阅读说明：本技术 温度测定传感器、温度测定系统及温度测定方法 (Temperature measurement sensor, temperature measurement system, and temperature measurement method ) 是由 吴同 南朋秀 宫川正章 于 2019-07-11 设计创作，主要内容包括：例示性实施方式所涉及的温度测定传感器具备：基板；及光纤,其设置于基板的上表面并沿着上表面而延伸。温度测定传感器还具备：作为使上表面的上方的空间和基板的下表面的下方的空间连通的空间的光导入路径；及光耦合部,其设置于上表面并配置于光导入路径上。光耦合部与光纤的端面光学地连接。光纤构成第1图案形状及第2图案形状。第1图案形状比第2图案形状更密集地包含光纤。经由光导入路径从下表面侧入射到光耦合部的光经由光耦合部到达端面。(A temperature measurement sensor according to an exemplary embodiment includes: a substrate; and an optical fiber disposed on the upper surface of the substrate and extending along the upper surface. The temperature measurement sensor further includes: a light introduction path serving as a space for communicating a space above the upper surface with a space below the lower surface of the substrate; and an optical coupling section disposed on the upper surface and disposed on the light introduction path. The optical coupling portion is optically connected to an end face of the optical fiber. The optical fibers form a1 st pattern shape and a2 nd pattern shape. The 1 st pattern shape contains optical fibers more densely than the 2 nd pattern shape. The light entering the optical coupling section from the lower surface side via the light introduction path reaches the end surface via the optical coupling section.)

1. A temperature measurement sensor is provided with:

a substrate;

an optical fiber disposed on and extending along an upper surface of the substrate;

a light introduction path of a space that communicates a space above the upper surface and a space below the lower surface of the substrate; and

an optical coupling section provided on the upper surface and disposed on the light introduction path,

the optical coupling portion is optically connected to an end face of the optical fiber,

the optical fibers constitute a1 st pattern shape and a2 nd pattern shape,

the 1 st pattern shape contains the optical fibers more densely than the 2 nd pattern shape,

the light entering the optical coupling portion from the lower surface side through the light introduction path reaches the end face through the optical coupling portion.

2. The thermometry sensor of claim 1,

the light introducing path is a through hole or a notch provided in the substrate.

3. The thermometry sensor of claim 1 or 2,

the optical coupling section includes a light reflector and a1 st collimator lens,

the light reflector is disposed on the light introduction path,

the 1 st collimating lens is disposed between the light reflector and the end face,

the light entering the optical coupling section from the lower surface side via the light introduction path reaches the end surface via the optical reflector and the 1 st collimator lens in this order.

4. The thermometry sensor of claim 3,

the light reflector is a prism or a mirror.

5. A temperature measurement system is provided with:

the thermometry sensor of any one of claims 1 to 4; and

a measuring device that measures a temperature of a substrate of the temperature measurement sensor,

the measuring device makes light incident on an optical fiber provided on the upper surface of the substrate and included in the temperature measurement sensor, receives backscattered light emitted from the optical fiber in accordance with the light, and measures the temperature of the substrate in accordance with the received backscattered light.

6. The temperature determination system of claim 5,

the measuring device is provided with a push-out pin,

the ejector pin is provided with an optical waveguide portion,

the measuring device causes light to be incident into the optical fiber via an end of the optical waveguide section,

the end portion is incident on the backward scattered light emitted from the optical fiber in accordance with the light incident on the optical fiber.

7. The temperature determination system of claim 6,

the end portion includes a convex lens.

8. The temperature determination system according to claim 6 or 7,

the material of the optical waveguide portion is sapphire.

9. The temperature determination system of claim 5,

the measuring device is provided with a2 nd collimator lens,

the measuring device makes light incident into the optical fiber through the 2 nd collimating lens,

the backward scattered light emitted from the optical fiber according to the light incident on the optical fiber is incident on the 2 nd collimator lens.

10. A temperature measurement method includes:

a first step of making light incident on an optical fiber extending along an upper surface of a substrate;

a2 nd step of receiving backscattered light emitted from the optical fiber in accordance with the light incident on the optical fiber in the 1 st step; and

a 3 rd step of measuring the temperature of the substrate based on the backscattered light received in the 2 nd step,

in the step 1, light is made incident from the lower surface side to a light coupling section provided on the upper surface via a light introduction path of a space which communicates a space above the upper surface of the substrate with a space below the lower surface of the substrate,

the optical coupling portion is optically connected to an end face of the optical fiber,

the optical fibers form a1 st pattern shape and a2 nd pattern shape,

the 1 st pattern shape contains the optical fibers more densely than the 2 nd pattern shape.

11. The temperature measuring method according to claim 10,

and alternately performing a series of processes including the 1 st step, the 2 nd step, and the 3 rd step on both end faces of the optical fiber.

Technical Field

Exemplary embodiments of the present disclosure relate to a temperature measurement sensor, a temperature measurement system, and a temperature measurement method.

Background

In the sensor device disclosed in patent document 1, the characteristics of the process are measured with a sensor, and the measured data is processed with an information processor. By this processing, the sensor device generates a correspondence model, and transmits the generated correspondence model to the external communicator by the internal communicator.

