阅读说明：本技术 一种电子设备的配线、该配线的注塑方法、电子设备 (Wiring of electronic equipment, injection molding method of wiring and electronic equipment ) 是由 张清森 陈俊灵 李小河 古汉奕 温鑫 于 2020-04-17 设计创作，主要内容包括：本发明公开了一种电子设备的配线、该配线的注塑方法、电子设备,其中,电子设备的配线,包括：具有第一端和第二端的线芯,第一端的端部用于与电子设备连接,第二端的端部用于与外部设备连接；包覆在第一端上的硬质包覆体,其包括：硬质包覆主体和形成在硬质包覆主体外围的第一硬质包覆凸起,硬质包覆主体包覆在第一端,第一端的端部外露于硬质包覆主体；第一硬质包覆凸起位于电子设备的壳体内；软质包覆体,其包覆在第一端与第二端之间的线芯上,并与硬质包覆主体连接；第二端的端部外露于软质包覆体。第一硬质包覆凸起位于电子设备壳体内,第一硬质包覆凸起可阻挡配线向电子设备外移动的趋势,保证配线与电子设备的稳固连接,以提高使用安全性。(The invention discloses a wiring of electronic equipment, an injection molding method of the wiring and the electronic equipment, wherein the wiring of the electronic equipment comprises the following steps: the cable core is provided with a first end and a second end, the end part of the first end is used for being connected with electronic equipment, and the end part of the second end is used for being connected with external equipment; a hard cover coated on the first end, comprising: the hard coating main body is coated at the first end, and the end part of the first end is exposed out of the hard coating main body; the first hard coating bulge is positioned in the shell of the electronic equipment; the soft coating body is coated on the wire core between the first end and the second end and is connected with the hard coating main body; the end part of the second end is exposed out of the soft cladding body. The first hard coating protrusion is located in the electronic equipment shell, and the first hard coating protrusion can block the trend that the wiring moves towards the outside of the electronic equipment, so that the stable connection between the wiring and the electronic equipment is ensured, and the use safety is improved.)

1. A wiring for an electronic device, comprising:

the cable core is provided with a first end and a second end, the end part of the first end is used for being connected with electronic equipment, and the end part of the second end is used for being connected with external equipment;

a hard cover coated over the first end, comprising: the hard coating body is coated on the first end, and the end part of the first end is exposed out of the hard coating body; the first hard coating bulge is positioned in a shell of the electronic equipment;

the soft coating body is coated on the wire core between the first end and the second end and is connected with the hard coating main body; the end part of the second end is exposed out of the soft cladding body.

2. The wiring of the electronic device according to claim 1, wherein a portion of the hard cover body is exposed to the first hard cover protrusion in a direction from the first end to the second end; the soft coating body is coated on the wire core between the first end and the second end and is coated on the part of the hard coating main body exposed out of the first hard coating bulge.

3. The wiring of the electronic device according to claim 1, wherein a portion of the hard cover body is exposed to the first hard cover protrusion in a direction from the first end to the second end; the soft coating body is coated on the wire core between the first end and the second end and is coated on the part of the hard coating main body exposed out of the first hard coating bulge; the soft coating body coated on the hard coating main body and the first hard coating bulge are arranged at intervals.

4. The wiring for electronic equipment according to claim 1, wherein said hard cover body further comprises: and the first hard coating bulge and the second hard coating bulge are arranged at intervals along the length direction from the first end to the second end, and the second hard coating bulge is positioned outside the shell of the electronic equipment.

5. The wiring of claim 4, wherein a portion of said hard coating body is exposed from said second hard coating protrusion along a direction from the first end to the second end, and said soft coating body is coated on the wire core between the first end and the second end and on said portion of said hard coating body exposed from said second hard coating protrusion.

6. An electronic device, comprising: wiring for an electronic device according to any one of claims 1 to 5; further comprising: last casing and lower casing of mutual lock, upward be provided with the breach on the casing, down on the casing for it is provided with down the breach to go up the breach, it is in to go up the casing lock back on the casing down, go up the breach with the breach forms the card hole down, the radial size in card hole is less than the radial size of first stereoplasm cladding convex body, first stereoplasm cladding arch is located go up casing and inferior valve are internal.

