阅读说明：本技术 在电镀系统中的清洁部件和方法 (Cleaning member and method in electroplating system ) 是由 凯尔·M·汉森 于 2019-01-30 设计创作，主要内容包括：用于清洁电镀系统部件的系统可包括密封件清洁组件,密封件清洁组件与电镀系统结合。密封件清洁组件可包括臂,臂于第一位置和第二位置之间为可枢转的。臂可绕着臂的中央轴为可旋转的。密封件清洁组件亦可包括清洁头,清洁头包括托架部,托架部与臂的远端部耦接。清洁头可由前部作为特征,前部形成为与电镀设备的密封件接合。清洁头可沿着前部限定沟槽,并且清洁头可限定多个流体通道,这些流体通道穿过清洁头,所述多个流体通道的每一个流体通道流体地通往沟槽的背侧。(A system for cleaning plating system components can include a seal cleaning assembly coupled to a plating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may also include a cleaning head including a bracket portion coupled with the distal end portion of the arm. The cleaning head may feature a front portion formed to engage with a seal of the electroplating apparatus. The cleaning head may define a channel along the front portion, and the cleaning head may define a plurality of fluid channels through the cleaning head, each fluid channel of the plurality of fluid channels fluidly opening to the back side of the channel.)

1. A seal cleaning assembly for an electroplating apparatus, comprising:

an arm pivotable between a first position and a second position, wherein the arm is rotatable about a central axis of the arm; and

a cleaning head including a cradle portion coupled with the distal end portion of the arm, the cleaning head characterized by a front portion formed to engage a seal of the electroplating apparatus, wherein the cleaning head defines a channel along the front portion, and wherein the cleaning head defines a plurality of fluid channels through the cleaning head, each fluid channel of the plurality of fluid channels fluidly open to a back side of the channel.

2. The seal cleaning assembly of a plating apparatus of claim 1, wherein the front portion of the cleaning head is at least partially characterized by an arcuate profile configured to receive an annular seal.

3. The seal cleaning assembly of an electroplating apparatus of claim 1, wherein the cleaning head further comprises a contact pin extending at least partially through the groove and configured to directly contact the seal.

4. The seal cleaning assembly of an electroplating apparatus of claim 3, wherein the cleaning head further comprises a clearance pin extending at least partially through the groove and configured to define a clearance between the clearance pin and the seal when the contact pin is in direct contact with the seal.

5. The seal cleaning assembly of an electroplating apparatus of claim 4, wherein the plurality of fluid channels comprises:

a first channel fluidly open to a first location along the trench; and

a second passage fluidly leading to a second location along the groove, the second location radially offset from the first location in a direction of rotation of the seal, wherein the clearance pin is located between the first location and the second location.

6. The seal cleaning assembly of a plating apparatus of claim 1, wherein the cleaning head comprises a hydrophobic material.

7. An electroplating system, comprising:

a system head having a rotor, the system head configured to hold a substrate for processing;

a seal on the rotor;

a head lift coupled with the system head and configured to position the system head; and

a seal cleaning assembly, the seal cleaning assembly comprising:

an arm pivotable between a first position and a second position, wherein a distal end of the arm is vertically aligned with an interior region of the system head, wherein the arm is rotatable about a central axis of the arm; and

a cleaning head including a cradle portion coupled with the distal end portion of the arm, the cleaning head characterized by a front portion formed to engage an inner surface of the seal, wherein the cleaning head defines a channel along the front portion, and wherein the cleaning head defines a plurality of fluid channels through the cleaning head, each fluid channel of the plurality of fluid channels fluidly open to a back side of the channel.

8. The electroplating system of claim 7 wherein when the arm is in the second position, the distal end of the arm is configured to rotate the cleaning head from a retracted position into direct contact with the seal, the electroplating system further comprising a torque controlled motor configured to drive the arm and maintain contact between the cleaning head and the seal while the rotor rotates the seal across the cleaning head.

9. The electroplating system of claim 7 wherein the seal is characterized by an annular form, and wherein the front portion of the cleaning head is at least partially characterized by an arcuate profile configured to receive an inner annular sidewall of the seal.

10. The electroplating system of claim 7, wherein the cleaning head further comprises a contact pin extending at least partially through the groove and configured to directly contact the seal during a cleaning operation.

11. The plating system of claim 10, wherein the cleaning head further comprises a clearance pin extending at least partially through the groove and configured to define a clearance between the clearance pin and the seal when the contact pin is in direct contact with the seal.

12. The electroplating system of claim 11, wherein the plurality of fluid channels comprises:

a first channel fluidly open to a first location along the trench; and

a second passage fluidly leading to a second location along the groove, the second location radially offset from the first location in a direction of rotation of the seal.