The substrate for temperature measurement disclosed in patent document 2 includes at least one optical fiber and a substrate. The substrate is either a semiconductor wafer or a substrate for flat panel display. The optical fiber is laid on the surface of the substrate and has a1 st pattern part and a2 nd pattern part formed more densely than the 1 st pattern part.

Prior art documents

Patent document

Patent document 1: japanese Kokai publication Hei-2004-507889

Patent document 2: international publication No. 2017/183471 pamphlet

Disclosure of Invention

Technical problem to be solved by the invention

The present disclosure provides a technique for facilitating installation of a device used for measuring a temperature.

Means for solving the technical problem

In one exemplary embodiment, a thermometry sensor is provided. The temperature measurement sensor includes: a substrate; and an optical fiber disposed on the upper surface of the substrate and extending along the upper surface. The temperature measurement sensor further includes: a light introduction path that communicates a space above the upper surface with a space below the lower surface of the substrate; and an optical coupling section disposed on the upper surface and disposed on the light introduction path. The optical coupling portion is optically connected to an end face of the optical fiber. The optical fibers form a1 st pattern shape and a2 nd pattern shape. The 1 st pattern shape contains optical fibers more densely than the 2 nd pattern shape. The light entering the optical coupling section from the lower surface side via the light introduction path reaches the end surface via the optical coupling section.

Effects of the invention

According to the temperature measurement sensor and the temperature measurement system of one exemplary embodiment, the installation of the device used for measuring the temperature is facilitated.

Drawings

Fig. 1 is a diagram showing a configuration of a temperature measurement system according to an exemplary embodiment.

Fig. 2 is a diagram showing in more detail the configurations of the optical terminal and the temperature measurement sensor shown in fig. 1.

Fig. 3 is a diagram showing an example of the structures of the substrate and the optical fiber shown in fig. 1 and 2 in more detail.

Fig. 4 is a diagram showing another example of the structures of the substrate and the optical fiber shown in fig. 1 and 2 in more detail.

Fig. 5 is a flowchart showing a temperature measurement method according to an exemplary embodiment.

Fig. 6 is a diagram showing another configuration of the optical terminal and the temperature measurement sensor shown in fig. 1 in more detail.

Detailed Description

Various exemplary embodiments are described below. In one exemplary embodiment, a thermometry sensor is provided. The temperature measurement sensor includes: a substrate; and an optical fiber disposed on the upper surface of the substrate and extending along the upper surface. The temperature measurement sensor further includes: a light introduction path serving as a space for communicating a space above the upper surface with a space below the lower surface of the substrate; and an optical coupling section disposed on the upper surface and disposed on the light introduction path. The optical coupling portion is optically connected to an end face of the optical fiber. The optical fibers form a1 st pattern shape and a2 nd pattern shape. The 1 st pattern shape contains optical fibers more densely than the 2 nd pattern shape. The light entering the optical coupling section from the lower surface side via the light introduction path reaches the end surface via the optical coupling section.

The optical coupling section optically connected to the optical fiber is disposed on the light introduction path. When the light entering through the light introduction path reaches the optical coupling section, the light reaches the optical fiber through the optical coupling section. Therefore, by placing the substrate provided with the optical fiber on the upper surface from which the light is emitted, temperature measurement using the optical fiber can be performed. Therefore, the temperature measurement sensor, particularly, the optical fiber used for temperature measurement can be easily installed. Further, since the temperature measurement sensor can be easily carried into the process chamber without opening the process chamber into which the temperature measurement sensor is carried into the atmosphere, the time for measuring the temperature can be shortened. Since the temperature measurement sensor (structure on the substrate) used for temperature measurement does not require power, a battery used for supplying power is not required. Since no battery is required, the temperature measurement range is extended without being limited to the battery operating temperature range.

In one aspect, the light introduction path may be, for example, a through-hole or a notch provided in the substrate. Therefore, when light is introduced into the optical coupling section through the light introduction path, light loss can be sufficiently suppressed.

In one embodiment, the optical coupling section includes, for example, a light reflector and a collimator lens. The light reflector may be disposed on the light introduction path. The collimating lens may be disposed between the light reflector and the end face. Light entering the optical coupling section from the lower surface side via the optical introduction path can reach the end surface via the optical reflector and the collimator lens in this order. Since the optical coupling section includes the optical reflector and the collimator lens, light entering the optical coupling section via the light introduction path can satisfactorily reach the end face of the optical fiber.

In one approach, the light reflector may be, for example, a prism or a mirror. Since the light reflector is a prism or a mirror, the structure of the light reflector becomes simple and the light reflector can be easily manufactured.

In one exemplary embodiment, a temperature determination system is provided. The temperature measurement system includes the temperature measurement sensor and a measurement device for measuring the temperature of the substrate of the temperature measurement sensor. The measuring device makes light incident on an optical fiber provided on the upper surface of the substrate and included in the temperature measuring sensor, receives backscattered light emitted from the optical fiber in accordance with the light, and measures the temperature of the substrate in accordance with the received backscattered light.

