阅读说明：本技术 把持装置和安装装置 (Gripping device and attachment device ) 是由 桥本康彦 坂东贤二 木村俊满 于 2018-11-15 设计创作，主要内容包括：本发明提供一种抑制电子部件从基板产生弹回的电子部件的把持装置和安装装置。把持装置具备：把持机构,其把持电子部件；和按压部,其设置于把持机构,在将由把持机构把持的电子部件安装于基板并解除电子部件的把持时,以阻碍电子部件向离开基板的方向移动的方式按压电子部件。(The invention provides an electronic component holding device and a mounting device for inhibiting the electronic component from rebounding from a substrate. The gripping device is provided with: a holding mechanism for holding the electronic component; and a pressing portion provided to the holding mechanism, the pressing portion pressing the electronic component so as to prevent the electronic component from moving in a direction away from the substrate when the electronic component held by the holding mechanism is mounted on the substrate and the holding of the electronic component is released.)

1. A holding device is characterized in that,

the gripping device includes:

a holding portion that holds an electronic component; and

and a pressing portion provided on the holding portion, the pressing portion pressing the electronic component so as to prevent the electronic component from moving in a direction away from the substrate when the electronic component held by the holding portion is mounted on the substrate and the holding of the electronic component by the holding portion is released.

2. The gripping device of claim 1,

the pressing portion is provided at a position of the holding portion opposed to the electronic component,

the distal end portion of the pressing portion on the side close to the electronic component is displaceable in a direction close to or away from the electronic component in accordance with a distance between the facing position of the holding portion and the electronic component.

3. The holding device according to claim 1 or 2,

the pressing part is an elastic body.

4. The gripping device of claim 2,

a passage is provided in the grip portion in a direction to approach or separate from the electronic component,

the pressing portion is movable inside the passage along a direction in which the passage extends.

5. A mounting device is characterized in that a mounting device is arranged on a base,

the mounting device is provided with:

a holding portion that holds an electronic component;

a pressing portion provided on the holding portion, the pressing portion pressing the electronic component so as to prevent the electronic component from moving in a direction away from the substrate when the electronic component held by the holding portion is mounted on the substrate and the holding of the electronic component by the holding portion is released; and

and a control unit that controls gripping of the electronic component by the gripping unit, release of the gripping of the electronic component by the gripping unit, and movement based on the gripping unit.

6. The mounting device of claim 5,

the gripping part is configured as a hand of the robot.

Technical Field

The present invention relates to an electronic component holding device for holding an electronic component and a mounting device for mounting the held electronic component on a substrate.

Background

Conventionally, a technique has been proposed in which an electronic component is gripped by a robot and a lead of the electronic component is inserted into a through hole of a substrate. As such a mounting device, there is a device disclosed in patent document 1.

Patent document 1: japanese laid-open patent publication No. 5-55784

However, in the case where the robot is moved at a high speed to mount the electronic components on the substrate in order to mount a large number of electronic components in a short time using the electronic component mounting apparatus disclosed in patent document 1, there is a possibility that the electronic components may bounce back when the electronic components are mounted on the substrate. Specifically, when the robot is moved at a high speed to place the electronic component on the substrate, a large force acts on the substrate, and therefore the substrate may be bent, and the electronic component may be repelled by the restoring force of the substrate at that time. When the electronic component bounces back and floats, the floating electronic component may fall off from the through hole of the substrate.

Disclosure of Invention

In view of the above circumstances, an object of the present invention is to provide an electronic component holding device and a mounting device that suppress the occurrence of bouncing of an electronic component from a substrate.

The gripping device of the present invention is characterized by comprising: a holding portion that holds an electronic component; and a pressing portion provided to the holding portion, the pressing portion pressing the electronic component so as to prevent the electronic component from moving in a direction away from the substrate when the electronic component held by the holding portion is mounted on the substrate and the holding of the electronic component by the holding portion is released.

In the holding device having the above configuration, when the holding of the electronic component is released by the pressing portion provided to the holding portion, the electronic component is pressed so as to be inhibited from moving in a direction away from the substrate, and therefore, the electronic component can be prevented from floating up due to rebounding from the substrate. Therefore, the electronic component can be prevented from falling off the substrate when the electronic component is mounted on the substrate.

