阅读说明：本技术 一种新型柔性电路板 (Novel flexible circuit board ) 是由 吴永淇 于 2020-05-30 设计创作，主要内容包括：本发明涉及柔性电路板技术领域,尤其涉及一种新型柔性电路板,包括基层膜,基层膜上表面放置有电路板,电路板的上表面与表层膜的下表面贴合,基层膜上表面的侧面通过黏胶层与表层膜粘结,黏胶层与电路板之间的空隙处灌装有环氧树脂密封层,环氧树脂密封层位于基层膜与表层膜之间的夹层处,表层膜的上表面固定连接有防老化层,防滑化层的上表面固定连接有耐磨层。本发明采用了基层膜和表层膜对电路板进行防水,防止服装在安设在衣物上时导致电路板浸水短路,使电路板适用于服装的使用,通过耐磨层方便在服装水洗的过程中对电路板进行防护,防止表层膜损坏造成电路板的损坏,增加了电路板的实用性。(The invention relates to the technical field of flexible circuit boards, in particular to a novel flexible circuit board which comprises a base layer film, wherein a circuit board is placed on the upper surface of the base layer film, the upper surface of the circuit board is attached to the lower surface of a surface layer film, the side surface of the upper surface of the base layer film is bonded with a surface layer film through a viscose layer, an epoxy resin sealing layer is filled in a gap between the viscose layer and the circuit board, the epoxy resin sealing layer is positioned in an interlayer between the base layer film and the surface layer film, the upper surface of the surface layer film is fixedly connected with an anti-aging layer, and the upper surface of the anti. The invention adopts the base layer film and the surface layer film to prevent the circuit board from being waterproof, prevents the circuit board from being short-circuited by water immersion when the garment is arranged on clothes, and ensures that the circuit board is suitable for the garment to be used.)

1. A novel flexible circuit board is characterized in that: the packaging film comprises a base layer film (1), wherein a circuit board (4) is placed on the upper surface of the base layer film (1), the upper surface of the circuit board (4) is attached to the lower surface of a surface layer film (3), the side surface of the upper surface of the base layer film (1) is bonded with the surface layer film (3) through an adhesive layer (2), an epoxy resin sealing layer (5) is filled in a gap between the adhesive layer (2) and the circuit board (4), and the epoxy resin sealing layer (5) is located in an interlayer between the base layer film (1) and the surface layer film (3);

the upper surface of the surface film (3) is fixedly connected with an anti-aging layer (6), and the upper surface of the anti-slip layer (6) is fixedly connected with a wear-resistant layer (7);

the circuit board (4) comprises a substrate (401), a wire groove (402), a circular groove (403), a liquid metal connecting wire (404) and a lamp bead (405);

the lower surface of the substrate (401) is placed on the upper surface of the base layer film (1), the wire groove (402) and the circular groove (403) are formed in the upper surface of the substrate (401) and are communicated with each other, the wire groove (402) and the circular groove (403) are filled with liquid metal connecting wires (404), and the lamp beads (405) are connected to the inside of the circular groove (403);

liquid metal connecting wire (404) is connected with the one end of power cord (8), the other end of power cord (8) runs through epoxy sealing layer (5) and viscose layer (2) and extends to the outside of basic unit's rete (1) and table tunic (3) intermediate layer department.

2. The novel flexible circuit board of claim 1, wherein: the anti-aging layer (6) is made of a PVC transparent film, and the thickness of the anti-aging layer is 0.06-0.1 mm.

3. The novel flexible circuit board of claim 1, wherein: the wear-resistant layer (7) is made of a BOPP touch film, and the thickness of the BOPP touch film is 0.1-0.2 mm.

4. The novel flexible circuit board of claim 1, wherein: the substrate (401) is made of polyimide or polyester film.

5. The novel flexible circuit board of claim 1, wherein: the width of the wire groove (402) is 0.07-0.1mm, the diameter of the circular groove (403) is 1-2mm, and the depths of the wire groove (402) and the circular groove (403) are both 0.05-0.1 mm.