13. The electroplating system of claim 12, wherein the clearance pin is located between the first position and the second position, the electroplating system further comprising:

a fluid delivery tube extending along the arm and configured to provide fluid to the first channel; and

a fluid removal tube extending along the arm and configured to remove the fluid from the second channel, wherein a vacuum is maintained by the fluid removal tube during operation.

14. A method of cleaning an electroplating system contact seal, the method comprising:

delivering an acidic solution in a first fluid channel of a cleaning head, wherein the cleaning head is positioned to physically contact the electroplating system contact seal;

rotating the electroplating system contact seal across the cleaning head; and

drawing the acidic solution from the cleaning head through a second fluid passage radially offset from the first fluid passage in a direction of rotation of the electroplating system contact seal.

15. The method of cleaning an electroplating system contact seal of claim 14, wherein the acidic solution is substantially maintained within a volume defined in part by an inner surface of the electroplating system contact seal, a groove formed in a front portion of the cleaning head, and a contact pin extending at least partially through the groove, the contact pin being located near a leading edge of the cleaning head in a direction of rotation of the electroplating system contact seal.

Technical Field

The present technology relates to cleaning operations in semiconductor processing. More particularly, the present techniques relate to systems and methods for performing in-situ (in situ) cleaning of electroplating systems.

Background

Integrated circuits can be made by processes that produce intricately patterned layers of materials on the surface of a substrate. After formation, etching, and other processing on the substrate, a metal or other conductive material is typically deposited or formed to provide electrical connections between the components. Because this metallization may be performed after many manufacturing operations, the problems caused during metallization may result in expensive waste substrates or wafers. One common problem is the non-uniform formation of metal across the surface of the substrate.

Uniformity problems during metallization can be caused by a number of conditions related to the process or equipment. One example is plating on parts of the chamber that are or become conductive and which may result in local loss of metal on the substrate. The material may be plated on the contact ring, the contact seal, or any other component that may be within the system. This erroneous formation may limit the total amount of plating on the substrate, which may result in insufficient plating, increased cost, and device failure.

Accordingly, there is a need for improved systems and methods that can be used to manufacture high quality devices and structures. These and other needs are addressed by the present technology.

Disclosure of Invention

The present techniques may include systems and methods for cleaning plating system components, which may include a seal cleaning assembly in combination with a plating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may also include a cleaning head including a cradle portion coupled with the distal end of the arm. The cleaning head may feature a front portion formed to engage with a seal of the electroplating apparatus. The cleaning head may define a channel along the front portion, and the cleaning head may define a plurality of fluid channels through the cleaning head, each of the plurality of fluid channels fluidly opening to the back side of the channel.

In some embodiments, the front of the cleaning head may be at least partially characterized by an arcuate profile (arcuateprofile) configured to receive the ring seal. The cleaning head may also include a contact pin extending at least partially through the groove and configured to directly contact the seal. The cleaning head may also include a clearance pin extending at least partially through the groove and configured to define a clearance between the clearance pin and the seal when the contact pin is in direct contact with the seal. The plurality of fluid passages of the cleaning head may include a first passage fluidly open to a first location along the groove and may include a second passage fluidly open to a second location along the groove, the second location being radially offset from the first location in a direction of rotation of the seal. The clearance pin may be located between a first position and a second position. In some embodiments, the cleaning head may be or may include a hydrophobic material.

Various embodiments of the present technology additionally include an electroplating system that may include a system head having a rotor. The system head may be configured to hold a substrate for processing. The system may include a seal on the rotor. The system can include a head lift coupled to the system head and configured to position the system head. The system may also include a seal cleaning assembly. The seal cleaning assembly can include an arm pivotable between a first position and a second position, wherein a distal end of the arm can be vertically aligned with an interior region of the system head. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may also include a cleaning head including a bracket portion coupled with the distal end portion of the arm. The cleaning head may feature a front portion formed to engage with an inner surface of the seal. The cleaning head may define a channel along the front portion, and the cleaning head may define a plurality of fluid passages through the cleaning head. Each of the plurality of fluid channels may be fluidly open to the back side of the trench.

In some embodiments, the arm may be in the second position and the distal end of the arm may be configured to rotate the cleaning head from the retracted position into direct contact with the seal. The system may include a torque-controlled motor configured to drive the arm and maintain contact between the cleaning head and the seal while the rotor rotates the seal across the cleaning head. The seal may be characterized by an annular form and the front portion of the cleaning head may be at least partially characterized by an arcuate profile configured to receive the inner annular sidewall of the seal. The cleaning head may also include a contact pin extending at least partially through the groove and configured to directly contact the seal during a cleaning operation. The cleaning head may also include a clearance pin extending at least partially through the groove and configured to define a clearance between the clearance pin and the seal when the contact pin is in direct contact with the seal. The plurality of fluid passages may include a first passage fluidly opening to a first location along the groove and a second passage fluidly opening to a second location along the groove, the second location being radially offset from the first location in a direction of rotation of the seal. The clearance pin may be located between a first position and a second position. The system may also include a fluid delivery tube extending along the arm and configured to provide fluid to the first channel. The system may also include a fluid removal tube extending along the arm and configured to remove fluid from the second channel. In some embodiments, a vacuum may be maintained through the fluid removal tube during operation.