7. The electronic device of claim 6, wherein the electronic device further comprises: the circuit board is installed between the upper shell and the lower shell, and the end part of the first end is connected to the circuit board.

8. An injection molding method for wiring based on the electronic device of any one of claims 1 to 5, comprising the steps of:

positioning the first end in a first cavity, wherein the end of the first end is exposed out of the first cavity;

injecting a first injection molding material into an area between the first end and the first cavity to obtain a hard cladding body cladding the first end;

positioning the wire core between the first end and the second end at the bottom of a second cavity, wherein the end part of the second end is exposed out of the second cavity;

injecting a second injection molding material into an area between the wire core and the second cavity between the first end and the second end to obtain a first semi-soft cladding body which is coated on one side of the wire core between the first end and the second end;

positioning the wire core coated with the first half of the soft coating body in a third cavity, wherein the end part of the second end is exposed out of the third cavity;

injecting a second injection molding material into an area between the wire core coated with the first semi-soft coating and the third cavity to obtain a second semi-soft coating coated on the other side of the wire core coated with the first semi-soft coating; the second semi-soft cover and the first semi-soft cover are formed as the soft cover.

9. The injection molding method for wiring of an electronic device according to claim 8, wherein a plurality of positioning grooves are provided in a row on a side wall of a bottom of the second cavity, and the core between the first end and the second end is positioned in the positioning grooves.

10. The injection molding method for wiring of an electronic device according to claim 8, wherein the first injection molding material is PP, and the second injection molding material is TPE; the hardness of the first injection molding material after being cured is larger than that of the second injection molding material after being cured.

Technical Field

The application relates to the technical field of wiring of electronic equipment, in particular to wiring of electronic equipment, an injection molding method of the wiring and the electronic equipment.

Background

The wiring of the electronic equipment in the market is usually manufactured by adopting an integrated forming mode, the hardness of the formed wiring is soft, and a fixed end of the wiring, which is connected with the electronic equipment, is easy to fall off under the condition of pulling, so that the connection of the wiring and the electronic equipment is influenced. The use experience is very bad under the condition that the hardness of the formed wire rod is hard.

Disclosure of Invention

The present application aims to provide a wiring of an electronic device, an injection molding method of the wiring, and an electronic device, wherein the wiring does not break away from the connection with the electronic device when being pulled.

According to a first aspect of the present application, there is provided a wiring of an electronic device, comprising:

the cable core is provided with a first end and a second end, the end part of the first end is used for being connected with electronic equipment, and the end part of the second end is used for being connected with external equipment;

a hard cover coated over the first end, comprising: the hard coating body is coated on the first end, and the end part of the first end is exposed out of the hard coating body; the first hard coating bulge is positioned in a shell of the electronic equipment;

the soft coating body is coated on the wire core between the first end and the second end and is connected with the hard coating main body; the end part of the second end is exposed out of the soft cladding body.

Furthermore, the wiring of the electronic device, wherein, along the direction from the first end to the second end, part of the hard coating body is exposed out of the first hard coating protrusion; the soft coating body is coated on the wire core between the first end and the second end and is coated on the part of the hard coating main body exposed out of the first hard coating bulge.

Furthermore, the wiring of the electronic device, wherein, along the direction from the first end to the second end, part of the hard coating body is exposed out of the first hard coating protrusion; the soft coating body is coated on the wire core between the first end and the second end and is coated on the part of the hard coating main body exposed out of the first hard coating bulge; the soft coating body coated on the hard coating main body and the first hard coating bulge are arranged at intervals.

Further, the wiring of the electronic device, wherein the hard coating body further includes: and the second hard coating protrusion is formed on the periphery of the hard coating main body, the first hard coating protrusion and the second hard coating protrusion are arranged at intervals along the length direction from the first end to the second end, and the second hard coating protrusion is positioned outside the shell of the electronic equipment.

Further, in the wiring of the electronic device, along a direction from the first end to the second end, a portion of the hard coating main body is exposed out of the second hard coating protrusion, and the soft coating body is coated on the wire core between the first end and the second end and on the portion of the hard coating main body exposed out of the second hard coating protrusion.