6. A preparation method of a novel flexible circuit board is characterized by comprising the following steps: the preparation steps are as follows:

s1, preparing a circuit board:

placing a substrate (401) on a preparation machine, extruding and positioning the substrate (401), arranging a wire groove (402) and a circular groove (403) on the substrate (401) by the preparation machine according to the requirements of a drawing and a PLC instruction, printing and dyeing liquid metal in the wire groove (402) and the circular groove (403), inserting a lamp bead (405) into the circular groove (403) before the liquid metal is cooled, and drying the liquid metal on the substrate (401);

s2, installing a circuit board:

the manufacturing method comprises the steps of placing a circuit board (4) on the upper surface of a base layer film (1), smearing an epoxy resin sealing layer (5) and an adhesive layer (2) on the side face of the upper surface of the base layer film (1), attaching the lower surface of a surface layer film (3) to the upper surface of the base layer film (1), bonding through the adhesive layer (2), attaching an anti-aging layer (6) to the surface layer film (3), and attaching a wear-resistant layer (7) to the anti-aging layer (6).

7. The method for preparing the novel flexible circuit board according to claim 6, wherein the method comprises the following steps: the manufacturing machine in the step S1 is a flexible circuit board laser cutting machine, and an 8W355nm all-solid-state ultraviolet laser is adopted.

Technical Field

The invention relates to the technical field of flexible circuit boards, in particular to a novel flexible circuit board.

Background

The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property.

The wide application scope of flexible circuit board can be used to electronic equipment's electrical system also can be used to with the clothing decoration, especially be suitable for with children's clothing, because of its luminous favor that can arouse children of circular telegram, but current flexible circuit board rarely has the adaptation children's clothing to use, so this application has proposed a novel flexible circuit board, comes the special use of children's clothing.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a novel flexible circuit board which is suitable for being used by children clothes and increases the diversity of the children clothes.

In order to achieve the purpose, the invention is realized by the following technical scheme: a novel flexible circuit board comprises a base layer film, wherein a circuit board is placed on the upper surface of the base layer film, the upper surface of the circuit board is attached to the lower surface of a surface layer film, the side surface of the upper surface of the base layer film is bonded with the surface layer film through an adhesive layer, an epoxy resin sealing layer is filled in a gap between the adhesive layer and the circuit board, and the epoxy resin sealing layer is positioned in an interlayer between the base layer film and the surface layer film;

the upper surface of the surface film is fixedly connected with an anti-aging layer, and the upper surface of the anti-slip layer is fixedly connected with a wear-resistant layer;

the circuit board comprises a substrate, a wire groove, a circular groove, a liquid metal connecting wire and a lamp bead;

the lower surface of the substrate is placed on the upper surface of the substrate film, the wire groove and the circular groove are both formed in the upper surface of the substrate and are communicated with each other, liquid metal connecting wires are filled in the wire groove and the circular groove, and the lamp beads are connected in the circular groove;

the liquid metal connecting wire is connected with one end of the power line, and the other end of the power line penetrates through the epoxy resin sealing layer and the adhesive layer and extends to the outside of the interlayer of the base layer film and the surface layer film.

Preferably, the anti-aging layer is made of a PVC transparent film, and the thickness of the anti-aging layer is 0.06-0.1 mm.

Preferably, the material of wearing layer is BOPP sense of touch membrane, and its thickness is 0.1-0.2 mm.

Preferably, the substrate is made of polyimide or polyester film.

Preferably, the width of the wire slot is 0.07-0.1mm, the diameter of the circular slot is 1-2mm, and the depths of the wire slot and the circular slot are both 0.05-0.1 mm.

A preparation method of a novel flexible circuit board comprises the following preparation steps:

s1, preparing a circuit board:

placing the substrate on a preparation machine, extruding and positioning the substrate, arranging a wire groove and a circular groove on the substrate by the preparation machine according to the requirements of a drawing and a PLC (programmable logic controller) instruction, printing and dyeing liquid metal in the wire groove and the circular groove, inserting a lamp bead into the circular groove before the liquid metal is cooled, and drying the liquid metal on the substrate;

s2, installing a circuit board:

the circuit board is placed on the upper surface of the base layer film, the side face of the upper surface of the base layer film is coated with the epoxy resin sealing layer and the adhesive layer, the lower surface of the surface layer film is attached to the upper surface of the base layer film and bonded through the adhesive layer, the anti-aging layer is attached to the surface layer film, and the wear-resistant layer is attached to the anti-aging layer.