Various embodiments of the present technology may also include methods of cleaning the plating system contact seal. The method may include delivering an acidic solution in a first fluid path of the cleaning head. The cleaning head may be positioned to physically contact the plating system contact seal. The method can include rotating an electroplating system contact seal across a cleaning head. The method may also include drawing the acidic solution from the cleaning head through a second fluid passage radially offset from the first fluid passage in a direction of rotation of the electroplating system contact seal. In some embodiments, the acidic solution may be substantially maintained within a volume defined in part by an inner surface of the plating system contact seal, a groove formed in a front portion of the cleaning head, and a contact pin extending at least partially through the groove, the contact pin being adjacent a leading edge of the cleaning head in a rotational direction of the plating system contact seal.

This technique may provide a number of advantages over conventional techniques. For example, by performing in-situ cleaning of the sealed contacts, the present techniques may reduce the number of cleans. Furthermore, the equipment used may help to improve the cleaning of the contact seal without damaging other system components via the cleaning solution. These and other embodiments and many of their advantages and features are described in more detail in conjunction with the following description and the appended drawings.

Drawings

A further understanding of the nature and advantages of the disclosed embodiments may be realized by reference to the remaining portions of the specification and the drawings.

Fig. 1 depicts a schematic perspective view of a chamber that may perform a cleaning technique in accordance with some embodiments of the present technique.

FIG. 2 depicts a partial cross-sectional view of a chamber that may be associated with a seal cleaning assembly in accordance with some embodiments of the present technique.

Fig. 3 depicts a schematic perspective view of a cleaning head in accordance with some embodiments of the present technique.

Fig. 4 depicts a schematic perspective view of a cleaning head in accordance with some embodiments of the present technique.

Figure 5 depicts a schematic view of an exemplary apparatus for positioning a cleaning head, in accordance with some embodiments of the present technique.

Figure 6 depicts a schematic view of an exemplary apparatus for positioning a cleaning head, in accordance with some embodiments of the present technique.

Figure 7 depicts a partial cross-sectional view of a cleaning head in operation, in accordance with some embodiments of the present technique.

Figure 8 depicts a partial cross-sectional view of a cleaning head in operation, in accordance with some embodiments of the present technique.

FIG. 9 depicts operations of an exemplary method of cleaning a contact seal, in accordance with an embodiment of the present technique.

Some of which are included as schematic illustrations. It will be appreciated that the figures are for illustrative purposes and are not to be considered to be drawn to scale unless specifically indicated to be drawn to scale. Moreover, the drawings are provided as schematic illustrations to aid understanding and may not include all aspects or information as compared to actual representations and may include exaggerated materials for illustrative purposes.

In the drawings, similar components and/or features may have the same numerical reference. Further, various components of the same type may be distinguished by following the reference label by a letter that distinguishes among the similar components and/or features. If only the first numerical reference label is used in the specification, the description is applicable to any one of the similar components and/or features having the same first numerical reference label, regardless of the alphabetic suffix.

Detailed Description

Various operations in semiconductor manufacturing and processing are performed to fabricate large arrays of features on a substrate. When forming a semiconductor layer, vias (via), trenches, and other pathways are fabricated within the structure. These features may then be filled with a conductive or metallic material so that power passes through the device from one layer to another. As the dimensions of device features continue to shrink, the amount of metal that provides a conductive path through the substrate is also reduced. As the amount of metal is reduced, the quality and uniformity of the fill may become more critical to ensure adequate conductivity through the device. Thus, manufacturing may attempt to reduce or remove defects and discontinuities in the path.

Electroplating operations may be performed to provide conductive material to vias and other features on the substrate. Electroplating utilizes an electrolytic bath (electrolyte bath) containing ions of a conductive material to electrochemically deposit the conductive material on the substrate and to electrochemically deposit the conductive material in features defined on the substrate. The metal plated part on the substrate is used as a cathode. Electrical contacts, such as rings or pins, may allow current to flow through the system. The contact is protected from the electrolyte by a seal that prevents metal plating on other conductive components. The seal is typically a non-conductive material, however, over time, the seal may become conductive due to residues formed on the seal during the plating operation. When sufficiently conductive, electroplating may occur on the seal. Plating that may occur on the seal may reduce localized plating on the substrate, resulting in uniformity problems. Uniformity problems can result in substrate or wafer scrap.