Further, the following may be configured: the pressing portion is provided at an opposing position of the holding portion to the electronic component, and a distal end portion of the pressing portion on a side close to the electronic component is displaceable in a direction to approach or separate from the electronic component in accordance with a distance between the opposing position of the holding portion and the electronic component.

The electronic component side end portion of the pressing portion can be displaced in a direction approaching or separating from the electronic component in accordance with a distance between an opposing position of the holding portion opposing the electronic component and the electronic component, and therefore, when the holding portion is released from the holding and the electronic component is separated, the pressing portion continues to abut against the electronic component following the electronic component, and the electronic component can be suppressed from floating upward. Therefore, when the grip portion releases the grip, the electronic component can be more reliably prevented from falling off the substrate.

Further, the following may be configured: the pressing part is an elastic body.

Since the pressing portion is made of an elastic body, the electronic component can be prevented from floating up due to springback from the substrate with a simple structure.

Further, the following may be configured: a passage is provided in the holding portion in a direction to approach or separate from the electronic component, and the pressing portion is movable in the passage in a direction in which the passage extends.

The pressing portion is movable in the passage along the direction in which the passage extends, and therefore, floating of the electronic component due to springback from the substrate can be suppressed with a simple configuration.

Further, the mounting device of the present invention includes: a holding portion that holds an electronic component; a pressing portion provided on the holding portion, the pressing portion pressing the electronic component so as to prevent the electronic component from moving in a direction away from the substrate when the electronic component held by the holding portion is mounted on the substrate and the holding of the electronic component by the holding portion is released; and a control unit that controls gripping of the electronic component by the gripping unit, release of the gripping of the electronic component by the gripping unit, and movement by the gripping unit.

In the mounting device having the above configuration, the control of the control unit controls the holding unit to hold the electronic component, the release of the holding of the electronic component by the holding unit, and the movement of the holding unit, so that the electronic component can be prevented from falling off the substrate when the electronic component is mounted on the substrate, and the mounting operation of the electronic component can be performed accurately and with high precision.

Further, the following may be configured: the gripping part is configured as a hand of the robot.

Since the holding portion is configured as a hand of the robot, the electronic component can be mounted with high accuracy and at high speed by the mounting device.

According to the present invention, when the electronic component is mounted on the substrate, the electronic component can be reliably mounted on the substrate because the electronic component can be prevented from springing back from the substrate. Therefore, the electronic component can be mounted more efficiently.

Drawings

Fig. 1 is a front view showing a schematic configuration of a mounting device according to a first embodiment of the present invention.

Fig. 2 is an enlarged side view showing a gripping device in the mounting device of fig. 1.

Fig. 3 is an enlarged perspective view showing a gripping mechanism in the gripping device of fig. 2.

Fig. 4 is a block diagram showing a configuration of a control system of the mounting device of fig. 1.

Fig. 5 (a) to (d) are structural diagrams showing respective steps when the electronic component is mounted on the substrate using the mounting apparatus of fig. 1.

Fig. 6 (a) and (b) are structural diagrams showing respective steps when an electronic component is mounted on a substrate using a mounting device according to a second embodiment of the present invention.

Detailed Description

Hereinafter, an electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.

(mounting device 100)

Fig. 1 is a diagram showing a schematic configuration of a mounting device 100 according to an embodiment of the present invention. As shown in fig. 1, the mounting device 100 according to the present embodiment includes a robot 11.

The robot 11 for mounting the apparatus 100 includes: a base 12 fixed to the carriage; a pair of robot arms 13a and 13b (a first robot arm 13a and a second robot arm 13b) supported by the base 12; and a control unit 14 housed in the base 12. The robot 11 can be installed in a limited space (for example, 610mm × 620mm) corresponding to the size of one person.

Hereinafter, a direction in which the pair of robot arms are opened is referred to as a left-right direction, a direction parallel to the axis of the base shaft is referred to as an up-down direction, and a direction orthogonal to the left-right direction and the up-down direction is referred to as a front-back direction. The robot 11 of the present embodiment is applied to a mounting site of a wiring board, and performs a work of mounting an electronic component with a lead on the wiring board.