The optical coupling section optically connected to the optical fiber is disposed on the light introduction path. When light entering from the measuring device through the light introduction path reaches the optical coupling section, the light reaches the optical fiber through the optical coupling section. Therefore, by placing the substrate provided with the optical fiber on the upper surface from which the light is emitted, temperature measurement using the optical fiber can be performed. Therefore, the temperature measurement sensor, particularly, the optical fiber used for temperature measurement can be easily installed. Further, since the temperature measurement sensor (structure on the substrate) used for temperature measurement does not require electric power, a battery used for supplying electric power is not required.

In one aspect, the measuring device may include a push pin (pushpin), for example. The ejector pin may include, for example, an optical waveguide. The measuring device may cause light to be incident into the optical fiber via an end of the optical waveguide portion. The back-scattered light emitted from the optical fiber according to the light incident into the optical fiber may be incident on the end portion. Since light can be made incident on the temperature measurement sensor through the ejector pin, light can be guided through an existing channel without significantly modifying the device.

In one aspect, the end portion may include a convex lens, for example. The collimating optical system may be constituted by a convex lens at an end portion and a light coupling portion. Therefore, with such a collimating optical system, positional deviation of light can be reduced.

In one aspect, the material of the optical waveguide portion may be, for example, sapphire. Since the optical waveguide portion includes sapphire, the influence of temperature change, mechanical stress, and the like is suppressed, and the shape of the optical waveguide portion can be accurately maintained. Therefore, the light can be accurately introduced into the temperature measurement sensor.

In one aspect, the measuring apparatus includes a2 nd collimator lens, and the measuring apparatus causes light to enter the optical fiber via the 2 nd collimator lens, and backward scattered light emitted from the optical fiber in accordance with the light entering the optical fiber to enter the 2 nd collimator lens. Since light can be made incident on the temperature measurement sensor through the 2 nd collimator lens, the optical system configuration is simplified and the manufacturing is facilitated.

In one exemplary embodiment, a method of temperature determination is provided. The temperature measuring method comprises the 1 st step, the 2 nd step and the 3 rd step. In step 1, light is made incident on an optical fiber extending along the upper surface of the substrate. In the 2 nd step, the backscattered light emitted from the optical fiber in accordance with the light incident on the optical fiber in the 1 st step is received. In the 3 rd step, the temperature of the substrate is measured from the backscattered light received in the 2 nd step. In the step 1, light is made incident from the lower surface side to the optical coupling portion provided on the upper surface via a light introduction path which is a space communicating a space above the upper surface of the substrate and a space below the lower surface of the substrate. The optical coupling portion is optically connected to an end face of the optical fiber. The optical fiber forms a1 st pattern shape and a2 nd pattern shape. The 1 st pattern shape contains optical fibers more densely than the 2 nd pattern shape.

The optical coupling section optically connected to the optical fiber is disposed on the light introduction path. When the light incident through the light introduction path in step 1 reaches the optical coupling section, the light reaches the optical fiber through the optical coupling section. In the 2 nd step, the backscattered light emitted from the optical fiber in accordance with the light incident on the optical fiber in the 1 st step is received. In the 3 rd step, the temperature of the substrate is measured from the backscattered light. Therefore, by placing the substrate provided with the optical fiber on the upper surface from which the light is emitted, temperature measurement using the optical fiber can be performed. Therefore, the optical fiber used for temperature measurement can be easily installed. Further, since the temperature measurement sensor can be easily carried into the process chamber without opening the process chamber into which the temperature measurement sensor is carried into the atmosphere, the time for measuring the temperature can be shortened. Since the structure on the substrate used for temperature measurement does not require power, a battery used for supplying power is not required. Since no battery is required, the temperature measurement range is extended without being limited to the battery operating temperature range.

In one aspect, a series of processes including the 1 st step, the 2 nd step, and the 3 rd step may be alternately performed on both end surfaces of the optical fiber. In this way, since the temperature measurement is performed using the backscattered light emitted from each of the two end surfaces of the optical fiber, the measurement error of the temperature can be reduced, and the operating temperature range of the temperature measurement system can be further expanded.

Hereinafter, various exemplary embodiments will be described in detail with reference to the accompanying drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals.

A temperature measurement system 1 according to an exemplary embodiment of the position will be described with reference to fig. 1 and 2. The temperature measurement system 1 includes a temperature measurement sensor SE, a control unit 20, and a measurement device 30.

In the temperature measurement system 1, the optical fiber FB laid on the upper surface SFa of the substrate W is used as a temperature detector. The temperature measurement system 1 measures the temperature distribution along the optical fiber FB by using raman scattered light included in backscattered light emitted from the optical fiber FB in accordance with incidence of light on the optical fiber FB. The temperature measurement system 1 can be used in a substrate processing apparatus (e.g., a plasma processing apparatus) that performs a predetermined process such as a heat process on a substrate such as a semiconductor wafer.

The temperature measurement sensor SE includes a substrate W, an optical fiber FB, an optical coupling portion OC1, and an optical coupling portion OC 2. The substrate W includes an upper surface SFa and a lower surface SFb. The substrate W includes a light introduction path OG1 and a light introduction path OG 2.

