阅读说明：本技术 单面跨线式导通电路薄膜及其制造方法 (Single-sided overline type conducting circuit film and manufacturing method thereof ) 是由 孔令海 刘超 于 2020-06-10 设计创作，主要内容包括：本发明涉及一种单面跨线式导通电路薄膜及其制造方法,电路薄膜包括:绝缘薄膜、位于正面的第一导电印刷层与第二导电印刷层、两导电印刷层之间的隔离图形层;第一导电印刷层包括多组成对配置的第一感应电极与第二感应电极,第二感应电极连续围绕对应的第一感应电极。第二导电印刷层的跨接走线跨过第二感应电极并沿着隔离图形层的长度方向电连接第一感应电极与连接线路。本发明具有无通孔不需要双面印刷能电连接两种感应电极并使第一感应电极表面完整无露孔的效果。(The invention relates to a single-sided overline type conductive circuit film and a manufacturing method thereof. The bridging routing of the second conductive printing layer crosses the second sensing electrode and is electrically connected with the first sensing electrode and the connecting circuit along the length direction of the isolation graph layer. The invention has the effect of no through hole, no double-sided printing, electric connection of two induction electrodes and complete surface of the first induction electrode without exposed holes.)

1. A single-sided flying lead type conducting circuit film is characterized by comprising:

an insulating film (10);

a first conductive printed layer (20) formed on the insulating film (10), wherein the first conductive printed layer (20) includes a plurality of sets of first sensing electrodes (21) and second sensing electrodes (22) configured in pairs, the second sensing electrodes (22) continuously surround the corresponding first sensing electrodes (21), and the first conductive printed layer (20) further includes a first connection line (23) not directly connected to the first sensing electrodes (21) and a second connection line (24) directly connected to the second sensing electrodes (22);

the isolation graph layer (30) covers a crossover part of the second sensing electrode (22) and is positioned on the film surface at the side edge of the crossover part, and the crossover part is positioned between the first sensing electrode (21) and the connection point of the first connection circuit (23);

the second conductive printing layer (40) is formed on the isolation pattern layer (30) and extends to the first conductive printing layer (20), the second conductive printing layer (40) comprises a first bridging line (41), and the first bridging line (41) is electrically connected with the first sensing electrode (21) and the first connecting circuit (23) along the length direction of the isolation pattern layer (30).

2. The single-sided flying lead type conductive circuit film as claimed in claim 1, wherein the first conductive printed layer (20) comprises a short circuit (25) directly connected to the first sensing electrode (21), and the first sensing electrode (21) is electrically connected to the first flying lead (41) via the short circuit (25).

3. The single-sided overline type conducting circuit film according to claim 1, wherein the isolation pattern layer (30) further includes a line portion (31) covering a portion of the second connecting line (24), the second conductive printed layer (40) includes a second overline (42), the second overline (42) electrically connects two adjacent first sensing electrodes (21) along the line portion (31) of the isolation pattern layer (30), the first overline (41), the second overline (42) and the first connecting line (23) are connected in series to form all the first sensing electrodes (21), and the first sensing electrodes (21) are equipotential reference electrodes.

4. The single-sided flying lead type conductive circuit film according to claim 1, wherein a first connection terminal (51) electrically connected to the first connection circuit (23) and a second connection terminal (52) electrically connected to the second connection circuit (24) are disposed on the insulating film (10), and the first connection terminal (51) and the second connection terminal (52) are arranged in a same surface bus bar interface area of the insulating film (10).

5. The single-sided flying lead type conducting circuit film according to claim 4, wherein the insulating film (10) has a shape of a slot (11) on both sides of the flat cable interface region, so that the flat cable interface region is a strip shape, preferably, the slots (11) on both sides are bent and expanded in a direction away from each other to form a test region, and a plurality of test terminals (70) are arranged in the test region to electrically connect the corresponding first connection terminals (51) and the second connection terminals (52).

6. The single-sided flying lead type conductive film of claim 1, wherein the first sensing electrode (21) has a circular pad shape, the second sensing electrode (22) has a continuous bad pad shape, and the second sensing electrode (22) surrounds the first sensing electrode (21) with a center of the first sensing electrode (21) as a ring center point.

7. The single-sided flying lead type conductive circuit film according to claim 6, wherein a fixed gap is formed between the first sensing electrode (21) and the corresponding second sensing electrode (22), and the first sensing electrode (21) and the second sensing electrode (22) arranged in pairs are arranged in the insulating film (10) in a staggered matrix manner, preferably, the insulating film (10) forms an opening (12) between a point adjacent to the staggered pair in the paired matrix of the first sensing electrode (21) and the second sensing electrode (22).

