阅读说明：本技术 骨声纹传感器及电子设备 (Bone voiceprint sensor and electronic equipment ) 是由 孟晗 端木鲁玉 李东宁 田峻瑜 方华斌 于 2021-05-28 设计创作，主要内容包括：本发明提供一种骨声纹传感器及电子设备,其中的骨声纹传感器包括基板和设置在所述基板上的外壳,所述基板与所述外壳之间形成封装结构,在所述封装结构内设置有振动组件和麦克风组件；其中,所述振动组件设置在所述封装结构内部的基板上,麦克风组件设置在所述振动组件的上方。利用上述发明能够解决传统的骨声纹传感器装配难度高和制作成本高的问题。(The invention provides a bone vocal print sensor and electronic equipment, wherein the bone vocal print sensor comprises a substrate and a shell arranged on the substrate, a packaging structure is formed between the substrate and the shell, and a vibration component and a microphone component are arranged in the packaging structure; the vibration component is arranged on the substrate inside the packaging structure, and the microphone component is arranged above the vibration component. The invention can solve the problems of high assembly difficulty and high manufacturing cost of the traditional bone voiceprint sensor.)

1. The bone voiceprint sensor is characterized by comprising a substrate and a shell arranged on the substrate, wherein a packaging structure is formed between the substrate and the shell, and a vibration component and a microphone component are arranged in the packaging structure; wherein the content of the first and second substances,

the vibration assembly is arranged on the substrate inside the packaging structure, and the microphone assembly is arranged above the vibration assembly.

2. The bone voiceprint sensor of claim 1 wherein,

and a supporting connecting sheet is arranged at the top of the vibration component, and the microphone component is arranged above the supporting connecting sheet.

3. The bone voiceprint sensor of claim 2 wherein,

the vibration assembly comprises a vibration ring fixed on the substrate, a vibration diaphragm arranged at the top of the vibration ring and a mass block arranged on the vibration diaphragm; and the number of the first and second electrodes,

the support connecting sheet covers the diaphragm and the mass block.

4. The bone voiceprint sensor of claim 3 wherein,

the mass block is arranged at the top or the bottom of the diaphragm.

5. The bone voiceprint sensor of claim 2 wherein,

the microphone assembly comprises a MEMS chip and an ASIC chip which are fixed on the top of the supporting connecting sheet; and the number of the first and second electrodes,

the MEMS chip and the ASIC chip are electrically connected through a lead, and both the MEMS chip and the ASIC chip are electrically connected with the substrate through leads.

6. The bone voiceprint sensor of claim 5 wherein,

and a ventilation opening is formed in the top of the supporting connecting sheet and is communicated with the inner cavity of the MEMS chip.

7. The bone voiceprint sensor of any one of claims 1 to 6 wherein,

the shell is a metal part; and the number of the first and second electrodes,

the substrate is a PCB.

8. The bone voiceprint sensor of any one of claims 2 to 6 wherein,

the shell is fixed on the substrate through solder paste, and the support connecting sheet is fixed above the vibration ring through bonding sheet glue.

9. The bone voiceprint sensor of any one of claims 1 to 6 wherein,

the top of the shell is provided with an air guide hole.

10. An electronic device characterized by comprising a bone voiceprint sensor according to any one of claims 1 to 9.

Technical Field

The invention relates to the field of sensor design, in particular to a bone voiceprint sensor and electronic equipment.

Background

The bone voiceprint sensor is a sensor which utilizes the driving air flow when the sound membrane vibrates, and therefore, the flow signal is detected. A conventional bone voiceprint sensor generally includes a vibration system and a microphone assembly, wherein the vibration system is used for sensing an external vibration signal and converting an airflow change generated by vibration into an electrical signal through the microphone assembly, so as to express the vibration signal. The vibration system and the microphone assembly are core components of the bone voiceprint sensor.

Most of the traditional bone voiceprint sensors adopt a microphone assembly with a three-layer PCB structure 2 ', and then a vibration assembly 1' is used as an independent component to be attached to the microphone assembly (as shown in figure 1); however, the microphone with the three-layer PCB structure 2' requires three PCB boards to be purchased, which results in higher cost, and two times of soldering is required to achieve conduction between the three PCB boards, which increases the assembly difficulty.

Based on the above technical problems, a method for reducing the assembly difficulty and the manufacturing cost of the bone voiceprint sensor is needed.

Disclosure of Invention

In view of the above problems, the present invention provides a bone voiceprint sensor to solve the problems of high assembly difficulty and high manufacturing cost of the conventional bone voiceprint sensor.

The bone voiceprint sensor provided by the embodiment of the invention comprises a substrate and a shell arranged on the substrate, wherein a packaging structure is formed between the substrate and the shell, and a vibration component and a microphone component are arranged in the packaging structure; wherein the content of the first and second substances,

the vibration assembly is arranged on the substrate inside the packaging structure, and the microphone assembly is arranged above the vibration assembly.

