Fused deposition 3D printer leveling device and leveling method thereof

文档序号:1106487 发布日期:2020-09-29 浏览:6次 中文

阅读说明:本技术 一种熔融沉积3d打印机调平装置及其调平方法 (Fused deposition 3D printer leveling device and leveling method thereof ) 是由 韩加军 章赣阳 于 2019-03-22 设计创作,主要内容包括:一种熔融沉积3D打印机调平装置及其调平方法,该调平装置包括底座、多个单元平台、测距传感器、处理器、升降调整机构,在底座上设有多个单元平台,每个单元平台通过升降调整机构安装固定在底座上,在单元平台的边缘设有活动拼接结构,相邻的单元平台通过活动拼接结构扣合;而在单元平台上方设有可移动的测距传感器,该测距传感器与处理器的信号输入端信号连接,而该处理器的输出端控制升降调整机构。本发明的调平装置将一个大尺寸的平台拆分为多个精度可靠的小尺寸的单元平台,并且对每个单元平台进行三点测距,根据测距结果,采用升降调整机构调整拼接后的单元平台的水平度,直到全部单元平台高度得到调整,则构成了一个整体调平的打印平台。(A fused deposition 3D printer leveling device and a leveling method thereof are provided, the leveling device comprises a base, a plurality of unit platforms, a distance measuring sensor, a processor and a lifting adjusting mechanism, wherein the base is provided with the plurality of unit platforms, each unit platform is fixedly arranged on the base through the lifting adjusting mechanism, the edge of each unit platform is provided with a movable splicing structure, and adjacent unit platforms are buckled through the movable splicing structures; and a movable distance measuring sensor is arranged above the unit platform, the distance measuring sensor is in signal connection with the signal input end of the processor, and the output end of the processor controls the lifting adjusting mechanism. According to the leveling device, a large-size platform is split into a plurality of small-size unit platforms with reliable precision, three-point distance measurement is carried out on each unit platform, the levelness of the spliced unit platforms is adjusted by adopting a lifting adjusting mechanism according to the distance measurement result until the heights of all the unit platforms are adjusted, and then the printing platform with integral leveling is formed.)

1. A fused deposition 3D printer leveling device is characterized by comprising a base, a plurality of unit platforms, a distance measuring sensor, a processor and a lifting adjusting mechanism, wherein the base is provided with the unit platforms, each unit platform is fixedly arranged on the base through the lifting adjusting mechanism, the edges of the unit platforms are provided with movable splicing structures, and adjacent unit platforms are buckled through the movable splicing structures; and a movable distance measuring sensor is arranged above the unit platform, the distance measuring sensor is in signal connection with the signal input end of the processor, and the output end of the processor controls the lifting adjusting mechanism.

2. The leveling device of a large-size fused deposition 3D printer according to claim 1, wherein at least three lifting adjusting mechanisms are arranged below the unit platform, and the three lifting adjusting mechanisms are not in the same straight line.

3. The leveling device of the large-size fused deposition 3D printer as claimed in claim 2, wherein the three lifting adjustment mechanisms are located at the three vertices of any one equilateral triangle in the unit plane.

4. The leveling device of the large-size fused deposition 3D printer according to claim 3, wherein the lifting adjusting mechanism is a motor lifting mechanism, the lifting adjusting mechanism comprises a threaded shaft motor and a spring, the threaded shaft motor is driven by the processor, a threaded shaft of the threaded shaft motor is connected to a position below the unit plane, and the spring is sleeved on the threaded shaft and clamped between the unit plane and the motor.

5. The leveling device of the large-size fused deposition 3D printer according to claim 3, wherein the lifting adjusting mechanism is a hydraulic lifting mechanism, a hydraulic rod of the hydraulic lifting mechanism is connected below the plane of the unit, and the hydraulic lifting mechanism is driven by the processor.

6. The leveling device of a large-size fused deposition 3D printer according to claim 1, wherein the movable splicing structure is a concave-convex slot splicing structure, and the concave-convex splicing head is in a circular arc shape, a T shape or a trapezoid shape.

