阅读说明：本技术 半导体工艺设备的上电极机构及半导体工艺设备 (Upper electrode mechanism of semiconductor process equipment and semiconductor process equipment ) 是由 卫晶 韦刚 杨京 牛晨 茅兴飞 于 2020-05-18 设计创作，主要内容包括：本发明实施例公开了一种半导体工艺设备的上电极机构及半导体工艺设备,所述上电级机构包括：射频线圈、电流传感器、电流调整装置,其中,所述射频线圈包括至少两条并联的支路；每条所述支路上均设置有一所述电流传感器,用于检测该支路的支路电流；所述电流调整装置设置在所述射频线圈上,用于调整每个所述支路的支路电流,以使各所述支路的支路电流均相等。这样,通过电流调整装置,可以使射频线圈中每个支路的支路电流相等,实现刻蚀的均匀性。(The embodiment of the invention discloses an upper electrode mechanism of semiconductor process equipment and the semiconductor process equipment, wherein the upper electrode mechanism comprises: the device comprises a radio frequency coil, a current sensor and a current adjusting device, wherein the radio frequency coil comprises at least two branches connected in parallel; each branch is provided with one current sensor for detecting the branch current of the branch; the current adjusting device is arranged on the radio frequency coil and used for adjusting the branch current of each branch circuit so as to enable the branch current of each branch circuit to be equal. Therefore, by the current adjusting device, the branch current of each branch in the radio frequency coil can be equal, and the etching uniformity is realized.)

1. An upper electrode structure of semiconductor processing equipment, comprising: a radio frequency coil, a current sensor, a current adjusting device, wherein,

the radio frequency coil comprises at least two branches connected in parallel;

each branch is provided with one current sensor for detecting the branch current of the branch;

the current adjusting device is arranged on the radio frequency coil and used for adjusting the branch current of each branch circuit so as to enable the branch current of each branch circuit to be equal.

2. A top electrode mechanism in accordance with claim 1, wherein said current adjustment means comprises: the at least two adjustable capacitors are arranged on the at least two parallel branches in a one-to-one correspondence manner.

3. A top electrode mechanism in accordance with claim 1, wherein said current adjustment means comprises: the first connecting strip is connected to a radio frequency source through a matcher, the second connecting strip is connected with at least two parallel branches respectively, the movable connecting strip is movably connected with the first connecting strip and the second connecting strip, the movable connecting strip and a connecting point of the first connecting strip can be moved along the first connecting strip, and the movable connecting strip and a connecting point of the second connecting strip can be moved along the second connecting strip.

4. A top electrode mechanism according to claim 3, wherein the movable connecting bar is connected at its two ends to the first and second connecting bars by a connecting assembly, respectively, the connecting assembly comprising: a first gasket, a second gasket, an elastic piece and a screw, wherein the first connecting strip and the second connecting strip are provided with strip-shaped grooves, two ends of the movable connecting strip are respectively provided with threaded holes matched with the screw, the first gasket and the second gasket are both provided with through holes for the screw to pass through, wherein,

the first gasket with first connecting strip or the laminating of second connecting strip sets up, the elastic component sets up first gasket with between the second gasket, the screw passes in proper order via hole on the second gasket, the via hole on the first gasket, first connecting strip or bar groove on the second connecting strip with screw hole on the removal connecting strip is connected.

5. A semiconductor processing apparatus comprising a process chamber having disposed thereon an upper electrode assembly as claimed in any one of claims 1 to 4.

6. A current control method of a radio frequency coil in semiconductor process equipment, applied to the upper electrode mechanism of any one of claims 1 to 4, comprising:

obtaining branch currents of at least two parallel branches of the radio frequency coil;

judging whether the branch currents are equal or not;

and when the branch currents are not equal, adjusting a current adjusting device arranged on the radio frequency coil so as to enable the branch currents of the branches to be equal.

7. The method of claim 6, wherein said adjusting a current adjustment device disposed on said RF coil to equalize branch currents of each of said branches comprises:

and adjusting the capacitance value of one or more adjustable capacitors in at least two adjustable capacitors which are arranged on the at least two parallel branches in a one-to-one correspondence manner, so that the branch currents of the branches are equal.

8. The method of claim 7, wherein said adjusting a current adjustment device disposed on said rf coil to equalize branch currents of each of said branches comprises:

and adjusting the positions of the movable connecting strips and the connecting points of the first connecting strip and the second connecting strip so as to enable the branch currents of the branches to be equal.

