阅读说明：本技术 一种化霜方法、制冷设备及化霜控制方法、商用制冷机组 (Defrosting method, refrigeration equipment, defrosting control method and commercial refrigeration unit ) 是由 马旻 罗建飞 周卫华 寇芷薇 于 2020-04-29 设计创作，主要内容包括：本发明涉及一种制冷系统的化霜方法,制冷系统为蒸汽压缩式制冷系统,制冷系统包括在制冷时用作蒸发器的室内换热器,当需要对室内换热器进行化霜时,停止制冷系统运行,利用半导体制冷器件进行化霜,一方面利用半导体制冷器件热端对室内换热器加热,另一方面利用半导体制冷器件冷端对室内换热器所在的室内环境进行制冷。本发明还涉及一种制冷设备及化霜控制方法、商用制冷机组。采用半导体集成板的热端对制冷设备的室内换热器进行加热化霜,半导体集成板的冷端对室内换热器所在的房间进行继续制冷,在保证室内换热器化霜效果良好的同时,防止房间温度波动以及房间温度过快上升。(The invention relates to a defrosting method of a refrigerating system, wherein the refrigerating system is a vapor compression type refrigerating system, the refrigerating system comprises an indoor heat exchanger used as an evaporator during refrigeration, when the indoor heat exchanger needs to be defrosted, the refrigerating system stops running, and defrosting is performed by using a semiconductor refrigerating device. The invention also relates to refrigeration equipment, a defrosting control method and a commercial refrigeration unit. The hot junction that adopts the semiconductor integrated board heats the indoor heat exchanger of refrigeration plant and changes the frost, and the cold junction of semiconductor integrated board continues to refrigerate the room that indoor heat exchanger is located, when guaranteeing that indoor heat exchanger changes the frost respond well, prevents that room temperature is undulant and room temperature from rising at the excessive speed.)

1. A defrosting method of a refrigeration system which is a vapor compression type refrigeration system including an indoor heat exchanger serving as an evaporator at the time of refrigeration, characterized in that: when the indoor heat exchanger needs to be defrosted, the operation of the refrigerating system is stopped, the semiconductor refrigerating device is used for defrosting, on one hand, the hot end of the semiconductor refrigerating device is used for heating the indoor heat exchanger, and on the other hand, the cold end of the semiconductor refrigerating device is used for refrigerating the indoor environment where the indoor heat exchanger is located.

2. The defrosting method according to claim 1, wherein: the semiconductor refrigeration device is provided with a plurality of semiconductor refrigeration units, the semiconductor refrigeration units are respectively arranged at different parts of the indoor heat exchanger during defrosting, and are controlled to be turned on/off according to the frosting degree of the different parts of the indoor heat exchanger and/or to adjust the current of one or more semiconductor refrigeration units.

3. A refrigeration apparatus employing a vapor compression refrigeration system including an indoor heat exchanger serving as an evaporator in a refrigeration operation, characterized in that: the refrigeration equipment is provided with a semiconductor refrigeration device, the semiconductor refrigeration device comprises a hot end and a cold end, when the indoor heat exchanger needs defrosting, the hot end and the indoor heat exchanger form a heat exchange relationship, and the cold end and indoor air form a heat exchange relationship.

4. A refrigeration appliance as recited in claim 3 wherein: the semiconductor refrigeration device is provided with a plurality of semiconductor refrigeration units which are respectively arranged at different parts of the indoor heat exchanger during defrosting, and can be controlled to open/close one or more semiconductor refrigeration units and/or adjust the current of one or more semiconductor refrigeration units according to the frosting degree of the different parts of the indoor heat exchanger.

5. The refrigeration appliance according to claim 4, wherein: the semiconductor refrigeration device also comprises a hot end heat dissipation plate and a cold end heat exchange plate, the plurality of semiconductor refrigeration units are positioned between the hot end heat dissipation plate and the cold end heat exchange plate to form a semiconductor structure layer, and the hot end heat dissipation plate and the hot end of the semiconductor structure layer are arranged together to form the hot end of the semiconductor device; the cold junction heat exchange plate and the cold junction of the semiconductor structure layer are arranged together to form the cold junction of the semiconductor device, and the hot junction of the semiconductor device and the cold junction of the semiconductor device are integrated into a semiconductor integrated plate.

6. The refrigeration appliance according to claim 5, wherein: the plurality of semiconductor refrigeration units form a plurality of semiconductor refrigeration unit groups, and each semiconductor refrigeration unit group comprises one or more semiconductor refrigeration units.

7. The refrigeration appliance according to claim 6 wherein: the semiconductor refrigeration unit comprises a unipolar semiconductor refrigeration unit and/or a bipolar semiconductor refrigeration unit.