7. A leveling method of a leveling device of a fused deposition 3D printer is characterized by comprising the following steps: splicing a plurality of unit platforms into a large printing platform through a movable splicing structure, and erecting the large printing platform on a base; moving a distance measuring sensor above the unit platform to be right above the lifting adjusting mechanism, measuring the distance and comparing the distance with a preset distance in the processor, and driving the lifting adjusting mechanism to adjust until the two values are consistent when the actual distance is not consistent with the preset distance; the distance measuring sensor moves to the next lifting adjusting mechanism to carry out the distance measuring and adjusting.

8. The leveling method of the leveling device of the fused deposition 3D printer is characterized in that the lifting adjusting mechanism is used for three-point positioning, and distance measurement and height adjustment of a unit platform are sequentially carried out through three points.

9. A leveling method of a leveling device of a fused deposition 3D printer is characterized in that after three points of the same unit platform are subjected to ranging and adjusting, the three points are retested once again.

[ technical field ] A method for producing a semiconductor device

The invention relates to a 3D printing technology with a large size, in particular to a 3D printer horizontal adjusting device adopting a fused deposition mode.

[ background of the invention ]

The 3D printing technique, which may also be referred to as additive manufacturing, implements printing of three-dimensional models through an automated, numerically controlled, layer-by-layer material accumulation process. Compared with the traditional processing technology, the 3D printing technology does not need to manufacture a die additionally, and a finished product is directly processed. The complexity of manufacturing parts by the traditional processing technology is broken through, and the positive correlation between the manufacturing cost and the complexity of the parts is decoupled, namely the manufacturing cost cannot greatly rise along with the increase of the complexity of the parts. Therefore, the 3D printing technology can reduce the research and development cost of enterprises, shorten the research and development period and shorten the product updating period.

In addition, 3D printing technology promotes a new era facing functional design and meets the increasing demand for personalization. In the future, 3D printing technology will become an important tool for the third industrial revolution, and will also help enterprises to improve product competitiveness.

At present, the 3D printing technology can be divided into according to the forming principle: fused deposition, ink-jet bonding, selective laser sintering, selective laser melting, and the like. The ink-jet bonding technique is to bond the powder particles together by spraying a bonding agent; its advantages are high shaping speed, low adhesion and low mechanical performance of parts. The selective laser sintering and selective laser melting equipment can mold materials such as plastic, precoated sand, metal and the like, has high mechanical properties, and the performance of a metal piece after heat treatment is equivalent to that of a forged piece, but the two technologies need to be provided with expensive lasers, and the price of powder materials is many times higher than that of traditional materials, so that the application cost of the technology is high.

The fused deposition technology melts the wire rod through heating, the spray head moves on the printing platform according to the generated code, the melted material is coated on the printing platform according to a preset mode, a two-dimensional section is formed after cooling, then the printing platform descends for a certain layer thickness, the spray head forms a second layer section on the basis of the first layer, and the steps are repeated until the whole three-dimensional model is formed. The fused deposition technology is suitable for common engineering plastics such as PLA, ABS, HIPS, PC and the like, flexible, conductive and carbon fiber reinforced composite wires and the like. Due to the adoption of the heating and melting mode, the equipment has low price and is widely applied to the industries of teaching, toys, household appliances, automobiles and war industry.

However, the existing fused deposition 3D printer has the problem that the leveling of a large-size printing platform is difficult when a large-size part is molded, and for the printing platform with the size of 500mm x 500mm, the whole platform surface is difficult to keep on the same horizontal plane. At present, a manual leveling mode is still adopted in the industry, time and trouble are wasted, leveling precision is limited, and the condition that the distance between a printing spray head and the whole printing platform is kept within a higher consistency range cannot be guaranteed. Therefore, the distance between the printing spray head and certain printing layers or between the bottom layer and the printing platform is too large, and the bonding force after printing is insufficient.

As is known, the material generates stress during the solidification process, and particularly, large stress is inevitably generated during the forming process of large-size parts, so that the part with insufficient adhesion between the model and the printing platform or the printing layer can be separated, the whole printing process fails, the material and energy are wasted, a large amount of precious time is consumed, and the whole production cost is increased.

[ summary of the invention ]

The invention provides a device for leveling a large-size printing platform, aiming at the problems, and the device has a simple structure, can ensure the flatness of the whole printing platform and ensure the smooth completion of the printing process.