Preferably, the manufacturing machine in step S1 is a flexible printed circuit board laser cutting machine, and an 8W355nm all-solid-state uv laser is used.

As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following advantages:

(1) the invention adopts the base layer film and the surface layer film to prevent the circuit board from being waterproof, prevents the circuit board from being short-circuited by water immersion when the garment is arranged on clothes, and ensures that the circuit board is suitable for the garment to be used.

(3) The anti-aging layer is adopted to achieve the anti-ultraviolet effect, the aging damage of the circuit board caused by the long-time irradiation of the circuit board under sunlight is prevented, and the service life of the circuit board is prolonged.

(3) The liquid metal connecting wire is adopted, so that the printing of the circuit board is facilitated, the cost of the circuit board during preparation is reduced, the thickness of the liquid metal connecting wire is conveniently increased through the arrangement of the wire grooves and the circular grooves, the service life of the protection of the liquid metal connecting wire is prolonged, and the damage of the circuit in the bending process is prevented.

(4) The invention adopts the epoxy resin sealing layer to seal the interlayer of the base layer film and the surface layer film, thereby preventing water from entering the base layer film and the surface layer film to cause short circuit of the circuit board and prolonging the service life of the circuit board.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of portion A of FIG. 1 according to the present invention;

fig. 3 is a top view of the circuit board of fig. 1 according to the present invention.

In the figure:

1 base layer film, 2 adhesive layer and 3 surface layer film;

4, a circuit board, a 401 substrate, a 402 wire groove, a 403 circular groove, a 404 liquid metal connecting wire and a 405 lamp bead;

5 epoxy sealing layer, 6 anti-aging layer, 7 wear-resisting layer, 8 power cords.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution:

a novel flexible circuit board comprises a base layer film 1, wherein a circuit board 4 is placed on the upper surface of the base layer film 1, the upper surface of the circuit board 4 is attached to the lower surface of a surface layer film 3, the side surface of the upper surface of the base layer film 1 is bonded with the surface layer film 3 through a viscose layer 2, an epoxy resin sealing layer 5 is filled in a gap between the viscose layer 2 and the circuit board 4, and the epoxy resin sealing layer 5 is located in an interlayer between the base layer film 1 and the surface layer film 3;

the epoxy resin sealing layer 5 is adopted to seal the interlayer of the base layer film 1 and the surface layer film 3, so that water is prevented from entering the base layer film 1 and the surface layer film 3 to cause short circuit of the circuit board 4, and the service life of the circuit board 4 is prolonged.

The upper surface of the surface film 3 is fixedly connected with an anti-aging layer 6, the anti-aging layer 6 is made of a PVC transparent film, the thickness of the anti-aging layer 6 is 0.06-0.1mm, the upper surface of the anti-slipping layer 6 is fixedly connected with a wear-resistant layer 7, the wear-resistant layer 7 is made of a BOPP touch film, and the thickness of the wear-resistant layer 7 is 0.1-0.2 mm;

the anti-aging layer 6 is adopted to achieve the anti-ultraviolet effect, so that the circuit board 4 is prevented from being aged and damaged due to the fact that the circuit board 4 is irradiated under sunlight for a long time, and the service life of the circuit board 4 is prolonged.