8. The refrigeration appliance according to claim 7 wherein: one surface of the cold end heat exchange plate, which is in contact with indoor air, forms a cold end surface, and a ribbed plate is arranged on the cold end surface; and the semiconductor integrated plate is provided with a heat insulation support structure between the hot end heat dissipation plate and the cold end heat exchange plate and around the semiconductor structure layer.

9. The refrigeration appliance according to claim 8, wherein: the refrigeration equipment is provided with a mechanical arm for driving the semiconductor integrated board to move; one end of the mechanical arm is fixed on the upper portion of the indoor heat exchanger, and the other end of the mechanical arm is connected with the cold end face of the cold end heat exchange plate.

10. The refrigeration appliance according to claim 9 wherein: the indoor heat exchanger forms at least one heat exchange part for exchanging heat with indoor air, when the indoor heat exchanger defrosts, the control mechanical arm drives the semiconductor integrated plate to rotate and move downwards, and when the hot end heat dissipation plate is attached to the heat exchange part of the indoor heat exchanger, the control mechanical arm locks and fixes the semiconductor integrated plate, so that the hot end heat dissipation plate exchanges heat with the heat exchange part to defrosts the indoor heat exchanger.

11. The refrigeration appliance according to claim 10 wherein: at least one air flow disturbance device is arranged around the semiconductor integrated plate and/or at least one air flow disturbance device is arranged around the heat exchange part;

when the indoor heat exchanger is defrosted: the hot end heat dissipation plate and the heat exchange portion are controlled to be attached to the indoor heat exchanger to defrost, meanwhile, the air flow disturbance device is controlled to work, and the air flow disturbance device mixes heat overflowing from the edge of the heat exchange portion with cold generated by the cold end heat exchange plate to eliminate heat leakage and waste heat which are not used for defrosting.

12. The refrigeration appliance according to claim 11 wherein: the hot end heat dissipation plate is attached to the heat exchange portion, one side of the hot end heat dissipation plate is a defrosting working face, a plurality of temperature sensors for detecting the temperature of the semiconductor refrigerating unit group are correspondingly arranged on the defrosting working face, the temperature sensors are in communication connection with an electric cabinet of the refrigerating equipment, and the electric cabinet controls the input current value of the semiconductor refrigerating unit group according to the temperature of the semiconductor refrigerating unit group.

13. A defrosting control method of a refrigerating apparatus as set forth in claim 12, comprising the control steps of:

s1: starting defrosting operation;

s2: controlling the indoor heat exchanger to stop refrigerating operation, and simultaneously controlling the mechanical arm to drive the semiconductor integrated plate to move so that the hot-end heat dissipation plate is attached to the heat exchange part;

s3: and controlling the semiconductor integrated plate to defrost the indoor heat exchanger.

14. The defrosting control method of a refrigerating apparatus as set forth in claim 13, characterized in that:

the step of S3 is specifically:

s31: the semiconductor integrated plate is controlled to be electrified, heat emitted by the hot-end heat dissipation plate exchanges heat with the heat exchange part so as to defrost the indoor heat exchanger, and meanwhile, the air flow disturbance device is controlled to work;

s32: controlling the temperature sensor according to a preset time interval t₀Detecting the temperature Tn of the corresponding semiconductor refrigerating unit group, and adjusting the input current value of the semiconductor refrigerating unit group according to the detected temperature Tn;

s33: taking the minimum value T in the temperature Tn of the semiconductor refrigerating unit group_minJudging the minimum value T_minWhether the temperature is more than or equal to the preset defrosting ending temperature T_over；

If yes, go to step S4;

when the judgment result is "no", continuing to return to the step S31;

s4: the control mechanical arm drives the semiconductor integrated plate to move, so that the hot end heat dissipation plate is far away from the heat exchange part, the semiconductor integrated plate is controlled to be powered off, the air flow disturbance device stops working, and the indoor heat exchanger is back to defrosting.

15. A commercial refrigerating unit, which comprises a condensing unit indoor unit which is arranged indoors and is used as an evaporator when the commercial refrigerating unit refrigerates, and is characterized in that the commercial refrigerating unit adopts a refrigerating system defrosting method as claimed in any one of claims 1-2 to defrost the condensing unit indoor unit; or the commercial refrigerating unit is provided with the semiconductor refrigerating device of the refrigerating equipment as claimed in any one of claims 3 to 12, and defrosting is carried out on the indoor unit of the condensing unit by using the semiconductor refrigerating device; or the commercial refrigerating unit defrosts the indoor unit of the condensing unit by the defrosting control method of the refrigerating equipment according to any one of claims 13 to 14.

Technical Field

The invention relates to a defrosting method, refrigeration equipment, a defrosting control method and a commercial refrigeration unit, and belongs to the technical field of refrigeration equipment.