Both the light introduction path OG1 and the light introduction path OG2 are spaces that communicate the space above the upper surface SFa and the space below the lower surface SFb. Each of the light introduction path OG1 and the light introduction path OG2 may be a through hole or a notch provided in the substrate W.

The optical fiber FB is laid on the upper surface SFa. The optical fiber FB is provided on the upper surface SFa and extends along the upper surface SFa.

The optical coupling portion OC1 is disposed on the upper surface SFa of the substrate W and on the optical introduction path OG 1. The optical coupling unit OC1 includes a photo reflector PM1 and a collimator lens CL1 (1 st collimator lens). The light reflector PM1 is disposed on the light introduction path OG 1. The collimator lens CL1 is disposed between the photo reflector PM1 and the end face ES1 of the optical fiber FB.

The end face ES1 of the optical fiber FB is optically connected to the collimator lens CL 1. The light entering the optical coupling portion OC1 from the lower surface SFb side via the light introducing path OG1 reaches the end face ES1 of the optical fiber FB via the optical coupling portion OC1 (more specifically, via the photo reflector PM1 and the collimator lens CL1 in this order).

The optical coupling portion OC2 is disposed on the upper surface SFa of the substrate W and on the optical introduction path OG 2. The optical coupling unit OC2 includes a photo reflector PM2 and a collimator lens CL2 (1 st collimator lens). The light reflector PM2 is disposed on the light introduction path OG 2. The collimator lens CL2 is disposed between the photo reflector PM2 and the end face ES2 of the optical fiber FB.

The light reflectors PM1, PM2 may each be a prism or a mirror.

The end face ES2 of the optical fiber FB is optically connected to the collimator lens CL 2. The light entering the optical coupling portion OC2 from the lower surface SFb side via the light introducing path OG2 reaches the end face ES2 of the optical fiber FB via the optical coupling portion OC2 (more specifically, via the photo reflector PM2 and the collimator lens CL2 in this order).

The structures of the light introduction path OG1, the optical coupling portion OC1, and the end face ES1 are the same as those of the light introduction path OG2, the optical coupling portion OC2, and the end face ES 2.

In the present disclosure, the temperature measurement sensor SE is disposed in a processing apparatus that processes a semiconductor substrate, and is particularly placed on the upper surface SFc of the electrostatic chuck SC that holds the semiconductor substrate. The lower surface SFb of the substrate W contacts the upper surface SFc of the electrostatic chuck SC.

The electrostatic chuck SC includes an upper surface SFc and a lower surface SFd. The electrostatic chuck SC has through holes HL1 and HL 2. Through holes HL1 and HL2 are spaces that communicate the space above upper surface SFc and the space below lower surface SFd.

The light introduction path OG1 of the substrate W is disposed above the through-hole HL1 of the electrostatic chuck SC, and the light introduction path OG1 and the through-hole HL1 communicate with each other. The light introduction path OG2 of the substrate W is disposed above the through-hole HL2 of the electrostatic chuck SC, and the light introduction path OG2 and the through-hole HL2 communicate with each other. Through-hole HL1 and through-hole HL2 have the same structure.

The optical coupling portion OC1 is optically connected to the end face ES1 of the optical fiber FB. The optical coupling portion OC2 is optically connected to the end face ES2 of the optical fiber FB.

The control unit 20 is a computer or the like that controls each unit of the measuring device 30. The control unit 20 can perform control of light emission of the light sources 31a and 31b, control of the operation of the signal processing unit 35, and the like.

The measuring device 30 measures the temperature of the substrate W of the temperature measuring sensor SE. The measuring device 30 causes the light to enter the optical fiber FB provided on the upper surface SFa of the substrate W and included in the temperature measurement sensor SE via the optical coupling portion OC1 and the optical coupling portion OC2, respectively. For example, the incidence of light from the measurement device 30 to the optical fiber FB via the optical coupling portion OC1 and the incidence of light from the measurement device 30 to the optical fiber FB via the optical coupling portion OC2 may be alternately performed at different timings.

The measurement device 30 receives, via the optical coupling portion OC1, backscattered light emitted from the optical fiber FB in accordance with light incident via the optical coupling portion OC 1. The measurement device 30 measures the temperature of the substrate W from the backscattered light received via the optical coupling portion OC 1. The measurement device 30 receives, via the optical coupling portion OC2, backscattered light emitted from the optical fiber FB in accordance with light incident via the optical coupling portion OC 2. The measurement device 30 measures the temperature of the substrate W from the backscattered light received via the optical coupling portion OC 2.

The measurement device 30 includes an optical transceiver OPa, an optical transceiver OPb, and a signal processor 35. The optical transceiver OPa and the optical transceiver OPb are connected to the signal processor 35.

The light transmitting/receiving section OPa includes an optical terminal TSa, a light source 31a, a beam splitter 32a, a wavelength separating section 33a, and a light detecting section 34 a. The optical terminal TSa includes an optical waveguide PN1 and an optical coupling CN 1. The optical coupling unit CN1 includes a collimator lens CLa1 and a collimator lens CLb 1.