8. The single-sided flying lead type conductive circuit film according to any one of claims 1 to 7, further comprising a front-side coating film (60) formed on the insulating film (10) and the first conductive printed layer (20), the front-side coating film (60) covering the first connecting line (23) and the second connecting line (24), the front-side coating film (60) having a coil opening (61) for exposing the first sensing electrode (21) and the second sensing electrode (22) arranged in pair.

9. The single-sided flying lead type conductive circuit film as claimed in claim 8, wherein the front-side film (60) has a cover strip (62) protruding into the sensor ring opening (61), and the cover strip (62) completely covers the first flying lead (41) and the portion of the isolation pattern layer (30) inside the sensor ring opening (61).

10. A method for manufacturing a single-sided flying lead-through circuit film according to any one of claims 1 to 9, comprising:

-providing said insulating film (10);

a first time of front printing of conductive paste to form the first conductive printing layer (20);

printing and forming an isolation pattern layer (30) on the insulation film (10) and the first conductive printing layer (20);

a second conductive paste front printing to form the second conductive printing layer (40);

preferably, the first sensing electrode (21) of the first conductive printed layer (20) has a shape of being exposed without holes intact, and preferably, the manufacturing method further includes printing a front surface coating film (60) on the insulating film (10) and the first conductive printed layer (20).

Technical Field

The invention relates to the technical field of double-sided conduction of circuits, in particular to a single-sided overline type conducting circuit film and a manufacturing method thereof.

Background

In the early Printed Circuit Board (PCB) and flexible printed circuit board (FPC) technologies, since the layout of the circuits needs to be staggered, printed circuits are formed on the upper and lower surfaces of a carrier or a carrier film to achieve double-sided conduction, and in the common double-sided conduction, a copper-clad layer is firstly attached to the surface of a base material, and a Plated Through Hole (PTH) is formed by electroplating after punching. The through hole shape of the plated through hole before electroplating is helpful for the double-sided distribution of the etching solution for etching the circuit in the wet process. However, with the development of tiny thinning of devices and the change of manufacturing processes, the circuit film has a thinner structure than a flexible circuit board, and the biggest difference between the two is that the circuit film does not use copper foil, an adhesive layer does not exist between a circuit and a base material, no etching process is used in manufacturing, the thickness of the whole product of the circuit film is more biased to a diaphragm rather than a plate, and the whole product of the circuit film has better bending and flexibility characteristics. However, in the process of manufacturing the circuit film, the circuit structure is directly printed by using metal paste such as silver paste, and the design of the through hole with two-sided conduction causes overflow pollution of the paste during printing, which easily causes the problem of inaccurate circuit pattern and short circuit of the circuit.

In some special circuit designs, the peripheral electrode needs to be designed in a ring shape, surrounding another central electrode. On the single-sided printing, the ring electrode is divided into a plurality of regions and gaps are formed between the regions, and a line connecting the central electrode is formed in the gaps to penetrate through the ring electrode. For example, in a circuit structure of no central electrode of ring portion subregion, in utility model patent publication No. CN208520504U disclose a film pressure sensor for sensing stress balance promptly, film pressure sensor includes an annular portion and a strip afterbody that extends from the annular portion outside, annular portion central authorities have a through-hole, and the conducting wire layer includes a plurality of induction zones and the output lead wire of outwards drawing forth by the induction zone, and the pressure sensitive material layer includes a plurality of resistances with each induction zone one-to-one, each induction zone sets up along the even interval of circumference, and centers on the through-hole is whole to be arranged and is the annular.

The invention patent publication No. CN105389048A discloses a printed circuit board of a gesture recognition device and an electronic device, wherein the printed circuit board is used for the gesture recognition device and is provided with a positioning hole; the first metal induction area is positioned on the first surface of the printed circuit board, the wiring shape is irregular, and every two adjacent metal induction areas are adjacent; each first metal induction area comprises a second metal induction area and a first metal induction disc corresponding to the mechanical key. The second metal sensing area is provided with a metal sensing plate at the center of the circle and a metal sensing plate at the periphery, which are divided into a plurality of areas, but the patent prior art does not disclose a circuit connection mode of the metal sensing plate. Generally, the printed circuit board uses plated through holes to complete signal or electrical connection. In terms of industry trend, the thickness of the printed circuit board is much larger than that of the circuit film, and the softness is poor, so that the printed circuit board is generally not preferred to be used as the sensing interface with the electrode in the light and thin electronic device.

