阅读说明：本技术 一种用灌胶工艺制造的贴片式光电传感器 (Surface-mounted photoelectric sensor manufactured by glue pouring process ) 是由 程晓林 杨天昴 杨家象 于 2020-07-02 设计创作，主要内容包括：一种用灌胶工艺制造的贴片式光电传感器,涉及一种贴片式光电传感器制造技术,为了解决现有的注塑工艺生产出来的贴片式光电传感器制造成本高的问题。本发明的管脚设置在胶体根部；胶体的顶部设有水平定位阶,并且在胶体的根部设有吸嘴平台；管脚为挺直状态；敷铜箔设置在PCB板上；PCB板上开设自动定位孔,并且自动定位孔的尺寸与胶体外形尺寸相匹配；胶体采用自动贴片机装配在PCB板的自动定位孔处,并采用焊接锡将管脚对应焊接在敷铜箔上。有益效果为胶体通过灌胶工艺完成封装,并实现了采用自动贴片机装配在PCB板上；灌胶工艺大大降低了贴片式光电传感器的制造成本和市场价格,从而降低了整机企业的采购成本。(A patch type photoelectric sensor manufactured by a glue pouring process relates to a manufacturing technology of the patch type photoelectric sensor and aims to solve the problem that the manufacturing cost of the patch type photoelectric sensor manufactured by the existing injection molding process is high. The pin of the invention is arranged at the root of the colloid; a horizontal positioning step is arranged at the top of the colloid, and a suction nozzle platform is arranged at the root of the colloid; the pin is in a straight state; the copper clad foil is arranged on the PCB; an automatic positioning hole is formed in the PCB, and the size of the automatic positioning hole is matched with the overall size of the colloid; the colloid is assembled at the automatic positioning hole of the PCB by an automatic chip mounter, and the pins are correspondingly welded on the copper clad by adopting welding tin. The packaging method has the advantages that the colloid is packaged through a glue pouring process, and the assembly on the PCB board by adopting an automatic chip mounter is realized; the glue pouring process greatly reduces the manufacturing cost and the market price of the patch type photoelectric sensor, thereby reducing the purchase cost of a whole machine enterprise.)

1. A patch type photoelectric sensor manufactured by a glue pouring process comprises a glue body (1), a pin (4), a PCB (printed circuit board) plate (5) and a copper clad (7);

the pins (4) are arranged at the root parts of the colloids (1); the copper clad foil (7) is arranged on the PCB (5);

the device is characterized in that a horizontal positioning step (2) is arranged at the top of the colloid (1), and a suction nozzle platform (3) is arranged at the root of the colloid (1);

the pin (4) is in a straight state;

an automatic positioning hole (6) is formed in the PCB (5), and the size of the automatic positioning hole (6) is matched with the external size of the colloid (1);

the colloid (1) is assembled at an automatic positioning hole (6) of the PCB (5) by adopting an automatic chip mounter, and the pins (4) are correspondingly welded on the copper-clad foil (7) by adopting welding tin (8).

2. The patch type photoelectric sensor manufactured by the glue pouring process according to claim 1, wherein the automatic positioning hole (6) is rectangular.

Technical Field

The invention relates to a manufacturing technology of a patch type photoelectric sensor.

Background

In the component assembly of electronic complete machine production enterprises, two assembling processes, namely direct insertion type assembly and surface mount type assembly, are mainly adopted, the evolution process of the component assembly is gradually developed from early direct insertion type assembly to advanced surface mount type assembly, and along with the high-speed development of electronic information technology and industry, the surface mount type electronic components adopted in the electronic complete machine assembly gradually become mainstream.

The mainstream manufacturing process of the direct-insert photoelectric sensor is a glue filling process, the price of the used packaging material is low, and is only one fifth or even one tenth of the price of the packaging material of the injection molding process, moreover, the actual utilization rate of the packaging material in the production process is up to more than 95%, and meanwhile, the direct-insert photoelectric sensor produced by the glue filling process is continuously produced, so that the production efficiency of the direct-insert photoelectric sensor produced by the glue filling process is high, the manufacturing cost is low, and the market selling price is low based on the beneficial factors; the structure of the colloid and the pin of the existing direct-insert type photoelectric sensor is shown in fig. 1 and fig. 2, and the assembling process of the existing glue-pouring process direct-insert type photoelectric sensor is shown in fig. 3 to fig. 5; the assembly process is mainly performed by hands; only a few enterprises adopt full-automatic plug-in machines to complete the operation.