The invention relates to a leveling device of a large-size fused deposition 3D printer, which comprises a base, a plurality of unit platforms, a distance measuring sensor, a processor and a lifting adjusting mechanism, wherein the base is provided with the plurality of unit platforms, each unit platform is fixedly arranged on the base through the lifting adjusting mechanism, the edge of each unit platform is provided with a movable splicing structure, and the adjacent unit platforms are buckled through the movable splicing structures; a movable distance measuring sensor is arranged above the unit platform, the distance measuring sensor is in signal connection with a signal input end of the processor, and an output end of the processor controls the lifting adjusting mechanism;

at least three lifting adjusting mechanisms are arranged below the unit platform, and the three lifting adjusting mechanisms are not positioned on the same straight line.

The three lifting adjusting mechanisms are positioned at the three vertexes of any one equilateral triangle in the unit plane.

The lifting adjusting mechanism is a motor lifting mechanism, the motor lifting mechanism comprises a threaded shaft motor and a spring, the threaded shaft motor is driven by the processor, a threaded shaft of the threaded shaft motor is connected to the lower portion of the unit plane, and the spring is sleeved on the threaded shaft and clamped between the unit plane and the motor.

The lift adjustment mechanism is a hydraulic lift mechanism having a hydraulic rod connected below the level of the cell, the hydraulic lift mechanism being driven by the processor.

The movable splicing structure is a concave-convex slot splicing structure, and the concave-convex splicing head is arc-shaped, T-shaped or trapezoidal.

A leveling method of a leveling device of a fused deposition 3D printer is characterized by comprising the following steps: splicing a plurality of unit platforms into a large printing platform through a movable splicing structure, and erecting the large printing platform on a base; moving a distance measuring sensor above the unit platform to be right above the lifting adjusting mechanism, measuring the distance and comparing the distance with a preset distance in the processor, and driving the lifting adjusting mechanism to adjust until the two values are consistent when the actual distance is not consistent with the preset distance; the distance measuring sensor moves to the next lifting adjusting mechanism to carry out the distance measuring and adjusting.

The leveling method of the leveling device of the large-size fused deposition 3D printer is characterized in that the lifting adjusting mechanism is used for three-point positioning, and distance measurement and height adjustment of the unit platform are sequentially carried out through three points.

And when the distance measurement and the adjustment of the three points of the same unit platform are completed, the measurement is repeated once again.

The leveling device of the invention splits a large-size platform into a plurality of small-size unit platforms with reliable precision, all the unit platforms are spliced and locked with other unit platforms around through the movable splicing structure, three-point distance measurement is carried out on each unit platform, the levelness of the unit platform is adjusted by adopting the lifting adjusting mechanism according to the distance measurement, and after all the unit platforms are leveled, an integrally leveled printing platform is formed.

[ description of the drawings ]

FIG. 1 is a schematic diagram of the structure of the leveling device of the 3D printer of the present invention;

FIG. 2 is a leveling mode of the leveling device of the 3D printer according to the present invention;

FIG. 3 is a circular arc shaped splicing structure of the leveling device of the 3D printer of the present invention;

FIG. 4 is a trapezoidal shaped mosaic configuration of the leveling device of the 3D printer of the present invention;

fig. 5 is a T-shaped splicing structure of the leveling device of the 3D printer of the present invention.

Wherein: 10. a base; 20. a unit platform; 30. a ranging sensor; 40. a lifting adjusting mechanism; 41. a motor lifting adjusting mechanism; 411. a motor; 412. a spring; 50. a movable splicing structure;

[ detailed description ] embodiments

The leveling device of the large-size fused deposition 3D printer according to the invention will be described in detail with reference to the accompanying drawings and examples.

Referring to fig. 1, a leveling device of a large-sized fused deposition 3D printer according to the present invention is shown, the leveling device includes a base 10, a plurality of unit platforms 20, a distance measuring sensor 30, a processor (not shown), and a lifting adjusting mechanism 40, wherein the base 10 is provided with the plurality of unit platforms 20, each unit platform 20 is fixed on the base 10 by the lifting adjusting mechanism 40, the edge of each unit platform 20 is provided with a movable splicing structure 50, and adjacent unit platforms 20 are fastened by the movable splicing structure 50; and a movable distance measuring sensor 30 is provided above the unit platform, the distance measuring sensor 30 is in signal connection with a signal input end of a processor, and an output end of the processor controls a lifting adjusting mechanism 40. Each unit platform is a unit structure which is small in size and can ensure strict flatness. The horizontal flatness is adjusted by taking the plurality of unit platforms as basic units, and the unit platforms are spliced into a large-size integral printing platform, so that the large-size platform with high flatness is obtained.