The patent publication No. CN110319971A discloses a bipolar capacitance type vacuum gauge and a corresponding measuring circuit thereof, wherein the bipolar capacitance type vacuum gauge comprises a shell, a diaphragm, a fixed substrate and a fixed electrode, the fixed substrate is fixedly arranged in a vacuum cavity, the fixed electrode is arranged on the fixed substrate, when the diaphragm is stressed and deformed, the capacitance on the fixed electrode can be changed, and the pressure in a detection cavity can be obtained by detecting the change of the capacitance; the fixed electrode comprises a ring electrode and a circular electrode, and the circular electrode is positioned in the ring electrode. The prior art does not specifically disclose which kind of circuit board the fixed substrate is, nor does it specifically disclose the wiring structure for connecting the ring-shaped electrodes and connecting the circular electrodes.

Disclosure of Invention

The invention mainly aims to provide a single-side overline type conducting circuit film, which is mainly characterized in that the circuit connection design of a ring electrode continuously surrounding a central electrode is realized in a single-side printing mode in a circuit film product, and the defect of a gap of a surrounding type induction electrode can be solved under the design without a through hole.

The invention mainly aims to provide a manufacturing method of a single-sided overline type conducting circuit film, which is used for realizing the technical effect of single-sided printing of the circuit film, and overbridge type conduction and no hole exposure.

The main purpose of the invention is realized by the following technical scheme:

a single-sided flying lead type conducting circuit film is provided, which comprises:

an insulating film having a front surface and an opposite back surface;

the first conductive printing layer is formed on the front surface of the insulating film and comprises a plurality of groups of first sensing electrodes and second sensing electrodes which are configured in pairs, the second sensing electrodes continuously surround the corresponding first sensing electrodes, and the first conductive printing layer further comprises a first connecting circuit which is not directly connected with the first sensing electrodes and a second connecting circuit which is directly connected with the second sensing electrodes;

the isolation graph layer covers a cross-line part of the second sensing electrode and is positioned on the surface of the film on the side edge of the cross-line part, and the cross-line part is positioned between the first sensing electrode and the connection point of the first connection circuit;

the second conductive printing layer is formed on the isolation graph layer and extends to the first conductive printing layer, the second conductive printing layer comprises a first bridging line, and the first bridging line is electrically connected with the first sensing electrode and the first connecting circuit along the length direction of the isolation graph layer.

By adopting the technical scheme, the second sensing electrode and the first cross wiring are isolated by utilizing the isolation graph layer, so that the single-sided conduction without a through hole under the front paste printing of the circuit film is realized, and the first sensing electrode has a complete electrode surface without an exposed hole.

The invention may in a preferred example be further configured to: the first conductive printed layer comprises a short circuit directly connected with the first sensing electrode, and the first sensing electrode is electrically connected with the first cross-connection wiring through the short circuit.

By adopting the preferable technical characteristics, the short circuit of the first conductive printing layer is used as an extension circuit which is directly connected with the first sensing electrode on the front surface of the film, and the length of the cross wiring on the front surface of the film is shortened.

The invention may in a preferred example be further configured to: the isolation graph layer further comprises a line part which covers part of the second connecting line, the second conductive printing layer comprises a second bridging line which is electrically connected with two adjacent first sensing electrodes along the line part of the isolation graph layer, the first bridging line, the second bridging line and the first connecting line are connected with all the first sensing electrodes in series, and the first sensing electrodes are equipotential reference electrodes.

By adopting the preferable technical characteristics, the line part of the isolation graph layer and the second bridging line of the second conductive printing layer are utilized, the second bridging line crosses over the second sensing electrode and the second connecting line on the front surface of the film on the line part, so that the connecting lines of the first sensing electrode and the second sensing electrode are not mutually connected in series, all the first sensing electrodes are connected in series by the first bridging line, the second bridging line and the segmented first connecting line, more connecting lines are arranged in the limited film surface area, the first sensing electrode is an equipotential reference electrode, the part of the bridging line is a segmented line which is separated into a plurality of segments, and the first connecting line on the same surface form a serial line. Therefore, all the wirings of the circuit film can be located on the front surface of the insulating film.

The invention may in a preferred example be further configured to: the insulating film is provided with a first connecting end point electrically connected with the first connecting circuit and a second connecting end point electrically connected with the second connecting circuit, and the first connecting end point and the second connecting end point are arranged in the same surface flat cable interface area of the insulating film.

