is formed between the outer annular sidewall 30d of the magnetic core element 30 and the second and third copper pillars 52 and 53, the second gap 24 is formed between the inner annular sidewall 30e of the magnetic core element 30 and the corresponding first copper pillar 51, and the voltage adjustment module 2 may further include an underfill (underfill), which is filled in the corresponding first gap 23 and the corresponding second gap 24, so that the magnetic core element 30 is fully contacted with the printed circuit board 22 and the adjacent copper pillars by using the underfill, so as to avoid gaps at these positions after the plastic encapsulation. Furthermore, the voltage regulation module 2 of the present embodiment is electrically connected to the system board by using two-sided plastic package and using chemical plating to generate the bonding pads, so that the components inside the voltage regulation module 2 can be prevented from falling off or shifting due to heating when the voltage regulation module 2 is welded to the system board or when other components are welded to the system board, and the assembly process of the voltage regulation module 2 in the production application can be simplified.

In some embodiments, in the manufacturing process of the printed circuit board 22, the magnetic core assembly 30, the first copper pillar 51, the second copper pillar 52, and the third copper pillar 53 may be embedded in the printed circuit board 22 in advance, and a first pad 51a (i.e., a positive output terminal lead), a second pad 52a (i.e., a positive input terminal lead), a third pad 53a (i.e., a negative output terminal lead), and a fourth pad 54a are formed on the second surface 22b of the printed circuit board 22 by electroplating. Please refer to fig. 8, which is a schematic structural diagram of the voltage regulator module shown in fig. 3A with a plastic package layer and a printed circuit board including an inner board. As shown, the pcb 22 of the present embodiment further includes an inner layer board 80 compared to the pcb 22 of fig. 3C, so that the pcb 22 is a multi-layer pcb. The magnetic core assembly 30 includes an upper surface 30f and a lower surface 30g (shown in fig. 3B), and the upper surface 30f and the lower surface 30g are plated to form a first copper electrode and a second copper electrode, respectively. The magnetic core assembly 30, the first copper pillar 51, the second copper pillar 52 and the third copper pillar 53 are fixed together and embedded in the inner layer board 80 of the printed circuit board 22.

Referring to fig. 9, which is a cross-sectional top view of the inner plate of the voltage regulating module shown in fig. 8, as shown in fig. 9 and 3B, the inner plate 80 includes a switch region 81, a core region 82, a positive input region 83 and a negative output region 84. The first copper pillar 51 is disposed and fixed in the switch area 81, the magnetic core assembly 30 is disposed and fixed in the magnetic core area 82, the second copper pillar 52 is disposed and fixed in the positive input end area 83 to form a positive input end of the voltage regulating module 2, and the third copper pillar 53 is disposed and fixed in the negative output end area 84 to form a negative output end of the voltage regulating module 2, wherein the magnetic core area 82 may be connected with the positive input end area 83 to form a connection area, or the magnetic core area 82 may be connected with the negative output end area 84 to form a connection area.

In this embodiment, the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the first copper electrode and the second copper electrode of the magnetic core assembly 30 can be drilled on the first surface 22a and the second surface 22b of the printed circuit board 22, respectively, and the inner walls of the holes are plated to form through holes. Referring to fig. 10A, which is a cross-sectional view of the voltage regulating module shown in fig. 8, the switch region 81, the core region 82, the positive input end region 83, and the negative output end region 84 are respectively connected to pins corresponding to dr. moss 21 on the first surface 22a of the printed circuit board 22 by using corresponding through holes, and as shown in the figure, the printed circuit board 22 includes a first through hole 91 and a second through hole 92. The first via 91 is electrically connected to the first copper pillar 51 and the pin corresponding to the dr.mos21 on the first surface 22a of the printed circuit board 22, and the second via 92 is electrically connected to the second copper electrode of the magnetic core assembly 30 and the pin corresponding to the dr.mos21 on the first surface 22a of the printed circuit board 22, such that the magnetic core assembly 30 is electrically connected to the pin corresponding to the dr.mos21 by the second copper electrode. In the embodiment, the printed circuit board 22 may further include a plurality of signal vias (not shown), which are electrically connected to the pins corresponding to the dr. moss 21 on the first surface 22a of the printed circuit board 22 and the fourth pads 54 a.