After each unit platform 20 is fixed on the base 10, all unit platforms 20 are spliced together by the movable splicing mechanism 50, but the unit platforms 20 can rotate relative to each other, so that all unit platforms 20 can be leveled. Leveling of the unit platform 20 is accomplished by the ranging sensor 30 and the elevation adjustment mechanism 40. In a specific implementation, at least three lifting adjusting mechanisms 40 may be disposed below the unit platform 20, and the three lifting adjusting mechanisms 40 are not in the same straight line. Based on the principle that three points that are not on the same line define a plane, if the three points are adjusted to be on the same horizontal plane, it represents that the unit platform 20 is leveled.

Further, if it is stated that three elevation adjusting mechanisms 40 are provided below the unit platform 20 in this embodiment, the three elevation adjusting mechanisms 40 are located at the three vertices of any one of the equilateral triangles in the unit plane. The equilateral triangles are internally tangent with the unit platform as much as possible, so that the leveling of three points of the equilateral triangles can be ensured to the maximum extent, and the unit platform 20 can be accurately leveled.

The lifting adjusting mechanism mainly functions in adjusting the unit platform at a preset position. The height of each preset position is determined through the matching of the distance measuring sensor, and the lifting adjusting mechanism carries out lifting movement according to the processing structure of the processor.

The lift adjustment mechanism 40 can be a variety of mechanisms with stepless lift adjustment movement, one of which is a motor lift mechanism 41 that includes a threaded shaft motor 411 and a spring 412, the threaded shaft motor 411 being driven by the processor, the threaded shaft of the motor being connected below the plane of the unit, and the spring being sleeved on the threaded shaft and captured between the plane of the unit and the motor.

Another way is a hydraulic lift mechanism with a hydraulic ram connected below the level of the cell, the hydraulic lift mechanism being driven by the processor.

As shown in fig. 3-5, the movable splicing structure 50 is a concave-convex slot splicing structure, and the concave-convex splicing head is arc-shaped, T-shaped or trapezoidal. The movable splicing structure is mainly used for realizing self-locking between the unit platforms, enhancing the connecting force between the unit platforms and preventing relative sliding or dislocation between small-size printing platforms.

The leveling process of the leveling device is as follows:

firstly, after splicing a small-size printing platform into a large printing platform, the distance measuring sensor 30 moves to the position right above the lifting adjusting mechanism 40 according to a set program to measure that the distance between the distance measuring sensor 30 and the unit platform 20 is d1, then measured data is fed back to the processor, the processor stores a preset distance d, and after the processor receives the actual distance measuring d1, the ratio is carried out, and the sizes of d1 and d are compared. If d1 > d indicates that the actual spacing is larger, the height needs to be reduced.

When d1 is greater than d, the processor controls the corresponding lift adjustment mechanism 40 to descend to a height, and the lift adjustment mechanism can drive the unit platform to descend, so that d1 approaches d.

After the leveling of the point is completed, the distance measuring sensor 30 continues to move to another preset point, the distance measuring sensor 30 measures the distance again, the lifting adjusting mechanism 40 adjusts the distance until the distances between the points corresponding to all the lifting adjusting mechanisms of the unit platform and the distance measuring sensor 30 are adjusted to the preset value D, the leveled unit platform can be retested again, the phenomenon that the overall flatness is affected due to the adjustment of other positioning points is avoided, the unit platform is leveled after the retesting is completed, the steps are repeated, the leveling of all the unit platforms is completed, the whole large-size platform is leveled, and the large-size fused deposition 3D printing platform with high flatness can be obtained.

The method has the advantages that the unit platforms with high leveling precision are spliced one by one and then leveled, so that the large-size fused deposition 3D printing platform capable of ensuring the leveling is formed, the success rate of printing is improved, and time and resources are saved.

Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

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