阅读说明：本技术 扬声器模组及电子设备 (Loudspeaker module and electronic equipment ) 是由 李乐乐 王晨波 于 2020-06-08 设计创作，主要内容包括：本申请公开了一种扬声器模组及电子设备,属于电子产品技术领域。扬声器模组包括：壳体,壳体设置有容纳腔,所述壳体设置有透风口,所述容纳腔与所述透风口连通；制冷件,设置于所述容纳腔内,所述制冷件的制热面朝向所述透风口；扬声器组件,所述扬声器组件设置于所述容纳腔内,且所述扬声器组件的出声口朝向所述制冷件的制热面和所述透风口。本申请的方案结构简单,降低了成本,在电子设备连接扬声器组件的情况下,能够快速地将电子设备使用时产生的热量散去。(The application discloses speaker module and electronic equipment belongs to electronic product technical field. The speaker module includes: the air conditioner comprises a shell, a fan and a controller, wherein the shell is provided with an accommodating cavity, the shell is provided with an air vent, and the accommodating cavity is communicated with the air vent; the refrigerating piece is arranged in the accommodating cavity, and the heating surface of the refrigerating piece faces to the air ventilation opening; the loudspeaker assembly is arranged in the accommodating cavity, and the sound outlet of the loudspeaker assembly faces the heating surface of the refrigerating piece and the air vent. The utility model provides a scheme simple structure, the cost is reduced under the condition of electronic equipment connection speaker subassembly, can dispel the heat that produces when electronic equipment uses fast.)

1. A speaker module, comprising:

the air conditioner comprises a shell, a fan and a controller, wherein the shell is provided with a containing cavity, the shell is provided with an air vent, and the containing cavity is communicated with the air vent;

the refrigerating piece is arranged in the accommodating cavity, and the heating surface of the refrigerating piece faces to the air ventilation opening;

the loudspeaker assembly is arranged in the accommodating cavity, and the sound outlet of the loudspeaker assembly faces the heating surface of the refrigerating piece and the air vent.

2. The speaker module as claimed in claim 1, wherein a gap is formed between the cooling member and the ventilation opening.

3. The speaker module as claimed in claim 2, wherein the speaker assembly comprises a speaker unit, the speaker assembly is disposed in the gap, and the speaker unit is disposed at an end of the speaker assembly away from the cooling member.

4. The speaker module as claimed in claim 1, wherein the ventilation opening is disposed on a bottom surface of the housing, the bottom surface being opposite to a heating surface of the cooling member.

5. The speaker module as claimed in claim 1, wherein the ventilation opening is disposed at a side of the housing, the side being adjacent to a heating surface of the cooling member.

6. The speaker module as claimed in claim 4, wherein the speaker assembly comprises two speakers, the two speakers are respectively disposed at two opposite sides of the accommodating cavity, and the sound outlets of the two speakers are disposed opposite to each other.

7. The speaker module as recited in claim 6, wherein the vent is disposed in a middle region of the bottom surface of the housing.

8. The speaker module as claimed in claim 4, wherein the speaker assembly comprises two speakers, and the sound outlets of the two speakers are disposed away from each other.

9. The speaker module as recited in claim 8, wherein the vent comprises: a first air vent and a second air vent;

the accommodating cavity comprises a first accommodating cavity and a second accommodating cavity which are isolated from each other, the first air vent is communicated with the first accommodating cavity, the first air vent is formed in one end, far away from the second accommodating cavity, of the bottom surface, the second air vent is communicated with the second accommodating cavity, and the second air vent is formed in one end, far away from the first accommodating cavity, of the bottom surface.

10. An electronic device comprising the speaker module according to any one of claims 1 to 9.

Technical Field

The application relates to the technical field of communication, concretely relates to speaker module and electronic equipment.

Background

With the development of human science and technology, smart mobile devices become one of the most commonly used devices for most people. The portability of the intelligent terminal causes certain limits to the weight and the volume of the loudspeaker. Therefore, the loudspeaker cavity on the intelligent terminal can not be large enough generally, and the sound effect is limited to a certain extent.

