阅读说明：本技术 磁头以及磁记录装置
(Magnetic head and magnetic recording apparatus
) 是由 永泽鹤美
成田直幸
首藤浩文
高岸雅幸
前田知幸 于 2019-09-10 设计创作，主要内容包括：提供能够提高记录密度的磁头以及磁记录装置。根据实施方式,磁头包括：屏蔽件；磁极；第1磁性层,其设置在屏蔽件与磁极之间；第2磁性层,其设置在第1磁性层与磁极之间；第3磁性层,其设置在第2磁性层与磁极之间；第1非磁性层,其设置在屏蔽件与第1磁性层之间；第2非磁性层,其设置在第1磁性层与第2磁性层之间；第3非磁性层,其设置在第2磁性层与第3磁性层之间；以及第4非磁性层,其设置在第3磁性层与磁极之间。第1非磁性层和第3非磁性层包含选自由Cu、Ag、Au、Al以及Ti构成的组中的至少一种。第2非磁性层和第4非磁性层包含选自由Ta、Pt、Ir、W、Mo、Cr、Tb、Rh、Pd以及Ru构成的组中的至少一种。(A magnetic head and a magnetic recording apparatus capable of improving recording density are provided. According to an embodiment, a magnetic head includes: a shield; a magnetic pole; a 1 st magnetic layer disposed between the shield and the magnetic pole; a 2 nd magnetic layer disposed between the 1 st magnetic layer and the magnetic pole; a 3 rd magnetic layer disposed between the 2 nd magnetic layer and the magnetic pole; a 1 st nonmagnetic layer disposed between the shield and the 1 st magnetic layer; a 2 nd nonmagnetic layer disposed between the 1 st magnetic layer and the 2 nd magnetic layer; a 3 rd non-magnetic layer disposed between the 2 nd and 3 rd magnetic layers; and a 4 th non-magnetic layer disposed between the 3 rd magnetic layer and the magnetic pole. The 1 st and 3 rd nonmagnetic layers contain at least one selected from the group consisting of Cu, Ag, Au, Al, and Ti. The 2 nd and 4 th nonmagnetic layers contain at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd, and Ru.)
1. A magnetic head includes:
a shield;
a magnetic pole;
a 1 st magnetic layer disposed between the shield and the magnetic pole;
a 2 nd magnetic layer disposed between the 1 st magnetic layer and the magnetic pole;
a 3 rd magnetic layer disposed between the 2 nd magnetic layer and the magnetic pole;
a 1 st nonmagnetic layer disposed between the shield and the 1 st magnetic layer;
a 2 nd nonmagnetic layer disposed between the 1 st magnetic layer and the 2 nd magnetic layer;
a 3 rd non-magnetic layer disposed between the 2 nd and 3 rd magnetic layers; and
a 4 th non-magnetic layer disposed between the 3 rd magnetic layer and the magnetic pole,
the 1 st and 3 rd nonmagnetic layers contain at least one selected from the group consisting of Cu, Ag, Au, Al and Ti,
the 2 nd and 4 th nonmagnetic layers contain at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd and Ru,
the thickness of each of the 2 nd and 4 th nonmagnetic layers along the 1 st direction from the shield toward the magnetic pole is 1nm or more and 3nm or less.
2. The magnetic head as claimed in claim 1,
flowing a 1 st current having a direction from the 1 st nonmagnetic layer toward the 4 th nonmagnetic layer.
3. A magnetic head includes:
a shield;
a magnetic pole;
a 1 st magnetic layer disposed between the shield and the magnetic pole;
a 2 nd magnetic layer disposed between the shield and the 1 st magnetic layer;
a 3 rd magnetic layer disposed between the shield and the 2 nd magnetic layer;
a 1 st nonmagnetic layer disposed between the 1 st magnetic layer and the magnetic pole;
a 2 nd nonmagnetic layer disposed between the 2 nd magnetic layer and the 1 st nonmagnetic layer;
a 3 rd non-magnetic layer disposed between the 3 rd magnetic layer and the 2 nd non-magnetic layer; and
a 4 th nonmagnetic layer disposed between the shield and the 3 rd magnetic layer,
the 1 st and 3 rd nonmagnetic layers contain at least one selected from the group consisting of Cu, Ag, Au, Al and Ti,
the 2 nd and 4 th nonmagnetic layers contain at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd and Ru,
the thickness of each of the 2 nd and 4 th nonmagnetic layers along the 1 st direction from the shield toward the magnetic pole is 1nm or more and 3nm or less.
4. A magnetic head as claimed in claim 3,
flowing a 1 st current having a direction from the 1 st nonmagnetic layer toward the 4 th nonmagnetic layer.
5. The magnetic head as claimed in claim 1,
further comprises at least one of a 5 th nonmagnetic layer and a 6 th nonmagnetic layer,
the 5 th nonmagnetic layer is disposed between the 2 nd nonmagnetic layer and the 1 st magnetic layer,
the 6 th nonmagnetic layer is disposed between the 2 nd magnetic layer and the 2 nd nonmagnetic layer,
the 5 th and 6 th nonmagnetic layers contain at least one selected from the group consisting of Cu, Ag, Au, Al, Ti and Ru,
the thickness of each of the 5 th and 6 th nonmagnetic layers along the 1 st direction is 1nm to 3 nm.
6. A magnetic head includes:
a shield;
a magnetic pole including a media facing surface along which a 1 st direction from the shield toward the magnetic pole is along;
a 1 st magnetic layer, a position of the 1 st magnetic layer in the 1 st direction being between a position of the shield in the 1 st direction and a position of the magnetic pole in the 1 st direction;
a 2 nd magnetic layer provided between the shield and the magnetic pole, a position of the 2 nd magnetic layer in a 2 nd direction intersecting the medium facing surface being between a position of a plane including the medium facing surface in the 2 nd direction and a position of the 1 st magnetic layer in the 2 nd direction;
a 3 rd magnetic layer disposed between the 2 nd magnetic layer and the magnetic pole;
a 1 st nonmagnetic layer disposed between the 1 st magnetic layer and the magnetic pole;
a 2 nd nonmagnetic layer disposed between the shield and the 2 nd magnetic layer;
a 3 rd non-magnetic layer disposed between the 2 nd and 3 rd magnetic layers;
a 4 th non-magnetic layer disposed between the 3 rd magnetic layer and the magnetic pole;
a 5 th nonmagnetic layer between which the 1 st magnetic layer is provided and the 5 th nonmagnetic layer; and
a 6 th nonmagnetic layer disposed between the 2 nd nonmagnetic layer and the 2 nd magnetic layer.