(A pair of robot arms 13a, 13b)

The first robot arm 13a (the right robot arm in the figure) and the second robot arm 13b (the left robot arm in the figure) are each a horizontal articulated robot arm configured to be movable relative to the base 12. The first robot arm 13a includes an arm portion 15, a toggle link portion 17, and a first end effector 18 a. The second robot arm 13b includes an arm portion 15, a toggle link portion 17, and a second end effector 18 b. The pair of robot arms 13a and 13b can be operated independently or in association with each other.

In the present embodiment, the arm portion 15 is constituted by a first link 15a and a second link 15 b. The first link 15a is rotatably coupled to a base shaft 16 fixed to the upper surface of the base 12 via a rotary joint J1, and is rotatable about a rotation axis L1 passing through the axial center of the base shaft 16. The second link 15b is rotatably coupled to the distal end of the first link 15a by a rotary joint J2, and is rotatable about a rotation axis L2 defined at the distal end of the first link 15 a.

An elbow lever portion 17 is attached to the distal end of the second link 15 b. The distal end of the second link 15b is coupled to the toggle link 17 via a linear joint J3 and a rotary joint J4. The toggle link 17 can be moved up and down with respect to the second link 15b by the linear joint J3. The toggle link 17 can be pivoted about a pivot axis L3 perpendicular to the second link 15b by the pivot joint J4. The elbow section 17 has a mechanical interface 19 for mounting the first end effector 18a or the second end effector 18 b.

The first end effector 18a is connected to the mechanical interface 19 of the right elbow lever 17. That is, the first end effector 18a is provided at the end of the first robot arm 13 a. Similarly, the second end effector 18b is coupled to the mechanical interface 19 of the left elbow lever 17. In this embodiment, the second end effector 18b is not used, and the mechanical interface 19 of the elbow lever portion 17 on the left side is not connected to any component.

The pair of robot arms 13a and 13b having the above-described structure have joints J1 to J4, respectively. Further, a servo motor (not shown) for driving, an encoder (not shown) for detecting a rotation angle of the servo motor, and the like are provided in the pair of robot arms 13a and 13b so as to be associated with the joints J1 to J4, respectively. The rotation axis L1 of the first link 15a of the first robot arm 13a and the rotation axis L1 of the first link 15a of the second robot arm 13b are collinear, and the first link 15a of the first robot arm 13a and the first link 15a of the second robot arm 13b are arranged at a step in the vertical direction.

(first end effector 18a)

Referring to fig. 2, the first end effector 18a will be described. Fig. 2 shows a state in which the robot 11 used in the mounting apparatus 100 of the present embodiment grips a plurality of electronic components E by a gripping device 60 provided as an end effector.

The first end effector 18a includes a holding device 60 provided rotatably at a base thereof for holding the electronic component E, and a connecting portion 70 connecting the holding device 60 and the toggle link portion 17. The connecting portion 70 is disposed to extend vertically downward from the toggle portion 17.

The gripping device 60 includes a plurality of gripping mechanisms (gripping portions) 64. In the present embodiment, the gripping device 60 includes eight gripping mechanisms 64. The gripping mechanism 64 is configured to be able to grip one electronic component E. In the gripping device 60, eight gripping mechanisms 64 are provided radially at intervals in the circumferential direction.

The holding device 60 includes a disk member 62. The disk member 62 is attached to the connecting portion 70 such that the central portion is located near the lower end portion of the connecting portion 70. The disk member 62 is provided rotatably. In the present embodiment, the disk member 62 is attached to be rotatable about a rotation axis I extending in the horizontal direction. Therefore, the disk member 62 is attached to be rotatable in a plane perpendicular to the horizontal plane.

The gripping mechanisms 64 each have a chuck portion 80 at a distal end portion.

The eight gripping mechanisms 64 each grip one electronic component E, and mount the electronic component E on the substrate. Each of the eight gripping mechanisms 64 includes a radially extending portion 66 extending in the radial direction of the disk member 62, and a collet portion 80 provided at a distal end portion of the radially extending portion 66. The collet portion 80 according to the present embodiment holds the electronic component E by restraining the electronic component E so as to sandwich the electronic component E from the outside.

