阅读说明：本技术 双均温板式散热模组 (Double-temperature-equalizing plate type heat dissipation module ) 是由 林俊宏 于 2019-03-18 设计创作，主要内容包括：本发明公开一种双均温板式散热模组,此双均温板式散热模组包括下均温板、上均温板、热管及多个散热鳍片,下均温板内部具有第一容腔；上均温板配置在下均温板的上方,上均温板内部具有第二容腔；热管固接在下均温板与上均温板之间,热管内部具有第三容腔,第一容腔、第二容腔与第三容腔相互连通；多个散热鳍片直立并列排布在下均温板与上均温板之间,每一散热鳍片的底端连接于下均温板及顶端连接于上均温板。借此,以提升双均温板式散热模组的导热效能及散热效率。(The invention discloses a double-temperature-equalizing-plate type heat dissipation module which comprises a lower temperature equalizing plate, an upper temperature equalizing plate, a heat pipe and a plurality of heat dissipation fins, wherein a first accommodating cavity is formed in the lower temperature equalizing plate; the upper temperature-uniforming plate is arranged above the lower temperature-uniforming plate, and a second containing cavity is formed in the upper temperature-uniforming plate; the heat pipe is fixedly connected between the lower temperature-uniforming plate and the upper temperature-uniforming plate, a third containing cavity is formed in the heat pipe, and the first containing cavity, the second containing cavity and the third containing cavity are communicated with each other; the plurality of radiating fins are vertically arranged between the lower temperature-uniforming plate and the upper temperature-uniforming plate in parallel, and the bottom end of each radiating fin is connected to the lower temperature-uniforming plate and the top end of each radiating fin is connected to the upper temperature-uniforming plate. Therefore, the heat conduction efficiency and the heat dissipation efficiency of the double-temperature-equalizing-plate type heat dissipation module are improved.)

1. The utility model provides a two temperature plate formula heat dissipation module for a heating element, its characterized in that, this two temperature plate formula heat dissipation module includes:

the lower temperature-uniforming plate is internally provided with a first containing cavity, and the heating element is thermally attached to the lower temperature-uniforming plate;

the upper temperature-uniforming plate is arranged above the lower temperature-uniforming plate, and a second containing cavity is formed in the upper temperature-uniforming plate;

the heat pipe is fixedly connected between the lower temperature-uniforming plate and the upper temperature-uniforming plate, a third cavity is formed in the heat pipe, and the first cavity, the second cavity and the third cavity are communicated with each other; and

a plurality of heat dissipation fins vertically arranged between the lower temperature-uniforming plate and the upper temperature-uniforming plate in parallel, wherein the bottom end of each heat dissipation fin is connected to the lower temperature-uniforming plate and the top end is connected to the upper temperature-uniforming plate.

2. The dual uniform temperature plate heat dissipation module of claim 1, wherein a plurality of the plurality of fins are connected to the heat pipe.

3. The dual temperature plate heat dissipation module as recited in claim 1, wherein the lower temperature plate has a first side and a second side opposite to each other, the lower temperature plate further has a middle section located between the first side and the second side, the number of the heat pipes is one, and the heat pipes are disposed in the middle section.

4. The dual temperature plate heat dissipation module as recited in claim 1, wherein the lower temperature plate has a first side and a second side opposite to each other, the lower temperature plate further has a middle section located between the first side and the second side, the number of the heat pipes is plural, and the plural heat pipes are arranged in the middle section at equal intervals.

5. The dual uniform temperature plate heat dissipation module of claim 1, further comprising a capillary structure and a working fluid, wherein the capillary structure covers inner walls of the first cavity, the second cavity and the third cavity, and the working fluid is contained in the first cavity, the second cavity and the third cavity.

6. The dual thermal plate module of claim 5, wherein the wick structure is a combination of one or more of a groove, a grid, a fiber, a sintered powder, and a corrugated sheet.

7. The module of claim 1, wherein the heat pipe is disposed opposite to the heat generating component.

Technical Field

The present invention relates to a heat dissipation module with a temperature equalization plate, and more particularly to a dual temperature equalization plate heat dissipation module.

Background

As the operation speed of electronic devices is increasing, the generated Heat is also increasing, and in order to effectively solve the problem of high Heat generation, Heat pipes (Heat pipes) and vapor chambers (vapor chambers) with good Heat conduction characteristics are applied to form Heat sinks, thereby improving the Heat dissipation efficiency.

However, most existing heat sinks employ heat pipes or condensation ends of temperature-equalizing plates to thermally attach heat dissipation fins, but the heat dissipation fins are conducted only by using pressure difference caused by temperature change of the environment, so that the heat conduction efficiency of the heat dissipation fins is greatly limited, heat is easily accumulated at the condensation ends of the heat pipes or the temperature-equalizing plates, and finally the condensation effect fails, thereby resulting in poor heat dissipation efficiency.