Conventional techniques typically stop operation between wafers to clean the seal from residues. The system can be partially disassembled and the seals can be manually cleaned and scrubbed prior to replacement in the tool. This process is time consuming and abrasive scrubbing can further roughen the seal surface, increasing the amount of conductive residue that can remain on the seal during processing.

The present technology overcomes these problems by incorporating a cleaning system that can perform clean-in-place of the seal. The system may include a nozzle or head that may extend against the seal, and the cleaning solution may flow against the seal to remove any residue. By utilizing a cleaning system in accordance with the present techniques, cleaning may be more easily performed and surface damage to the seal may be limited or reduced. After describing an exemplary chamber in which various embodiments of the present technology may be performed, the remaining disclosure will discuss various aspects of the systems and processes of the present technology.

Fig. 1 depicts a schematic perspective view of an electroplating system 20 that can utilize and practice methods and cleaning systems in accordance with various embodiments of the present technique. Plating system 20 illustrates an exemplary plating system including a system head 22 and a bowl (bowl) 26. During the plating operation, the wafer may be clamped to the system head 22, inverted, and extended into the bowl 26 to perform the plating operation. The electroplating system 20 may include a head lift 24, and the head lift 24 may be configured to raise and rotate the system head 22, or otherwise position the system head within the system. The head and bowl may be affixed to the deck plate 28 or other structure, may be part of a larger system incorporating multiple electroplating systems 20, and may share electrolytes and other materials. The rotor 34 may allow the substrate clamped to the head to rotate in the bowl, or outside the bowl in a different operation. The rotor may include a contact ring 40, and the contact ring 40 may provide an electrically conductive contact with the substrate. FIG. 1 depicts a plating chamber that may include components to be cleaned directly on a platen. It will be appreciated that other configurations are possible, including several platforms on which the head moves to additional modules and on which cleaning of seals or other components is performed. In addition, one or more components, such as the seal ring, may be removed from the chamber and placed in a maintenance system or a cleaning system for cleaning. Any number of other operations may be performed to provide or expose the component for cleaning.

Turning to fig. 2, fig. 2 illustrates a partial cross-sectional view of the electroplating system 20. A motor 38 included in the head may provide rotation of the contact ring 40 and the contact seal 50, the contact seal 50 may seal the substrate. This seal may provide isolation of the contact ring 40 from the electrolyte during operation to prevent plating on the contact ring. This seal may be made of an insulating material and may be made of a material configured to limit interaction with the electrolyte. For example, the seal material may include some polymers including elastomers, such as fluoroelastomers (fluoroelastomers) including any FKM materials including Type 1 (Type 1), Type 2 (Type 2), Type 3 (Type 3), Type4 (Type4), and Type 5 (Type 5) FKM materials, and may include fluoropolymers. These materials may also include perfluoroelastomers (perfluoroelastomers), including any FFKM material, as well as tetrafluoroethylene/propylene rubber or FFPM. The seal material may also comprise thermoplastic elastomers including thermoplastic vulcanizates (thermoplastic vulcanizes) and elastomers with additional moieties (moieties) such as styrene-ethylene/butylene-styrene (styrene ethylene butylene), as well as materials developed from polyolefins (polyoefins) or other plastics. The seal may also comprise any other material that is compatible with the electroplating system and the electrolyte.

As explained above, residues may form on the seal during the plating operation. In some embodiments of the present technology, after the plating operation, the substrate may be removed and the seal may be cleaned. The seals may be cleaned on the same platform as the bowl, or the head may be repositioned to a separate module associated with the plating system 20 or connected to the system 20. The system head 22 may be reversed and the seal cleaning assembly may be used while the seal is still connected to the head to clean the seal. Fig. 3 depicts a schematic front perspective view of a seal cleaning assembly 300 that may be used in various embodiments of the present technology. With the substrate removed and the system head 22 inverted, the seal cleaning assembly 300 may be positioned within the cavity of the head and used to clean the interior of the seal, which may have plating residues on the surface. It will be understood that the inversion of the head may not be critical, and the present system is operable to accommodate seals in any orientation.

As shown, the seal cleaning assembly 300 may include an arm 305 and a cleaning head 310. The arm 305 may be a swing arm or other device associated with an electroplating system or maintenance system for the head, and may be pivotable between positions including a first position, which may be a retracted position, and a second position, which may be an operative position and may position a distal end of the arm 305, and the cleaning head 310 may be coupled with the distal end of the arm 305 at a position vertically aligned with an interior region of the system head 22. The arm 305 may also be rotatable about a central axis of the arm, which allows the cleaning head to be raised and lowered to an operating position where it may contact the seal. The arm 305 may be an L-shaped or other retractable or extendable arm and may be coupled with a torque controlled motor that may be coupled with or connected to the arm. The torque control motor may drive the arm between a first position and a second position, and may also be configured to maintain contact between the cleaning head and the seal to be cleaned.