9. The method of claim 8, wherein said adjusting the position of the connection points of the moving connecting bar to the first connecting bar and the second connecting bar comprises:

screwing the screw in a direction away from the movable connecting strip to reduce the compression amount of the elastic piece between the first gasket and the second gasket;

moving both ends of the movable connecting bar along the first connecting bar and the second connecting bar to change positions of connecting points of the movable connecting bar and the first connecting bar and the second connecting bar;

and screwing the screw in the direction close to the movable connecting strip to increase the compression amount of the elastic piece between the first gasket and the second gasket so as to fix the movable connecting strip.

Technical Field

The invention relates to the technical field of semiconductor equipment, in particular to an upper electrode mechanism of semiconductor process equipment and the semiconductor process equipment.

Background

In plasma etching equipment, it is important to improve the uniformity of etching in the wafer range.

In the existing inductively coupled plasma equipment, a radio frequency source outputs radio frequency power, the radio frequency power is connected to an outer coil and an inner coil through a matcher, and the matcher and the coils are in transitional connection through a connecting strip part. By the matching function of the matcher, the induction magnetic field generated by the inner coil and the outer coil generates inductively coupled plasma in the cavity through the dielectric window. The RF source can control the radial uniformity of the plasma by adjusting the ratio of the currents in the inner and outer coils.

However, when the current is adjusted by the method to realize the radial uniformity of the plasmon, because the connection part between the matcher and the coil and the part connected with each coil can be regarded as a part of the coil impedance, because of the difference of the mechanical structure (such as the branch length of the connection strip) and the difference of the distribution parameters caused by the limitation of the space of the ground part, the distribution parameters of the connection strip parts connected in series on each parallel branch are different, so that the total inductance values of the branches are also different, the currents passing through the two parallel branches are different, and the energy coupled to the plasma in the chamber through the dielectric window has uneven height, which causes the problem of uneven etching process.

Disclosure of Invention

The embodiment of the invention aims to provide an upper electrode mechanism of semiconductor process equipment and the semiconductor process equipment, and aims to solve the problem of uneven etching process when the radial uniformity of plasma is realized by adjusting the current ratio of an inner coil, an outer coil and an outer coil in the prior art.

To solve the above technical problem, the embodiment of the present invention is implemented as follows:

in a first aspect, an embodiment of the present invention provides an upper electrode mechanism of a semiconductor processing apparatus, including: a radio frequency coil, a current sensor, a current adjusting device, wherein,

the radio frequency coil comprises at least two branches connected in parallel;

each branch is provided with one current sensor for detecting the branch current of the branch;

the current adjusting device is arranged on the radio frequency coil and used for adjusting the branch current of each branch circuit so as to enable the branch current of each branch circuit to be equal.

Optionally, the current adjusting device includes: the at least two adjustable capacitors are arranged on the at least two parallel branches in a one-to-one correspondence manner.

Optionally, the current adjusting device includes: the first connecting strip is connected to a radio frequency source through a matcher, the second connecting strip is connected with at least two parallel branches respectively, the movable connecting strip is movably connected with the first connecting strip and the second connecting strip, the movable connecting strip and a connecting point of the first connecting strip can be moved along the first connecting strip, and the movable connecting strip and a connecting point of the second connecting strip can be moved along the second connecting strip.

Optionally, both ends of the movable connecting strip are respectively connected to the first connecting strip and the second connecting strip through a connecting assembly, and the connecting assembly includes: a first gasket, a second gasket, an elastic piece and a screw, wherein the first connecting strip and the second connecting strip are provided with strip-shaped grooves, two ends of the movable connecting strip are respectively provided with threaded holes matched with the screw, the first gasket and the second gasket are both provided with through holes for the screw to pass through, wherein,

the first gasket with first connecting strip or the laminating of second connecting strip sets up, the elastic component sets up first gasket with between the second gasket, the screw passes in proper order via hole on the second gasket, the via hole on the first gasket, first connecting strip or bar groove on the second connecting strip with screw hole on the removal connecting strip is connected.

In a second aspect, embodiments of the present invention provide a semiconductor processing apparatus, comprising a process chamber, on which an upper electrode mechanism as described in the first aspect is disposed.