7. A magnetic head includes:
a shield;
a magnetic pole including a media facing surface along which a 1 st direction from the shield toward the magnetic pole is along;
a 1 st magnetic layer, a position of the 1 st magnetic layer in the 1 st direction being between a position of the shield in the 1 st direction and a position of the magnetic pole in the 1 st direction;
a 2 nd magnetic layer provided between the shield and the magnetic pole, a position of the 2 nd magnetic layer in a 2 nd direction intersecting the medium facing surface being between a position of a plane including the medium facing surface in the 2 nd direction and a position of the 1 st magnetic layer in the 2 nd direction;
a 3 rd magnetic layer disposed between the shield and the 2 nd magnetic layer;
a 1 st nonmagnetic layer disposed between the 1 st magnetic layer and the magnetic pole;
a 2 nd nonmagnetic layer disposed between the 2 nd magnetic layer and the magnetic pole;
a 3 rd non-magnetic layer disposed between the 3 rd magnetic layer and the 2 nd magnetic layer;
a 4 th nonmagnetic layer disposed between the shield and the 3 rd magnetic layer;
a 5 th nonmagnetic layer between which the 1 st magnetic layer is provided and the 5 th nonmagnetic layer; and
a 6 th nonmagnetic layer disposed between the 2 nd magnetic layer and the 2 nd nonmagnetic layer.
8. A magnetic recording apparatus includes:
the magnetic head of claim 6; and
a circuit part which is connected with the power supply,
the circuit section includes:
a 1 st circuit capable of supplying a 1 st current having a direction from the 1 st magnetic layer toward the 1 st non-magnetic layer; and
a 2 nd circuit capable of supplying a 2 nd current having a direction from the 2 nd nonmagnetic layer toward the 4 th nonmagnetic layer,
the circuit part can control the 1 st current and the 2 nd current independently of each other.
9. A magnetic recording apparatus includes:
a shield;
a magnetic pole;
a 1 st magnetic layer disposed between the shield and the magnetic pole;
a 2 nd magnetic layer disposed between the 1 st magnetic layer and the magnetic pole;
a 3 rd magnetic layer disposed between the 2 nd magnetic layer and the magnetic pole;
a 1 st nonmagnetic layer disposed between the shield and the 1 st magnetic layer;
a 2 nd nonmagnetic layer disposed between the 1 st magnetic layer and the 2 nd magnetic layer;
a 3 rd non-magnetic layer disposed between the 2 nd and 3 rd magnetic layers;
a 4 th non-magnetic layer disposed between the 3 rd magnetic layer and the magnetic pole; and
a circuit section including a 1 st circuit and a 2 nd circuit, the 1 st circuit being capable of supplying a 1 st current having a direction from the 1 st nonmagnetic layer toward the 2 nd nonmagnetic layer, the 2 nd circuit being capable of supplying a 2 nd current having a direction from the 2 nd nonmagnetic layer toward the 4 th nonmagnetic layer,
the circuit part can control the 1 st current and the 2 nd current independently of each other.
10. A magnetic recording apparatus includes:
a shield;
a magnetic pole;
a 1 st magnetic layer disposed between the shield and the magnetic pole;
a 2 nd magnetic layer disposed between the 1 st magnetic layer and the magnetic pole;
a 3 rd magnetic layer disposed between the 1 st and 2 nd magnetic layers;
a 1 st nonmagnetic layer disposed between the shield and the 1 st magnetic layer;
a 2 nd nonmagnetic layer disposed between the 1 st magnetic layer and the 3 rd magnetic layer;
a 3 rd non-magnetic layer disposed between the 3 rd magnetic layer and the 2 nd magnetic layer;
a 4 th non-magnetic layer disposed between the 2 nd magnetic layer and the magnetic pole; and
a circuit section including a 1 st circuit and a 2 nd circuit, the 1 st circuit being capable of supplying a 1 st current having a direction from the 1 st nonmagnetic layer toward the 2 nd nonmagnetic layer, the 2 nd circuit being capable of supplying a 2 nd current having a direction from the 4 th nonmagnetic layer toward the 2 nd nonmagnetic layer,
the circuit part can control the 1 st current and the 2 nd current independently of each other.
Technical Field
Embodiments of the present invention relate to a magnetic head and a magnetic recording apparatus.
Background
Information is recorded on a magnetic recording medium such as an HDD (Hard Disk Drive) using a magnetic head. In magnetic heads and magnetic recording apparatuses, it is desired to increase the recording density.
Disclosure of Invention
Embodiments of the present invention provide a magnetic head and a magnetic recording apparatus capable of improving recording density.
According to an embodiment of the present invention, a magnetic head includes a shield; a magnetic pole; a 1 st magnetic layer disposed between the shield and the magnetic pole; a 2 nd magnetic layer disposed between the 1 st magnetic layer and the magnetic pole; a 3 rd magnetic layer disposed between the 2 nd magnetic layer and the magnetic pole; a 1 st nonmagnetic layer disposed between the shield and the 1 st magnetic layer; a 2 nd nonmagnetic layer disposed between the 1 st magnetic layer and the 2 nd magnetic layer; a 3 rd non-magnetic layer disposed between the 2 nd and 3 rd magnetic layers; and a 4 th non-magnetic layer disposed between the 3 rd magnetic layer and the magnetic pole. The 1 st and 3 rd nonmagnetic layers include at least one selected from the group consisting of Cu, Ag, Au, Al, and Ti. The 2 nd and 4 th nonmagnetic layers include at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd, and Ru. The thickness of each of the 2 nd and 4 th nonmagnetic layers along the 1 st direction from the shield toward the magnetic pole is 1nm or more and 3nm or less.
According to the above configuration, a magnetic head and a magnetic recording apparatus capable of improving recording density can be provided.
Drawings
Fig. 1 is a schematic cross-sectional view illustrating a magnetic head and a magnetic recording apparatus according to embodiment 1.
Fig. 2 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 1.
Fig. 3 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 2.
Fig. 4 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 2.
Fig. 5 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 3.
Fig. 6 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 3.
Fig. 7 is a schematic cross-sectional view illustrating a magnetic head and a magnetic recording apparatus according to an embodiment.
Fig. 8 is a schematic cross-sectional view illustrating a magnetic head and a magnetic recording apparatus according to an embodiment.
Fig. 9 is a schematic perspective view illustrating a part of the magnetic recording apparatus according to the embodiment.
Fig. 10 is a schematic perspective view illustrating a magnetic recording apparatus according to an embodiment.
Fig. 11 (a) and 11 (b) are schematic perspective views illustrating a part of the magnetic recording apparatus according to the embodiment.