The optical waveguide portion PN1 of the optical terminal TSa is disposed in the through hole HL1 of the electrostatic chuck SC so as to be freely inserted and removed. The measuring device 30 causes light to enter the optical fiber FB from the end EG1 of the optical waveguide PN1 through the optical coupling portion OC1 and the end face ES 1. The backscattered light emitted from the optical fiber FB via the end face ES1 in accordance with the light incident on the optical fiber FB enters the optical waveguide section PN1 via the end EG 1.

The end EG1 of the optical waveguide section PN1 may include a convex lens, for example. The material of the optical waveguide portion PN1 may be sapphire, for example.

The collimator lens CLa1 and the collimator lens CLb1 may constitute a collimating optical system. The light emitted from the light source 31a of the main body 301 reaches the optical waveguide portion PN1 through the collimator lens CLa1 and the collimator lens CLb1 in this order, travels in the optical waveguide portion PN1, and is emitted from the end EG1 toward the optical coupling portion OC 1.

The light transmitting/receiving unit OPb includes an optical terminal TSb, a light source 31b, a beam splitter 32b, a wavelength separating unit 33b, and a light detecting unit 34 b. The optical terminal TSb includes an optical waveguide PN2 and an optical coupling CN 2. The optical coupling unit CN2 includes a collimator lens CLa2 and a collimator lens CLb 2.

The optical waveguide portion PN2 of the optical terminal TSb is disposed in the through hole HL2 of the electrostatic chuck SC so as to be freely inserted and removed. The measuring device 30 causes light to enter the optical fiber FB from the end EG2 of the optical waveguide PN2 through the optical coupling portion OC2 and the end face ES 2. The backscattered light emitted from the optical fiber FB via the end face ES2 in accordance with the light incident on the optical fiber FB enters the optical waveguide section PN2 via the end EG 2.

The end EG2 of the optical waveguide section PN2 may include a convex lens, for example. The material of the optical waveguide portion PN2 may be sapphire, for example.

The collimator lens CLa2 and the collimator lens CLb2 may constitute a collimating optical system. The light emitted from the light source 31b of the main body 301 reaches the optical waveguide portion PN2 through the collimator lens CLa2 and the collimator lens CLb2 in this order, travels in the optical waveguide portion PN2, and is emitted from the end EG2 toward the optical coupling portion OC 2.

The measuring device 30 includes a main body 301. The main body 301 includes, among a plurality of constituent elements of the measuring device 30, the optical terminals TSa and TSb. The components of the measuring apparatus 30 other than the optical terminal TSa and the optical terminal TSb include a light source 31a, a beam splitter 32a, a wavelength separating unit 33a, a light detecting unit 34a, a light source 31b, a beam splitter 32b, a wavelength separating unit 33b, a light detecting unit 34b, and a signal processing unit 35.

The configuration of the optical transceiver OPa and the configuration of the optical transceiver OPb are the same. The measurement device 30 in the present disclosure includes both the optical transceiver OPa and the optical transceiver OPb, but may include only one of the optical transceiver OPa and the optical transceiver OPb.

The configuration in which the measuring apparatus 30 includes only one of the optical transmission/reception unit OPa and the optical transmission/reception unit OPb is sometimes referred to as a single-ended configuration. The configuration in which the measuring apparatus 30 includes both the optical transceiver OPa and the optical transceiver OPb is sometimes referred to as a double-ended configuration. In the present disclosure, the configuration of the optical transceiver section OPa is described in particular, but the configuration of the optical transceiver section OPb is the same as that of the optical transceiver section OPa, and therefore, the description of the configuration of the optical transceiver section OPb is omitted.

The light source 31a outputs laser light (pulsed light) of a predetermined pulse length at a predetermined cycle. The pulsed light output from the light source 31a is sequentially emitted from the optical terminal TSa (more specifically, the end EG1 of the optical terminal TSa) via the beam splitter 32a and the optical terminal TSa, and reaches the end face of the optical fiber FB via the optical coupling unit OC1 of the temperature measurement sensor SE. The light incident into the optical fiber FB from the end face ES1 travels in the optical fiber FB while being scattered by molecules constituting the optical fiber FB. A part of the scattered light generated in the optical fiber FB is returned to the incident end (end face ES1) as backward scattered light.

The measuring device 30 may include a plurality of ejector pins. In this case, two ejector pins out of the plurality of ejector pins may include, for example, the optical waveguide PN1 and the optical waveguide PN2, respectively.

Raman scattered light (stokes light and anti-stokes light), which is one of the backscattered lights, has temperature dependency. The anti-stokes light is more temperature dependent than the stokes light. The stokes light is raman scattered light shifted to a longer wavelength side than the incident light, and the anti-stokes light is raman scattered light shifted to a shorter wavelength side than the incident light.

The backscattered light passes through the optical fiber FB, is emitted from the incident end (end face ES1) of the optical fiber FB, reaches the beam splitter 32a via the optical coupling unit OC1 and the optical terminal TSa in this order, is reflected by the beam splitter 32a, and enters the wavelength separation unit 33 a.