The arm 305 may also include one or more fluid delivery tubes 307a or fluid removal tubes 307b, which may extend along the arm. These tubes may be coupled with one or more reservoirs (reservoirs) or other materials that may be used for cleaning operations, and may be coupled or fluidly connected with the cleaning head 310. For example, the fluid delivery tube 307a may provide one or more cleaning solutions to the cleaning head, while the fluid removal tube 307b may remove the cleaning solution after the cleaning solution subsequently interacts with the seal to be cleaned. The cleaning head 310 may allow cleaning solution to be delivered to and removed from the seals without contacting other chamber components, dripping (driping), or otherwise interacting with the system head 22. The seal contacting and cleaning operations will be described in more detail below.

The cleaning head 310 may be multiple components coupled together, or may be a single piece mechanical design incorporating one or more aspects in the design. The cleaning head 310 may include a bracket portion 312. The cleaning head 310 may be coupled to the arm 305 by a bracket portion 312, such as to a distal portion of the arm 305. The bracket portion 312 may be rigidly coupled to the head using any number of components, including fastening components, adhesives, or the bracket portion may include a form configured to receive a snap-fitting cleaning head on the arm. Any number of aspects of the arm or cleaning head carrier portion may be adjusted to provide coupling between these components.

A front portion 314 of the cleaning head 310 may extend from the cradle portion 312 in a first direction and a back portion 316 of the cleaning head 310 may extend from the cradle portion 312 in a second direction opposite the front portion. The front portion 314 may be formed to engage a seal of an electroplating system head. For example, the contact seal may be an annular member, and thus may be characterized by curved profiles of the inner and outer surfaces. Thus, the front portion 314 may be at least partially characterized by an arcuate profile configured to accommodate the curvature of the seal. This may provide improved contact between these components to reduce the chance of liquid leakage or weeping.

The cleaning head 310 may define a channel 318 along the front 314. The groove 318 may be defined by an upper sidewall 320 and a lower sidewall 322, and may face the seal to be cleaned. In an embodiment, one or both of upper sidewall 320 and lower sidewall 322 may exhibit an arcuate profile. For example, in some embodiments, the lower sidewall 322 may exhibit an arcuate profile along the front 314 of the cleaning head 310. The lower sidewall may be characterized by a curvature equivalent to the curvature of the seal to limit any fluid from leaking out of the groove through the space formed between these components.

The cleaning head 310 may be made of any number of materials or combination of materials. In some embodiments, the cleaning head 310 may comprise a polymeric material that is resistant to damage from cleaning solutions that may be used. For example, as will be explained with respect to the method of operation below, in some embodiments, the cleaning solution may comprise an acidic solution. Thus, the cleaning head 310 may comprise a material that is resistant to acidic solutions that may flow through the cleaning head. In addition, water, whether in an acidic solution or separately delivered, may flow through the cleaning head 310. In some embodiments, the cleaning head 310 may include a hydrophobic material that may resist wetting by the cleaning fluid and may facilitate movement and removal of the cleaning fluid through the cleaning head 310. By utilizing a hydrophobic material, the cleaning fluid may preferably fill the volume of the grooves because the cleaning fluid may repel (repelled) from the cleaning head to form a high contact angle of the cleaning solution on the surface of the cleaning head, e.g., greater than 90 °. This ensures that the entire surface of the seal is in contact with the cleaning solution. For example, the cleaning head 310 may be or may include a material similar to or the same as the material of the seal to be cleaned, and may be any of the materials previously described. The cleaning head 310 may also be or include a fluoropolymer including polyvinyl fluorides (polyvinylfluorides), vinyl fluoride compounds including polytetrafluoroethylene (polytetrafluoroethylene), fluoropropylene compounds, and other compounds that are resistant to any material used in electroplating or the cleaning operation in question.

Fig. 4 depicts a schematic perspective view of a cleaning head 310, in accordance with some embodiments of the present technique. FIG. 4 may further depict the back 316 of the cleaning head 310, and may depict the fluid delivery ports 324. As previously explained, the fluid tube 307 may extend along the arm 305 and may be fluidly connected with the cleaning head 310. The tubing may be fluidly coupled with the cleaning head 310 via a fluid delivery port 324, the fluid delivery port 324 being defined or located in the back 316 of the cleaning head. Although three fluid delivery ports 324 are shown, any number of fluid delivery ports 324 may be included in the system depending on the size and configuration of the cleaning assembly. The fluid delivery port may be open to the channel 318, such as the back side of the channel 318 as will be described below, and may be used to deliver cleaning solution to the channel or may be used to withdraw cleaning solution from the channel. For example, in one embodiment, including those used to illustrate possible configurations contemplated by the present technology, fluid delivery port 324a may be fluidly coupled with fluid delivery tube 307a, and fluid delivery ports 324b, 324c may be fluidly coupled with two fluid removal tubes 307 b. The cleaning assembly may also accommodate any other configuration, as will be understood by those skilled in the art.