In addition, it is preferable that a support connection piece is provided on a top of the vibration assembly, and the microphone assembly is provided above the support connection piece.

In addition, it is preferable that the vibration assembly includes a vibration ring fixed on the substrate, a vibration membrane disposed on top of the vibration ring, and a mass disposed on the vibration membrane; and the number of the first and second electrodes,

the support connecting sheet covers the diaphragm and the mass block.

In addition, it is preferable that the mass block is disposed on the top or bottom of the diaphragm.

In addition, it is preferable that the microphone assembly includes a MEMS chip and an ASIC chip fixed on top of the support connection pad; and the number of the first and second electrodes,

the MEMS chip and the ASIC chip are electrically connected through a lead, and both the MEMS chip and the ASIC chip are electrically connected with the substrate through leads.

In addition, preferably, a vent opening is formed in the top of the supporting connecting sheet, and the vent opening is communicated with the inner cavity of the MEMS chip.

In addition, it is preferable that the housing is made of metal; and the number of the first and second electrodes,

the substrate is a PCB.

In addition, preferably, the housing is fixed on the substrate through solder paste, and the support connecting sheet is fixed above the vibration ring through bonding sheet glue.

In addition, preferably, the top of the shell is provided with an air guide hole.

In addition, the invention also provides electronic equipment which comprises the bone voiceprint sensor.

According to the technical scheme, the bone vocal print sensor provided by the invention aims at the problems of high cost and complex assembly process of the traditional bone vocal print sensor due to the three-layer PCB structure microphone and vibration component structure, the vibration component is firstly mounted on the PCB, then the microphone MEMS chip and the ASIC chip are arranged above the vibration component, and finally the metal shell is fixed with the PCB through the solder paste. Therefore, the microphone MEMS chip, the ASIC chip and the vibration component can be directly stacked and assembled in a packaging structure formed by the metal shell and the PCB, and compared with a structure of a three-layer substrate of a traditional bone voiceprint sensor, the structure only uses one layer of substrate, so that the cost can be effectively reduced, and the assembly process is reduced.

To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, it is intended that the present invention includes all such aspects and their equivalents

Drawings

Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:

FIG. 1 is a front sectional view of a conventional bone voiceprint sensor;

FIG. 2 is a front cross-sectional view of a bone voiceprint sensor according to an embodiment of the invention;

wherein the reference numerals include: PCB 11, shell 12, air vent 121, MEMS chip 13, ASIC chip 131, vibrating diaphragm 14, mass block 141, support connecting sheet 15, vibrating ring 16, vibration front cavity 17, vibration back cavity 18 and ventilation opening 19.

The same reference numbers in all figures indicate similar or corresponding features or functions.

Detailed Description

To describe the structure of the bone voiceprint sensor of the present invention in detail, specific embodiments of the present invention will be described below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that if the description of "first", "second", etc. is provided in the embodiment of the present invention, the description of "first", "second", etc. is only for descriptive purposes and is not to be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Furthermore, if any reference to the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicates an orientation or positional relationship based on that shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, and it does not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied.

Fig. 1 shows a front view cross-sectional structure of a bone acoustic print sensor according to an embodiment of the present invention, and according to fig. 1, the bone acoustic print sensor provided in the embodiment of the present invention includes a substrate 11 for soldering an internal Circuit of the bone acoustic print sensor, and a housing 12 fixed on the substrate 11 and functioning as a protection component, where the substrate 11 may be a Circuit Board, such as a PCB (Printed Circuit Board, which is a support for electronic components); a package structure for accommodating components is formed between the substrate 11 and the housing 12, and a vibration assembly and a microphone assembly for sensing external vibration signals are disposed inside the package structure. In the in-service use process, the vibration subassembly can produce stronger vibration after sensing external vibration signal, along with the vibration of vibration subassembly drives the inside air vibration of packaging structure and produces the vibration air current, this vibration air current is the signal of telecommunication after being received by the microphone subassembly conversion, and signal processing device that the signal of telecommunication rethread base plate 11 goes up the transmission to external carries out the signal analysis.

Specifically, the vibration component is attached to the substrate 11 in the packaging structure, and the microphone component is arranged above the vibration component, so that the vibration component and the microphone component can be arranged in the packaging structure together, the whole bone voiceprint sensor can be manufactured by only using one layer of substrate 11 and one shell 12, and compared with the structure of the three layers of substrates 11 of the traditional bone voiceprint sensor, the cost can be effectively reduced, and the assembling process is reduced.

It should be noted that a vibration front cavity 17 is formed between the vibration component and the substrate 11, a vibration rear cavity 18 is formed between the vibration component and the supporting connection sheet 15, and after the vibration component senses an external vibration signal, the vibrating diaphragm 14 can generate vibration between the vibration front cavity 17 and the vibration rear cavity 18, so as to transmit the generated vibration airflow to the microphone component.