In the present embodiment, as shown in fig. 10A, the printed circuit board 22 further includes a third via 93 and a fourth via 94, the third via 93 is electrically connected to the first pad 51a and the first copper electrode of the magnetic core element 30, such that the magnetic core element 30 is electrically connected to the first pad 51a by the first copper electrode, and the fourth via 94 is electrically connected to the first pad 51a and the first copper pillar 51. In the above embodiments, the first through hole 91, the second through hole 92, the third through hole 93 and the fourth through hole 94 may be straight holes, or as shown in fig. 10B, the first through hole 91, the second through hole 92, the third through hole 93 and the fourth through hole 94 are respectively formed by a plurality of staggered through holes, i.e. stepped through holes, and the specific implementation manner is not limited thereto. In the embodiment, the copper electrode is disposed on the surface of the magnetic core assembly 30, and the through hole is used to connect the copper electrode and the pad on the surface of the printed circuit board 22, so as to reduce the thermal interface resistance between the magnetic core assembly 30 and the surface of the printed circuit board 22, so that the magnetic core assembly 30 can respectively dissipate heat to the surface of the printed circuit board 22 through the through hole.

In some embodiments, the printed circuit board 22 further includes a plurality of other vias (not shown), such that the second pad 52a (i.e., the positive input terminal connection) is electrically connected to the second copper pillar 52 through the corresponding via, and the third pad 53a (i.e., the negative output terminal connection) is also electrically connected to the third copper pillar 53 through the corresponding via. In some embodiments, the printed circuit board 22 may further include at least one signal via (not shown) to form a signal terminal by using the signal via instead of the fourth copper pillar, one end of each signal via is electrically connected to a corresponding pin of the dr. mos21 on the first surface 22a of the printed circuit board 22, and the other end of each signal via is electrically connected to the fourth pad 54a on the second surface 22b of the printed circuit board 22.

In the embodiment, the first copper pillar 51, the second copper pillar 52, the third copper pillar 53 and the fourth copper pillar 54 are exposed to the plastic package side surface 60c, and the exposed first copper pillar 51, the exposed second copper pillar 52, the exposed third copper pillar 53 and the exposed fourth copper pillar 54 can be electroplated to form an electroplating area, so that when the voltage adjusting module 2 and the system board are reflow-welded, the electroplating area can provide side surface tin climbing to improve the welding strength between the voltage adjusting module 2 and the system board.

In the embodiment, the height of the magnetic core element 30, the height of the first copper pillar 51, the height of the second copper pillar 52 and the height of the third copper pillar 53 are the same and are all welded on the same inner layer board 80 in the printed circuit board 22, however, the invention is not limited thereto, and magnetic core elements and copper pillars with different heights may be adopted, and the magnetic core elements and copper pillars may be fixed on different inner layer boards.

In the embodiment, the magnetic core assembly 30 is soldered on the inner board 80 in the printed circuit board 22, so that there is more area on the second surface 22b of the printed circuit board 22 for placing the first soldering land 51a, the second soldering land 52a, the third soldering land 53a and the fourth soldering land 54a, so as to further increase the area of one or more of the first soldering land 51a, the second soldering land 52a, the third soldering land 53a and the fourth soldering land 54a, increase the soldering area and soldering strength with the system board, reduce the average stress of the voltage regulating module 2, reduce the weight born by the unit soldering area, and diffuse the current and reduce the loss. In addition, the first surface 22a of the printed circuit board 22 of the present embodiment can also be molded in the aforementioned manner, which is not described herein again.

In summary, the switch circuit and the magnetic core assembly of the voltage regulation module are respectively disposed on two opposite sides of the printed circuit board, and in addition, the voltage regulation module can utilize the first side to be plastic-packaged, and embed the magnetic core assembly and the copper column inside the printed circuit board, and form a guiding connection part on the second side to be welded with the system board, or utilize the copper column to be disposed on the circuit board, and weld with the system board after two sides are plastic-packaged, so that the components inside the voltage regulation module can be prevented from falling off or shifting due to heating when the voltage regulation module is welded with the system board, and therefore the assembly process of the voltage regulation module in production and application can be simplified, and the problem of electrical connection between the voltage regulation module and the system board in the vertical power supply structure can be solved, the design of the guiding connection part can be simplified, and the size of the voltage regulation module can be reduced.