阅读说明：本技术 一种基于环氧树脂的线型聚合物及其制备方法和制备热熔胶的方法 (Linear polymer based on epoxy resin, preparation method thereof and method for preparing hot melt adhesive ) 是由 代本祝 周庆伟 王俊 谢尚啸 金怀东 于 2020-07-09 设计创作，主要内容包括：本发明公开了一种基于环氧树脂的线型聚合物及其制备方法和制备热熔胶的方法,分子式为：<Image he="140" wi="700" file="DDA0002576989440000011.GIF" imgContent="drawing" imgFormat="GIF" orientation="portrait" inline="no"></Image>在本发明中,主要为线型的环氧树脂,线型环氧树脂的分子链呈线型,分子结构的规整性较好,从而使得其较为容易结晶,十分适用与热熔胶中使用。在制备过程中,主要采用含含两个环氧基的化合物和含两个酰胺基的化合物的化合物进行反应,其中环氧基开环,酰胺基脱氢,开环的环氧基与脱氢的酰胺基进行聚合,形成了线型的环氧树脂。并且通过本发明制备的线型环氧树脂其线型结构单一,可以采用低分子量环氧树脂作为原料,工艺简单,没有小分子副产物,无废物排放。(The invention discloses a linear polymer based on epoxy resin, a preparation method thereof and a method for preparing hot melt adhesive, wherein the molecular formula is as follows: in the invention, the linear epoxy resin is mainly used, the molecular chain of the linear epoxy resin is linear, and the regularity of the molecular structure is better, so that the linear epoxy resin is easy to crystallize and is very suitable for being used in hot melt adhesive. In the preparation process, the compound mainly contains two epoxy groupsThe compound and a compound containing two amide groups are reacted, wherein the epoxy group is opened in a ring, the amide groups are dehydrogenated, and the opened epoxy group and the dehydrogenated amide group are polymerized to form the linear epoxy resin. The linear epoxy resin prepared by the method has a single linear structure, can adopt low-molecular-weight epoxy resin as a raw material, and has the advantages of simple process, no micromolecular by-product and no waste discharge.)

1. A linear epoxy-based polymer characterized by:

the molecular formula is:

2. a linear epoxy resin-based polymer according to claim 1, characterized in that:

by

Compound containing two amide groups

And

compounds containing two epoxy groupsAnd (3) reacting.

3. The method for preparing a linear epoxy resin-based polymer according to claim 1, wherein:

will be provided with

Compound containing two amide groups

And

compounds containing two epoxy groups

By reaction in a melting process

Linear epoxy resin

4. The method for preparing a linear epoxy resin-based polymer according to claim 3, wherein: the molar ratio of the compound containing two acylamino groups to the compound containing two epoxy groups is 0.8-1.2: 1.

5. The method for preparing a linear epoxy resin-based polymer according to claim 4, wherein: the compound containing two amide groups is at least one of adipamide, sebacamide and heptane diamide.

6. The method for preparing a linear epoxy resin-based polymer according to claim 5, wherein: the compound containing two epoxy groups is at least one of 1, 2, 7, 8-diepoxyoctane, diglycidyl ether and bisphenol A epoxy resin.

7. The process for preparing hot melt adhesives according to the polymers of claims 1 to 6, characterized in that:

the raw materials comprise the following mole portions:

compounds containing two amide groups: 0.8 to 1.2 portions of

A compound containing two epoxy groups: 1 part of

End-capping agent: 0.01-0.05 part;

the method comprises the following steps: weighing raw materials according to the conversion of molar parts;

step two: fully mixing a compound containing two epoxy groups and a compound containing two amide groups;

step three: heating to a molten state, and reacting for 1-7 hours in a heat preservation manner;

step four: adding a blocking agent, and continuously reacting for 0.5-1 hour to obtain the hot melt adhesive.

8. The method for preparing the hot melt adhesive according to claim 7, wherein the method comprises the following steps:

the end capping agent is monofunctional epoxy resin or a monoamide compound or a mono-secondary amino compound.

9. The method for preparing the hot melt adhesive according to claim 8, wherein the method comprises the following steps:

the end-capping agent is a secondary amine compound or a compound containing a single epoxy group or a compound containing a single amide group.

