阅读说明：本技术 一种柔性传感器及其制备方法 (Flexible sensor and preparation method thereof ) 是由 唐思琪 张青竹 张兆浩 张楠 魏千惠 张静 闫江 王文武 于 2020-05-13 设计创作，主要内容包括：本发明公开一种柔性传感器及其制备方法,涉及柔性传感器领域,以解决柔性传感器形变不够、灵敏度低和一致性低的问题。所述柔性传感器包括：柔性基底以及形成在所述柔性基底上的纳米线阵列；所述纳米线阵列为聚二甲基硅氧烷转移法转移的纳米线阵列。所述柔性传感器制备方法包括上述技术方案所提的。本发明提供的柔性传感器用于检测信号。(The invention discloses a flexible sensor and a preparation method thereof, relates to the field of flexible sensors, and aims to solve the problems of insufficient deformation, low sensitivity and low consistency of the flexible sensor. The flexible sensor includes: a flexible substrate and an array of nanowires formed on the flexible substrate; the nanowire array is a nanowire array transferred by a polydimethylsiloxane transfer method. The preparation method of the flexible sensor comprises the technical scheme. The flexible sensor provided by the invention is used for detecting signals.)

1. A flexible sensor, characterized in that the flexible sensor comprises:

a flexible substrate and an array of nanowires formed on the flexible substrate;

the nanowire array is a nanowire array transferred by a polydimethylsiloxane transfer method.

2. The flexible sensor of claim 1, further comprising: an electrode formed over a flexible substrate including the nanowire array.

3. The flexible sensor of claim 1, wherein the flexible substrate comprises: a plastic substrate and a resin adhesive layer; the resin bonding layer is formed on the plastic substrate.

4. The flexible sensor of claim 3, wherein the plastic substrate comprises:

at least one of polyethylene terephthalate, polyimide, polyurethane and polyethylene.

5. The flexible sensor of claim 3, wherein the resin bonding layer comprises:

at least one of an epoxy resin layer, a heat-conducting silica gel layer and a polyimide layer.

6. The flexible sensor of claim 3, wherein the resin bond layer has a thickness of 2mm to 5 mm.

7. A flexible sensor according to any of claims 1 to 6, wherein the nanowire array comprises: semiconductor nanowire arrays and/or graphene nanowire arrays.

8. The flexible sensor of claim 7, wherein the array of semiconductor nanowires comprises: zinc oxide nanowire arrays and/or silicon nanowire arrays.

9. A method for preparing a flexible sensor, the method comprising:

providing a first substrate comprising an array of nanowires;

and transferring the nanowire array contained in the first substrate to a second substrate by utilizing a polydimethylsiloxane transfer method, wherein the second substrate is a flexible substrate.

10. The method of manufacturing a flexible sensor according to claim 9, wherein the first substrate is:

a first substrate containing a nanowire array is prepared by a side wall transfer method.

11. The method of manufacturing a flexible sensor according to claim 9, wherein the flexible substrate comprises: a plastic substrate and a resin adhesive layer; the resin bonding layer is formed on the plastic substrate.

12. The method of claim 9, wherein transferring the nanowire array onto the flexible substrate using a polydimethylsiloxane transfer method comprises:

forming a polydimethylsiloxane cured layer on the surface of the nanowire array contained in the first substrate by adopting a polydimethylsiloxane transfer method;

transferring the nanowire array to a flexible substrate using the cured layer of polydimethylsiloxane.

13. The method of claim 12, wherein the forming a cured polydimethylsiloxane layer on the surface of the nanowire array included in the first substrate using polydimethylsiloxane comprises:

and spin-coating polydimethylsiloxane curing liquid on the surface of the nanowire array included in the first substrate, so that the nanowire array and the polydimethylsiloxane form a polydimethylsiloxane cured layer.

14. The method of manufacturing a flexible sensor according to claim 13, wherein the polydimethylsiloxane curing liquid comprises: polydimethylsiloxane and a curing agent; wherein the mass ratio of the polydimethylsiloxane to the curing agent is (8-12) to 1.

15. The method of claim 12, wherein the cured polydimethylsiloxane layer has a thickness of 3mm to 6 mm.

16. The method of claim 9, wherein before transferring the nanowire array included in the first substrate to a second substrate by using a polydimethylsiloxane transfer method, the method further comprises:

and soaking the first substrate by adopting an acid solution to obtain the nanowire array in a release state with the first substrate.

17. The method of manufacturing a flexible sensor according to claim 16, wherein the acidic solution comprises: one or more of hydrofluoric acid, phosphoric acid and hydrochloric acid.

Technical Field

The invention relates to the field of flexible sensors, in particular to a flexible sensor and a preparation method thereof.

Background

The flexible sensor has flexible and various structural forms, can be randomly arranged according to the requirements of measurement conditions, and solves the development problems of miniaturization, integration and intelligence compared with the traditional sensor. The flexible sensor can be applied to artificial intelligence wearing and medical monitoring equipment, and can continuously monitor physiological information such as human pulse, electrocardiogram, respiration and temperature, so as to adjust the motion mode of a user or guide the user to prevent and treat diseases.

In use, the flexible sensor has the following problems: the deformation is not enough, the sensitivity is low, various environmental stimuli and various mechanical parts cannot be distinguished, and the consistency is poor. The current technical solution to these problems is to select materials with good ductility, such as: graphene, carbon nanotubes, silicon nanowires, and the like. However, the effect of improving the degree of deformation, sensitivity and consistency is very limited only by applying the above materials to the flexible sensor.