(holding means 64)

Fig. 3 shows an enlarged perspective view of one of the eight gripping mechanisms 64, namely the gripping mechanism 64. The gripping mechanism 64 includes a plurality of chuck units 80. In the present embodiment, the gripping mechanism 64 includes three chuck units 80a, 80b, and 80 c.

The three clip portions 80a, 80b, and 80c are configured to be movable in directions to approach and separate from each other. The structure is as follows: the plurality of chuck units 80 are separated from each other and hold the electronic component between the chuck units, and the plurality of chuck units 80 are moved in the direction of approaching each other, whereby the holding mechanism 64 can hold the electronic component E. Further, the structure is: the plurality of chuck units 80 are moved in a direction away from each other from a state where the electronic component E is gripped between the plurality of chuck units 80, whereby the gripping mechanism 64 can release the gripping of the electronic component E.

In the present embodiment, when the holding mechanism 64 holds the electronic component E, the electronic component E is disposed between the three chuck sections 80a, 80b, and 80c in a state where the chuck sections are separated from each other. In a state where the electronic component E is disposed between the three chuck units 80a, 80b, and 80c, the three chuck units 80a, 80b, and 80c are moved in directions to approach each other, and the electronic component E is clamped, whereby the clamping mechanism 64 clamps the electronic component E. Further, the gripping mechanism 64 releases the gripping by the gripping mechanism 64 by moving the three clip parts 80a, 80b, and 80c in directions away from each other from the state of being gripped by the three clip parts 80a, 80b, and 80 c.

In the present embodiment, the embodiment in which the gripping mechanism 64 includes the three clip portions 80a, 80b, and 80c has been described, but the present invention is not limited to the above embodiment. The gripping mechanism 64 may have two chuck portions. In this case, the electronic component E may be held by being sandwiched between the two clip portions from both side portions. The gripping mechanism may include four or more chuck units. The following may be configured: the four or more clip parts move in directions to approach each other, thereby clipping the electronic component located inside, and gripping the electronic component.

In the present embodiment, the pressing portion 81 is attached to the collet portion 80a of the three collet portions 80. The pressing portion 81 is attached to a position (facing position) of the chuck portion 80a of the gripping mechanism 64 facing the electronic component E. In the present embodiment, the pressing portion 81 is attached to the distal end of the chuck portion 80 a. The pressing portion 81 is formed of an elastic body, and in the present embodiment, the pressing portion 81 is formed of a spring.

(control structure)

Next, a control structure of the mounting apparatus 100 will be explained. Fig. 4 shows a block diagram of a control structure in the mounting apparatus 100.

As shown in fig. 4, the control unit 14 in the mounting apparatus 100 includes a calculation unit 14a, a storage unit 14b, and a servo control unit 14 c.

The control unit 14 is a robot controller provided with a computer, such as a microcontroller. The control unit 14 may be constituted by a single control unit 14 that performs centralized control, or may be constituted by a plurality of control units 14 that perform distributed control in cooperation with each other.

The storage unit 14b stores information such as a basic program and various kinds of fixed data as a robot controller. The arithmetic unit 14a reads out and executes software such as a basic program stored in the storage unit 14b, thereby controlling various operations of the mounting apparatus 100. That is, the arithmetic unit 14a generates a control command for the mounting apparatus 100 and outputs the command to the servo control unit 14 c. For example, the arithmetic unit 14a is constituted by a processor unit.

The servo control unit 14c is configured to control driving of the servo motors corresponding to the respective joints of the robot arms 13a and 13b in the mounting apparatus 100 based on the control command generated by the arithmetic unit 14 a.

(mounting of electronic component E)

Next, mounting of the electronic component E on the substrate S using the mounting apparatus 100 will be described. Fig. 5 (a) to (d) show structural diagrams showing the structures of the holding mechanism 64 and the electronic component E in the respective steps of mounting the electronic component E on the substrate S.

Fig. 5 (a) shows the holding mechanism 64 holding the electronic component E and the electronic component E in a state where the holding mechanism 64 moves toward the through holes 90 and 91 of the substrate S to be mounted. As shown in fig. 5 (a), the electronic component E is gripped by the gripping mechanism 64 by being gripped by the gripper portion 80 of the gripping mechanism 64. The holding mechanism 64 moves toward the through hole to be mounted on the substrate S in a state where the electronic component E is held.