In a third aspect, an embodiment of the present invention provides a current control method for a radio frequency coil in semiconductor processing equipment, which is applied to the upper electrode mechanism in the first aspect, and includes:

obtaining branch currents of at least two parallel branches of the radio frequency coil;

judging whether the branch currents are equal or not;

and when the branch currents are not equal, adjusting a current adjusting device arranged on the radio frequency coil so as to enable the branch currents of the branches to be equal.

Optionally, the adjusting a current adjusting device disposed on the radio frequency coil to equalize branch currents of the branches includes:

and adjusting the capacitance value of one or more adjustable capacitors in at least two adjustable capacitors which are arranged on the at least two parallel branches in a one-to-one correspondence manner, so that the branch currents of the branches are equal.

Optionally, the adjusting a current adjusting device disposed on the radio frequency coil to equalize branch currents of the branches includes:

and adjusting the positions of the movable connecting strips and the connecting points of the first connecting strip and the second connecting strip so as to enable the branch currents of the branches to be equal.

Optionally, the adjusting the position of the connection point of the movable connection bar with the first connection bar and the second connection bar includes:

screwing the screw in a direction away from the movable connecting strip to reduce the compression amount of the elastic piece between the first gasket and the second gasket;

moving both ends of the movable connecting bar along the first connecting bar and the second connecting bar to change positions of connecting points of the movable connecting bar and the first connecting bar and the second connecting bar;

and screwing the screw in the direction close to the movable connecting strip to increase the compression amount of the elastic piece between the first gasket and the second gasket so as to fix the movable connecting strip.

In a fourth aspect, an embodiment of the present invention provides a current adjustment apparatus for semiconductor processing equipment, including:

the acquisition module is used for acquiring branch currents of at least two parallel branches of the radio frequency coil;

the judging module is used for judging whether the branch currents are equal or not;

and the adjusting module is used for adjusting the current adjusting device arranged on the radio frequency coil when the branch currents are not equal, so that the branch currents of the branches are equal.

Optionally, the adjusting module is configured to:

and adjusting the capacitance value of one or more adjustable capacitors in at least two adjustable capacitors which are arranged on the at least two parallel branches in a one-to-one correspondence manner, so that the branch currents of the branches are equal.

Optionally, the adjusting module is configured to:

and adjusting the positions of the movable connecting strips and the connecting points of the first connecting strip and the second connecting strip so as to enable the branch currents of the branches to be equal.

Optionally, the adjusting module is configured to:

screwing the screw in a direction away from the movable connecting strip to reduce the compression amount of the elastic piece between the first gasket and the second gasket;

moving both ends of the movable connecting bar along the first connecting bar and the second connecting bar to change positions of connecting points of the movable connecting bar and the first connecting bar and the second connecting bar;

and screwing the screw in the direction close to the movable connecting strip to increase the compression amount of the elastic piece between the first gasket and the second gasket so as to fix the movable connecting strip.

According to the technical scheme provided by the embodiment of the invention, the embodiment of the invention judges whether the branch currents are equal or not by obtaining the branch currents of at least two parallel branches of the radio frequency coil, and adjusts the current adjusting device arranged on the radio frequency coil when the branch currents are not equal, so that the branch currents of the branches are equal. Therefore, the radio frequency coil with the unequal branch currents of the branches connected in parallel can be adjusted through the current adjusting device, so that the branch currents of two branches connected in parallel in the radio frequency coil are equal, the condition that the energy coupled to the plasma of the chamber through the dielectric window is uneven in height due to the fact that the currents of the parallel branches of the coil are different can be avoided, and the uniformity of the etching process is guaranteed.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of the construction of a semiconductor processing apparatus;

FIG. 2 is a schematic diagram of the configuration of a semiconductor processing apparatus of the present invention;

FIG. 3 is a schematic diagram of an equivalent circuit of the present invention;

FIG. 4 is a schematic structural diagram of a movable connecting strip according to the present invention;

FIG. 5 is a schematic cross-sectional view of a movable connecting strip according to the present invention;

FIG. 6 is a schematic diagram of another equivalent circuit of the present invention;

FIG. 7 is a flow chart illustrating a method of adjusting current in semiconductor processing equipment according to the present invention;

FIG. 8 is a schematic flow chart illustrating another method of adjusting current in semiconductor processing equipment in accordance with the present invention;

FIG. 9 is a schematic structural diagram of a current adjustment apparatus of a semiconductor processing apparatus according to the present invention.

Detailed Description

The embodiment of the invention provides an upper electrode mechanism of semiconductor process equipment and the semiconductor process equipment.

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.