Background

At present, the defrosting modes commonly used by refrigeration equipment mainly comprise four-way valve reversing defrosting, hot gas bypass defrosting and electric heating defrosting, and because of special use environments and requirements of the refrigeration industry, an evaporator in the refrigeration equipment, particularly an air cooler in an indoor heat exchanger of the refrigeration equipment, is also an electric heating defrosting mode.

Disclosure of Invention

In view of the above, the invention provides a defrosting method, refrigeration equipment, a defrosting control method and a commercial refrigeration unit. The method is used for solving the problems that mistaken defrosting is easily caused when an indoor heat exchanger is defrosted by an electric defrosting mode for at least refrigeration equipment, or the local temperature of the indoor heat exchanger is too high easily because the control mode adopted by electric heating defrosting is only limited on-off time control, and the indoor temperature fluctuation is large when defrosting. The invention also solves the problem that the common electric heating defrosting or the small fixed semiconductor component can not carry out accurate defrosting according to the frosting degree of different parts in the internal machine of the condensing unit in the large commercial refrigerating unit.

Specifically, the method comprises the following steps:

the invention relates to a defrosting method of a refrigerating system, wherein the refrigerating system is a vapor compression type refrigerating system, the refrigerating system comprises an indoor heat exchanger used as an evaporator during refrigeration, when the indoor heat exchanger needs to be defrosted, the refrigerating system stops running, and defrosting is performed by using a semiconductor refrigerating device.

Further optionally, the semiconductor refrigeration device is provided with a plurality of semiconductor refrigeration units, the plurality of semiconductor refrigeration units are respectively arranged at different parts of the indoor heat exchanger during defrosting, and are controlled to turn on/off one or more semiconductor refrigeration units and/or adjust the current of one or more semiconductor refrigeration units according to the frosting degree of the different parts of the indoor heat exchanger.

The invention relates to a refrigeration device, which adopts a vapor compression refrigeration system, wherein the refrigeration system comprises an indoor heat exchanger used as an evaporator during refrigeration operation, the refrigeration device is provided with a semiconductor refrigeration device, the semiconductor refrigeration device comprises a hot end and a cold end, when the indoor heat exchanger needs defrosting, the hot end and the indoor heat exchanger form a heat exchange relationship, and the cold end and indoor air form a heat exchange relationship.

Further optionally, the semiconductor refrigeration device is provided with a plurality of semiconductor refrigeration units, so as to be arranged at different parts of the indoor heat exchanger during defrosting, and can be controlled to turn on/off one or more semiconductor refrigeration units and/or adjust the current of one or more semiconductor refrigeration units according to the frosting degree of the different parts of the indoor heat exchanger.

Further optionally, the semiconductor refrigeration device further comprises a hot end heat dissipation plate and a cold end heat exchange plate, the plurality of semiconductor refrigeration units are located between the hot end heat dissipation plate and the cold end heat exchange plate to form a semiconductor structure layer, and the hot end heat dissipation plate and the hot end of the semiconductor structure layer are arranged together to form the hot end of the semiconductor device; the cold junction heat exchange plate and the cold junction of semiconductor structure layer set up the cold junction that forms semiconductor device together, and semiconductor device's hot junction and semiconductor device's cold junction are integrated into a semiconductor integrated board.

Further optionally, the plurality of semiconductor refrigeration units form a plurality of semiconductor refrigeration unit groups, and each semiconductor refrigeration unit group includes one or more semiconductor refrigeration units.

Further optionally, the semiconductor refrigeration unit comprises a unipolar semiconductor refrigeration unit and/or a bipolar semiconductor refrigeration unit.

Further optionally, one surface of the cold end heat exchange plate, which is in contact with indoor air, forms a cold end surface, and a ribbed plate is arranged on the cold end surface; the semiconductor integrated plate is provided with heat insulation support structures between the hot end heat dissipation plate and the cold end heat exchange plate and around the semiconductor structure layer.

Further optionally, the refrigeration equipment is provided with a mechanical arm for driving the semiconductor integrated board to move; one end of the mechanical arm is fixed on the upper part of the indoor heat exchanger, and the other end of the mechanical arm is connected with the cold end face of the cold end heat exchange plate.

Further optionally, indoor heat exchanger forms at least one heat transfer portion that carries out the heat exchange with indoor air, and when indoor heat exchanger defrosted, the control arm drives semiconductor integrated plate rotatory removal downwards, and the control arm locks fixedly to semiconductor integrated plate when hot junction heating panel and the laminating of indoor heat exchanger heat transfer portion, makes hot junction heating panel and heat transfer portion carry out the heat exchange and defrosts indoor heat exchanger.