Description of the reference symbols
10D, circuit 1; a 10U circuit section; 11 to 131 st to 3 rd magnetic layers; 11M to 13M magnetization of the 1 st to 3 rd magnetic layers; 20D, circuit 2; 21 to 26 1 st to 6 th nonmagnetic layers; 21e a conductive layer; 30 magnetic poles; 30D, circuit 3; a 30F media facing surface; magnetizing a 30M magnetic pole; 30c a coil; 31 a shield; a 31M shield magnetization; 80 a magnetic recording medium; 110. 111, 120, 121, 130, 131, 140, 141 heads; 150 a magnetic recording device; 154 a suspension; 155 arm; 156 a voice coil motor; 157 a bearing portion; a 158-head gimbal assembly; 159 head slider; 159A air inflow side; 159B air outflow side; 160 Head Stack Assembly (Head Stack Assembly), 161 support frame; 162 a coil; 180 a recording medium disk; a 180M spindle motor; 181 recording medium; 190 a signal processing section; an AR arrow; d1, D2, 1 st, 2 nd directions; i1, I2 current 1, current 2; iw records the current; je1, Je2, electron stream No. 1, electron stream No. 2; an SB laminate; T1-T3 No. 1 to No. 3 terminals.
Detailed Description
Embodiments of the present invention will be described below with reference to the drawings.
The drawings are schematic or conceptual drawings, and the relationship between the thickness and width of each part, the ratio of the size between parts, and the like are not necessarily limited to those in reality. Even when the same portions are shown, they may be shown in different sizes and ratios from each other in the drawings.
In the present specification and the drawings, the same reference numerals are given to the same elements as those already described with respect to the previous drawings, and detailed description thereof is omitted as appropriate.
(embodiment 1)
Fig. 1 is a schematic cross-sectional view illustrating a magnetic head and a magnetic recording apparatus according to embodiment 1.
As shown in fig. 1, in an embodiment, the magnetic recording device 150 includes a magnetic head 110 and a magnetic recording medium 80. The magnetic recording device 150 may further include a recording current circuit (3 rd circuit 30D), for example.
Magnetic head 110 includes shield 31, magnetic pole 30, 1 st magnetic layer 11 to 3 rd magnetic layer 13, and 1 st to 4 th nonmagnetic layers 21 to 24. In this example, magnetic head 110 also includes a 5 th nonmagnetic layer 25 and a 6 th nonmagnetic layer 26.
For example, the magnetic head 110 includes a coil 30 c. At least a part of the coil 30c is opposed to the magnetic pole 30. For example, a recording current Iw is supplied from a recording current circuit (3 rd circuit 30D) to the coil 30 c. Thereby, a recording magnetic field corresponding to the recording current Iw is generated from the magnetic pole 30. A recording magnetic field is applied to the magnetic recording medium 80, and the magnetization direction of the magnetic recording medium 80 is controlled. Thereby, information is recorded in the magnetic recording medium 80.
The magnetic pole 30 is, for example, a main magnetic pole. The magnetic pole 30 includes a medium facing surface 30F. The medium facing Surface 30F is along an ABS (Air Bearing Surface) of the magnetic head 110. The medium facing surface 30F faces the magnetic recording medium 80.
The direction perpendicular to the medium facing surface 30F is taken as the Z-axis direction. One direction perpendicular to the Z-axis direction is taken as the X-axis direction. The direction perpendicular to the Z-axis direction and the X-axis direction is defined as the Y-axis direction.
The Z-axis direction is, for example, a height direction. The X-axis direction is, for example, a down track (down track) direction. The Y-axis direction is a cross-track (cross track) direction.
The shield 31 corresponds to a trailing shield (trailing shield), for example. The shield 31 is, for example, an auxiliary pole. The shield 31 can form a magnetic core together with the magnetic pole 30. For example, an additional shield such as a side shield (not shown) may be provided.
In magnetic head 110, the 1 st magnetic layer 11 is disposed between shield 31 and pole 30. The 2 nd magnetic layer 12 is disposed between the 1 st magnetic layer 11 and the magnetic pole 30. The 3 rd magnetic layer 13 is disposed between the 2 nd magnetic layer 12 and the magnetic pole 30.
The direction from the shield 31 toward the magnetic pole 30 is referred to as the 1 st direction D1. The 1 st direction D1 is, for example, along the X-axis direction.
The 1 st magnetic layer 11 contains, for example, at least one selected from the group consisting of FeNi and CoFe. The 2 nd magnetic layer 12 and the 3 rd magnetic layer 13 include, for example, FeCo alloy or the like. Examples of the material of these magnetic layers will be described later.
The 1 st nonmagnetic layer 21 is disposed between the shield 31 and the 1 st magnetic layer 11. The 2 nd nonmagnetic layer 22 is disposed between the 1 st magnetic layer 11 and the 2 nd magnetic layer 12. The 3 rd non-magnetic layer 23 is disposed between the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13. The 4 th non-magnetic layer 24 is disposed between the 3 rd magnetic layer 13 and the magnetic pole 30. The 5 th nonmagnetic layer 25 is disposed between the 1 st magnetic layer 11 and the 2 nd nonmagnetic layer 22. The 6 th nonmagnetic layer 26 is disposed between the 2 nd nonmagnetic layer 22 and the 2 nd magnetic layer 12. The 1 st to 3 rd magnetic layers 11 to 13 and the 1 st to 6 th nonmagnetic layers 21 to 26 are included in the laminate SB.
The 1 st nonmagnetic layer 21 and the 3 rd nonmagnetic layer 23 contain, for example, at least one selected from the group consisting of Cu, Ag, Au, Al, and Ti. The 1 st nonmagnetic layer 21 and the 3 rd nonmagnetic layer 23 are, for example, layers that transmit spin (spin).
The 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 contain, for example, at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd, and Ru. The 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 are, for example, layers that cancel (or attenuate) spin. The thickness of each of the 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer along the 1 st direction D1 is, for example, 1nm or more and 3nm or less.
The 5 th and 6 th nonmagnetic layers 25 and 26 contain, for example, at least one selected from the group consisting of Cu, Ag, Au, Al, Ti, and Ru. The thickness of each of the 5 th and 6 th nonmagnetic layers 25 and 26 along the 1 st direction D1 is 1nm or more and 3nm or less. At least either one of the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26 may be provided. An increase in damping (damming) in the 1 st magnetic layer 11 can be suppressed by these nonmagnetic layers, for example. An increase in damping in the 2 nd magnetic layer 12 can be suppressed by these nonmagnetic layers, for example. For example, the operating current density decreases. For example, a long life can be obtained.
As shown in fig. 1, in the magnetic head 110, the 1 st current I1 can flow. Current I1, No. 1, has a direction from shield 31 toward pole 30. The 1 st current I1 has a direction from the 1 st nonmagnetic layer 21 toward the 4 th nonmagnetic layer 24. For example, the 1 st current I1 is supplied from the 1 st circuit 10D. For example, the 1 st circuit 10D is electrically connected to the shield 31 and the magnetic pole 30.