When the lead wires 68 and 69 extending from the electronic component E reach positions corresponding to the through holes 90 and 91 to be mounted on the substrate S, the holding mechanism 64 moves downward from the positions, and the electronic component E approaches the substrate S and the lead wires 68 and 69 are inserted into the through holes 90 and 91. Fig. 5 (b) shows a configuration diagram of the holding mechanism 64 and the electronic component E in a state where the lead wires 68 and 69 extending from the electronic component E are inserted into the through holes 90 and 91. In this state, the electronic component E is held by the chuck portion 80.

When the lead wires 68 and 69 of the electronic component E are inserted into the through holes 90 and 91 of the substrate S, the collet portions 80 of the gripping mechanism 64 move in directions away from each other. Fig. 5 (c) shows a configuration diagram of the holding mechanism 64 and the electronic component E in a state where the collet portion 80 of the holding mechanism 64 moves in a direction away from each other. The chuck portions 80 of the gripping mechanism 64 move in the direction away from each other, thereby releasing the gripping of the electronic component E by the gripping mechanism 64.

At this time, the pressing portion 81 presses the electronic component E from above in a direction toward the substrate S. Therefore, the pressing portion 81 presses the electronic component E in a direction to prevent the electronic component E from moving upward.

When the holding mechanism 64 releases the holding of the electronic component E, the holding mechanism 64 moves in a direction away from the electronic component E. Fig. 5 (d) shows a configuration diagram showing a state in which the holding mechanism 64 moves in a direction away from the electronic component E. When the holding mechanism 64 is separated from the electronic component E and the distal end portion 81a of the pressing portion 81 on the electronic component E side is separated from the electronic component E, the mounting of the electronic component E on the substrate S is completed.

In the present embodiment, the robot 11 to which the apparatus 100 is attached includes a gripping device 60 as the first end effector 18 a. That is, the gripping device 60 functions as a hand of the robot 11 in the mounting device 100. At this time, the gripping device 60 is moved by the control of the control unit 14 of the robot 11, and the gripping mechanism 64 is moved. Therefore, the control unit 14 of the robot 11 moves the gripping device 60, and the gripping mechanism 64 moves while gripping the electronic component E, so that the lead wires 68 and 69 of the electronic component E are inserted into the through holes 90 and 91 of the substrate S. Further, the control unit 14 of the robot 11 controls the gripping of the electronic component E by the gripping device 60 and the release of the gripping. Therefore, the holding of the electronic component E is released by the control of the control unit 14 of the robot 11, and the holding mechanism 64 moves in a direction away from the electronic component E.

Thereafter, the gripping device 60 rotates and moves the disk member 62 so that the next gripping mechanism 64 is disposed at a position facing the through hole to be mounted on the substrate S. Thereby, the mounting of the electronic component E to the next through hole by the next gripping mechanism 64 is started.

As the mounting apparatus 100 for the electronic component E, in order to improve the productivity (Throughput) during mounting, the holding mechanism 64 may be moved at a high speed, and the electronic component E may be mounted at a high speed. When the electronic component E is mounted at a high speed, the speed when the leads 68 and 69 of the electronic component E are moved downward to be inserted into the through holes 90 and 91 is high. In this case, when the electronic component E is mounted on the substrate S, the bottom surface of the electronic component E comes into contact with the substrate S, and a relatively large force F1 is applied in a direction in which the substrate S is pushed downward by the bottom surface of the electronic component E.

As shown in fig. 5 (b), when the force F1 acts in the direction of pushing the substrate S downward, the substrate S slightly flexes so as to protrude downward. When the substrate S is flexed to protrude downward, the substrate S is thereafter flexed in a direction protruding upward by the restoring force of the substrate S. Due to the restoring force of the substrate S at this time, the force F2 acts in the upward direction on the electronic component E.

Even in the case where the pressing portion 81 is not provided, the electronic component E may float due to the upward force F2 of the electronic component E. When the force F2 is large at this time, the leads 68 and 69 of the electronic component E may move to positions above the through holes 90 and 91, and the electronic component E may be detached from the through holes 90 and 91.