Further optionally, at least one airflow disturbing device is arranged around the semiconductor integrated board and/or at least one airflow disturbing device is arranged around the heat exchanging part;

when the indoor heat exchanger defrosts: when the heat control end heat dissipation plate and the heat exchange portion are attached to defrost the indoor heat exchanger, the air flow disturbance device is controlled to work, and the heat overflowing from the edge of the heat exchange portion and the cold generated by the cold end heat exchange plate are mixed by the air flow disturbance device to eliminate heat leakage and waste heat which are not used for defrosting.

Further optionally, the one side of laminating at hot junction heating panel and heat transfer portion is for changing the frost working face, and it sets up a plurality of temperature sensor that detect semiconductor refrigeration unit group temperature to change the frost working face on, and temperature sensor is connected with refrigeration plant's electric cabinet communication, and the electric cabinet controls the input current value of semiconductor refrigeration unit group according to the temperature of semiconductor refrigeration unit group.

The invention also relates to a defrosting control method, which comprises the following control steps:

s1: starting defrosting operation;

s2: controlling the indoor heat exchanger to stop refrigerating operation, and simultaneously controlling the mechanical arm to drive the semiconductor integrated plate to move so that the hot end heat dissipation plate is attached to the heat exchange part;

s3: and controlling the semiconductor integrated plate to defrost the indoor heat exchanger.

Further optionally, the step S3 specifically includes:

s31: the semiconductor integrated plate is controlled to be electrified, heat emitted by the hot-end heat dissipation plate exchanges heat with the heat exchange part so as to defrost the indoor heat exchanger, and meanwhile, the air flow disturbance device is controlled to work;

s32: controlling the temperature sensor according to a preset time interval t₀Detecting the temperature Tn of the corresponding semiconductor refrigerating unit group, and adjusting the input current value of the semiconductor refrigerating unit group according to the detected temperature Tn;

s33: taking the minimum value T in the temperature Tn of the semiconductor refrigerating unit group_minJudging the minimum value T_minWhether the temperature is more than or equal to the preset defrosting ending temperature T_over；

If yes, go to step S4;

when the judgment result is "no", continuing to return to the step S31;

s4: the control mechanical arm drives the semiconductor integrated plate to move, so that the hot end heat dissipation plate is far away from the heat exchange part, the semiconductor integrated plate is controlled to be powered off, the air flow disturbance device stops working, and the indoor heat exchanger is back to defrosting.

The invention also relates to a commercial refrigerating unit, which comprises a condensing unit inner unit, wherein the condensing unit inner unit is arranged indoors and is used as an evaporator when the commercial refrigerating unit refrigerates; or the commercial refrigerating unit is provided with the semiconductor refrigerating device of the refrigerating equipment, and the semiconductor refrigerating device is used for defrosting the internal unit of the condensing unit; or the commercial refrigerating unit adopts the defrosting control method of the refrigerating equipment to defrost the internal unit of the condensing unit.

Advantageous effects

The invention has the beneficial effects that the hot end of the semiconductor integrated plate is adopted to heat and defrost the indoor heat exchanger of the refrigeration equipment, and the cold end of the semiconductor integrated plate continuously refrigerates the room where the indoor heat exchanger is located, so that the defrosting effect of the indoor heat exchanger is ensured to be good, and the room temperature fluctuation and the over-fast room temperature rise are prevented.

The periphery of the semiconductor integrated plate is provided with at least one airflow disturbance device and/or the periphery of a heat exchange part which is arranged on the indoor heat exchanger and exchanges heat with indoor air is provided with at least one airflow disturbance device, so that heat leakage which is not used for defrosting when the hot end of the semiconductor integrated plate dissipates heat and waste heat are offset by cold output by the cold end of the semiconductor integrated plate, and the fluctuation of room temperature or the rise of room temperature is further controlled.

Through setting up a plurality of semiconductor refrigeration units that can adjust input current value alone in the semiconductor integrated board, consequently can be through the cold and hot end difference in temperature of every semiconductor refrigeration unit of size control of control current to the different electric currents of semiconductor refrigeration unit input that is in different positions are further adjusted to the frosting condition of different positions on the heat transfer portion according to indoor heat exchanger, and the cold and hot end difference in temperature of semiconductor refrigeration unit is further adjusted to realize more meticulous accuse temperature defrosting.

The defrosting method, the defrosting equipment and the defrosting control method for the refrigerating system, which are provided by the invention, can be used for efficiently and accurately controlling the temperature of the refrigerating equipment, particularly an indoor heat exchanger of a commercial refrigerating unit to defrost, and can also be used for maintaining the temperature of a room during the defrosting period of the indoor heat exchanger to prevent the temperature of the room from rising too fast.

Drawings

The above and other objects, features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings. The drawings described below are merely exemplary embodiments of the present disclosure, and other drawings may be derived by those skilled in the art without inventive effort.