By adopting the preferable technical characteristics, two connection end points which are respectively connected by two connecting circuits connected by two sensing electrodes are arranged in the same surface flat cable interface area of the insulating film, so that the same area and the same surface of the connection end points are converged, and the external connection is facilitated.

The invention may in a preferred example be further configured to: the insulating film is provided with grooves on two sides of the flat cable interface area, so that the flat cable interface area on the surface is in a strip shape, preferably, the grooves on the two sides are bent and expanded towards the direction away from each other to form a test area, and a plurality of test end points are arranged in the test area to electrically connect the corresponding first connection end points and the second connection end points.

By adopting the preferable technical characteristics, the insulation film is formed with a strip-shaped flexible integrated flat cable design by utilizing the slotted shapes at the two sides of the flat cable interface area, so that a welding point for connecting the flat cable and the flat cable is omitted. Preferably, the two side slots are bent and expanded in the direction away from each other to form a test area, test terminals connected with the two sensing electrodes are arranged in the test area for testing the thin film circuit, the test terminals are configured in the expanded bent test area, the test terminals are connected before the fan-in convergent flat cable, and the distance between the test terminals can be larger than that between the connection terminals, so that probes of the tester can be pressed and contacted conveniently.

The invention may in a preferred example be further configured to: the first induction electrodes are in a circular pad shape, the second induction electrodes are in a continuous bad-shape pad shape, and the second induction electrodes surround the first induction electrodes by taking circle centers of the first induction electrodes corresponding to the second induction electrodes as ring center points.

By adopting the preferable technical characteristics, the first induction electrode of the circular pad and the second induction electrode of the bad-shaped pad are utilized, the second induction electrode surrounds the first induction electrode, an object approaches or an external electrode makes the two induction electrodes contact to generate capacitance or resistance change between the first induction electrode and the second induction electrode, a gesture, electromotive force or short-distance non-touch mode or touch mode induction interface can be formed, and the touch type passive induction panel can be used as a next generation non-touch type/touch type power-saving passive induction panel.

The invention may in a preferred example be further configured to: the first induction electrodes and the corresponding second induction electrodes form fixed gaps, the first induction electrodes and the second induction electrodes which are arranged in pairs are arranged in the insulating film in a staggered matrix mode, and preferably, openings are formed in the insulating film between the adjacent points of the paired matrix in the first induction electrodes and the second induction electrodes which are arranged in pairs and the paired staggered points.

By adopting the preferable technical characteristics, the specific configuration relationship and arrangement relationship between the first sensing electrode and the second sensing electrode are utilized to maintain the same sensing effect between the two sensing electrodes and have better sensing distribution in the sensing area. Preferably, openings are formed between adjacent dots of the paired matrix and the paired dislocation dots, and a gas permeable region can be formed in the sensing region of the device unit to reduce adverse effects of gas flow on short-distance sensing.

The invention may in a preferred example be further configured to: the single-sided overline type conducting circuit film further comprises a front face covering film formed on the insulating film and the first conducting printing layer, the front face covering film covers the first connecting circuit and the second connecting circuit, and the front face covering film is provided with an induction coil opening and used for exposing the first induction electrode and the second induction electrode which are configured in pairs.

By adopting the preferable technical characteristics, the front-side coating film and the forming form thereof are utilized to protect the conductive circuit printed on the front side. The induction coil opening of the front surface film does not influence the induction efficiency of the first induction electrodes and the second induction electrodes which are arranged in groups.

The invention may in a preferred example be further configured to: the front surface covering film is provided with a covering strip protruding into the induction coil opening, and the covering strip completely covers the first bridging wire and the position of the isolation graph layer in the induction coil opening.

By adopting the preferable technical characteristics, the covering strip which protrudes inwards from the front-side covering film is utilized to prevent the circuit of the first cross wiring from being exposed and strengthen the fixation of the isolation graph layer on the film.

The main purpose of the invention is realized by the following technical scheme:

a method for manufacturing a single-sided flying lead type conducting circuit film according to any one of the above technical solutions is provided, the method comprising the steps of:

providing the insulating film;

the first time of front printing of the conductive paste is carried out to form the first conductive printing layer;

printing on the insulating film and the first conductive printing layer to form an isolation pattern layer;

conducting paste front printing for the second time to form the second conducting printing layer;

preferably, the first sensing electrode of the first conductive printing layer has a shape of being entirely exposed without holes, and the manufacturing method further includes printing a front cover film on the insulating film and the first conductive printing layer.