FIG. 5 depicts a schematic view of an exemplary apparatus for positioning a cleaning head, in accordance with some embodiments of the present technique. The illustrated apparatus may include a base 303, and the torque control motor may be connected within the base 303. The arm 305 may be coupled to the base 303 and the cleaning head 310 may be coupled to the arm 305 at a distal location. As before, the base 303 may be operable to pivot or swing the arm 305 to allow the cleaning head 310 to be positioned relative to a seal or other device to be cleaned. During operation of the base 303, the cleaning head 310 is maintained in a retracted or retracted position, which can help position the cleaning head 310 while limiting the opportunity for the cleaning head 310 to contact seals or other components. By maintaining the cleaning head 310 in an upwardly concave downward facing position, the cleaning head 310 may pass over the seal to be cleaned before being positioned in contact with the seal.

Figure 6 depicts a schematic view of an exemplary apparatus for positioning a cleaning head, in accordance with some embodiments of the present technique. Once the cleaning head 310 has been swung into the interior region of the seal, the arm 305 can be rotated to position the cleaning head 310 in an operating position in which the cleaning head 310 can contact the seal or other component to be cleaned. While in some embodiments the arm 305 may be rotated in either direction to operably position the cleaner head 310, in some embodiments the arm 305 may be swung clockwise to provide an amount of compression of the seal by the cleaner head 310. Fig. 5-6 depict one possible system for delivering the cleaning head 310 to the seal or component to be cleaned, but it will be understood that any system may be used to pivot, rotate, or otherwise position the cleaning head 310 relative to the seal to be cleaned.

In some embodiments, fig. 4, as previously described, additionally depicts that the upper sidewall 320 may extend laterally beyond the outer edge of the lower sidewall 322. For example, when engaged with a seal, as will be illustrated below, the upper sidewall 320 may extend beyond the inner wall of the seal such that the seal may be at least partially disposed within the groove 318 during cleaning. Fig. 7 illustrates a partial cross-sectional view of the cleaning head 310 in operation, in accordance with some embodiments of the present technique. This cross-sectional view may pass through the groove 318, such as just below the upper sidewall 320. As shown and illustrated in cross-section, the cleaning head 310 may define a plurality of fluid passages 326, with the fluid passages 326 passing through the cleaning head. Each fluid passage 326 may be fluidly open to the backside of the trench 318. The fluid channel 326 may extend to the back side of the cleaning head 310 and in and out of the fluid delivery port 324. Thus, in some embodiments, the number of fluid delivery ports may be equal to the number of fluid delivery channels. The fluid delivery passage may include a larger diameter portion and a smaller diameter portion as shown, with the smaller diameter portion being located between the groove 318 and the larger diameter portion. Adjustment of the diameter of the passage may further assist in the movement of fluid through the cleaning head.

The cleaning head may comprise one or more contact pins which may interact with the seal to be cleaned. As shown, the cleaning head 310 may contact seals 510 located on the contact pins 328 and 330. In operation, the system head rotor may rotate the seal 510 across the cleaning head 310. The direction of rotation as shown may begin at the leading edge 332 of the cleaning head 310 and extend laterally or radially along the cleaning head to the trailing edge 334. The contact pins 328 may extend at least partially through the grooves 318 and may be positioned perpendicularly through the front 314 of the cleaning head 310. The contact pins 328 may be positioned near the leading edge 332 of the cleaning head 310. During a cleaning operation, the contact pin 328 may be configured to be in direct contact with the seal 510. Further, the contact pins 330 may be coincident with the contact pins 328 and may be positioned near the trailing edge 334 of the cleaning head 310 in the rotational direction of the seal 510 across the cleaning head. By extending the contact pin only partially within the groove 318 in some embodiments, the seal may be at least partially recessed within the groove above and below the seal. Accordingly, a clean volume may be defined within the groove 318 between the first contact pin 328, the seal 510, and the second contact pin 330. This volume may be configured to maintain cleaning fluid delivered through the fluid passage of the cleaning head to limit or avoid any leakage from the cleaning head.

The cleaning head 310 may also include a standoff pin 336, the standoff pin 336 being positioned between the first contact pin 328 and the second contact pin 330. The clearance pin 336 may extend at least partially through the groove 318 similar to a contact pin. In some embodiments, unlike the contact pins, the clearance pins 336 may not contact the seal 510. The clearance pin 336 may instead define a clearance between the clearance pin and the seal when the contact pin is in direct contact with the seal 510. Accordingly, the clearance pin 336 may facilitate contact between the delivered cleaning fluid and the seal to ensure complete wetting of the seal during seal rotation. As previously described, the components of the cleaning head 310 may be hydrophobic, and thus depending on the gap distance between the groove and the seal, cleaning fluid may flow from the fluid delivery channel to the fluid removal channel without contacting the seal or intermittently contacting the seal.