In the 1 st nonmagnetic layer 21, the 1 st magnetic layer 11, the 5 th nonmagnetic layer 25, the 2 nd nonmagnetic layer 22, the 6 th nonmagnetic layer 26, the 2 nd magnetic layer 12, the 3 rd nonmagnetic layer 23, the 3 rd magnetic layer 13, and the 4 th nonmagnetic layer 24, the 1 st current I1 flows in the direction from the 1 st nonmagnetic layer 21 to the 4 th nonmagnetic layer 24.
The 1 st electron current Je1 flows by the 1 st current I1. The 1 st electron flow Je1 flows in a direction from the magnetic pole 30 toward the shield 31.
The magnetic pole 30 has a pole magnetization 30M. The shield 31 has a shield magnetization 31M. The 1 st magnetic layer 11 has a 1 st magnetic layer magnetization 11M. The 2 nd magnetic layer 12 has a 2 nd magnetic layer magnetization 12M. The 3 rd magnetic layer 13 has a 3 rd magnetic layer magnetization 13M.
By the 1 st current I1 (1 st electron current Je1), for example, the 1 st magnetic layer magnetization 11M is inverted with respect to the shield magnetization 31M and the magnetic pole magnetization 30M. This makes it difficult for the recording magnetic field generated in the magnetic pole 30 to pass through the laminated body SB. The magnetic field (gap magnetic field) between the shield 31 and the magnetic pole 30 can be reduced.
Thereby, most of the recording magnetic field is directed toward the magnetic recording medium 80. The recording magnetic field is efficiently applied to the magnetic recording medium 80. The 1 st Magnetic Layer 11 functions as, for example, an MFCL (Magnetic Field Control Layer).
On the other hand, by the 1 st current I1 (1 st electron current Je1) and the gap magnetic field, spins are injected from the 3 rd magnetic layer 13 into the 2 nd magnetic layer 12, and the 2 nd magnetic layer magnetization 12M rotates. The 3 rd magnetic layer 13 functions as a spin injection layer, for example. The 2 nd magnetic layer 12 functions as an oscillation layer, for example. The laminated body including the 2 nd magnetic layer 12, the 3 rd nonmagnetic layer 23, and the 3 rd magnetic layer 13 functions as, for example, an STO (Spin Torque Oscillator). For example, spin torque is provided in each of the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13. For example, when the current is increased, the 3 rd magnetic layer magnetization 13M of the 3 rd magnetic layer 13 is first inverted, and then the 2 nd magnetic layer magnetization 12M of the 2 nd magnetic layer 12 starts oscillating. When the 2 nd magnetic layer magnetization 12M starts oscillating, the oscillation proceeds toward the direction of inversion of the 3 rd magnetic layer magnetization 13M. For example, the magnetization 12M of the 2 nd magnetic layer is inclined in the gap magnetic field direction and oscillates substantially in plane.
A high-frequency magnetic field is generated from the STO, and the high-frequency magnetic field is applied to the magnetic recording medium 80. In the magnetic recording medium 80, the direction of magnetization is easily changed in a portion to which a high frequency is applied. The magnetization direction of the magnetic recording medium 80 can be easily controlled.
In the embodiment, by providing the 1 st magnetic layer 11, the gap magnetic field can be reduced without reducing the recording magnetic field. This enables the 2 nd magnetic layer magnetization 12M to be rotated by spin torque at a low current density, for example. This can improve, for example, recording characteristics. For example, the recording density can be improved. For example, high reliability is easily obtained. In the embodiment, a magnetic head and a magnetic recording apparatus capable of improving recording density can be provided.
For example, the gap magnetic field applied to STO can be controlled by the 1 st magnetic layer 11. For example, the recording magnetic field and the gap magnetic field applied to the STO can be independently designed. This makes it easy to adjust the oscillation frequency of STO, for example.
Fig. 2 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 1.
As shown in fig. 2, in the embodiment, the magnetic recording device 150 includes a magnetic head 111 and a magnetic recording medium 80. The magnetic head 111 includes a shield 31, a magnetic pole 30, 1 st to 3 rd magnetic layers 11 to 13, and 1 st to 4 th nonmagnetic layers 21 to 24. In this example, magnetic head 111 also includes a 5 th nonmagnetic layer 25 and a 6 th nonmagnetic layer 26.
In magnetic head 111, the 1 st magnetic layer 11 is disposed between shield 31 and magnetic pole 30. The 2 nd magnetic layer 12 is disposed between the shield 31 and the 1 st magnetic layer 11. The 3 rd magnetic layer 13 is disposed between the shield 31 and the 2 nd magnetic layer 12.
The 1 st non-magnetic layer 21 is disposed between the 1 st magnetic layer 11 and the magnetic pole 30. The 2 nd nonmagnetic layer 22 is disposed between the 2 nd magnetic layer 12 and the 1 st nonmagnetic layer 21. The 3 rd non-magnetic layer 23 is disposed between the 3 rd magnetic layer 13 and the 2 nd non-magnetic layer 22. The 4 th non-magnetic layer 24 is disposed between the shield 31 and the 3 rd magnetic layer 13. The 5 th nonmagnetic layer 25 is disposed between the 2 nd nonmagnetic layer 22 and the 1 st magnetic layer 11. The 6 th nonmagnetic layer 26 is disposed between the 2 nd magnetic layer 12 and the 2 nd nonmagnetic layer 22.
In this case, the 1 st nonmagnetic layer 21 and the 3 rd nonmagnetic layer 23 also contain at least one selected from the group consisting of Cu, Ag, Au, Al, and Ti. The 2 nd and 4 th nonmagnetic layers 22 and 24 include at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd, and Ru. The thickness of each of the 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 along the 1 st direction D1 (direction from the shield 31 toward the magnetic pole 30) is 1nm or more and 3nm or less. The 5 th and 6 th nonmagnetic layers 25 and 26 contain at least one selected from the group consisting of Cu, Ag, Au, Al, Ti, and Ru. The thickness of each of the 5 th and 6 th nonmagnetic layers 25 and 26 along the 1 st direction D1 is 1nm or more and 3nm or less. At least either one of the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26 may be provided. For example, an increase in damping in the 1 st magnetic layer 11 can be suppressed. For example, an increase in damping in the 2 nd magnetic layer 12 can be suppressed. For example, the operating current density decreases. For example, a long life can be obtained.
As shown in fig. 2, the 1 st current I1 flows in the magnetic head 111 from the magnetic pole 30 toward the shield 31. The 1 st current I1 has a direction from the 1 st nonmagnetic layer 21 toward the 4 th nonmagnetic layer 24. The 1 st electron flow Je1 has a direction from shield 31 toward pole 30. The 1 st current I1 is supplied from the 1 st circuit 10D.