By adopting the technical scheme, the same surface is printed for multiple times, the second conductive printing layer is provided with the bridging wiring, the single-sided printing bridge-crossing type through-hole-free conduction is achieved, the through-hole plating process is not needed, the first induction electrode on the front surface of the film is in a complete hole-free exposed shape, and the second induction electrode is in a complete continuous ring shape surrounding the first induction electrode, so that the induction potential of the front surface of the film with 360-degree consistency is achieved.

In summary, the present invention includes at least one of the following technical effects that contribute to the prior art:

1. the circuit film can achieve the bridge-spanning type circuit connection of two specific induction electrodes by conducting paste through single-sided printing for multiple times, and can prevent the pollution of a through hole plating process or the problem of back diffusion pollution caused by double-sided paste through a film through hole;

2. the circuit for connecting the two specific induction electrodes can be completely formed on the front surface of the insulating film, the reverse printing is not needed, and the back surface coating film can be saved in a finished product structure;

3. the first induction electrode has a complete non-exposed-hole shape, the second induction electrode has a continuous ring shape surrounding the first induction electrode, and the induction efficiency can be controlled.

Drawings

FIG. 1 is a schematic diagram of a front side of a single-sided cross-line conducting circuit film according to some embodiments of the invention;

FIG. 2 is a partially enlarged view of a region A in FIG. 1;

FIG. 3 is a partial cutaway view of the area A of FIG. 1;

FIG. 4 is a cross-sectional view of a single-sided flying lead-through thin film of some embodiments of the present invention at a first sensing electrode and a second sensing electrode arranged in pairs;

FIG. 5 is a process flow diagram illustrating a method of fabricating a single-sided flying lead-through film in accordance with further embodiments of the present invention;

FIG. 6 is a schematic diagram illustrating the relationship between elements in the step of providing an insulating film in the manufacturing method according to another embodiment of the invention;

FIG. 7 is a schematic diagram illustrating the relationship between elements in the first conductive paste printing step in the method according to another embodiment of the invention;

FIG. 8 is a schematic diagram illustrating the relationship between elements in the step of forming an isolation pattern layer in the manufacturing method according to another embodiment of the present invention;

FIG. 9 is a schematic diagram illustrating the relationship between elements in the second conductive paste printing step in the manufacturing method according to another embodiment of the invention.

The test structure comprises a reference numeral 10, an insulating film, 11, a groove, 12, a hole, 20, a first conductive printing layer, 21, a first sensing electrode, 22, a second sensing electrode, 23, a first connecting circuit, 24, a second connecting circuit, 25, a short circuit, 30, an isolating graph layer, 31, a line part, 40, a second conductive printing layer, 41, a first bridging wire, 42, a second bridging wire, 51, a first connecting end point, 52, a second connecting end point, 60, a front surface coating, 61, an induction coil opening, 62, a covering strip, 70 and a test end point.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of embodiments for understanding the inventive concept of the present invention, and do not represent all embodiments, nor do they explain only embodiments. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention under the understanding of the inventive concept of the present invention are within the protection scope of the present invention.

It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly. In order to facilitate understanding of the technical solution of the present invention, the single-sided overline conductive circuit film and the manufacturing method thereof of the present invention will be described and explained in further detail below, but the present invention is not limited to the scope of the present invention.

The accompanying drawings illustrate, where possible, certain features that are common to the various embodiments, and the differences or distinctions between the embodiments will be described or shown in text or by contrast with the drawings. Therefore, based on the industrial characteristics and technical essence, those skilled in the art should correctly and reasonably understand and judge whether the individual technical features or any combination of a plurality of the technical features described below can be characterized in the same embodiment or whether a plurality of technical features mutually exclusive can be respectively characterized in different variant embodiments.

In order to facilitate understanding of the technical solutions of the present application, some terms appearing in the embodiments are explained. The "paste printing" refers to screen printing or stencil printing of a metal particle paste, which usually contains a high proportion of conductive particles and a binder, usually silver paste, which are baked sufficiently to achieve electrical connection, and may also be conductive paste mixed with other conductive particles. The "sensing electrode" is an electrode point that can be sensed by a gesture, electromotive force, or other means, and is usually a non-contact type, but may be a contact type.

