Copper electrodeposition method

文档序号:108199 发布日期:2021-10-15 浏览:41次 中文

阅读说明:本技术 铜电积方法 (Copper electrodeposition method ) 是由 图姆·埃内贝勒 汉斯·格拉德 达安·霍夫曼 弗雷德里克·费尔哈格 于 2020-02-18 设计创作,主要内容包括:本发明涉及一种适合从高污染的电解液生产质量增强的阴极的铜电积方法。该方法在包括多个阳极和阴极、底部配备有气体喷射元件的电积槽中进行。它包括遍及阴极喷射气体的步骤,并且其特征在于该溶液含有大于100mg/L的砷。本发明提供了当处理高污染的电解液时,特别是当含有高浓度的砷时,对阴极质量问题的替代解决方案。(The present invention relates to a copper electrodeposition process suitable for producing quality-enhanced cathodes from highly contaminated electrolytes. The process is carried out in an electrodeposition cell comprising a plurality of anodes and cathodes, the bottom of which is equipped with gas injection elements. It comprises the step of sparging gas throughout the cathode and is characterized in that the solution contains more than 100mg/L arsenic. The present invention provides an alternative solution to the problem of cathode quality when handling highly contaminated electrolytes, particularly when containing high concentrations of arsenic.)

1. A method for the electrodeposition of copper from an acidic copper sulfate solution, wherein the method is carried out in an electrodeposition cell comprising a plurality of anodes and cathodes, equipped with gas injection elements, the method comprising the step of injecting gas throughout the cathodes, characterized in that the solution contains more than 100mg/L of arsenic.

2. The method of claim 1, wherein the solution further comprises greater than 1mg/L of Bi.

3. The method of claim 1 or 2, wherein the solution comprises up to 5g/L As and/or up to 200mg/L Bi.

4. The method of any one of claims 1 to 3, wherein the sparging gas is air.

5. The method of any one of claims 1 to 4, wherein the flow velocity of the sparging gas is at every m3Solution 0.02 standard m3H and per m3Solution 0.5 standard m3Is between/h.

6. The method of any one of claims 1 to 5, wherein the electrodeposition method is at greater than 250A/m2At a current density of (3).

7. The process according to any one of claims 1 to 6, wherein the process is a copper electrodeposition process with at most 15ppm As.

8. The process according to any one of claims 1 to 7, wherein the process is a copper electrodeposition process with at most 3ppm Bi.

9. A process for copper production, wherein an acidic copper sulphate solution is produced by dissolving one or more raw materials in an aqueous sulphuric acid solution, wherein the acidic copper sulphate solution is subsequently treated by the process according to any one of claims 1 to 8.

10. The method for copper production according to claim 9, wherein the acidic copper sulfate solution is produced by non-electrolytic dissolution.

11. The process for copper production according to claim 9 or 10, wherein the acidic copper sulfate solution is produced in a reactor separate from the electrodeposition tank.

12. Use of an electrowinning cell comprising a plurality of anodes and cathodes and equipped with gas injection elements for injecting a gas, preferably uniformly, throughout the cathode for recovering copper from an acidic copper sulphate solution further comprising 100mg/L to 5g/L arsenic.

13. The use of claim 12, wherein the solution comprises 1mg/L to 200mg/L bismuth.

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