The detachable peripheral hardware is a scheme of solving intelligent terminal audio problem, through putting equipment such as battery, speaker, treater, wireless transceiver, microphone even on a detachable back splint, when needs outstanding outer putting experience, assembles the back splint on the cell-phone, connects through wired (USB) or wireless (WIFI, bluetooth etc.) mode, and the speaker that will put the signal outward on through the back splint is broadcast out. When not in use, the utility model can be detached and independently stored. Because the back splint type peripheral hardware can reserve the big enough cavity for the speaker, consequently can obtain better tone quality and experience.

In the process of implementing the present application, the inventor finds that at least the following problems exist in the prior art:

since the hardware specification and performance of the electronic device are higher and higher, and the capacity of the battery for supplying electric energy in the electronic device is higher and higher, the hardware and the battery in the electronic device generate more and more heat, so that how to quickly dissipate the heat generated when the electronic device is used becomes one of the first problems to be considered when the terminal is connected to the back clip type speaker.

At present, the conventional back splint type speaker generally solves the heat dissipation problem by arranging a fan, and has the problems of complex structure and high cost.

Disclosure of Invention

The embodiment of the application aims to provide a loudspeaker module, which can solve the problem that the traditional heat dissipation back splint generally solves the heat dissipation problem by arranging a fan, and has the problems of complex structure and higher cost.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a speaker module, including:

the air conditioner comprises a shell, a fan and a controller, wherein the shell is provided with a containing cavity, the shell is provided with an air vent, and the containing cavity is communicated with the air vent;

the refrigerating piece is arranged in the accommodating cavity, and the heating surface of the refrigerating piece faces to the air ventilation opening;

the loudspeaker assembly is arranged in the accommodating cavity, and the sound outlet of the loudspeaker assembly faces the heating surface of the refrigerating piece and the air vent.

In a second aspect, an embodiment of the present application provides an electronic device, including the speaker module according to the first aspect.

In the embodiment of the application, the shell is provided with an accommodating cavity, the shell is provided with a ventilation opening, and the accommodating cavity is communicated with the ventilation opening; the refrigerating piece is arranged in the accommodating cavity, and the heating surface of the refrigerating piece faces to the air ventilation opening; the speaker subassembly set up in hold the intracavity, just the sound outlet orientation of speaker subassembly the face of heating of refrigeration piece with the ventilation opening is in like this when the vibrating diaphragm of speaker is in the vibration state, utilize vibrating diaphragm drive air to circulate between sound outlet and ventilation opening to air flow around the face of heating with higher speed, thereby take away the heat on the heat-conducting part, reach the heat dissipation purpose, utilize speaker subassembly to hold the heat dissipation function concurrently moreover, increased speaker equipment's use flexibility, the cost is reduced.

Drawings

Fig. 1 is a schematic view illustrating an installation of a speaker module and a mobile terminal according to an embodiment of the invention;

fig. 2 is a schematic diagram of a housing structure of a speaker module according to an embodiment of the invention;

FIG. 3 is an exploded view of a speaker module according to an embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of a speaker module according to an embodiment of the invention;

FIG. 5 is a second schematic cross-sectional view of a speaker module according to an embodiment of the invention;

fig. 6 is a second exploded view of the speaker module according to the embodiment of the present invention;

fig. 7 shows a third explosion diagram of the speaker module according to the embodiment of the invention.

Description of reference numerals:

100-a mobile terminal; 1-a shell; 11-a ventilation opening; 12-dust screen; 13-a separator; 2-a refrigeration member; 3-a loudspeaker; 31-horn monomer; 32-speaker front cavity; 33-speaker back volume; 34-a sound outlet; 4-a support part.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The speaker module provided in the embodiments of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 1 to 7, an embodiment of the present invention provides a speaker module, including: the air conditioner comprises a shell 1, wherein the shell 1 is provided with a containing cavity, the shell 1 is provided with an air vent 11, and the containing cavity is communicated with the air vent; the refrigerating piece 2 is arranged in the accommodating cavity, and the heating surface of the refrigerating piece 2 faces the air ventilation opening 11; the speaker subassembly, the speaker subassembly set up in hold the intracavity, just the sound outlet 34 orientation of speaker subassembly the face of heating of refrigeration piece 2 with ventilation opening 11.