By including the clearance pin 336, a reduced clearance that can be used to ensure full contact along the surface of the seal can be maintained as the seal is rotated across the cleaning head. In some embodiments, the gap may be less than or about 1cm, and may be less than or about 9mm, less than or about 8mm, less than or about 7mm, less than or about 6mm, less than or about 5mm, less than or about 4mm, less than or about 3mm, less than or about 2mm, less than or about 1mm, less than or about 0.5mm, less than or about 0.2mm, or less, depending on the size of the system and the surface to be cleaned. The contact pins 328, 330 and the clearance pin 336 may be of a material similar to or different from the material of the seal or cleaning head, and may be or include any of the aforementioned materials. The pins may be a general purpose plastic including polyethylene (polyethylene) or any other long chain polymer material that may provide low friction or other beneficial properties. Further, while the material may be compatible with the seal material to limit damage to the seal, the pins may comprise any other polymer that is resistant to wear since the contact pins may directly contact the seal. The pins may also be accessible from below the cleaning head and replaced when needed.

The clearance pin 336 may be positioned within the cleaning head between the inlet and outlet passages for the cleaning fluid. For example, as shown, the first fluid passage 326a may extend inward to the contact pin 328 and open into the groove 318 in the first position. The second and third fluid passages 326b, 326c may fluidly open to second and third locations along the groove, respectively, that are radially or laterally offset from the first location, respectively, in the direction of rotation of the seal. The clearance pin 336 may be located between the first and second fluid passages and may be positioned at least partially within the groove between the first and second positions.

The cleaning solution may be flowed or pumped into the first fluid passage 326a, for example, by delivering the cleaning solution through the fluid delivery tube 307a to a first fluid delivery port in the cleaning head 310. The second fluid passage 326b and the third fluid passage 326c may be used to withdraw the cleaning solution after the cleaning solution has contacted the seal 510 near the clearance pin 336 and interacted with the seal 510. The second fluid channel and the third fluid channel may be coupled to a vacuum system through a fluid removal tube. This vacuum system is, for example, an aspirator (asparator) that can perform a suction action to draw cleaning fluid from the gutter 318 and from the cleaning head 310. The seal may be rotated during the flow of the cleaning solution to ensure that one or more surfaces of the entire seal are cleaned. As previously mentioned, the torque controlled motor may be coupled to the arm, the cleaning head may be coupled to the arm, and the torque controlled motor may ensure that the cleaning head remains in contact with the seal along the seal at all times while rotating.

Fig. 8 illustrates another partial cross-sectional view of the cleaning head 310 in operation, in accordance with some embodiments of the present technique. This partial cross-sectional view may pass perpendicularly through the third fluid passage 326 c. FIG. 8 depicts additional aspects of the seal 510, which may include an inner annular sidewall 512. The inner annular sidewall may be a location where plating residues are formed, and in some embodiments, the inner annular sidewall may be the only location to contact electrolyte. When the arm with the cleaning head thereon is rotated, for example, clockwise, the cleaning head may swing downward from a raised or retracted position and may directly contact seal 510 along inner annular sidewall 512, for example, by contacting seal 510 directly with the aforementioned contact pins. The inner annular sidewall 512 may extend within the channel 518 and may be recessed below the upper sidewall 320 of the channel 318 of the cleaning head 310. The seal may also be at least partially recessed across the lower sidewall 322 in some embodiments, and the lower sidewall 322 may feature an arcuate profile to accommodate the shape of the seal to limit cleaning solution leakage between these components. By utilizing such a cleaning assembly, in-situ cleaning may be performed on the seal to reduce or eliminate residue on the seal. The residue on the seal may be conductive and may interfere with the plating operation.

The previously described systems and components may be used in a number of methods for in situ component cleaning. Fig. 9 depicts operations of an exemplary method 900 of cleaning a contact seal of an electroplating system, according to some embodiments of the present technique, and the exemplary method 900 may use any of the components previously described, such as the cleaning head 310. The method 900 may include several operations prior to actual seal cleaning. For example, prior to cleaning, the system head may be positioned, which may be inverted, for example, to expose the contact seal or other component to be cleaned. The arm of the cleaning assembly may be positioned in the interior of the head and may rotate the cleaning head into contact with the contact seal or other component. At operation 910, a cleaning solution may be delivered through the cleaning head to contact the seal. The cleaning head may be positioned in physical contact with the plating system contact seal and the cleaning solution may be delivered through the first fluid passage of the cleaning head. At operation 920, the seal may be rotated across the cleaning head, which may allow the cleaning solution to contact the entire surface. At operation 930, during the rotation and delivery of the cleaning solution, the cleaning solution can be drawn from the cleaning head and passed through a second fluid channel radially offset from the first fluid channel in a direction of rotation of the electroplating system. Although depicted in a particular sequential order, operations 910 and 920 may be performed in any order, including simultaneously. For example, the method 900 may begin with rotating a seal operable to draw cleaning solution as it enters the cleaning head from the delivery channel to the retrieval channel. By starting this operation with a rotating seal, the seal can be used to establish a balance between fluid flow and exhaust rates (oscillations) to facilitate fluid transfer from the transfer channel to the return channel. Further, the rotation of the seal of operation 920 may be performed simultaneously with the delivery of the solution.