In the magnetic head 111, the gap magnetic field can be reduced without reducing the recording magnetic field. For example, the 2 nd magnetic layer magnetization 12M can be rotated by spin torque at a low current density. For example, the recording characteristics can be improved. The recording density can be improved. For example, high reliability is easily obtained. A magnetic head and a magnetic recording apparatus capable of improving the recording density can be provided. For example, the oscillation frequency of STO can be easily adjusted.
In the magnetic heads 110 and 111, for example, the 1 st magnetic layer 11 is in contact with the 1 st nonmagnetic layer 21 and the 5 th nonmagnetic layer 25. The 2 nd nonmagnetic layer 22 is in contact with the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26. The 2 nd magnetic layer 12 is in contact with the 6 th nonmagnetic layer 26 and the 3 rd nonmagnetic layer 23. The 3 rd magnetic layer 13 is in contact with the 3 rd nonmagnetic layer 23 and the 4 th nonmagnetic layer 24.
In the magnetic heads 110 and 111, for example, the product of the thickness of the 2 nd magnetic layer 12 (the thickness along the 1 st direction D1) and the 2 nd saturation magnetic flux density of the 2 nd magnetic layer 12 is larger than the product of the thickness of the 3 rd magnetic layer (the thickness along the 1 st direction D1) and the 3 rd saturation magnetic flux density of the 3 rd magnetic layer 13. This facilitates oscillation in the 2 nd magnetic layer 12. For example, the product of the volume of the 2 nd magnetic layer 12 and the 2 nd saturation magnetic flux density of the 2 nd magnetic layer 12 is larger than the product of the volume of the 3 rd magnetic layer 13 and the 3 rd saturation magnetic flux density of the 3 rd magnetic layer 13. For example, the thickness of the 3 rd magnetic layer 13 is thinner than the thickness of the 2 nd magnetic layer 12. This can provide stable oscillation in the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13, for example.
(embodiment 2)
Fig. 3 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 2.
As shown in fig. 3, in the embodiment, the magnetic recording device 150 includes a magnetic head 120, a magnetic recording medium 80, and a circuit portion 10U. The magnetic recording device 150 may further include, for example, a recording current circuit (3 rd circuit 30D).
The magnetic head 120 includes a shield 31, a magnetic pole 30, 1 st to 3 rd magnetic layers 11 to 13, and 1 st to 4 th non-magnetic layers 21 to 24. In this example, magnetic head 120 also includes a 5 th nonmagnetic layer 25 and a 6 th nonmagnetic layer 26.
The 1 st magnetic layer 11 is disposed between the shield 31 and the magnetic pole 30. The 2 nd magnetic layer 12 is disposed between the 1 st magnetic layer 11 and the magnetic pole 30. The 3 rd magnetic layer 13 is disposed between the 2 nd magnetic layer 12 and the magnetic pole 30.
The 1 st nonmagnetic layer 21 is disposed between the shield 31 and the 1 st magnetic layer 11. The 2 nd nonmagnetic layer 22 is disposed between the 1 st magnetic layer 11 and the 2 nd magnetic layer 12. The 3 rd non-magnetic layer 23 is disposed between the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13. The 4 th non-magnetic layer 24 is disposed between the 3 rd magnetic layer 13 and the magnetic pole 30. The 5 th nonmagnetic layer 25 is disposed between the 1 st magnetic layer 11 and the 2 nd nonmagnetic layer 22. The 6 th nonmagnetic layer 26 is disposed between the 2 nd nonmagnetic layer 22 and the 2 nd magnetic layer 12.
The circuit unit 10U includes a 1 st circuit 10D and a 2 nd circuit 20D. The 1 st circuit 10D can supply the 1 st current I1. The 1 st current I1 has a direction from the shield 31 toward the 2 nd nonmagnetic layer 22. The 1 st current I1 has a direction from the 1 st nonmagnetic layer 21 toward the 2 nd nonmagnetic layer 22. The 2 nd circuit 20D is capable of supplying the 2 nd current I2. Current I2 has a direction from nonmagnetic layer 2 22 toward pole 30. The 2 nd current I2 has a direction from the 2 nd nonmagnetic layer 22 toward the 4 th nonmagnetic layer 24. The direction of the 1 st electron current Je1 based on the 1 st current I1 is opposite to the direction of the 1 st current I1. The direction of the 2 nd electron current Je2 based on the 2 nd current I2 is opposite to the direction of the 2 nd current I2.
For example, the magnetic head 120 includes 1 st to 3 rd terminals T1 to T3. The 1 st terminal T1 is electrically connected to the shield 31. The 2 nd terminal T2 is electrically connected to the magnetic pole 30. The 3 rd terminal T3 is electrically connected to the 2 nd nonmagnetic layer 22.
One end of the 1 st circuit 10D is electrically connected to the 1 st terminal T1. The other end of the 1 st circuit 10D is electrically connected to the 3 rd terminal T3. One end of the 2 nd circuit 20D is electrically connected to the 2 nd terminal T2. The other end of the 2 nd circuit 20D is electrically connected to the 3 rd terminal T3.
By the 1 st current I1, the 1 st magnetic layer magnetization 11M of the 1 st magnetic layer 11 is inverted with respect to the shield magnetization 31M and the pole magnetization 30M. The 2 nd magnetic layer magnetization 12M is rotated by the 2 nd current I2. The 2 nd magnetic layer 12 oscillates.
The circuit section 10U can control the 1 st current I1 and the 2 nd current I2 independently of each other. Thus, the gap magnetic field can be reduced by the 1 st current I1, and the oscillation frequency of STO can be easily adjusted by the 2 nd current I2. This can easily improve the recording density. For example, a magnetic head and a magnetic recording apparatus capable of improving the recording density can be provided.
For example, the oscillation frequency of the STO may fluctuate due to fluctuations in the manufacturing process. In this case, the 1 st current I1 and the 2 nd current I2 are independently controlled, whereby the adjustment of the oscillation frequency is facilitated.
In the magnetic head 120, the 1 st nonmagnetic layer 21 and the 3 rd nonmagnetic layer 23 contain at least one selected from the group consisting of Cu, Ag, Au, Al, and Ti, for example. The 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 contain, for example, at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd, and Ru. The thickness of each of the 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 along the 1 st direction D1 (the direction from the shield 31 toward the magnetic pole 30) is 1nm or more and 3nm or less. The 5 th and 6 th nonmagnetic layers 25 and 26 contain, for example, at least one selected from the group consisting of Cu, Ag, Au, Al, Ti, and Ru. The thickness of the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26 along the 1 st direction D1 is 1nm or more and 3nm or less. At least either one of the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26 may be provided. For example, an increase in damping in the 1 st magnetic layer 11 can be suppressed. For example, an increase in damping in the 2 nd magnetic layer 12 can be suppressed. For example, the operating current density decreases. For example, a long life can be obtained.