The circuit board 4 comprises a substrate 401, a wire groove 402, a circular groove 403, a liquid metal connecting wire 404 and a lamp bead 405;

the lower surface of the substrate 401 is placed on the upper surface of the base layer film 1, the substrate 401 is made of polyimide or polyester film, the wire groove 402 and the circular groove 403 are both formed in the upper surface of the substrate 401 and are communicated with each other, the width of the wire groove 402 is 0.07-0.1mm, the diameter of the circular groove 403 is 1-2mm, the depths of the wire groove 402 and the circular groove 403 are both 0.05-0.1mm, liquid metal connecting wires 404 are filled in the wire groove 402 and the circular groove 403, and the lamp beads 405 are connected in the circular groove 403;

the liquid metal connecting wire 404 is connected with one end of the power line 8, and the other end of the power line 8 penetrates through the epoxy resin sealing layer 5 and the adhesive layer 2 and extends to the outside of the interlayer of the base film 1 and the surface film 3.

The liquid metal connecting wire 404 is adopted, so that the printing of the circuit board 4 is facilitated, the cost of the circuit board 4 during preparation is reduced, the thickness of the liquid metal connecting wire 404 is conveniently increased through the arrangement of the wire groove 402 and the circular groove 403, the service life of the protection of the liquid metal connecting wire 404 is prolonged, and the damage of a circuit caused in the bending process is prevented.

Adopted basal lamina membranacea 1 and top layer membrane 3 to waterproof circuit board 4, prevented that the clothing from leading to circuit board 4 to soak the short circuit when installing on the clothing, made circuit board 4 be applicable to the use of clothing, conveniently protected circuit board 4 at the in-process of clothing washing through wearing layer 7, prevented that top layer membrane 3 from damaging the damage that causes circuit board 4, increased circuit board 4's practicality.

A preparation method of a novel flexible circuit board comprises the following preparation steps:

s1, preparing a circuit board:

placing a substrate 401 on a manufacturing machine, wherein the manufacturing machine is a flexible circuit board laser cutting machine, adopting an 8W355nm all-solid-state ultraviolet laser, extruding and positioning the substrate 401, arranging a wire groove 402 and a circular groove 403 on the substrate 401 according to the requirements of a drawing and a PLC instruction by the manufacturing machine, printing and dyeing liquid metal in the wire groove 402 and the circular groove 403, inserting a lamp bead 405 into the circular groove 403 before the liquid metal is cooled, and then drying the liquid metal on the substrate 401;

s2, installing a circuit board:

the circuit board 4 is placed on the upper surface of the base layer film 1, the epoxy resin sealing layer 5 and the adhesive layer 2 are smeared on the side face of the upper surface of the base layer film 1, the lower surface of the surface layer film 3 is attached to the upper surface of the base layer film 1 and is bonded through the adhesive layer 2, the anti-aging layer 6 is attached to the surface layer film 3, and the wear-resistant layer 7 is attached to the anti-aging layer 6.

In summary, the following steps: the invention adopts the base layer film 1 and the surface layer film 3 to prevent the circuit board 4 from being soaked and short-circuited when the garment is arranged on the garment, so that the circuit board 4 is suitable for the garment, the wear-resistant layer 7 is convenient for protecting the circuit board 4 in the garment washing process, the damage of the surface layer film 3 to the circuit board 4 is prevented, and the practicability of the circuit board 4 is improved.

The anti-aging layer 6 is adopted to achieve the anti-ultraviolet effect, so that the circuit board 4 is prevented from being aged and damaged due to the fact that the circuit board 4 is irradiated under sunlight for a long time, and the service life of the circuit board 4 is prolonged.

The liquid metal connecting wire 404 is adopted, so that the printing of the circuit board 4 is facilitated, the cost of the circuit board 4 during preparation is reduced, the thickness of the liquid metal connecting wire 404 is conveniently increased through the arrangement of the wire groove 402 and the circular groove 403, the service life of the protection of the liquid metal connecting wire 404 is prolonged, and the damage of a circuit in the bending process is prevented.

The invention adopts the epoxy resin sealing layer 5 to seal the interlayer of the base layer film 1 and the surface layer film 3, thereby preventing water from entering the base layer film 1 and the surface layer film 3 to cause short circuit of the circuit board 4 and prolonging the service life of the circuit board 4.

The novel flexible circuit board provided by the invention is described in detail above. The principles and embodiments of the present invention have been explained by applying specific examples, and the above descriptions of the embodiments are only used to help understanding the method and the core idea of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.