In the present embodiment, the pressing portion 81 is disposed at a position facing the electronic component E in the collet portion 80 a. Therefore, when the chuck portions 80 move in the direction away from each other and the holding mechanism 64 releases the holding of the electronic component E, the electronic component E can be pressed downward. Therefore, when the holding by the holding mechanism 64 is released, the upward movement of the electronic component E can be suppressed.

Since the upward movement of the electronic component E is suppressed, the electronic component E can be suppressed from being accidentally detached from the through holes 90 and 91 of the substrate S. Therefore, when the electronic component E is mounted on the substrate S, the leads 68 and 69 of the electronic component E do not fall off the through holes 90 and 91, and the electronic component E can be reliably mounted on the substrate S. Since the electronic component E is reliably mounted, the electronic component E can be more efficiently mounted. Therefore, the running cost can be reduced when the electronic component E is mounted.

Further, even if the holding mechanism 64 is moved at a high speed and the electronic component E is mounted at a high speed, the electronic component E can be reliably mounted. Therefore, the number of electronic components E that can be mounted per unit time can be increased, and the productivity of mounting electronic components E can be improved.

In addition, in the present embodiment, the configuration is such that: since the pressing portion 81 is formed of a spring, the distal end portion 81a on the side close to the electronic component E can be displaced in the direction of approaching to and separating from the electronic component E. Therefore, as shown in fig. 5 (c), when the holding mechanism 64 releases the holding of the electronic component E and the holding mechanism 64 moves in the direction away from the electronic component E, the pressing part 81 can also continue to contact the electronic component E.

In the present embodiment, as shown in fig. 5 (b), electronic component E is gripped by gripping mechanism 64 in a state where pressing part 81 is compressed. Therefore, the pressing portion 81 is attached to the distal end portion of the holding mechanism 64 while being biased in the direction toward the electronic component E. Even if the holding mechanism 64 moves and the chuck part 80 of the holding mechanism 64 is separated from the electronic component E, the distal end part 81a of the pressing part 81 on the electronic component E side can be displaced in the direction toward the electronic component E according to the distance between the chuck part 80 of the holding mechanism 64 and the electronic component E. Therefore, the pressing portion 81 can continue to abut against the electronic component E. In this way, the distal end portion 81a of the pressing portion 81 on the electronic component E side is configured to be displaceable according to the distance between the position facing the electronic component E and the electronic component E in the gripping mechanism 64. Therefore, when the holding mechanism 64 releases the holding of the electronic component E, the holding mechanism 64 releases the holding of the electronic component E in a state where the pressing portion 81 is already in contact with the electronic component E. Thus, at the time of releasing the holding of the electronic component E by the holding mechanism 64, the pressing portion 81 is already in contact with the electronic component E, and the upward movement of the electronic component E is suppressed.

When releasing the grip of the gripping mechanism 64, the gripping mechanism 64 is moved in a direction away from the electronic component E in a state where the distal end portion 81a of the pressing portion 81 is in contact with the electronic component E, whereby the grip of the gripping mechanism 64 can be released while gradually reducing the pressing force on the electronic component E. When the holding mechanism 64 releases the holding of the electronic component E, the holding is released while gradually reducing the pressing force in the direction toward the substrate S, and therefore, the pressing force applied to the electronic component E can be prevented from being suddenly released.

If the pressing force of the holding mechanism 64 is suddenly released, elastic energy due to downward displacement of the substrate S is suddenly released, and the electronic component E is suddenly displaced upward, so that the lead wires 68 and 69 may be detached from the through holes 90 and 91.

In contrast, in the present embodiment, even when the holding by the holding mechanism 64 is released, the pressing portion 81 continues to press the electronic component E in the direction toward the substrate S, and the holding mechanism 64 is separated from the electronic component E while the pressing force in the direction toward the substrate S is gradually reduced. Therefore, when the gripping mechanism 64 releases the gripping, it is possible to suppress the elastic energy from the substrate S from being suddenly released due to the displacement of the substrate S. This can suppress the electronic component E from springing back and floating up, and can suppress the leads 68 and 69 of the electronic component E from coming off the through holes 90 and 91 of the substrate S.

