阅读说明：本技术 电子设备 (Electronic device ) 是由 德田孝太 山本展大 于 2019-06-26 设计创作，主要内容包括：本发明提供一种能够充分连接挠性印刷布线基板及连接部件的电子设备。实施方式的电子设备具有FPC单元(50)(挠性印刷布线基板)及设置有连接端子(43)的连接端部(42)(连接部件)。FPC单元(50)具备绝缘层(62)、设置于绝缘层(62)的一个面侧并在电气上由一群构成的多个连接焊盘(61)、以及设置于绝缘层(62)的另一个面侧并具有传热性的焊盘(65)等。焊盘(65)与一群连接焊盘(61)之中位于外缘的1个以上连接焊盘(61)隔着绝缘层(62)而重叠,且包括延伸到位于外缘的连接焊盘(61)的外侧的部分。连接部件具有经由焊锡与连接焊盘(61)连接的多个连接端子(43)。(The invention provides an electronic device capable of sufficiently connecting a flexible printed wiring board and a connecting member. An electronic device of an embodiment has an FPC unit (50) (flexible printed wiring board) and a connection end portion (42) (connection member) provided with a connection terminal (43). The FPC unit (50) is provided with an insulating layer (62), a plurality of connection pads (61) which are provided on one surface side of the insulating layer (62) and are electrically composed of a group, a pad (65) which is provided on the other surface side of the insulating layer (62) and has heat conductivity, and the like. The pad (65) overlaps with 1 or more connection pads (61) located on the outer edge among the group of connection pads (61) with an insulating layer (62) interposed therebetween, and includes a portion extending to the outside of the connection pads (61) located on the outer edge. The connecting member has a plurality of connecting terminals (43) connected to the connecting pads (61) via solder.)

1. An electronic device is provided with:

a flexible printed wiring board including an insulating layer, a plurality of connection pads provided on one surface side of the insulating layer and formed of a group, and a pad provided on the other surface side of the insulating layer and having a heat transfer property, the pad being overlapped with 1 or more connection pads located at an outer edge among the group of connection pads with the insulating layer interposed therebetween, and including a portion extending to an outer side of the connection pad located at the outer edge; and

and a connection member having a plurality of connection terminals connected to the connection pads via solder.

2. The electronic device of claim 1,

the pad overlaps with the entire area of 1 or more connection pads located on the outer edge among the connection pads in the group, with the insulating layer interposed therebetween.

3. The electronic device of claim 1,

the flexible printed wiring board has a ground pad provided on the other surface side of the insulating layer, and the pad is connected to the ground pad.

4. The electronic device of claim 1,

the flexible printed wiring board has a plurality of groups of the connection pads arranged in a plurality of rows on one surface side of the insulating layer,

the pad includes a plurality of pads arranged to overlap with 1 or more connection pads located at an end of each of the groups.

5. The electronic device of claim 4,

the plurality of pads include a plurality of pads having different areas.

6. The electronic device of claim 1,

the flexible printed wiring board has a plurality of 2 nd connection pads provided on one surface side of the insulating layer, and a semiconductor element bonded to the 2 nd connection pads by solder,

the melting point of the solder for bonding the semiconductor element is higher than the melting point of the solder for bonding the connection pad.

Technical Field

Embodiments of the present invention relate to an electronic device.

Background

Conventionally, there is known a structure in which a flexible printed wiring board and a connection end portion (connection member) provided with a connection terminal are connected by, for example, solder melted by heating.

Here, when the connection region between the flexible printed wiring board and the connection member is relatively large, even if the connection region is uniformly heated, the outer edge portion is relatively more likely to radiate heat than the central portion, and thus the temperature is likely to be low. That is, when the connection region is relatively large, temperature unevenness may occur in the connection region and it may be difficult to perform uniform connection. Although the connecting device can be modified to uniformly heat the connecting region, it is costly.

Disclosure of Invention

Embodiments of the invention provide an electronic device capable of sufficiently connecting a flexible printed wiring board and a connecting member.

Drawings

Fig. 1 is an exploded perspective view of a Hard Disk Drive (HDD) including the electronic apparatus according to embodiment 1.

Fig. 2 is a perspective view showing the HDD drive unit and a substrate unit (FPC unit).

Fig. 3 is a side view showing a driving block of the driving assembly, an engaging portion (FPC engaging portion) of the FPC unit, and a connecting end portion of a flexure.

Fig. 4 is a perspective view showing a suspension assembly in the driving assembly.

Fig. 5 is a plan view showing the joint portion of the FPC unit.

Fig. 6 is a cross-sectional view of the FPC bonding portion along line a-a of fig. 5.

Fig. 7 is a plan view showing the joint portion of the FPC unit to which the connection end portion is joined.

Fig. 8 is a cross-sectional view of the connection end and the FPC bonding portion taken along line B-B of fig. 7.

Fig. 9 is a perspective view schematically showing the connection end and a main portion of the FPC unit.

Fig. 10 is a plan view showing a joint portion of the FPC unit according to embodiment 2.

Fig. 11 is a plan view showing a joint portion of the FPC unit according to embodiment 3.

Fig. 12 is a perspective view of a Solid State Drive (SSD) including the electronic device according to embodiment 4.

Fig. 13 is a sectional view showing a main part of fig. 12 according to example 1.

Fig. 14 is a cross-sectional view showing a 2 nd example of a main part of fig. 12.

An electronic device according to an embodiment includes a flexible printed wiring board and a connecting member. The flexible printed wiring board includes an insulating layer, a plurality of connection pads formed of a group and provided on one surface side of the insulating layer, and a pad having heat conductivity and provided on the other surface side of the insulating layer, wherein the pad overlaps with 1 or more connection pads located on an outer edge of the group of connection pads with the insulating layer interposed therebetween, and includes a portion extending to an outer side of the connection pads located on the outer edge, and the connection member includes a plurality of connection terminals connected to the connection pads via solder.