The wavelength separation unit 33a includes a beam splitter, a filter, a condenser lens, and the like, separates raman scattered light into stokes light and anti-stokes light, and inputs the separated light to the light detection unit 34 a. The light detection unit 34a outputs an electric signal corresponding to the intensities of the stokes light and the anti-stokes light to the signal processing unit 35. The signal processing unit 35 calculates the temperature distribution in the longitudinal direction of the optical fiber FB from the electric signal output from the photodetector 34.

In this way, the temperature measurement system 1 uses the optical fiber FB laid on the upper surface SFa of the substrate W as a temperature detector to detect the temperature dependence of the raman scattered light, which is one of the backward scattered lights, and thereby calculates the temperature distribution of the substrate W. Then, the position (distance) at which the rear raman scattered light is generated is calculated by measuring the reciprocating time until the rear raman scattered light generated in the optical fiber FB returns to the incident end (end face ES1) after the pulsed light enters the optical fiber FB from the incident end (end face ES 1).

The structure of the temperature measurement sensor SE according to an exemplary embodiment will be further described with reference to fig. 3 and 4. Fig. 3 and 4 show the structures of the substrate W and the optical fiber FB as viewed from above the upper surface SFa. The temperature measurement sensor SE shown in fig. 3 and the temperature measurement sensor SE shown in fig. 4 are different in the installation location of the light introduction path OG1 and the light introduction path OG2 provided on the substrate W.

In the case of the temperature measurement sensor SE shown in fig. 3, the light introduction path OG1 and the light introduction path OG2 are through holes provided in the substrate W, respectively. In this case, the light guide paths OG1 and OG2 are disposed at positions in contact with the push-out pins, respectively, and the optical waveguide portion PN1 of the optical terminal TSa is particularly the push-out pin.

In the case of the temperature measurement sensor SE shown in fig. 4, the light introduction path OG1 and the light introduction path OG2 are notches provided in the substrate W, respectively. In this case, the light introduction path OG1 and the light introduction path O G2 may be notches (notch) of the substrate W, respectively, for example.

The material of the substrate W may be, for example, silicon (Si). The diameter of the substrate W is not particularly limited, and may be, for example, about 300 to 450[ mm ].

The optical fiber FB may be, for example, a thin fiber-like tube formed of quartz glass, plastic, or the like. The optical fiber FB includes two end surfaces (end surfaces ES1, ES 2). The end face ES1 is connected to an optical coupling portion OC1 provided on the light introduction path OG 1. The end face ES2 is connected to an optical coupling portion OC2 provided on the light introduction path OG 2.

The pulsed light output from the light source 31a is incident into the optical fiber FB via the end face ES 1. The pulsed light output from the light source 31b is incident into the optical fiber FB via the end face ES 2.

The optical fiber FB forms the 1 st pattern 14 and the 2 nd pattern 15 between the end face ES1 and the end face ES 2. The 1 st pattern shape 14 contains the optical fibers FB more densely than the 2 nd pattern shape 15. The 1 st pattern shape 14 and the 2 nd pattern shape 15 of the optical fiber FB are alternately arranged on the upper surface SFa.

The number of 1 st pattern shapes 14 and the number of 2 nd pattern shapes 15 are not particularly limited, and may be determined according to the size of the substrate W or the like. When the optical fiber FB has a plurality of pattern shapes 2, the pattern shapes 2 may be the same shape or different shapes.

A temperature measurement method MT according to an exemplary embodiment is described with reference to fig. 5. The temperature measuring method MT includes a step ST1 (step 1), a step ST2 (step 2), and a step ST3 (step 3). The temperature measurement method MT can be executed by the control unit 20 operating each component of the temperature measurement system 1. When the temperature measurement system 1 is of the double-ended type, a series of processes including the steps ST1, ST2, and ST3 may be alternately performed on both end surfaces (the end surface ES1, the end surface ES2) of the optical fiber FB.

First, in step ST1, light is made incident on the optical fiber FB from the measuring device 30. In particular, when the temperature measurement system 1 is of the double-ended type, the light emission from the light source 31a and the light emission from the light source 31b are alternately performed at different timings.

In step ST2 after step ST1, the backscattered light emitted from the optical fiber FB in accordance with the light incident on the optical fiber FB in step ST1 is received. In particular, when the temperature measurement system 1 is of the double-ended type, backscattered light generated from light incident from the end face ES1 is emitted from the end face ES1, and backscattered light generated from light incident from the end face ES2 is emitted from the end face ES 2.

In step ST3 after step ST2, the temperature of the substrate W is measured from the backscattered light received in step ST 2. In particular, when the temperature measurement system 1 is of the double-ended type, since backscattered light output from both end faces (the end faces ES1, ES2) of the optical fiber FB is used, it is possible to reduce a measurement error of the temperature and further expand the operating temperature range of the temperature measurement system 1.