Fig. 1 is a schematic front view of a single-sided cross-line conducting circuit film according to some embodiments of the invention, fig. 2 is a partially enlarged schematic view of the circuit film in a region a of fig. 1, fig. 3 is a partially cut-away schematic view of the region a of fig. 1, and fig. 4 is a cut-away schematic view of the circuit film at a pair of a first sensing electrode and a second sensing electrode. Referring to fig. 1 to 3, a single-sided flying lead type conducting circuit film according to some embodiments of the present invention includes:

a single-sided flying lead type conducting circuit film is provided, which comprises:

the insulation film 10 is usually made of PET material, the color is usually transparent, and can also be white or black, the thickness of the insulation film 10 is usually between 0.038-0.05 mm or can be thinner according to the film processing capability;

the first conductive printing layer 20 is formed on the front surface of the insulating film 10, the first conductive printing layer 20 comprises a plurality of groups of first sensing electrodes 21 and second sensing electrodes 22 which are configured in pairs, the second sensing electrodes 22 continuously surround the corresponding first sensing electrodes 21, the first conductive printing layer 20 further comprises a first connecting circuit 23 which is not directly connected with the first sensing electrodes 21 and a second connecting circuit 24 which is directly connected with the second sensing electrodes 22, and the circuits and the sensing electrodes can be formed on the same conductive printing layer;

the isolation pattern layer 30 covers a crossover part of the second sensing electrode 22 and is positioned on the film surface at the side of the crossover part, the crossover part is positioned between the first sensing electrode 21 and the connection point of the first connection line 23, the isolation pattern layer 30 comprises a plurality of attachment strips in shape, particularly as shown in FIG. 8, so as to occupy a smaller coverage area of the insulation film 10, and the isolation pattern layer 30 is preferably formed by printing an insulation glue to be attached to the side edge of the crossover part of the second sensing electrode 22 (as shown in FIG. 3);

and a second conductive printing layer 40 formed on the isolation pattern layer 30 and extending to the first conductive printing layer 20, wherein the respective thicknesses of the first conductive printing layer 20 and the second conductive printing layer 40 may be 6-8 μm, and the printing paste of the first conductive printing layer 20 and the second conductive printing layer 40 may be silver paste.

The implementation principle of the embodiment is as follows: the second sensing electrode 22 and the first bridging trace 41 are isolated by using the isolation pattern layer 30, so that the single-sided conduction without a through hole under the front paste printing of the circuit film is realized, and the first sensing electrode 21 has a complete electrode surface without an exposed hole.

In use, when the first connection terminal 51 electrically connected to the first sensing electrode 21 is connected to ground or low level, a potential difference is generated between the first sensing electrode 21 and the second sensing electrode 22, and a current change can be detected by the second connection terminal 52 electrically connected to the second sensing electrode 22. When the first connection terminal 51 electrically connected to the first sensing electrode 21 is connected at a high level and serves as an input terminal, when the first sensing electrode 21 is connected in contact with the second sensing electrode 22, the second connection terminal 52 electrically connected to the second sensing electrode 22 can detect the generation of current, or the change of capacitance or resistance between the first sensing electrode 21 and the second sensing electrode 22 in the same sensing coil can be detected by external gesture or potential change by using an electromagnetic effect.

As to a specific description of the first conductive printed layer 20, in a preferred example, referring to fig. 2 to 4, the first conductive printed layer 20 includes a short circuit 25 directly connected to the first sensing electrode 21, and the first sensing electrode 21 is electrically connected to the first bridging trace 41 through the short circuit 25. Therefore, the short circuit 25 of the first conductive printed layer 20 is used as an extension circuit directly connected to the first sensing electrode 21 on the front surface of the film, so as to shorten the length of the first bridging trace 41 on the back surface of the film, and the back surface of the film has no structure of the first bridging trace 41 passing through the first sensing electrode 21, so as to shorten the length of the bridging trace on the front surface of the film, or prevent the first sensing electrode 21 from being covered. In addition, the second connection line 24 is mainly used in the line design of the first conductive printed layer 20, and specifically, a line dense region may be formed at a portion of the insulating film 10, and a segmented first connection line 23 may be disposed in a line sparse region of the second connection line 24. The specific form of the first conductive printed layer 20 can be seen in fig. 7.