In the magnetic head 120, for example, the 1 st magnetic layer 11 is in contact with the 1 st nonmagnetic layer 21 and the 5 th nonmagnetic layer 25. The 2 nd nonmagnetic layer 22 is in contact with the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26. The 2 nd magnetic layer 12 is in contact with the 6 th nonmagnetic layer 26 and the 3 rd nonmagnetic layer 23. The 3 rd magnetic layer 13 is in contact with the 3 rd nonmagnetic layer 23 and the 4 th nonmagnetic layer 24.
Fig. 4 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 2.
As shown in fig. 4, in the embodiment, the magnetic recording device 150 includes a magnetic head 121, a magnetic recording medium 80, and a circuit unit 10U. The magnetic recording device 150 may further include a recording current circuit (3 rd circuit 30D), for example.
The magnetic head 121 includes a shield 31, a magnetic pole 30, 1 st to 3 rd magnetic layers 11 to 13, and 1 st to 4 th nonmagnetic layers 21 to 24. In this example, magnetic head 120 also includes a 5 th nonmagnetic layer 25 and a 6 th nonmagnetic layer 26.
In magnetic head 121, the 1 st magnetic layer 11 is disposed between shield 31 and magnetic pole 30. The 2 nd magnetic layer 12 is disposed between the 1 st magnetic layer 11 and the magnetic pole 30. The 3 rd magnetic layer 13 is disposed between the 1 st magnetic layer 11 and the 2 nd magnetic layer 12.
The 1 st nonmagnetic layer 21 is disposed between the shield 31 and the 1 st magnetic layer 11. The 2 nd nonmagnetic layer 22 is disposed between the 1 st magnetic layer 11 and the 3 rd magnetic layer 13. The 3 rd non-magnetic layer 23 is disposed between the 3 rd magnetic layer 13 and the 2 nd magnetic layer 12. The 4 th non-magnetic layer 24 is disposed between the 2 nd magnetic layer 12 and the magnetic pole 30. The 5 th nonmagnetic layer 25 is disposed between the 1 st magnetic layer 11 and the 2 nd nonmagnetic layer 22. The 6 th nonmagnetic layer 26 is disposed between the 2 nd nonmagnetic layer 22 and the 3 rd magnetic layer 13.
In this example, the circuit unit 10U also includes the 1 st circuit 10D capable of supplying the 1 st current I1 and the 2 nd circuit 20D capable of supplying the 2 nd current I2. The 1 st current I1 has a direction from the 1 st nonmagnetic layer 21 toward the 2 nd nonmagnetic layer 22. The 2 nd current I2 has a direction from the 4 th nonmagnetic layer 24 toward the 2 nd nonmagnetic layer 22. The circuit section 10U can control the 1 st current I1 and the 2 nd current I2 independently of each other.
For example, the gap magnetic field can be reduced by the 1 st current I1, and the oscillation frequency of STO can be easily adjusted by the 2 nd current I2. The recording density can be easily increased. For example, a magnetic head and a magnetic recording apparatus capable of improving the recording density can be provided. Adjustment of the oscillation frequency becomes easy.
In the magnetic head 121, the 1 st nonmagnetic layer 21 and the 3 rd nonmagnetic layer 23 contain at least one selected from the group consisting of Cu, Ag, Au, Al, and Ti, for example. The 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 contain at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd, and Ru. The thickness (thickness along the direction from the shield 31 toward the magnetic pole 30) of each of the 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 is 1nm or more and 3nm or less. The 5 th and 6 th nonmagnetic layers 25 and 25 contain at least one selected from the group consisting of Cu, Ag, Au, Al, Ti, and Ru. The thickness (thickness along the 1 st direction D1) of each of the 5 th and 6 th nonmagnetic layers 25 and 26 is 1nm or more and 3nm or less. At least either one of the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26 may be provided. For example, an increase in damping in the 1 st magnetic layer 11 can be suppressed. For example, an increase in damping in the 2 nd magnetic layer 12 can be suppressed. For example, the operating current density decreases. For example, a long life can be obtained.
In the magnetic head 121, for example, the 1 st magnetic layer 11 is in contact with the 1 st nonmagnetic layer 21 and the 5 th nonmagnetic layer 25. The 2 nd nonmagnetic layer 22 is in contact with the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26. The 3 rd magnetic layer 13 is in contact with the 6 th nonmagnetic layer 26 and the 3 rd nonmagnetic layer 23. The 2 nd magnetic layer 12 is in contact with the 3 rd nonmagnetic layer 23 and the 4 th nonmagnetic layer 24.
In the magnetic heads 120 and 121, for example, the product of the thickness of the 2 nd magnetic layer 12 (the thickness along the 1 st direction D1) and the 2 nd saturation magnetic flux density of the 2 nd magnetic layer 12 is larger than the product of the thickness of the 3 rd magnetic layer (the thickness along the 1 st direction D1) and the 3 rd saturation magnetic flux density of the 3 rd magnetic layer 13. This facilitates oscillation in the 2 nd magnetic layer 12. For example, the product of the volume of the 2 nd magnetic layer 12 and the 2 nd saturation magnetic flux density of the 2 nd magnetic layer 12 is larger than the product of the volume of the 3 rd magnetic layer 13 and the 3 rd saturation magnetic flux density of the 3 rd magnetic layer 13. For example, the thickness of the 3 rd magnetic layer 13 is thinner than the thickness of the 2 nd magnetic layer 12. This can provide stable oscillation in the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13, for example.
(embodiment 3)
Fig. 5 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 3.
As shown in fig. 5, in the embodiment, the magnetic recording device 150 includes a magnetic head 130, a magnetic recording medium 80, and a circuit unit 10U. The magnetic recording device 150 may further include a recording current circuit (3 rd circuit 30D), for example.
The magnetic head 130 includes a shield 31, a magnetic pole 30, 1 st to 3 rd magnetic layers 11 to 13, and 1 st to 4 th non-magnetic layers 21 to 24. In this example, magnetic head 130 also includes a 5 th nonmagnetic layer 25 and a 6 th nonmagnetic layer 26.
The magnetic pole 30 includes a medium facing surface 30F. The 1 st direction D1 from the shield 31 toward the magnetic pole 30 is along the medium facing surface 30F. Media facing surface 30F is, for example, along an X-Y plane.
The position of the 1 st magnetic layer 11 in the 1 st direction D1 is between the position of the shield 31 in the 1 st direction D1 and the position of the magnetic pole 30 in the 1 st direction D1.