Specifically, a supporting connection sheet 15 is disposed on the top of the vibrating assembly, and the microphone assembly is disposed above the vibrating assembly through the supporting connection sheet 15, it should be noted that the supporting connection sheet 15 may be made of the same material as or different from the substrate 11, for example, a circuit board residual material, a pvc material, a metal material, etc., as long as the requirement is satisfied, and the supporting connection sheet is a hard material capable of producing a corresponding supporting effect.

In one embodiment of the present invention, the vibration assembly includes a vibrating ring 16 fixed on the substrate 11 and a diaphragm 14 disposed on top of the vibrating ring 16; in practical use, the vibrating diaphragm 14 mainly functions, and the vibrating ring 16 mainly supports the vibrating diaphragm 14, so that when the vibrating diaphragm 14 senses an external vibration signal, the vibrating diaphragm can vibrate up and down between the front vibration cavity 17 and the rear vibration cavity 18. It should be noted that the vibrating ring 16 is a hollow structure, and when the diaphragm 14 is fixed on the top of the vibrating ring 16, the inner cavity of the vibrating ring 16 serves as the vibration front cavity 17.

In addition, for the response effect of promotion vibrating diaphragm 14, and then promote bone vocal print sensor's sensitivity, can be at quality piece 141 on vibrating diaphragm 14, when vibrating diaphragm 14 vibrates, because quality piece 141's existence, can show the vibration amplitude of promotion vibrating diaphragm 14 under equal vibration signal to produce bigger vibrating air current, promote bone vocal print sensor's sensitivity.

It should be noted that due to the existence of the supporting connection piece 15, the supporting connection piece 15 will cover the diaphragm 14 and the mass block 141, thereby reducing the effect of the microphone assembly receiving vibrating air flow. For this purpose, a ventilation opening 19 can be provided in the support lug 15, through which opening 19 a vibrating air flow is transmitted to the microphone assembly.

Specifically, the mass block 141 may be disposed on the top or the bottom of the diaphragm 14, and in an actual manufacturing process, in order to make the mass block 141 and the diaphragm 14 vibrate, the mass block 141 may be fixed on the top or the bottom of the diaphragm 14 by a bonding adhesive or the like.

In a specific real-time aspect of the present invention, the microphone assembly may include a MEMS chip 13(micro electro Mechanical Systems) and an ASIC chip 131(ASIC, i.e., application specific integrated circuit, referring to an integrated circuit designed and manufactured according to the requirements of a specific user and the requirements of a specific electronic system) fixed on top of the supporting connection pads 15; the MEMS chip 13 and the ASIC chip 131 are electrically connected by a wire, and both the MEMS chip 13 and the ASIC chip 131 are electrically connected to the substrate 11 by a wire.

In the actual use process, when the vibrating diaphragm 14 vibrates, the vibrating diaphragm drives the air to vibrate to generate vibrating airflow, and after the MEMS chip 13 senses the vibrating airflow, a corresponding electric signal is generated, and after the electric signal is amplified by the ASIC chip 131, the electric signal is transmitted to the substrate 11 through a metal lead (a wire), and finally transmitted to an external signal processing device to perform signal analysis.

It should be noted that the vent opening 19 formed at the top of the supporting connecting sheet 15 needs to communicate with the inner cavity of the MEMS chip 13, so that only the MEMS chip 13 can timely and effectively receive the vibrating airflow generated by the diaphragm 14.

In one embodiment of the present invention, in order to ensure that the housing 12 has sufficient protection performance, the housing 12 needs to be made of a metal material and fixed on the substrate 11 by solder paste or the like; in addition, the vibrating ring 16 may be fixed on the substrate 11 by an adhesive sheet, the supporting connecting piece 15 may be fixed on the top of the vibrating ring 16 by an adhesive sheet, and the MEMS chip 13 and the ASIC chip 131 may also be fixed on the top of the supporting connecting piece 15 by an adhesive sheet.

In a preferred embodiment of the present invention, in order to prevent the internal gas of the package structure from expanding due to heating during the processes of reflow soldering and high-temperature baking, the housing 12 may be provided with a gas vent 121, and the balance between the internal pressure and the external pressure during the assembly of the bone acoustic pattern sensor can be effectively ensured through the gas vent 121, thereby preventing the occurrence of the shell explosion phenomenon.

In another aspect, the present invention further provides an electronic device, which includes the components of the aforementioned bone voiceprint sensor. In the actual use process, the electronic device may first collect the vibration signal around by using the voiceprint sensor provided by the present invention, and then perform corresponding processing, such as sound intensity recognition, vibration intensity recognition, etc., on the vibration signal.

The proposed bone voiceprint sensor and electronic device according to the invention are described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the bone voiceprint sensor and electronic device of the present invention described above without departing from the spirit of the invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.