Compared with a direct-insert electronic component, the patch type electronic component has a plurality of advantages, and one of the outstanding characteristics is that high-speed and full-automatic assembly is realized; historically, photoelectric sensors are mainly assembled in a manual direct insertion manner, and in recent years, with the continuous and great improvement of labor cost, manual assembly is continuously adopted, which is difficult for enterprises to bear, so that complete machine production enterprises urgently want to adopt patch type photoelectric sensors, so that labor cost is saved while high-speed full-automatic assembly is realized, which becomes an inevitable choice for complete machine production enterprises! However, this option has a new problem in practice, that is, the procurement cost of the components is greatly increased, because the current market price of the surface mount electronic components is much higher than that of the similar direct-insert electronic components (by more than twenty percent), and the surface mount photoelectric sensor is no exception, so that the excessive market price always restricts the wide application of the surface mount photoelectric sensor.

The manufacturing of the patch type photoelectric sensor generally adopts an injection molding process, and the assembly process of the existing injection molding process of the patch type photoelectric sensor is shown in fig. 6 to 8; the assembling process is completed by using a full-automatic chip mounter, and the precision after assembling is determined by the pattern recognition precision and the mechanical precision of the chip mounter; however, the packaging material used in the process is expensive, and meanwhile, the injection molding process is completed in the mold, so that the operation process is discontinuous, and the utilization rate of the packaging material is only 70%, and the adverse factors cause high manufacturing cost and high market selling price of the injection molding process patch type photoelectric sensor.

Disclosure of Invention

The invention aims to solve the problem that a surface mount type photoelectric sensor produced by the existing injection molding process is high in manufacturing cost, and provides a surface mount type photoelectric sensor manufactured by a glue pouring process.

The invention relates to a surface-mounted photoelectric sensor manufactured by a glue pouring process, which comprises a glue body, a pin, a PCB (printed circuit board) and a copper clad;

the pins are arranged at the root of the colloid; the copper clad foil is arranged on the PCB;

the top of the colloid is provided with a horizontal positioning step, and the root of the colloid is provided with a suction nozzle platform;

the pin is in a straight state;

an automatic positioning hole is formed in the PCB, and the size of the automatic positioning hole is matched with the overall size of the colloid;

the colloid is assembled at the automatic positioning hole of the PCB by an automatic chip mounter, and the pins are correspondingly welded on the copper clad by adopting welding tin.

The invention has the advantages that the horizontal positioning step and the suction nozzle platform are additionally arranged on the colloid, and the automatic positioning hole is formed in the PCB, so that the invention has self-calibration and positioning functions in the assembling process, and the colloid can be assembled on the PCB through the automatic chip mounter through the change; the glue pouring process greatly reduces the manufacturing cost and the market price of the surface mount type photoelectric sensor, thereby reducing the purchase cost of a whole machine enterprise; the surface mount type photoelectric sensor manufactured by the glue pouring process can be applied in a surface mount manner and can also be applied in a direct insertion manner, and the two application modes are compatible, so that the production and manufacturing enterprises of the photoelectric sensor are facilitated, and the flexible use of the whole machine enterprise is facilitated; meanwhile, the adhesive pouring process surface mount type photoelectric sensor can be assembled on the front side of the PCB and also can be assembled on the back side of the PCB.

Drawings

FIG. 1 is a side view of a gel and pin configuration of a prior art in-line photosensor; wherein, B2 is colloid, B3 is base pin;

FIG. 2 is a top view of a gel and pin structure of a prior art in-line photoelectric sensor;

FIG. 3 is a side view of a process of assembling a direct-insert type photoelectric sensor in a glue-pouring process in the prior art, wherein B1 is a PCB, and B4 is solder tin;

FIG. 4 is a top view of a prior art in-line photoelectric sensor after assembly, wherein B5 is copper clad;

FIG. 5 is a sectional view taken along line A-A of FIG. 4;

fig. 6 is a side view of an assembly process of a chip-type photoelectric sensor in an injection molding process in the background art, wherein a1 is a PCB, a2 is a glue, and A3 is a pin;

FIG. 7 is an enlarged schematic view of the circled portion in FIG. 6, wherein A4 is solder tin;

fig. 8 is a top view of an assembled injection-molded surface mount photoelectric sensor in the background art, wherein a5 is a copper clad;

fig. 9 is a side view of a gel and pin structure of a surface mount photoelectric sensor manufactured by a gel filling process according to an embodiment;

fig. 10 is a top view of a PCB board and a copper clad structure of a chip-type photoelectric sensor manufactured by a glue filling process according to an embodiment one;

FIG. 11 is a side view of the front assembly process of glue on a PCB board with the horizontal alignment step on top of the glue in accordance with one embodiment;

FIG. 12 is a side view of a back side assembly process of glue on a PCB board with the horizontal alignment step on top of the glue in accordance with one embodiment;

FIG. 13 is a side view of the front assembly process of the glue on the PCB board with horizontal positioning steps on both sides of the glue in accordance with the first embodiment;

fig. 14 is a side view of the assembly process of the glue on the back side of the PCB board with horizontal positioning steps on both sides of the glue in accordance with the first embodiment.

Detailed Description