In some embodiments, the cleaning solution may be or may include an acidic solution. The residue may include metal ions or materials on the surface of the seal, which may be removed by acid wash. The acidic solution may be selected based on the metal being plated, and may include nitric acid, acetic acid, sulfuric acid, or any other organic or inorganic acid, and may include acid mixtures that may aid in removing copper material, nickel material, tin-silver solder, or other materials that may contribute to the removal of plating and may cause residue to form on the seal. Other materials include metal organic materials and composite metals such as silver, for example in a tin-silver bath.

As explained above, the cleaning head may be made of a hydrophobic material, which may limit or avoid wetting of the cleaning solution onto the cleaning head material. The delivery of cleaning solution, removal of cleaning solution, and rotation of the seal may also be performed in a manner that limits contact of the solution with the surface of the cleaning head, as well as limits dripping or leakage of solution from the cleaning head into contact with any other component of the system head. For example, if an acidic solution is allowed to interact with the contact, damage to the contact may result, and thus, by carefully controlling the delivery and removal of the solution, the acidic solution may be used in the present techniques, unlike other in situ systems that may be limited to the use of water. By utilizing the present techniques, the cleaning solution may be substantially maintained within a volume defined in part by the inner surface of the contact seal, a groove formed in the front of the cleaning head, and one or more contact pins extending at least partially through the groove, the contact pins being located adjacent the leading and trailing edges of the cleaning head in a direction of rotation of the contact seal across the cleaning head.

In some embodiments, a water rinse may be performed with water (such as deionized water) followed by delivery and removal of the cleaning solution. The water may be delivered in the same manner as the cleaning solution. In some embodiments, the water may be delivered at a volume flow rate greater than the cleaning solution. By delivering additional water relative to the removal rate, the water may flow further into the volume, for example interacting with the contact pins 328 or 330, and any residual cleaning solution may be efficiently rinsed from the cleaning head. In addition, a certain amount of water may leak or be ejected from the cleaning head and may wash the lower contacts on the system head. The present techniques provide the ability to clean the contact seal in-situ, which limits the downtime of the electroplating equipment, while also limiting the formation of conductive residues on the exposed tool surfaces that may affect the plating uniformity on the substrate. Thus, improved yield and quality may be provided by systems and methods according to the present techniques.

In the description above, for the purposes of explanation, numerous details have been set forth in order to provide an understanding of various embodiments of the present technology. It will be apparent, however, to one skilled in the art that the specific embodiments may be practiced without some or with additional details. For example, other substrates that may benefit from the described wetting techniques may be used with the present techniques.

Having disclosed several embodiments, it will be recognized by those of skill in the art that various modifications, alternative constructions, and equivalents may be used without departing from the spirit of the embodiments. Additionally, some well known processes and elements have not been described in order to avoid unnecessarily obscuring the present technology. Accordingly, the above description should not be taken as limiting the scope of the present technology.

It will be understood that where a range of values is provided, each intervening value, to the smallest unit of lower limit, between the upper and lower limit of that range is also specifically disclosed unless the context clearly dictates otherwise. Any stated value or intervening value in a stated range, or any narrower range between any other stated or intervening value in a stated range is encompassed. The upper and lower limits of these smaller ranges may independently be included or excluded in the range, and any specifically excluded limit in the stated range is intended to be encompassed within the technology, subject to any specifically excluded limit in the stated range, or each range where either, neither or both limits are included in the smaller ranges. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included. Where multiple values are provided in a list, any range encompassing or based on those values is similarly specifically disclosed.

As used herein and in the appended claims, the singular forms "a", "an", and "the" include plural references unless the content clearly dictates otherwise. Thus, for example, reference to "a material" includes a plurality of such materials, and reference to "the channel" includes reference to one or more channels and equivalents thereof known to those skilled in the art, and so forth.

Furthermore, the words "comprise(s)", comprising, containing, holding, including(s), and including "when used in this specification and in the claims which follow are intended to specify the presence of stated features, integers, components, or operations, but they do not preclude the presence or addition of one or more other features, integers, components, operations, acts, or groups thereof.