In the present embodiment, since the gripping mechanism 64 is configured as a hand of a robot, the mounting of the electronic component E by the mounting device 100 can be performed with high accuracy and at high speed. In the present embodiment, the electronic component E is gripped by the gripping mechanism 64, the gripping of the electronic component E is released by the gripping mechanism 64, and the movement by the gripping mechanism 64 is performed by the control of the control unit 14 of the robot 11, and therefore these operations can be performed accurately and with high accuracy.

(second embodiment)

Next, a test apparatus according to a second embodiment of the present invention will be described. Note that, in the drawings, the same reference numerals are given to the same components as those of the first embodiment, and the description thereof will be omitted, and only different components will be described.

In the first embodiment described above, the pressing portion 81 is formed of an elastic body. In contrast, the second embodiment differs from the first embodiment in that the pressing portion is formed of a columnar body movable inside the passage.

Fig. 6 (a) shows a configuration diagram of a holding mechanism 64a and an electronic component E in a state where the electronic component E is held by the holding mechanism 64a in the second embodiment. Fig. 6 (b) shows a configuration diagram of the holding mechanism 64a and the electronic component E in a state where the holding of the electronic component E by the holding mechanism 64a in the second embodiment is released.

In the gripping mechanism 64a according to the second embodiment, a passage 83 is provided in the chuck portion 80 a. In the present embodiment, the passage 83 is provided to penetrate the chuck portion 80a in the vertical direction. The passage 83 in the chuck portion 80a is provided with a pressing portion 82. The pressing portion 82 is disposed movably inside the passage 83. In the present embodiment, the pressing portion 82 is a columnar body movable in the passage 83 along the direction in which the passage 83 extends. In the present embodiment, the pressing portion 82 is formed in a cylindrical shape so that a cross section along a horizontal plane is circular.

A flange 82a having a larger diameter than the columnar portion is formed at an end of the pressing portion 82 on the side facing the electronic component E. The pressing portion 82 is configured such that an end portion 82b of the flange portion 82a on the side facing the electronic component E abuts against the electronic component E. A flange portion 82c having a larger diameter than the cylindrical portion is formed at an end portion of the pressing portion 82 opposite to the side facing the electronic component E.

As shown in fig. 6 (a), in a state where the holding mechanism 64a in the present embodiment holds the electronic component E, the electronic component E is held by being held by the holders 80a, 80b, and 80 c.

As shown in fig. 6 (b), when the lead wires 68 and 69 of the electronic component E are inserted into the through holes 90 and 91 of the substrate S, the chuck portions 80a, 80b, and 80c of the holding mechanism 64a move in directions away from each other, and the electronic component E held by the chuck portions 80a, 80b, and 80c is released from being held.

At this time, the pressing portion 82 presses the electronic component E in a direction toward the substrate S.

In the present embodiment, the chuck portion 80a is provided with a passage 83, and the passage 83 is provided with a pressing portion 82 movably inside the passage 83. Therefore, after the chuck portions 80a, 80b, and 80c of the holding mechanism 64a release the holding of the electronic component E, the pressing portion 82 can press the electronic component E downward. Thus, at the timing when the chuck portions 80a, 80b, and 80c of the holding mechanism 64a release the holding of the electronic component E, the pressing portion 82 already presses the electronic component E. In the present embodiment, the pressing portion 82 presses the electronic component E downward by its own weight. Therefore, the electronic component E can be prevented from moving upward after releasing the gripping of the collet portions 80a, 80b, and 80c of the gripping mechanism 64 a. Thus, when the electronic component E is mounted on the substrate S, the leads 68 and 69 of the electronic component E do not fall off the through holes 90 and 91, and the electronic component E can be reliably mounted on the substrate S. Since the electronic component E is reliably mounted, the electronic component E can be more efficiently mounted. Therefore, the running cost can be reduced when the electronic component E is mounted.

Further, even if the holding mechanism 64a is moved at a high speed to mount the electronic component E at a high speed, the electronic component E can be reliably mounted. Therefore, the number of electronic components E that can be mounted per unit time can be increased, and the productivity of mounting electronic components E can be improved.