FIG. 1 is a schematic view of a single-pole semiconductor refrigeration unit according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a bipolar semiconductor refrigeration unit according to an embodiment of the present invention;

FIG. 3 is a schematic side view of a semiconductor integrated board according to an embodiment of the present invention;

FIG. 4 is a front view of a refrigeration unit without defrosting operation in accordance with an embodiment of the present invention;

FIG. 5 is a right side view of the refrigeration unit without defrosting operation in accordance with an embodiment of the present invention;

FIG. 6 is a top view of a refrigeration unit without defrosting operation in accordance with an embodiment of the present invention;

FIG. 7 is a control logic diagram of a defrosting control method of a refrigeration device according to an embodiment of the invention;

in the figure: a semiconductor integrated board-1; a semiconductor structure layer-11; a hot end heat dissipation plate-12; defrosting work surface-121; a cold end heat exchange plate-13; cold end face-131; a unipolar semiconductor refrigeration unit-14; a first hot end insulating and heat conducting layer-141; a first cold end insulating and thermally conductive layer-142; a bipolar semiconductor refrigeration unit-15; a second hot end insulating and heat conducting layer-151; a second cold side insulated heat conductive layer-152; couple-16; an N-type semiconductor element-161; a P-type semiconductor element-162; a hot end flow conductor-163; cold end flow conductor-164; a wrapper-17; heat insulation support structure-18

A refrigeration plant-2; a robot arm-21; an indoor heat exchanger-22; the air flow disturbing device is arranged at the position-23; a heat exchanging part-24 and an air outlet-241;

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and "a" and "an" generally include at least two, but do not exclude at least one, unless the context clearly dictates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a commodity or system that includes the element.

The embodiment provides a defrosting method for a refrigerating system, the refrigerating system is a vapor compression type refrigerating system, the refrigerating system comprises an indoor heat exchanger used as an evaporator during refrigeration, when the indoor heat exchanger needs to be defrosted, the refrigerating system stops running, a semiconductor refrigerating device is used for defrosting, on one hand, the hot end of the semiconductor refrigerating device is used for heating the indoor heat exchanger, and on the other hand, the cold end of the semiconductor refrigerating device is used for refrigerating the indoor environment where the indoor heat exchanger is located. In the process of defrosting an indoor heat exchanger serving as an evaporator by a vapor compression refrigeration system, the refrigeration system needs to stop running and does not supply cold to the indoor space, the indoor temperature fluctuation is large by only adopting an electric heating defrosting method in the prior art, and the indoor temperature is quickly heated during defrosting. And the conventional electrochemical defrosting method is easy to cause that the integral defrosting of the indoor heat exchanger cannot be accurately regulated and controlled, and the problem of local overheating of the indoor heat exchanger is easy to occur. The indoor environment in the indoor heat exchanger used as the evaporator in the refrigeration in this embodiment may be an environment in a large-sized refrigerator, particularly a refrigerator for business use, or an environment in a refrigerator body in which an object to be cooled is placed in a household or commercial refrigerator.

The semiconductor refrigeration device is provided with a plurality of semiconductor refrigeration units, the semiconductor refrigeration units are respectively arranged at different parts of the indoor heat exchanger during defrosting, and are controlled to be turned on/off according to the frosting degree of the different parts of the indoor heat exchanger and/or to adjust the current of the semiconductor refrigeration unit or units.

The frosting degree can be judged according to the frosting thickness of the detection indoor heat exchanger, the temperature value between the two heat exchange parts can be judged when the semiconductor refrigeration equipment and the indoor heat exchanger carry out heat exchange, and the frosting degree of different parts of the indoor heat exchanger can be judged through other parameters capable of reflecting the frosting degree.

The embodiment also provides a refrigeration device, which adopts a vapor compression refrigeration system, wherein the refrigeration system comprises an indoor heat exchanger used as an evaporator during refrigeration operation, the refrigeration device is provided with a semiconductor refrigeration device, the semiconductor refrigeration device comprises a hot end and a cold end, when the indoor heat exchanger needs defrosting, the hot end and the indoor heat exchanger form a heat exchange relationship, and the cold end and indoor air form a heat exchange relationship. The refrigeration equipment in this embodiment takes a commercial refrigeration unit, especially a commercial functional cold air refrigeration unit, for a large commercial refrigeration house as an example, and a defrosting method and a defrosting control method for a semiconductor refrigeration device used for defrosting an indoor heat exchanger in the refrigeration equipment, a structure of the semiconductor refrigeration device, and a working process of the semiconductor refrigeration device used for defrosting the indoor heat exchanger are described. The indoor heat exchanger in the embodiment is a condensing unit indoor unit which is used for refrigerating the commercial refrigerator in the commercial refrigerator and conveying cold. The condensing unit inner machine can be hung on the wall surface of a commercial refrigeration house, and a distance exists between the upper part of the condensing unit inner machine and the top of the commercial refrigeration house.