As described above, the optical coupling portion OC1 and the optical coupling portion OC2 optically connected to the optical fiber FB are disposed on the light introduction path OG1 and the light introduction path OG2, respectively. When the light entering through the light introduction path OG1 and the light introduction path OG2 reaches the optical coupling unit OC1 and the optical coupling unit OC2, the light reaches the optical fiber FB through the optical coupling unit OC1 and the optical coupling unit OC 2. Therefore, by placing the substrate W provided with the optical fiber FB on the upper surface SFc of the electrostatic chuck SC from which light is emitted, temperature measurement using the optical fiber FB can be performed. Therefore, the temperature measurement sensor SE, particularly, the optical fiber FB used for temperature measurement can be easily installed. Further, since the temperature measurement sensor SE can be easily carried into the process chamber without opening the process chamber into which the temperature measurement sensor SE is carried into the atmosphere, the time for measuring the temperature can be shortened. Since the temperature measurement sensor SE (structure on the substrate W) used for temperature measurement does not require electric power, a battery used for supplying electric power is not required. Since no battery is required, the temperature measurement range is extended without being limited to the battery operating temperature range.

When the light introduction path OG1 and the light introduction path OG2 are through-holes or notches provided in the substrate W, light loss can be sufficiently suppressed when the light is introduced into each of the optical coupling portion OC1 and the optical coupling portion OC2 via each of the light introduction path OG1 and the light introduction path OG 2.

Since the optical coupling section OC1 includes the photo reflector PM1 and the collimator lens CL1, the light incident on the optical coupling section OC1 via the light introduction path OG1 can favorably reach the end face ES1 of the optical fiber FB. Since the optical coupling section OC2 includes the photo reflector PM2 and the collimator lens CL2, the light incident on the optical coupling section OC2 via the light introduction path OG2 can favorably reach the end face ES2 of the optical fiber FB.

Since the photo reflectors PM1, PM2 are prisms or mirrors, respectively, the structures of the photo reflectors PM1, PM2 are simplified, and the photo reflectors PM1, PM2 can be easily manufactured.

The measuring device 30 may have a plurality of ejector pins, for example. Each of the two ejector pins of the plurality of ejector pins may include an optical waveguide PN1 and an optical waveguide PN 2. In this case, since light can be made incident on the temperature measurement sensor SE via the ejector pin, light can be guided using an existing channel without significantly modifying the device.

The end EG1 of the optical waveguide section PN1 and the end EG2 of the optical waveguide section PN2 may each include a convex lens, for example. In this case, one collimating optical system may be configured by the convex lens of the end EG1 and the optical coupling portion OC1, and one collimating optical system may be configured by the convex lens of the end EG2 and the optical coupling portion OC 2. Therefore, with such a collimating optical system, positional deviation of light can be reduced.

The material of each of the optical waveguide section PN1 and the optical waveguide section PN2 may be, for example, sapphire. In this case, since the optical waveguide PN1 and the optical waveguide PN2 each include sapphire, the influence of temperature change, mechanical stress, and the like can be suppressed, and the shapes of the optical waveguide PN1 and the optical waveguide PN2 can be accurately maintained. Therefore, the light can be accurately introduced into the temperature measurement sensor SE.

The optical coupling portion OC1 and the optical coupling portion OC2 optically connected to the optical fiber FB are disposed on the light introduction path OG1 and the light introduction path OG2, respectively. When the light incident through the light introduction path OG1 in step ST1 of the temperature measurement method MT reaches the optical coupling unit OC1, the light reaches the optical fiber through the optical coupling unit OC 1. When the light incident through the light introduction path OG2 in step ST1 of the temperature measurement method MT reaches the optical coupling unit OC2, the light reaches the optical fiber through the optical coupling unit OC 2. In step ST2, the backscattered light emitted from the optical fiber FB in accordance with the light incident on the optical fiber FB in step ST1 is received. In step ST3, the temperature of the substrate W is measured from the backscattered light. Therefore, by placing the substrate W provided with the optical fiber FB on the upper surface SFc of the electrostatic chuck SC from which light is emitted, temperature measurement using the optical fiber FB can be performed. Therefore, the optical fiber FB used for temperature measurement can be easily installed. Further, since the temperature measurement sensor SE can be easily carried into the process chamber without opening the process chamber into which the temperature measurement sensor SE is carried into the atmosphere, the time for measuring the temperature can be shortened. Since the temperature measurement sensor SE (structure on the substrate W) used for temperature measurement does not require electric power, a battery used for supplying electric power is not required. Since no battery is required, the temperature measurement range is extended without being limited to the battery operating temperature range.

Since the temperature measurement is performed using the backscattered light emitted from each of the two end surfaces (end surfaces ES1, ES2) of the optical fiber FB, the measurement error of the temperature can be reduced, and the operating temperature range of the temperature measurement system 1 can be further expanded.

While various exemplary embodiments have been described above, the present invention is not limited to the exemplary embodiments described above, and various omissions, substitutions, and changes may be made. Moreover, the elements of the different embodiments may be combined to form other embodiments.

For example, as shown in fig. 6, the measuring device 30 may include an optical terminal TSa1 and an optical terminal TSb 1. The functions of the optical terminals TSa1 and TSb1 shown in fig. 6 correspond to the functions of the optical terminals TSa and TSb shown in fig. 2.