The loudspeaker assembly can comprise a vibrating diaphragm, an air duct is formed between the sound outlet 34 and the air inlet 11, and the heating surface of the refrigerating part 2 is positioned in the air duct; when the diaphragm is in a vibration state, the diaphragm drives air to enter and exit the accommodating cavity through the air duct. Therefore, air is driven by the vibrating diaphragm to enter and exit the air vent 11 through the air duct, so that the air flow on the surface of the heat conducting part 2 can be accelerated, heat on the heating surface is taken away through the air flow, and the purpose of heat dissipation is achieved.

Specifically, the refrigerating element 2 is used for transferring heat generated by one surface of the electronic device, which is in contact with the refrigerating surface of the refrigerating element 2, to the heating surface of the refrigerating element 2, and the heating surface of the refrigerating element 2 is arranged in an air duct formed between the air inlet 11 and the sound outlet 34 in an open manner. When the loudspeaker assembly works, the vibrating diaphragm inside the loudspeaker assembly vibrates, and the vibrating diaphragm pushes the air on the heating surface of the refrigerating part 2 to flow out of the air vent 11 (as shown by a dotted line in fig. 4) through the air duct, so that heat is exhausted; when the vibrating diaphragm vibrates reversely, air flows into the accommodating cavity through the ventilation opening 11, so that the air pumping process is realized, cold air outside the shell 1 is sucked into the accommodating cavity through the ventilation opening 11 (as shown by a dotted line in fig. 4), and the purpose of cooling the heating surface of the refrigerating element 2 is achieved. Therefore, the vibrating diaphragm drives air to pass in and out the air penetrating opening through the air duct, so that the air flow on the surface of the heating surface of the refrigerating piece 2 can be accelerated, the heat on the heating surface is taken away through the air flow, and the heat dissipation purpose is achieved.

And the ventilation opening 11 is not only an air outlet and an air inlet of the loudspeaker assembly, but also a sound generating hole of the loudspeaker assembly. Can realize utilizing the dual-purpose heat dissipation function of speaker module of peripheral hardware, increase speaker equipment's use flexibility, the cost is reduced.

In one embodiment, a gap is formed between the cooling element 2 and the ventilation opening 11.

The speaker assembly is disposed in a gap formed between the refrigeration element 2 and the air vent 11, and an air duct formed between the sound outlet 34 of the speaker assembly and the air vent 11 is located in the gap. Therefore, the vibration of the vibrating diaphragm is utilized to accelerate the air circulation in the gap, the heat on the heating surface is taken away at an accelerated speed, and the purpose of heat dissipation is achieved.

Further, the speaker includes loudspeaker unit 31, the speaker subassembly sets up in the clearance, just loudspeaker unit 31 sets up the speaker is kept away from the one end of refrigeration piece 2.

For example, be close to the face setting that heats of refrigeration piece 2 with speaker 3's among the speaker subassembly speaker rear chamber 33, keep away from refrigeration piece 2 setting with speaker front chamber 32, utilize speaker rear chamber 33's great space, separate loudspeaker monomer 31 and refrigeration piece 2, avoid the heat transfer that loudspeaker monomer 31 during operation produced to give refrigeration piece 2, influence the radiating effect of speaker module.

Specifically, the speaker assembly is fixedly connected with the heating surface of the refrigerating element 2, and the speaker assembly is separated from the bottom surface of the shell 1 by a distance, so that heat generated by the horn unit 31 in the speaker assembly can be prevented from being transferred to the shell 1.

In one embodiment, the ventilation opening 11 is disposed on a bottom surface of the housing, and the bottom surface is directly opposite to the heating surface of the cooling element 2. Therefore, the flowing speed of air in the gap can be improved, the smoothness of air exhaust or air suction of the air vent 1 is favorably improved, and the heat radiation efficiency is favorably improved.