Disclosure of Invention

The invention aims to provide a flexible sensor and a preparation method thereof, which are used for improving the deformability, the sensitivity and the consistency of the flexible sensor.

In a first aspect, the present invention provides a flexible sensor. The flexible sensor includes:

a flexible substrate and an array of nanowires formed on the flexible substrate;

the nanowire array is a nanowire array transferred by a polydimethylsiloxane transfer method.

Compared with the prior art, the flexible sensor provided by the invention comprises the nanowire array formed on the flexible substrate. The nanowire array comprises a plurality of nanowires which are orderly arranged, so that when the flexible sensor comprising the nanowire array is prepared or signals are collected, the collected signals have higher consistency, and the performance of the flexible sensor is improved. Moreover, the nanowire array is small in size and has a large specific surface area, so that the flexible sensor provided by the invention has high sensitivity, and the degree of influence of the nanowire array on the flexibility of the flexible substrate is low, so that the flexible sensor has high deformability, and can meet the data acquisition function of various flexible application scenes.

In addition, in the flexible sensor provided by the invention, the nanowire array is a nanowire array transferred by a polydimethylsiloxane transfer method. According to the characteristics of viscosity between polydimethylsiloxane and the nanowire array and easiness in falling off at high temperature, the nanowire array transferred on the flexible substrate can keep a better appearance, and then signals acquired by the flexible sensor through the regular nanowire array are more accurate.

In a second aspect, the present invention also provides a method for preparing a flexible sensor, the method comprising:

providing a first substrate comprising an array of nanowires;

and transferring the nanowire array contained in the first substrate to a second substrate by utilizing a polydimethylsiloxane transfer method, wherein the second substrate is a flexible substrate.

Compared with the prior art, the preparation method of the flexible sensor provided by the invention has the same beneficial effects as the flexible sensor in the technical scheme, and the details are not repeated here.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a simplified schematic diagram of a flexible sensor according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A' of FIG. 1;

FIG. 3 is a schematic structural diagram of a flexible sensor according to an embodiment of the present invention;

FIG. 4 is a schematic flow chart of a method for manufacturing a flexible sensor according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a first substrate including an array of nanowires in an embodiment of the invention;

FIG. 6 is a first state diagram illustrating a process for fabricating a first substrate comprising an array of nanowires in accordance with an embodiment of the present invention;

FIG. 7 is a second state diagram illustrating an exemplary process for fabricating a first substrate comprising nanowire arrays;

FIG. 8 is a state diagram of a process for fabricating a first substrate comprising an array of nanowires in accordance with an embodiment of the present invention;

FIG. 9 is a state diagram of a process of fabricating a first substrate comprising an array of nanowires in accordance with an embodiment of the present invention;

FIG. 10 is a state diagram of a fifth process for fabricating a first substrate comprising an array of nanowires in accordance with an embodiment of the invention;

FIG. 11 is a state diagram illustrating a sixth process for fabricating a first substrate comprising an array of nanowires in accordance with an embodiment of the present invention;

FIG. 12 is a state diagram of a seventh process for fabricating a first substrate comprising an array of nanowires in accordance with an embodiment of the invention;

FIG. 13 is a schematic view of a process for transferring a nanowire array by PDMS transfer according to an embodiment of the present invention;

FIG. 14 is a state diagram of a process of spin-coating a PDMS curing fluid on a nanowire array of a first substrate using a spin coater in an embodiment of the present invention;

fig. 15 is a state diagram of a process of forming a cured polydimethylsiloxane layer on the nanowire array of the first substrate in an embodiment of the present invention;

FIG. 16 is a state diagram illustrating the process of detaching the nanowire array by removing the PDMS curing layer from the surface of the first substrate in an embodiment of the present invention;

FIG. 17 is a state diagram illustrating a process of transferring nanowires from a cured polydimethylsiloxane layer to a flexible substrate according to an embodiment of the invention;

FIG. 18 is a schematic structural diagram of a flexible substrate covered with a cured polydimethylsiloxane layer with nanowire arrays according to an embodiment of the present invention;

FIG. 19 is a diagram illustrating a process of releasing the cured polydimethylsiloxane layer from the flexible substrate according to an embodiment of the present invention;

FIG. 20 is an electron microscope image of a topography of a first substrate including a hydrofluoric acid dip with bonded nanowire arrays in accordance with an embodiment of the present invention.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The flexible sensor has good flexibility and ductility, is various in structural form, can be randomly arranged according to the requirements of measuring conditions, can be used for accurately and quickly measuring special environments and special signals very conveniently, and can be suitable for the fields of artificial intelligence wearing, medical monitoring equipment, intelligent robots and 3D printers. In the related technology, the flexible sensor has insufficient deformation degree, is difficult to distinguish various environmental stimuli, and has poor consistency of collected signals. It is understood that the various environmental stimuli may be lateral strain, shear, torsion, vibration, pressure, temperature, humidity, and the like.

In view of the above problems, embodiments of the present invention provide a flexible sensor. Fig. 1 illustrates a simplified structural schematic diagram of a flexible sensor 1 provided by an embodiment of the present invention. As shown in fig. 1, a flexible sensor 1 according to an embodiment of the present invention includes: a flexible substrate 11 and a nanowire array 12.

As shown in fig. 1, the nanowire array 12 is on a flexible substrate 11. The nanowire array 12 is a nanowire array 12 transferred onto the flexible substrate 11 by a polydimethylsiloxane transfer method.