According to a second aspect of the present application, there is provided an electronic device comprising: wiring of the electronic device; further comprising: last casing and lower casing of mutual lock, go up and be provided with the breach on the casing, down on the casing for go up the breach and be provided with down the breach, it is in to go up the casing lock back on the casing down, go up the breach with the breach forms the card hole down, the radial size in card hole is less than the radial size of first stereoplasm cladding convex body, first stereoplasm cladding arch is located go up casing and inferior valve are internal.

Further, the electronic device, wherein the electronic device further includes: the circuit board is installed between the upper shell and the lower shell, and the end part of the first end of the wire core is connected to the circuit board.

According to a third aspect of the present application, there is provided an injection molding method for wiring based on the electronic device, comprising the steps of:

positioning the first end in a first cavity, wherein the end of the first end is exposed out of the first cavity;

injecting a first injection molding material into an area between the first end and the first cavity to obtain a hard cladding body cladding the first end;

positioning the wire core between the first end and the second end at the bottom of a second cavity, wherein the end part of the second end is exposed out of the second cavity;

injecting a second injection molding material into an area between the wire core between the first end and the second cavity to obtain a first semi-soft cladding body which is coated on one side of the wire core between the first end and the second end;

positioning the wire core coated with the first half of the soft coating body in a third cavity, wherein the end part of the second end is exposed out of the third cavity;

injecting a second injection molding material into an area between the wire core coated with the first semi-soft coating body and the third cavity to obtain a second semi-soft coating body coated on the other side of the wire core coated with the first semi-soft coating body; the second semi-soft cover and the first semi-soft cover are formed as the soft cover.

Further, the injection molding method of the wiring of the electronic equipment is characterized in that a plurality of positioning grooves which are arranged in a straight line are formed in the side wall of the bottom of the second cavity, and the wire core between the first end and the second end is positioned in the positioning grooves.

Further, the injection molding method of the wiring of the electronic device is characterized in that the first injection molding material is PP, and the second injection molding material is TPE; the hardness of the first injection molding material after being cured is larger than that of the second injection molding material after being cured.

The invention has the beneficial effects that:

the application provides a wiring of electronic equipment, an injection molding method of the wiring and the electronic equipment, wherein the wiring of the electronic equipment comprises: the cable core is provided with a first end and a second end, the end part of the first end is used for being connected with electronic equipment, and the end part of the second end is used for being connected with external equipment; a hard cover coated over the first end, comprising: the hard coating body is coated on the first end, and the end part of the first end is exposed out of the hard coating body; the first hard coating bulge is positioned in a shell of the electronic equipment; the soft coating body is coated on the wire core between the first end and the second end and is connected with the hard coating main body; the end part of the second end is exposed out of the soft cladding body. First stereoplasm cladding arch on the stereoplasm cladding body is located the electronic equipment casing, so, when dragging this wiring, the stereoplasm cladding arch can block the trend that the wiring removed outward to electronic equipment, guarantees wiring and electronic equipment's firm being connected, avoids this wiring to break away from electronic equipment, improve equipment safety in utilization.

Drawings

FIG. 1 is an exploded view of an electronic device and wiring provided herein;

FIG. 2 is an assembled effect diagram of the electronic device and the wiring provided by the present application;

FIG. 3 is a process diagram of injection molding of a hard coating in a wire of an electronic device according to the present application;

FIG. 4 is a schematic view of the hard clad of FIG. 3 after it has been formed;

fig. 5 is a process diagram of injection molding of a first semi-soft cover in a wiring of an electronic device provided by the present application;

FIG. 6 is a schematic view of the first semi-soft cover of FIG. 5 after molding;

FIG. 7 is a diagram illustrating a process of injection molding a second semi-soft cover in a wiring of an electronic device according to the present application;

FIG. 8 is a schematic view of the second semi-soft cover of FIG. 7 after it has been formed;

fig. 9 is a first schematic cross-sectional view of a wiring of an electronic device provided in the present application;

FIG. 10 is an enlarged view of a portion of FIG. 9 at A;

fig. 11 is a second schematic cross-sectional view of a wiring of an electronic device according to the present application;

FIG. 12 is an enlarged partial view at B in FIG. 11;

fig. 13 is a third schematic cross-sectional view of a wiring of the electronic device provided in the present application;

fig. 14 is a partially enlarged schematic view at C in fig. 13.

Detailed Description

The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.