Further optionally, the semiconductor refrigeration device is provided with a plurality of semiconductor refrigeration units, so as to be arranged at different parts of the indoor heat exchanger during defrosting, and can be controlled to turn on/off one or more semiconductor refrigeration units and/or adjust the current of one or more semiconductor refrigeration units according to the frosting degree of the different parts of the indoor heat exchanger.

The semiconductor refrigeration device also comprises a hot end heat dissipation plate 12 and a cold end heat exchange plate 13, a plurality of semiconductor refrigeration units are positioned between the hot end heat dissipation plate 12 and the cold end heat exchange plate 13 to form a semiconductor structure layer 11, and the hot end heat dissipation plate 12 and the hot end of the semiconductor structure layer 11 are arranged together to form the hot end of the semiconductor device; the cold end heat exchange plate 13 and the cold end of the semiconductor structure layer 11 are arranged together to form the cold end of the semiconductor device, and the hot end of the semiconductor device and the cold end of the semiconductor device are integrated into a semiconductor integrated plate 1.

The plurality of semiconductor refrigeration units form a plurality of semiconductor refrigeration unit groups, and each semiconductor refrigeration unit group comprises one or more semiconductor refrigeration units.

The semiconductor refrigeration unit comprises a unipolar semiconductor refrigeration unit 14 and/or a bipolar semiconductor refrigeration unit 15.

As shown in fig. 1, the unipolar semiconductor refrigeration unit 14 includes a first semiconductor refrigeration plate, which includes:

at least m galvanic couples, wherein m is more than or equal to 1 and is an integer; the couple pair is formed by connecting an N-type semiconductor element 161 and a P-type semiconductor element 162 through a current carrier, wherein: the current in the hot side current carrier 163 flows from the P-type semiconductor element 162 to the N-type semiconductor element 161, the current in the cold side current carrier 164 flows from the N-type semiconductor element 161 to the P-type semiconductor element 162, the m galvanic couples are all connected in series, and the N-type semiconductor element 161 and the P-type semiconductor element 162 are arranged at intervals;

a first hot side insulating and heat conducting layer 141 abutting the hot side current carrier 163;

a first cold end insulated heat conductive layer 142 abutting the cold end flow conductor 164.

As shown in fig. 2, the bipolar semiconductor refrigeration unit 15 comprises a second semiconductor refrigeration sheet, which comprises;

at least 2n-1 galvanic couples, n is not less than 2 and is an integer; the couple pair is formed by connecting an N-type semiconductor element 161 and a P-type semiconductor element 162 through a current carrier, wherein: the current in the hot side current carrier 163 flows from the P-type semiconductor element 162 to the N-type semiconductor element 161, the current in the cold side current carrier 164 flows from the N-type semiconductor element 161 to the P-type semiconductor element 162, N pairs of the couples are connected in series in the second semiconductor chilling plate, and the N-type semiconductor element 161 and the P-type semiconductor element 162 are arranged at intervals; n-1 galvanic couples are correspondingly connected in parallel between the adjacent hot end current carriers 163 of the n galvanic couples in series;

a second cold end insulating layer 152 abutting the cold end current carriers 164 of the n couple pairs in series;

and a second hot side insulating layer 151 attached to the hot side current carriers 163 of n-1 said galvanic couples in parallel.

The first and/or second hot end insulating and heat conducting layers form the hot end of the semiconductor structure layer, and the first and/or second cold end insulating and heat conducting layers form the cold end of the semiconductor structure layer.

As shown in fig. 3, a cold end face 131 is formed on one side of the cold end heat exchange plate 13 contacting with the indoor air, and the rib plate 17 is arranged on the cold end face 131; the semiconductor integrated board 1 is provided with a heat insulation support structure 18 between the hot end heat dissipation plate 12 and the cold end heat exchange plate 13 and around the semiconductor structure layer 11.

As shown in fig. 4-6, the refrigeration device 2 in this embodiment is provided with a mechanical arm 21 for driving the semiconductor integrated board 1 to move; one end of the mechanical arm 21 is fixed on the upper part of the indoor heat exchanger 22, and the other end thereof is connected with the cold end face 131 of the cold end heat exchange plate 13. The mechanical arm 21 can drive the semiconductor integrated board 1 to move with multiple degrees of freedom, wherein the movement in this embodiment includes turning, rotating, translating, and other movement.