Referring to fig. 1 (see also fig. 8), in a preferred example, the isolation pattern layer 30 includes a line portion 31 covering a portion of the second connection line 24, the second conductive printing layer 40 includes a second jumper trace 42, the second jumper trace 42 electrically connects two adjacent first sensing electrodes 21 along the line portion 31 of the isolation pattern layer 30, the first jumper trace 41, the second jumper trace 42 and the first connection line 23 are connected in series to form all the first sensing electrodes 21, and the first sensing electrodes 21 are equipotential reference electrodes. By using the line part 30 of the isolation pattern layer 30 and the second crossover wire 42 of the second conductive printing layer 40, the second crossover wire 42 crosses the second sensing electrode 22 and the second connection line 24 on the front surface of the film on the line part 31, so that the connection lines of the first sensing electrode 21 and the second sensing electrode 22 are not connected in series, and all the first sensing electrodes are connected in series by using the first crossover wire 41, the second crossover wire 42 and the segmented first connection line 23, more connection lines are arranged in the limited film surface area, the first sensing electrode 21 is an equipotential reference electrode, the crossover wires 41,42 are segmented lines separated into segments, and form a series connection line with the first connection line 23 on the same surface, and back wiring is not needed. Therefore, all the wirings of the circuit film can be located on the front surface of the insulating film.

Regarding the thickness relationship between the second conductive printed layer 40 and the first conductive printed layer 20, in a preferred example, the printing thickness of the second conductive printed layer 40 may be the same as or greater than the printing thickness of the first conductive printed layer 20.

In a preferred example of the external connection mode of the circuit film, referring to fig. 1, the insulating film 10 is provided with a first connection terminal 51 electrically connected to the first connection line 23 and a second connection terminal 52 electrically connected to the second connection line 24, and the first connection terminal 51 and the second connection terminal 52 are arranged on the same surface of the front surface of the insulating film 10. Therefore, two connection terminals respectively connected by two connection lines connected by two sensing electrodes are arranged in the same surface wiring interface region of the insulating film 10, so that the same region and the same surface of the connection terminals are converged to facilitate external connection.

Referring to fig. 1, in a preferred example, the insulating film 10 has a slot 11 shape on both sides of the bus bar interface region, so that the surface bus bar interface region is a long strip. Therefore, by utilizing the shape of the slots 11 on both sides of the flat cable interface area, the insulating film 10 itself forms a strip-shaped flexible integrated flat cable design to omit a section of welding point for connecting the flat cable and the flat cable.

Referring to fig. 1, in a preferred example of the test connection of the circuit film, the slots 11 on both sides are bent and expanded away from each other to form a test area, and a plurality of test terminals 70 are arranged in the test area to electrically connect the corresponding first connection terminals 51 and the corresponding second connection terminals 52. Therefore, the slots 11 on both sides are bent and expanded in the direction away from each other to form a test area, the test terminals 70 connected to the two kinds of sensing electrodes are arranged in the test area for testing the thin film circuit, the test terminals are configured in the expanded and bent test area, the distance between the test terminals 70 can be larger than the distance between the connection terminals 51 and 52 before the test terminals 70 are connected to the fan-in convergent flat cable, so as to facilitate the probe press-contact of the tester.

As to the specific shape of the first sensing electrode 21 and the second sensing electrode 22, in a preferred example, the first sensing electrode 21 has a circular pad shape, the second sensing electrode 22 has a continuous bad pad shape, and the second sensing electrode 22 surrounds the first sensing electrode 21 with the center of the circle of the first sensing electrode 21 as a circle center point. Therefore, the first sensing electrode 21 of the circular pad and the second sensing electrode 22 of the bad-shaped pad are utilized, the second sensing electrode 22 surrounds the first sensing electrode 21, an object approaches or contacts the two sensing electrodes by an external electrode to generate capacitance or resistance change between the first sensing electrode 21 and the second sensing electrode 22, a sensing interface of a gesture, an electromotive force or a short-distance non-touch mode or a touch mode can be formed, and the passive sensing panel can be used as a next generation non-touch/touch power-saving passive sensing panel. The width of the second sensing electrode 22 is specifically 10% to 50% of the diameter of the first sensing electrode 21.

In a preferred example of the combination relationship between the first sensing electrodes 21 and the second sensing electrodes 22, a fixed gap is formed between the first sensing electrode 21 and the corresponding second sensing electrode 22, and the first sensing electrode 21 and the second sensing electrode 22, which are arranged in pairs, are arranged in the insulating film 10 in a staggered matrix manner. Therefore, the specific arrangement and arrangement of the first sensing electrodes 21 and the second sensing electrodes 22 are utilized to maintain the same sensing effect between the two sensing electrodes and to have a better sensing distribution in the sensing region. The fixed gap is smaller than the diameter or length of the first sensing electrode 21 and larger than the width of the second sensing electrode 22.