For example, as shown in fig. 2 to 5, the bottom surface of the case 1 and the heating surface of the cooling member 2 are disposed to face each other, and the ventilation opening 11 is disposed in the middle region of the bottom of the case 1, thereby achieving the heating surface to be directly opposite to the ventilation opening 11. Alternatively, as shown in fig. 6, the bottom surface of the case 1 and the heating surface of the cooling member 2 are disposed to face each other, and two separate ventilation ports 11 are respectively disposed at opposite ends on the bottom of the case 1, thereby achieving that the heating surface and the ventilation ports 11 are directly opposed.

In an embodiment, the ventilation opening 11 is disposed on a side surface of the housing 1, the side surface being adjacent to a heating surface of the cooling member 2.

For example, as shown in fig. 7, the housing 1 includes a bottom surface facing the heating surface of the cooling member 2 and a side surface disposed adjacent to the cooling plate 2, the air vents 11 include two, and the two air vents 11 are disposed at opposite ends on the side surface of the housing 1.

Thus, the problem that the heat radiation performance and the external radiation performance of the loudspeaker module are affected by the fact that the ventilating opening 11 is covered when the bottom of the shell 1 of the loudspeaker module is placed horizontally downwards can be avoided.

Furthermore, the first side face where the ventilation port 11 is located is opposite to the second side face where the keys are arranged on the shell 1, so that the problem that the ventilation port 11 is blocked by the hand of a user when the user transversely holds the loudspeaker module to operate the electronic equipment can be avoided, and the heat dissipation and the outward release effect of the loudspeaker module are influenced.

For example, when the electronic device is a mobile terminal 100, a schematic view of an installation state of the mobile terminal 100 and a speaker module is shown in fig. 1.

In an embodiment, the speaker assembly includes two speakers 3, the two speakers 3 are respectively disposed at two opposite sides of the accommodating cavity, and the sound outlets 34 of the two speakers 3 are disposed opposite to each other.

Further, the ventilation opening 11 is arranged in the middle area of the bottom surface of the shell 1, and the bottom surface is opposite to the heating surface of the refrigerating part 2.

For example, referring to fig. 2 to 5, the ventilation opening 11 is provided in the middle area of the bottom surface, and the speakers 3 are disposed at positions close to the side walls of the casing 1, which realizes that each speaker 3 sucks or discharges air through the ventilation opening 11 provided in the middle area of the bottom surface. When the loudspeaker module comprises two loudspeakers 3, the two loudspeakers 3 are arranged on two sides of the shell 1 in the length direction, the sound outlets 34 of the two loudspeakers face each other, and the two sound outlets 34 and the air inlet 11 in the middle area of the bottom surface of the shell 1 form an air duct respectively.

In another embodiment, the speaker assembly comprises two speakers, and the sound outlets of the two speakers are arranged away from each other.

For example, referring to fig. 6 and 7, two speakers 3 are disposed near the center area of the housing 1, and the sound outlets 34 of the two speakers 3 are disposed away from each other.

Further, the air vent 11 includes: a first air vent and a second air vent; the accommodating cavity comprises a first accommodating cavity and a second accommodating cavity which are isolated from each other, the first air vent is communicated with the first accommodating cavity, and the first air vent is arranged at one end of the bottom surface, which is far away from the second accommodating cavity; the second ventilation opening is communicated with the second accommodating cavity, and the second ventilation opening is formed in one end, far away from the first accommodating cavity, of the bottom surface.

Wherein, hold the chamber and be separated into two independent first chambeies and the second chamber that holds by baffle 13, first chamber and the second of holding holds and is provided with a speaker 3 in the chamber respectively, and first chamber and the second of holding hold in the chamber respectively with the first ventilative mouthful intercommunication that corresponds separately and the second. Thus, the sound production of the loudspeaker 3 in each cavity is not influenced by the loudspeakers in other cavities, and the stereo effect is ensured.