The indoor heat exchanger 22 forms at least one heat exchange part 24 for exchanging heat with indoor air, when the indoor heat exchanger 22 defrosts, the control mechanical arm 21 drives the semiconductor integrated plate 1 to rotate and move downwards, and when the hot end heat dissipation plate 12 is attached to the heat exchange part 24 of the indoor heat exchanger 22, the control mechanical arm 21 locks and fixes the semiconductor integrated plate 1, so that the hot end heat dissipation plate exchanges heat with the heat exchange part 24 to defrosts the indoor heat exchanger.

The heat exchanging unit 24 in this embodiment is a heat exchanging portion in which a refrigerant flow path through which a refrigerant flows is provided in the indoor heat exchanger 22, and the refrigerant evaporates and absorbs heat in the refrigerant flow path of the heat exchanging unit 24 to cool the indoor space. The heat exchanging part 24 may be a heat exchanging surface of the indoor heat exchanger 22 disposed near the heat exchanger as shown in fig. 4 to 6, and a fan or a fan may be installed on the heat exchanging surface to accelerate the heat exchange between the indoor heat exchanger 22 and the indoor air. The heat exchanging part may be an indoor evaporator with finned tubes that directly exchanges heat with indoor air in another embodiment.

As shown in fig. 4-6, in the present embodiment, the indoor heat exchanger 22 is hung on an inner wall surface of a commercial refrigeration storage, when the indoor heat exchanger 22 defrosts, the control mechanical arm 21 drives the semiconductor integrated plate 1 to rotate and move downward, and when the hot-end heat dissipation plate 12 is attached to the heat exchanging portion 24 of the indoor heat exchanger 22, the control mechanical arm 21 locks and fixes the semiconductor integrated plate 1, so that the hot-end heat dissipation plate 12 exchanges heat with the heat exchanging portion 24 to defrosts the indoor heat exchanger 22.

At least one airflow disturbance device is arranged around the semiconductor integrated plate 1 and/or at least one airflow disturbance device is arranged around the heat exchange part 24;

when the indoor heat exchanger is defrosted: the hot end control heat dissipation plate 12 and the heat exchange portion 24 are attached to defrost the indoor heat exchanger 22, and meanwhile, the air flow disturbing device is controlled to work, and the air flow disturbing device mixes heat overflowing from the edge of the heat exchange portion 24 and cold generated by the cold end heat exchange plate 13 to eliminate heat leakage and waste heat which are not used for defrosting. In this embodiment, the airflow disturbance device is a fan disposed at an airflow disturbance device disposition position 23, and the airflow disturbance device disposition position 23 is located at one side of the cold-end heat exchange plate close to the mechanical arm 21. In other embodiments, the airflow disturbing device may be disposed around the semiconductor integrated board 1 and/or around the heat exchanging portion 24, and a plurality of airflow disturbing devices may be disposed to enhance the mixing effect of the heat overflowing from the edge of the heat exchanging portion 24 and the cold generated by the cold-end heat exchanging plate 13, so as to further prevent the indoor temperature from fluctuating and rising too fast.

At this moment, when the semiconductor integrated board 1 in this embodiment is attached to the heat exchanging portion 24, the air outlet type of the indoor heat exchanger 22 is completely sealed, preferably, the airflow disturbing device only acts on the cold end of the semiconductor refrigeration device in this embodiment, and the beneficial effects here are that the cold energy overflowing by the semiconductor refrigeration is used to maintain the temperature of the storage, and the temperature difference between the cold end and the hot end around the semiconductor integrated board 1 can be stabilized at the same time.

The one side of laminating in hot junction heating panel 12 and heat transfer portion 24 is for changing white working face 121, changes and sets up a plurality of temperature sensor that detect semiconductor refrigeration unit group temperature on white working face 121 correspondingly, and temperature sensor is connected with the electric cabinet communication of refrigeration plant, and the electric cabinet controls the input current value of semiconductor refrigeration unit group according to the temperature of semiconductor refrigeration unit group. The power supply wires of the semiconductor integrated board 1 and the control communication wires connected with the temperature sensor and/or the semiconductor refrigeration unit in the semiconductor integrated board 1 are respectively connected to the electric control box through the mechanical arm 21 in the embodiment.

As shown in fig. 7, the embodiment further discloses a defrosting control method for a refrigeration apparatus:

s0, judging whether to start defrosting operation according to the indoor temperature T and the accumulated continuous refrigerating operation time T of the indoor heat exchanger 22;

further, in this embodiment:

s01: detecting whether the indoor temperature is less than or equal to T0; the value time of T0 can be 10 ℃;

s02: if the indoor temperature is less than or equal to T0, continuously detecting whether the accumulated continuous cooling operation time of the indoor heat exchanger 22 is greater than or equal to T1; executing S1 downwards if the accumulated continuous cooling operation time of the indoor heat exchanger is greater than or equal to t 1; further, t1 may take the value of 120 min;