10. The method for preparing the hot melt adhesive according to claim 9, wherein: the end capping agent is at least one of dimethylamine, propylene oxide, 1, 2-epoxy heptane, butyramide, valeramide, ethanolamine and piperazine.

Technical Field

The invention relates to a high polymer in the field, in particular to a linear polymer based on epoxy resin, a preparation method thereof and a method for preparing hot melt adhesive.

Background

The epoxy resin has excellent performance, but the traditional epoxy resin has low molecular weight and cannot meet the use requirement without curing. Therefore, the thermosetting resin is generally used as the thermosetting resin, so that the application range of the thermosetting resin is limited on one hand, and the thermosetting resin cannot be fully recycled and is not environment-friendly on the other hand. There is therefore a need to develop high molecular weight, linear-structured (thermoplastic) epoxy resins.

At present, the linear epoxy resin is a common phenoxy resin. The production process also generates branched and cross-linked structures.

There is also a proposal to synthesize high molecular weight linear epoxies by reacting low molecular weight difunctional epoxies (e.g., E51) with compounds containing only two active hydrogens (e.g., hexylamine, cyclohexylamine, piperazine, etc.), but this approach is also susceptible to branching and crosslinking.

Particularly, in the application of the hot melt adhesive, if the branching and crosslinking capabilities are strong, the regularity of molecular chains is poor, and crystallization is not easy, so that epoxy resin with good regularity is required to be applied to the hot melt adhesive at present.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide a linear epoxy resin which has good regularity and is not easy to branch and crosslink.

In order to achieve the purpose, the invention provides the following technical scheme:

a linear epoxy resin composition comprising a linear epoxy resin,

the molecular formula is:

as the inventionFurther improved by compounds containing two amide groupsWith compounds containing two epoxy groupsAnd (3) reacting.

As another object of the present invention, there is provided a method for preparing a linear epoxy resin by reacting a compound having two amide groupsWith compounds containing two epoxy groupsAdopting a melting method to carry out reaction to obtain linear epoxy resin

As a further improvement of the present invention,

the molar ratio of the compound containing two acylamino groups to the compound containing two epoxy groups is 0.8-1.2: 1.

As a further improvement of the present invention,

the compound containing two amide groups is at least one of adipamide, sebacamide and heptane diamide.

As a further improvement of the present invention,

the compound containing two epoxy groups is at least one of 1, 2, 7, 8-diepoxyoctane, diglycidyl ether and bisphenol A epoxy resin.

As another object of the present invention, there is provided a method for preparing a hot melt adhesive from a linear epoxy resin,

the raw materials comprise the following mole portions:

compounds containing two amide groups: 0.8 to 1.2 portions of

A compound containing two epoxy groups: 1 part of

End-capping agent: 0.01-0.05 part;

the method comprises the following steps: weighing raw materials according to the conversion of molar parts;

step two: fully mixing a compound containing two epoxy groups and a compound containing two amide groups;

step three: heating to a molten state, and reacting for 1-7 hours in a heat preservation manner;

step four: adding a blocking agent, and continuously reacting for 0.5-1 hour to obtain the hot melt adhesive.

As a further improvement of the present invention,

the end capping agent is monofunctional epoxy resin or a monoamide compound or a mono-secondary amino compound.

As a further improvement of the present invention,

the end-capping agent is a secondary amine compound or a compound containing a single epoxy group or a compound containing a single amide group.

As a further improvement of the present invention,

the end capping agent is at least one of dimethylamine, propylene oxide, 1, 2-epoxy heptane, butyramide, valeramide, ethanolamine and piperazine.

In the invention, the linear epoxy resin is mainly used, the molecular chain of the linear epoxy resin is linear, and the regularity of the molecular structure is better, so that the linear epoxy resin is easy to crystallize and is very suitable for being used in hot melt adhesive.

In the preparation process, a compound containing two epoxy groups and a compound containing two amide groups are mainly adopted for reaction, wherein the epoxy groups are subjected to ring opening, the amide groups are dehydrogenated, and the ring-opened epoxy groups and the dehydrogenated amide groups are polymerized to form the linear epoxy resin.

The linear epoxy resin prepared by the method has a single linear structure, can adopt low-molecular-weight epoxy resin as a raw material, and has the advantages of simple process, no micromolecular by-product and no waste discharge.

Detailed Description