For example, referring to fig. 6 and 7, the whole accommodating cavity is divided into a left cavity and a right cavity by a partition plate 31, and correspondingly, one ventilation opening 11 is correspondingly arranged on each of the left cavity and the right cavity. So, two independent wind channels about whole wind channel is divided into by the baffle, and the speaker module is at the during operation, and left side speaker 3 corresponds the right channel, and right side speaker 3 corresponds the left channel, from the sound that left side ventilation opening 11 and right side ventilation opening 11 sent two sound channels, realizes that the speaker module goes out the sound through controlling the sound channel, forms the stereo effect.

For example, referring to fig. 6, two speakers 3 are disposed near the central region of the housing 1, the sound outlets 34 of the two speakers 3 are disposed away from each other, and a ventilation opening 11 is disposed on each of the two sides of the bottom surface of the housing 1 in the longitudinal direction. The respective speakers 3 are realized to suck or discharge air through the respective corresponding ventilation ports 11.

For another example, referring to fig. 7, two speakers 3 are disposed near the center region of the housing 1, the sound outlets 34 of the two speakers 3 are disposed away from each other, and the ventilation opening 11 is disposed on the side wall of the housing 1. The respective speakers 3 are realized to suck or discharge air through the respective corresponding ventilation ports 11.

The refrigerating piece 2 can be made of a semiconductor refrigerating piece.

Specifically, the speaker module still includes supporting part 4, supporting part 4 is connected with the heating face of refrigeration piece 2, and this supporting part 4 can be used to the installation to place electronic equipment such as mobile terminal, including like cell-phone, panel computer, notebook computer, palm computer, vehicle-mounted terminal, wearable equipment, and pedometer etc..

Specifically, the support portion 4 is foam. The foam has certain elasticity and better heat-conducting property, can play a role in buffering the electronic equipment, and conducts heat to the refrigerating piece 2 from the electronic equipment.

In one embodiment, the speaker module further comprises: the processor is arranged in the accommodating cavity and is in communication connection with the loudspeaker assembly; the processor is configured to receive an audio signal and send the audio signal to the speaker assembly.

Wherein the processor is arranged in the gap formed between the cooling element 2 and the ventilation opening 11. For example, but not limited to, the space between the speaker 3 and the bottom surface of the housing 1.

Wherein, in order to further improve the heat dissipation effect of the whole device, the audio signal comprises: one or more of an audible signal, an ultrasonic signal, and an infrasonic signal.

Thus, the speaker 3 emits sound audible to the human ear, and also modulates an ultrasonic wave signal or an infrasonic wave signal therein. When the user closes the external amplifier, the ultrasonic signal or the infrasonic wave signal still works, and when the user closes the external amplifier function, the heat dissipation function of the equipment is prevented from stopping due to the fact that the loudspeaker does not work.

Specifically, after the loudspeaker module is started, the processor judges whether the user starts the external playing function, and when the user is determined to start the external playing function, the processor sends an audio signal modulated with an ultrasonic signal or an ultrasonic signal to the loudspeaker 3; when it is determined that the user turns off the play-out function, an ultrasonic signal or an ultrasonic signal is sent to the speaker 3.

Further, the ventilation opening 11 is covered with a dust screen 12, thereby realizing a dust-proof function.

In addition, this application embodiment still provides an electronic equipment, includes the speaker module as above.

The application discloses electronic equipment, through setting up the speaker module, wherein the speaker module includes: the shell is provided with an accommodating cavity and a ventilation port, and the accommodating cavity is communicated with the ventilation port; the refrigerating piece is arranged in the accommodating cavity, and the heating surface of the refrigerating piece faces to the air ventilation opening; the speaker subassembly set up in hold the intracavity, just the sound outlet orientation of speaker subassembly the face of heating of refrigeration piece with the ventilation opening is in like this when the vibrating diaphragm of speaker subassembly is in the vibration state, utilizes vibrating diaphragm drive air to circulate between sound outlet and ventilation opening to the air flow around the face of heating with higher speed, thereby take away the heat in the heat-conducting part, the heat that produces when can be fast using electronic equipment dispels. And the loudspeaker assembly is used for radiating, so that the use flexibility of the loudspeaker device is improved, and the cost is reduced.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.