Magnetic layer 2 12 is disposed between shield 31 and pole 30. The direction intersecting the medium facing surface 30F is referred to as a 2 nd direction D2. The 2 nd direction D2 is, for example, along the Z-axis direction. The position of the 2 nd magnetic layer 12 in the 2 nd direction D2 is located between the position of the plane containing the medium facing surface 30F (the plane along the X-Y plane) in the 2 nd direction D2 and the position of the 1 st magnetic layer 11 in the 2 nd direction D2.
The 3 rd magnetic layer 13 is disposed between the 2 nd magnetic layer 12 and the magnetic pole 30.
The 1 st non-magnetic layer 21 is provided between the 1 st magnetic layer 11 and the magnetic pole 30. The 2 nd nonmagnetic layer 22 is disposed between the shield 31 and the 2 nd magnetic layer 12. The 3 rd non-magnetic layer 23 is disposed between the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13. The 4 th non-magnetic layer 24 is disposed between the 3 rd magnetic layer 13 and the magnetic pole 30. The 1 st magnetic layer 11 is provided between the 5 th nonmagnetic layer 25 and the 1 st nonmagnetic layer 21. The 6 th nonmagnetic layer 26 is disposed between the 2 nd nonmagnetic layer 22 and the 2 nd magnetic layer 12.
In the magnetic head 130, the 1 st magnetic layer 11 is provided separately from the laminated body including the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13. The 1 st current I1 flowing through the 1 st magnetic layer 11 and the 2 nd current I2 flowing through the stacked body including the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13 can be controlled independently of each other.
In the magnetic head 130, the 1 st magnetic layer magnetization 11M is inverted with respect to the directions of the shield magnetization 31M and the pole magnetization 30M by the 1 st current I1 flowing in the 1 st magnetic layer 11. The gap field will increase.
For example, the gap magnetic field can be increased by the 1 st current I1, and the oscillation frequency of STO can be easily adjusted by the 2 nd current I2 flowing in the stacked body including the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13. The recording density can be easily increased. For example, a magnetic head and a magnetic recording apparatus capable of improving the recording density can be provided. Adjustment of the oscillation frequency becomes easy.
The magnetic recording apparatus 150 including the magnetic head 130 may also include the circuit portion 10U. The circuit unit 10U includes a 1 st circuit 10D capable of supplying a 1 st current I1 and a 2 nd circuit 20D capable of supplying a 2 nd current I2. The 1 st current I1 has a direction from the 1 st magnetic layer 11 toward the 1 st nonmagnetic layer 21. The 1 st current I1 has a direction from the magnetic pole 30 toward the 1 st nonmagnetic layer 21. The 2 nd current I2 has a direction from the 2 nd nonmagnetic layer 22 toward the 4 th nonmagnetic layer 24. Current I2, No. 2, has a direction from shield 31 toward pole 30. The circuit section 10U can control the 1 st current I1 and the 2 nd current I2 independently of each other.
In this example, a conductive layer 21e is provided, and a 1 st magnetic layer 11 is provided between the conductive layer 21e and the 1 st nonmagnetic layer 21.
For example, the magnetic head 130 includes 1 st to 3 rd terminals T1 to T3. The 1 st terminal T1 is electrically connected to the shield 31. The 2 nd terminal T2 is electrically connected to the magnetic pole 30. The 3 rd terminal T3 is electrically connected to the conductive layer 21 e.
One end of the 2 nd circuit 20D is electrically connected to the 1 st terminal T1. The other end of the 2 nd circuit 20D is electrically connected to the 3 rd terminal T3. One end of the 1 st circuit 10D is electrically connected to the 2 nd terminal T2. The other end of the 1 st circuit 10D is electrically connected to the 3 rd terminal T3.
In the magnetic head 130, the 1 st nonmagnetic layer 21 and the 3 rd nonmagnetic layer 23 contain at least one selected from the group consisting of Cu, Ag, Au, Al, and Ti, for example. The 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer contain at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd, and Ru. The thickness of each of the 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 along the 1 st direction D1 (direction from the shield 31 toward the magnetic pole 30) is 1nm or more and 3nm or less. The 5 th and 6 th nonmagnetic layers 25 and 26 contain at least one selected from the group consisting of Cu, Ag, Au, Al, Ti, and Ru. The thickness of each of the 5 th and 6 th nonmagnetic layers 25 and 26 along the 1 st direction D1 is 1nm or more and 3nm or less. At least either one of the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26 may be provided. For example, an increase in damping in the 1 st magnetic layer 11 can be suppressed. For example, an increase in damping in the 2 nd magnetic layer 12 can be suppressed. For example, the operating current density decreases. For example, a long life can be obtained.
In the magnetic head 130, for example, the 1 st magnetic layer 11 is in contact with the 1 st nonmagnetic layer 21 and the 5 th nonmagnetic layer 25. The 6 th nonmagnetic layer 26 is in contact with the 2 nd nonmagnetic layer 22 and the 2 nd magnetic layer 12. The 2 nd magnetic layer 12 is in contact with the 6 th nonmagnetic layer 26 and the 3 rd nonmagnetic layer 23. The 3 rd magnetic layer 13 is in contact with the 3 rd nonmagnetic layer 23 and the 4 th nonmagnetic layer 24.
Fig. 6 is a schematic cross-sectional view illustrating the magnetic head and the magnetic recording apparatus according to embodiment 3.
As shown in fig. 6, in the embodiment, the magnetic recording device 150 includes a magnetic head 131, a magnetic recording medium 80, and a circuit unit 10U. The magnetic recording device 150 may further include a recording current circuit (3 rd circuit 30D), for example.
The magnetic head 131 includes a shield 31, a magnetic pole 30, 1 st to 3 rd magnetic layers 11 to 13, and 1 st to 4 th nonmagnetic layers 21 to 24. In this example, magnetic head 131 also includes a 5 th nonmagnetic layer 25 and a 6 th nonmagnetic layer 26.
The 1 st direction D1 from the shield 31 toward the pole 30 is along the media facing surface 30F of the pole 30. The position of the 1 st magnetic layer 11 in the 1 st direction D1 is between the position of the shield 31 in the 1 st direction D1 and the position of the magnetic pole 30 in the 1 st direction D1.
Magnetic layer 2 12 is disposed between shield 31 and pole 30. The position of the 2 nd magnetic layer 12 in the 2 nd direction D2 intersecting the medium facing surface 30F is located between the position of the plane containing the medium facing surface 30F in the 2 nd direction D2 and the position of the 1 st magnetic layer 11 in the 2 nd direction D2.
The 3 rd magnetic layer 13 is disposed between the shield 31 and the 2 nd magnetic layer 12.