Disclosure of Invention

The invention provides a double-temperature-equalizing-plate type heat dissipation module, which aims to improve the heat conduction efficiency and the heat dissipation efficiency of the double-temperature-equalizing-plate type heat dissipation module by fixedly connecting a heat pipe and a heat dissipation fin between a lower temperature equalizing plate and an upper temperature equalizing plate.

To achieve the above object, the present invention provides a dual temperature equalization plate type heat dissipation module, comprising: the lower temperature-uniforming plate is internally provided with a first containing cavity; the upper temperature-uniforming plate is arranged above the lower temperature-uniforming plate, and a second containing cavity is formed in the upper temperature-uniforming plate; the heat pipe is fixedly connected between the lower temperature-uniforming plate and the upper temperature-uniforming plate, a third cavity is formed in the heat pipe, and the first cavity, the second cavity and the third cavity are communicated with each other; and a plurality of heat dissipation fins which are vertically arranged between the lower temperature-uniforming plate and the upper temperature-uniforming plate in parallel, wherein the bottom end of each heat dissipation fin is connected with the lower temperature-uniforming plate, and the top end of each heat dissipation fin is connected with the upper temperature-uniforming plate.

Optionally, a plurality of the plurality of heat dissipation fins are connected to the heat pipe.

Optionally, the lower vapor chamber has a first side and a second side opposite to each other, the lower vapor chamber further has a middle section located between the first side and the second side, the number of the heat pipes is one, and the heat pipes are disposed in the middle section.

Optionally, the lower vapor chamber has a first side and a second side opposite to each other, the lower vapor chamber further has a middle section located between the first side and the second side, the number of the heat pipes is plural, and the plural heat pipes are arranged in the middle section at equal intervals.

Optionally, the liquid crystal display device further includes a capillary structure and a working fluid, the capillary structure is covered on inner wall surfaces of the first cavity, the second cavity and the third cavity, and the working fluid is contained in the first cavity, the second cavity and the third cavity.

Optionally, the capillary structure is one or a combination of a groove shape, a grid shape, a fiber shape, a sintered powder body and a wavy sheet.

Optionally, the position of the heat pipe is opposite to the position of the heating element.

Based on the above, the heat pipe and the heat dissipation fins are fixedly connected between the lower temperature equalizing plate and the upper temperature equalizing plate, so that the heat absorbed by the lower temperature equalizing plate can be conducted through the heat dissipation fins by the pressure difference caused by the temperature change of the environment, and the heat pipe and the upper temperature equalizing plate can also conduct heat quickly through the convection of the working fluid vapor back to the liquid, so that the heat of the lower temperature equalizing plate can be dissipated to the upper temperature equalizing plate and the external environment quickly, and the double temperature equalizing plate type heat dissipation module has excellent heat conduction efficiency and heat dissipation efficiency.

Drawings

Fig. 1 is a schematic perspective view of a dual uniform temperature plate type heat dissipation module according to the present invention.

Fig. 2 is a schematic cross-sectional view of a dual uniform temperature plate heat dissipation module according to the present invention.

Fig. 3 is another schematic cross-sectional view of the dual uniform temperature plate heat dissipation module of the present invention.

Fig. 4 is another schematic cross-sectional view of the dual uniform temperature plate heat dissipation module of the present invention.

Fig. 5 is a schematic cross-sectional view illustrating another embodiment of a dual uniform temperature plate heat dissipation module according to the present invention.

Fig. 6 is a schematic cross-sectional view illustrating a dual uniform temperature plate heat dissipation module according to another embodiment of the invention.

Fig. 7 is a schematic cross-sectional view illustrating a dual uniform temperature plate heat dissipation module according to another embodiment of the present invention.

In the figure:

10 … double temperature equalization plate type heat radiation module; 1, temperature-uniforming plate under 1 …; 11 … first volume; 12 … a first side edge; 13 … second side edge; 14 … middle section; 2 … temperature equalizing plate; 21 … second cavity; 3 … heat pipe; 31 … third volume; 4 … heat sink fins;

5 … capillary structure; 100 … heating element.

Detailed Description

The detailed description and technical contents of the present invention will be described below with reference to the accompanying drawings, however, the contents shown in the drawings are only for illustrative purposes and are not intended to limit the present invention.

Referring to fig. 1 to 4, the present invention provides a dual temperature-uniforming plate type heat dissipation module for a heat generating element 100, wherein the dual temperature-uniforming plate type heat dissipation module 10 mainly includes a lower temperature-uniforming plate 1, an upper temperature-uniforming plate 2, a heat pipe 3 and a plurality of heat dissipation fins 4.

The lower temperature-uniforming plate 1 is internally provided with a first containing cavity 11, the upper temperature-uniforming plate 2 is arranged above the lower temperature-uniforming plate 1, the upper temperature-uniforming plate 2 is internally provided with a second containing cavity 21, and the heating element 100 is thermally attached to the lower temperature-uniforming plate 1.

