阅读说明：本技术 一种pcb板和pcb走线结构的制备方法 (PCB and PCB routing structure manufacturing method ) 是由 陈峰跃 于 2020-06-12 设计创作，主要内容包括：本申请提供一种PCB板,包括至少一组差分线,所述差分线的至少一端具有孔盘,所述孔盘与所述差分线走线之间具有间隙。可见,本申请中提供的PCB板包括至少一组差分线,当差分线的一端具有孔盘时,在孔盘和差分线的走线之间设置有间隙,使走线与孔盘隔离开,能将孔盘绕线部分变成有效的走线长度,保证差分线走线总长度一致,提高信号传输质量。本申请同时还提供了一种PCB走线结构的制备方法,具有上述有益效果。(The application provides a PCB board, including at least a set of difference line, the at least one end of difference line has the hole dish, the hole dish with the difference line is walked and is had the clearance between the line. It is thus clear that the PCB board that provides in this application includes at least a set of difference line, when the one end of difference line has the hole dish, is provided with the clearance between the line of walking of hole dish and difference line, makes to walk the line and keep apart with the hole dish, can become effectual line length of walking with hole dish wire winding part, guarantees that the difference line walks that the total length is unanimous, improves signal transmission quality. The application also provides a preparation method of the PCB wiring structure, and the PCB wiring structure has the beneficial effects.)

1. The PCB is characterized by comprising at least one group of differential lines, wherein at least one end of each differential line is provided with a hole disc, and a gap is reserved between each hole disc and the differential line routing.

2. The PCB panel of claim 1, wherein the gap has a width of at least greater than 0.0508 mm.

3. A method for manufacturing a PCB routing structure is characterized by comprising the following steps:

providing a copper sheet;

covering a mask on the copper sheet, wherein the mask is obtained based on PCB wiring file projection, and gaps are formed between wirings of differential lines in the mask and corresponding hole discs;

and etching the copper sheet based on the mask, and removing the copper sheet corresponding to the gap to obtain the PCB wiring structure.

4. The method according to claim 3, wherein the step of covering the copper sheet with a mask obtained by projection based on a PCB trace file includes:

covering a first mask on the copper sheet, wherein the first mask is obtained by projecting the PCB routing file;

and removing the mask of the gap between the routing of the differential line in the first mask and the corresponding hole disc to obtain the mask.

5. The method for manufacturing a PCB trace structure according to claim 3, wherein before providing a copper sheet, the method further comprises:

projecting the PCB wiring file on a second mask;

and removing the mask of the gap between the routing of the differential line in the second mask and the corresponding hole disc to obtain the mask.

6. The method for manufacturing a PCB trace structure according to claim 3, wherein the mask is a corrosion-resistant dry film, and correspondingly, the etching the copper sheet based on the mask to remove the copper sheet corresponding to the gap to obtain the PCB trace structure includes:

and putting the copper sheet into etching liquid for etching based on the mask to obtain the PCB wiring structure.

7. The method for manufacturing a PCB trace structure according to claim 3, wherein the etching solution is ferric chloride.

8. The method for manufacturing a PCB trace structure according to any of claims 3 to 7, wherein the width of the gap is at least greater than 0.0508 mm.