The 1 st non-magnetic layer 21 is provided between the 1 st magnetic layer 11 and the magnetic pole 30. The 2 nd non-magnetic layer 22 is disposed between the 2 nd magnetic layer 12 and the magnetic pole 30. The 3 rd non-magnetic layer 23 is disposed between the 3 rd magnetic layer 13 and the 2 nd magnetic layer 12. The 4 th non-magnetic layer 24 is disposed between the shield 31 and the 3 rd magnetic layer 13. The 1 st magnetic layer 11 is provided between the 5 th nonmagnetic layer 25 and the 1 st nonmagnetic layer 21. The 6 th nonmagnetic layer 26 is disposed between the 2 nd nonmagnetic layer 22 and the 2 nd magnetic layer 12.
In the magnetic head 131, the 1 st magnetic layer 11 is also provided separately from the laminated body including the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13. The 1 st current I1 flowing through the 1 st magnetic layer 11 and the 2 nd current I2 flowing through the stacked body including the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13 can be controlled independently of each other. The 1 st current I1 has a direction from the 1 st magnetic layer 11 toward the 1 st nonmagnetic layer 21. The 2 nd current I2 has a direction from the 2 nd nonmagnetic layer 22 toward the 4 th nonmagnetic layer 24.
In the magnetic head 131, the 1 st magnetic layer magnetization 11M is inverted with respect to the directions of the shield magnetization 31M and the pole magnetization 30M by the 1 st current I1 flowing in the 1 st magnetic layer 11. The gap field increases.
For example, the gap magnetic field can be increased by the 1 st current I1, and the oscillation frequency of STO can be easily adjusted by the 2 nd current I2 flowing in the stacked body including the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13. The recording density can be easily increased. For example, a magnetic head and a magnetic recording apparatus capable of improving the recording density can be provided. Adjustment of the oscillation frequency becomes easy.
For example, the magnetic head 131 includes 1 st to 3 rd terminals T1 to T3. The 3 rd terminal T3 is electrically connected to the conductive layer 21 e. The 2 nd circuit 20D is electrically connected to the 1 st terminal T1 and the 3 rd terminal T3. The 1 st circuit 10D is electrically connected to the 2 nd terminal T2 and the 3 rd terminal T3.
In the magnetic head 131, the 1 st nonmagnetic layer 21 and the 3 rd nonmagnetic layer 23 contain at least one selected from the group consisting of Cu, Ag, Au, Al, and Ti, for example. The 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 contain at least one selected from the group consisting of Ta, Pt, Ir, W, Mo, Cr, Tb, Rh, Pd, and Ru. The thickness of the 2 nd nonmagnetic layer 22 and the 4 th nonmagnetic layer 24 along the 1 st direction D1 is 1nm or more and 3nm or less. The 5 th and 6 th nonmagnetic layers 25 and 26 contain at least one selected from the group consisting of Cu, Ag, Au, Al, Ti, and Ru. The thickness of the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26 along the 1 st direction D1 is 1nm or more and 3nm or less. At least either one of the 5 th nonmagnetic layer 25 and the 6 th nonmagnetic layer 26 may be provided. For example, an increase in damping in the 1 st magnetic layer 11 can be suppressed. For example, an increase in damping in the 2 nd magnetic layer 12 can be suppressed. For example, the operating current density decreases. For example, a long life can be obtained.
In the magnetic head 131, for example, the 1 st magnetic layer 11 is in contact with the 1 st nonmagnetic layer 21 and the 5 th nonmagnetic layer 25. The 3 rd magnetic layer 13 is in contact with the 4 th nonmagnetic layer 24 and the 3 rd nonmagnetic layer 23. The 2 nd magnetic layer 12 is in contact with the 3 rd nonmagnetic layer 23 and the 6 th nonmagnetic layer 26. The 6 th nonmagnetic layer 26 is in contact with the 2 nd magnetic layer 12 and the 2 nd nonmagnetic layer 22.
In the magnetic heads 130 and 131, for example, the product of the thickness of the 2 nd magnetic layer 12 (thickness along the 1 st direction D1) and the 2 nd saturation magnetic flux density of the 2 nd magnetic layer 12 is larger than the product of the thickness of the 3 rd magnetic layer 13 (thickness along the 1 st direction D1) and the 3 rd saturation magnetic flux density of the 3 rd magnetic layer 13. This facilitates oscillation in the 2 nd magnetic layer 12. For example, the product of the volume of the 2 nd magnetic layer 12 and the 2 nd saturation magnetic flux density of the 2 nd magnetic layer 12 is larger than the product of the volume of the 3 rd magnetic layer 13 and the 3 rd saturation magnetic flux density of the 3 rd magnetic layer 13. For example, the thickness of the 3 rd magnetic layer 13 is thinner than the thickness of the 2 nd magnetic layer 12. This can provide stable oscillation in the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13, for example.
In the magnetic head 130, the distance between the 2 nd magnetic layer 12 and the 1 st magnetic layer 11 along the 2 nd direction D2 is, for example, 1/2 or more of the length of the 1 st magnetic layer 11 along the 2 nd direction D2. In the magnetic head 131, the distance between the 3 rd magnetic layer 13 and the 1 st magnetic layer 11 along the 2 nd direction D2 is, for example, 1/2 or more of the length of the 1 st magnetic layer 11 along the 2 nd direction D2.
Fig. 7 and 8 are schematic cross-sectional views illustrating a magnetic head and a magnetic recording apparatus according to an embodiment.
In the structure of the magnetic head 110, as in the magnetic head 140 illustrated in fig. 7, the lamination direction (1 st direction D1) of the laminated body SB may be inclined with respect to a plane (for example, X-Y plane) including the medium facing surface 30F. In the structure of the magnetic head 111, as in the magnetic head 141 illustrated in fig. 8, the laminated body SB may be inclined in the lamination direction with respect to a plane (for example, X-Y plane) including the medium facing surface 30F. In the magnetic head 141, the volume of the 2 nd magnetic layer 12 is easily larger than the volume of the 3 rd magnetic layer 13.
Such an inclination in the stacking direction (the 1 st direction D1) can also be applied to any of the magnetic recording heads according to embodiments 1 to 3.
In the embodiment, the magnetic pole 30 includes, for example, FeCo alloy or FeCoNi alloy.
The shield 31 includes, for example, FeCo alloy or FeCoNi alloy.
At least any one of the 2 nd magnetic layer 12 and the 3 rd magnetic layer 13 includes at least any one of a FeCo alloy, a Heusler (Heusler) alloy, [ Fe/Co ] artificial lattice, [ FeCoNi/Ni ] artificial lattice, and [ Co/Pt ] artificial lattice, for example. At least either of the 1 st magnetic layer 11 and the 2 nd magnetic layer 12 may also include a laminated film including at least two of a FeCo alloy film, a heusler alloy film, an [ Fe/Co ] artificial lattice film, an [ FeCoNi/Ni ] artificial lattice film, and an [ Co/Pt ] artificial lattice film.
The magnetic recording medium 80 contains, for example, CoCrPt-SiO2A particulate membrane.