As for the specific shape description of the insulating film 10 outside the sensing electrode region arranged in pairs, in a preferred example, the insulating film 10 forms openings 12 between pairs of matrix adjacent points and pairs of dislocation points in the first and second sensing electrodes 21 and 22 arranged in pairs. Therefore, the openings 12 formed between the adjacent dots of the paired matrix and the paired dislocation dots can form a gas-permeable region in the sensing region of the device unit (corresponding to the monomer shape of the insulating film 10) to reduce the adverse effect of the gas flow on the short-distance sensing. In this embodiment, the insulating film 10 is provided with two openings 12, the opening 12 far away from the flat cable interface area is smaller and can be a rectangular hole or a square hole, 3 paired induction electrode coils are arranged on the periphery, the opening 12 in the middle of the film is larger and can be an irregular hole, 6 paired induction electrode coils are arranged on the periphery, and the circuit film can specifically have 8 induction electrode coils and can specifically correspond to an induction switch of one palm.

In a preferred example of the surface protection of the circuit film, referring to fig. 3, the one-sided overline type conductive circuit film further includes a front surface coating film 60 formed on the insulating film 10 and the first conductive printed layer 20, the front surface coating film 60 covers the first connecting line 23 and the second connecting line 24, and the front surface coating film 60 has an inductor opening 61 for exposing the first inductor electrode 21 and the second inductor electrode 22 arranged in a pair. The front side coating film 60 and the formation thereof are used to protect the conductive circuit printed on the front side. The induction coil opening 61 of the front surface coating 60 does not affect the induction performance of the first induction electrode 21 and the second induction electrode 22 which are arranged in pair. The "paired configuration" specifically combines adjacent one first sensing electrode 21 and one second sensing electrode 22 in one sensing coil region. The insulation film 10 and the front surface coating 60 may have an inductive isolation effect, or/and an inductive isolation effect on the film circuit may be obtained by using a shielding cover which is additionally assembled.

In a preferred example of the specific description of the coil opening 61, referring to fig. 2, the front cover film 60 has a cover strip 62 protruding into the coil opening 61, and the cover strip 62 completely covers the first crossover trace 41 and the portion of the isolation pattern layer 30 inside the coil opening 61. The cover strip 62 protruding inward from the front cover film 60 is used to prevent the first cross trace 41 from being exposed and enhance the fixation of the isolation graphic layer 30 on the film.

In addition, the other embodiments of the present invention disclose a method for manufacturing a single-sided flying lead-through circuit film, which is used for manufacturing the circuit film according to any of the above technical schemes. FIG. 5 is a block diagram showing the manufacturing method, FIG. 6 is a schematic diagram showing the relationship of elements in the step of providing an insulating film; FIG. 7 is a schematic diagram showing the relationship between elements in the first conductive paste printing step; FIG. 8 is a schematic diagram showing the relationship between elements in the step of forming an isolation pattern layer; fig. 9 is a schematic diagram showing the relationship between elements in the second conductive paste printing step. Referring to fig. 6 to 9 in conjunction with fig. 5, the manufacturing method includes the following main steps and preferred steps:

step S1, as shown in FIG. 6, providing an insulation film 10, wherein, in the mass production process, the shape, the slot 11 and the opening 12 of the insulation film 10 are not formed yet, a plurality of units of the insulation film 10 are defined in a film substrate, and the shape, the slot 11 and the opening 12 of the insulation film 10 are formed after all the printing processes are completed;

step S2, as shown in fig. 7, conducting paste is printed on the front surface for the first time to form the first conducting printed layer 20;

step S3, as shown in fig. 8, printing the isolation pattern layer 30 on the insulation film 10 and the first conductive printing layer 20;

step S4, as shown in fig. 9, the second conductive paste is printed on the front surface to form the second conductive printing layer 40, and in the preferred step S5, as shown in fig. 2 to 4, the insulating film 10 and the first conductive printing layer 20 are printed to form the front surface coating film 60.

The implementation principle of the embodiment is as follows: the second sensing electrode 22 and the first bridging trace 41 are isolated by the isolation pattern layer 30, so that the single-sided conduction without a through hole under the front paste printing of the circuit film is realized, and the first sensing electrode 21 has a complete electrode surface without an exposed hole, so as to maintain the sensing performance of the first sensing electrode 21. More specifically, referring to fig. 1 and 9, the formation of the trench 11, the opening 12 and the outline of the insulating film 10 is performed after the formation of the front surface coating 60.

The embodiments of the present invention are merely preferred embodiments for easy understanding or implementing of the technical solutions of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes in structure, shape and principle of the present invention should be covered by the claims of the present invention.