In the present embodiment, the pressing portion 82 is configured such that the distal end portion 82b on the side close to the electronic component E is displaceable in a direction to approach and separate from the electronic component E. Since the pressing portion 82 is configured to be freely movable inside the passage 83, even if the holding mechanism 64a moves in a direction away from the electronic component E, the pressing portion 82 can move in a direction toward the electronic component E following the electronic component E. That is, even if the chuck portion 80 of the holding mechanism 64a is separated from the electronic component E, the distal end portion 82b of the pressing portion 82 on the electronic component E side is displaced in the direction toward the electronic component E according to the distance between the position facing the electronic component E in the holding mechanism 64a and the electronic component E. Therefore, the pressing portion 82 can continue to abut against the electronic component E.

In this way, the distal end portion 82b of the pressing portion 82 on the electronic component E side can be displaced according to the distance between the chuck portion 80 of the gripping mechanism 64 and the electronic component E. Therefore, when the holding mechanism 64 releases the holding of the electronic component E, the holding mechanism 64a releases the holding of the electronic component E in a state where the pressing portion 82 has already come into contact with the electronic component E. Thus, at the time of releasing the holding of the electronic component E by the holding mechanism 64a, the pressing portion 82 already abuts against the electronic component E, and the upward movement of the electronic component E is suppressed. Therefore, as shown in fig. 6 (b), when the holding mechanism 64a releases the holding of the electronic component E and the holding mechanism 64a moves in the direction away from the electronic component E, the pressing portion 82 can also continue to abut against the electronic component E and press the electronic component E.

When the state in which the holding mechanism 64a holds the electronic component E as shown in fig. 6 (a) is changed to the state in which the holding mechanism 64a releases the holding of the electronic component E as shown in fig. 6 (b), the electronic component E is in a state in which the pressing force by the weight of the pressing portion 82 alone acts.

A flange 82c is provided at an end of the pressing portion 82 opposite to the side facing the electronic component E. When the gripping mechanism 64a is further separated from the electronic component E from the state shown in fig. 6 (b), the flange portion 82c comes into contact with the collet portion 80a, and the pressing portion 82 is in a state where the electronic component E cannot be further pressed. When the holding mechanism 64a further moves in a direction to separate from the electronic component E, the pressing portion 82 separates from the electronic component E.

In the present embodiment, when the holding mechanism 64a releases the holding of the electronic component E, the pressing force changes from the pressing by the holding mechanism 64a to the pressing by the weight of the pressing portion 82, and thereafter the pressing force on the electronic component E disappears. At this time, the pressing force by the weight of the pressing portion 82 is smaller than the pressing force of the gripping mechanism 64 a.

In the present embodiment, when the holding of the electronic component E by the holding mechanism 64a is released, the pressing force acting on the electronic component E is changed so that the pressing force from the holding mechanism 64a is temporarily applied via the pressing force by the weight of the pressing portion 82, and the pressing force is not applied. Therefore, when the holding mechanism 64a releases the holding of the electronic component E, the pressing force to the electronic component E is changed so as to decrease stepwise, and the holding mechanism 64a releases the holding of the electronic component E.

When releasing the hold by the holding mechanism 64, the hold is released while the pressing force in the direction toward the substrate S is gradually reduced, so that the pressing force on the electronic component E can be suppressed from being suddenly released. In the present embodiment, even when the holding by the holding mechanism 64a is released, the pressing portion 82 continues to press the electronic component E in the direction toward the substrate S, and the holding mechanism 64a is separated from the electronic component E while the pressing force in the direction toward the substrate S is gradually reduced. Therefore, when the gripping mechanism 64a releases the gripping, it is possible to suppress the elastic energy from the substrate S from being suddenly released due to the displacement of the substrate S. This can prevent the lead wires 68 and 69 of the electronic component E from coming off the through holes 90 and 91 of the substrate S due to the electronic component E floating upward.

In the above-described embodiment, the structure in which the elastic body and the columnar body movable inside the passage in the chuck portion are used as the pressing portion has been described, but the present invention is not limited to the above-described embodiment. As long as the holding mechanism can hold the electronic component when the holding mechanism releases the holding of the electronic component, and suppress the electronic component from rebounding from the substrate, another structure of the holding portion may be applied to the present invention.

Description of the reference numerals

A holding device; a holding mechanism; 81. 82.. a pressing portion; a mounting device.