The heat pipe 3 is fixedly connected between the lower temperature-uniforming plate 1 and the upper temperature-uniforming plate 2, the position of the heat pipe 3 is opposite to the position of the heating element 100 (as shown in fig. 4), a third accommodating cavity 31 is formed inside the heat pipe 3, and the first accommodating cavity 11, the second accommodating cavity 21 and the third accommodating cavity 31 are communicated with each other. The shape of the heat pipe 3 is a vertical strip, but not limited thereto.

A plurality of heat dissipation fins 4 are vertically arranged between the lower temperature-uniforming plate 1 and the upper temperature-uniforming plate 2 in parallel, the bottom end of each heat dissipation fin 4 is connected to the lower temperature-uniforming plate 1, the top end of each heat dissipation fin 4 is connected to the upper temperature-uniforming plate 2, and a plurality of the heat dissipation fins 4 are connected to the heat pipe 3. In this embodiment, each heat dissipation fin 4 is connected to the lower temperature uniforming plate 1, the upper temperature uniforming plate 2 and the heat pipe 3 in an integrated manner, but not limited thereto, each heat dissipation fin 4 may also be connected to the lower temperature uniforming plate 1, the upper temperature uniforming plate 2 and the heat pipe 3 in an inserting manner or an adhering manner.

As described in detail below, the lower vapor chamber 1 has a first side 12 and a second side 13 opposite to each other, the lower vapor chamber 1 further has a middle section 14 located between the first side 12 and the second side 13, the number of the heat pipes 3 is one, and the heat pipes 3 are disposed in the middle section 14.

The dual temperature equalization plate type heat dissipation module 10 further includes a capillary structure 5 and a working fluid, the capillary structure 5 is covered on the inner wall surfaces of the first cavity 11, the second cavity 21 and the third cavity 31, and the working fluid is contained in the first cavity 11, the second cavity 21 and the third cavity 31. Wherein, the capillary structure 5 is one or a combination of a plurality of groove-shaped, grid-shaped, fiber-shaped, sintered powder and wavy thin plates.

In the using state of the dual uniform temperature plate type heat dissipation module 10, the heat pipe 3 and the heat dissipation fins 4 are fixedly connected between the lower uniform temperature plate 1 and the upper uniform temperature plate 2, so that the heat absorbed by the lower uniform temperature plate 1 can be rapidly conducted through the convection of the working fluid vapor returning to the liquid in addition to the heat conduction of the heat dissipation fins 4 through the pressure difference caused by the change of the ambient temperature, and the heat of the lower uniform temperature plate 1 can be rapidly dissipated to the upper uniform temperature plate 2 and the external environment, so that the dual uniform temperature plate type heat dissipation module 10 has excellent heat conduction efficiency and heat dissipation efficiency.

In addition, the capillary structure 5 is covered on the inner wall surfaces of the first accommodating cavity 11, the second accommodating cavity 21 and the third accommodating cavity 31, so that the working fluid absorbs heat from the lower temperature-uniforming plate 1 and is vaporized, and then is condensed and liquefied from the heat pipe 3 to the upper temperature-uniforming plate 2, so that the double temperature-uniforming plate type heat dissipation module 10 has the characteristic of rapid temperature equalization.

Furthermore, the position of the heat pipe 3 is opposite to the position of the heat generating element 100 (as shown in fig. 4), so as to accelerate the heat transfer of the heat generating element 100 to the heat pipe 3.

Referring to fig. 5, another embodiment of a dual uniform temperature plate type heat dissipation module 10 of the present invention is shown, the embodiment of fig. 5 is substantially the same as the embodiment of fig. 1 to 4, but the embodiment of fig. 5 is different from the embodiment of fig. 1 to 4 in that the shape of the heat pipe 3 is different, the shape of the heat pipe 3 is a horizontal strip shape, but not limited thereto, and the shape of the heat pipe 3 of the present invention may be any geometric shape.

Referring to fig. 6, in another embodiment of the dual uniform temperature plate type heat dissipation module 10 of the present invention, the embodiment of fig. 6 is substantially the same as the embodiment of fig. 1 to 4, but the embodiment of fig. 6 is different from the embodiment of fig. 1 to 4 in that the number of the heat pipes 3 is multiple, the multiple heat pipes 3 are arranged in the middle section 14 in an equidistant manner, and increasing the number of the heat pipes 3 can more quickly dissipate the heat of the lower uniform temperature plate 1, so as to enhance the heat dissipation efficiency of the dual uniform temperature plate type heat dissipation module 10.

Referring to fig. 7, a further embodiment of a dual uniform temperature plate heat dissipation module 10 of the present invention is shown, the embodiment of fig. 7 is substantially the same as the embodiment of fig. 1 to 4, but the embodiment of fig. 7 is different from the embodiment of fig. 1 to 4 in that each heat dissipation fin 4 is connected to the lower uniform temperature plate 1, the upper uniform temperature plate 2 and the heat pipe 3 in an inserting manner, but not limited thereto, each heat dissipation fin 4 may also be connected to the lower uniform temperature plate 1, the upper uniform temperature plate 2 and the heat pipe 3 in an integrally formed or bonded manner.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.