The electrostatic chuck SC shown in fig. 6 includes a through hole HL3 and a through hole HL 4. The through-holes HL3 and HL4 are provided separately from the through-holes HL1 through which the optical waveguide PN1 (push-out pin) passes and the through-holes HL2 through which the optical waveguide PN2 (push-out pin) passes. Through-hole HL3 and through-hole HL4 may have the same structure as each other. Through holes HL3 and HL4 are spaces that communicate the space above upper surface SFc and the space below lower surface SFd. The light introduction path OG1 of the substrate W is disposed above the through-hole HL3 of the electrostatic chuck SC, and the light introduction path OG1 and the through-hole HL3 communicate with each other. The light introduction path OG2 of the substrate W is disposed above the through-hole HL4 of the electrostatic chuck SC, and the light introduction path OG2 and the through-hole HL4 communicate with each other.

The optical terminal TSa1 is connected to the splitter 32a of the main body 301 via an optical fiber. The optical terminal TSa1 includes a collimator lens CLc1 (2 nd collimator lens). The optical terminal TSa1 is disposed in the through hole HL3 of the electrostatic chuck SC. An optical coupling portion OC1 is disposed on the optical terminal TSa1 disposed in the through hole HL 3. The optical terminal TSa1 is detachably provided to the through-hole HL 3.

The measuring apparatus 30 causes light to enter the optical fiber FB from the collimator lens CLc1 of the optical terminal TSa1 via the optical coupling portion OC1 and the end face ES 1. More specifically, the light emitted from the light source 31a of the main body 301 reaches the collimator lens CLc1 of the optical terminal TSa1, and is emitted from the collimator lens CLc1 toward the optical coupling portion OC 1.

The backscattered light emitted from the optical fiber FB via the end face ES1 in accordance with the light incident into the optical fiber FB via the end face ES1 reaches the collimator lens CLc1 of the optical terminal TSa 1. More specifically, the backscattered light emitted from the end face ES1 reaches the collimator lens CLc1 of the optical terminal TSa1 via the optical coupling portion OC1, and reaches the beam splitter 32a from the collimator lens CLc 1.

The optical terminal TSb1 is connected to the beam splitter 32b of the main body 301 via an optical fiber. The optical terminal TSb1 includes a collimator lens CLc2 (2 nd collimator lens). The optical terminal TSb1 is disposed in the through hole HL4 of the electrostatic chuck SC. An optical coupling portion OC2 is disposed on the optical terminal TSb1 disposed in the through hole HL 4. The optical terminal TSb1 is detachably provided to the through-hole HL 4.

The measuring apparatus 30 causes light to enter the optical fiber FB from the collimator lens CLc2 of the optical terminal TSb1 via the optical coupling portion OC2 and the end face ES 2. More specifically, the light emitted from the light source 31b of the main body 301 reaches the collimator lens CLc2 of the optical terminal TSb1, and is emitted from the collimator lens CLc2 toward the optical coupling portion OC 2.

The backscattered light emitted from the optical fiber FB via the end face ES2 in accordance with the light incident into the optical fiber FB via the end face ES2 reaches the collimator lens CLc2 of the optical terminal TSb 1. More specifically, the backscattered light emitted from the end face ES2 reaches the collimator lens CLc2 of the optical terminal TSb1 via the optical coupling portion OC2, and reaches the beam splitter 32b from the collimator lens CLc 2.

Since light can be made incident on the temperature measurement sensor SE via the collimator lens CLc1 and the collimator lens CLc2, the optical system configuration is simplified, and the manufacturing is facilitated.

From the above description, various embodiments of the present disclosure have been described in the present specification within the scope of the description, and it should be understood that various modifications may be made without departing from the scope and spirit of the present disclosure. Therefore, the various embodiments disclosed in this specification are not intended to be limiting, and the true scope and spirit are indicated by the appended claims.

Description of the symbols

1-temperature measuring system, 14-1 st pattern shape, 15-2 nd pattern shape, 20-control section, 30-measuring device, 301-main body section, 31 a-light source, 31 b-light source, 32 a-beam splitter, 32 b-beam splitter, 33 a-wavelength separating section, 33 b-wavelength separating section, 34 a-light detecting section, 34 b-light detecting section, 35-signal processing section, CL 1-collimator lens, CL 2-collimator lens, CLa 1-collimator lens, CLa 2-collimator lens, CLb 1-collimator lens, CLb 2-collimator lens, CLc 1-collimator lens, CLc 2-collimator lens, CN 1-optical coupling section, CN 2-optical coupling section, EG 1-end, EG 2-end, ES 1-end, ES 2-end, FB-optical fiber, HL 1-through hole, HL 2-through hole, HL 3-through hole, HL 4-through hole, MT-temperature measuring method, OC 1-optical coupling section, OC 2-optical coupling section, OG 1-optical introduction path, OG 2-optical introduction path, OPa-optical transmission/reception section, OPb-optical transmission/reception section, PM 1-optical reflector, PM 2-optical reflector, PN 1-optical waveguide section, PN 2-optical waveguide section, SC-electrostatic chuck, SE-temperature measuring sensor, SFa-upper surface, SFb-lower surface, SFc-upper surface, SFd-lower surface, TSa-optical terminal, TSa 1-optical terminal, TSb 1-optical terminal, TSW-substrate.