s1: starting defrosting operation;

s2: controlling the indoor heat exchanger 22 to stop refrigerating operation, and simultaneously controlling the mechanical arm 21 to drive the semiconductor integrated plate 1 to move so that the hot-end heat dissipation plate 12 is attached to the heat exchange part 24; further, after the indoor heat exchanger 22 stops the cooling operation, the shutdown and power-off operation time of the indoor heat exchanger 22 needs to be recorded;

s3: controlling the semiconductor integrated plate to defrost the indoor heat exchanger, wherein the step S3 specifically comprises the following steps:

s31: controlling the semiconductor integrated plate 1 to be electrified, and controlling the air flow disturbance device to work at the same time, wherein heat emitted by the hot-end heat dissipation plate 12 exchanges heat with the heat exchange part 24 so as to defrost the indoor heat exchanger 22;

s32: controlling the temperature sensor according to a preset time interval t₀Detecting the temperature Tn of the corresponding semiconductor refrigerating unit group, and adjusting the input current value of the semiconductor refrigerating unit group according to the detected temperature Tn; further, in S32, t₀Is (1s,300 s)]Preferably, t is₀Is 10 s; further optionally, in this embodiment, the semiconductor refrigeration unit group includes a plurality of semiconductor refrigeration units, in this embodiment, different semiconductor refrigeration unit groups are divided by dividing a plurality of square areas on the semiconductor integrated board 1, and the temperature Tn of the corresponding semiconductor refrigeration unit group is monitored, that is, the temperature Tn of the square area corresponding to the temperature sensor is monitored. Further, the input current value of the semiconductor refrigeration unit group is inversely proportional to the detected temperature Tn of the semiconductor refrigeration unit group, that is, the higher the detected temperature Tn of the semiconductor refrigeration unit group, the smaller the input current value of the semiconductor refrigeration unit group corresponding thereto, the smaller the input current value, the smaller the temperature difference between the semiconductor refrigeration unit group and the heat exchanger unit group, so as to reduce the defrosting intensity of the heat exchanger unit 24 and the heat exchanger unit group corresponding thereto, thereby realizing the accurate defrosting control of different positions on the heat exchanger unit 24 of the indoor heat exchanger 22.

S33: taking the minimum value T in the temperature Tn of the semiconductor refrigerating unit group_minJudging the minimum value T_minWhether the temperature is more than or equal to the preset defrosting ending temperature T_over；

If yes, go to step S4;

when the judgment result is "no", continuing to return to the step S31;

s4: the control mechanical arm drives the semiconductor integrated plate to move, so that the hot-end heat dissipation plate is far away from the heat exchange part and is restored to the original position which does not enter the defrosting process, the semiconductor integrated plate is controlled to be powered off, the air flow disturbance device stops working, and the indoor heat exchanger exits defrosting;

furthermore, the hot-end heat dissipation plate is far away from the heat exchange part and is restored to the original position which does not enter the defrosting process; when the indoor heat exchanger is hung on the side wall of the refrigeration house, the semiconductor integrated plate rotates upwards to reset, and when the semiconductor integrated plate rotates upwards, the mechanical arm is controlled to fixedly lock the semiconductor integrated plate when the semiconductor integrated plate touches the ceiling of the refrigeration house.

S5: the indoor heat exchanger 22 is controlled to continue to resume the cooling operation.

The embodiment discloses a defrosting method of a refrigerating system, refrigerating equipment and a defrosting control method of the refrigerating equipment. The refrigerating system is a vapor compression type refrigerating system, the refrigerating system comprises an indoor heat exchanger used as an evaporator during refrigeration, when the indoor heat exchanger needs defrosting, the refrigerating system stops running, a semiconductor refrigerating device is used for defrosting, on one hand, the semiconductor refrigerating device is used for heating the indoor heat exchanger, and on the other hand, the semiconductor refrigerating device is used for refrigerating an indoor environment where the indoor heat exchanger is located. The semiconductor refrigeration device in this embodiment is the semiconductor integrated board that contains a plurality of semiconductor refrigeration unit groups, when defrosting the indoor heat exchanger in the refrigeration plant of this embodiment, can correspond the input current value of adjusting different semiconductor refrigeration unit groups according to the temperature that the temperature sensor that different semiconductor refrigeration unit groups correspond detected, thereby realize the high-efficient accurate defrosting control to indoor heat exchanger, the hot junction during the semiconductor is defrosted, its cold junction is to indoor continuous output cold volume during defrosting, prevent that indoor temperature fluctuation is too big and indoor temperature rises excessively fast.

Exemplary embodiments of the present disclosure are specifically illustrated and described above. It is to be understood that the disclosure is not limited to the precise construction, arrangement of parts, or methods of operation described herein; on the contrary, the disclosure is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.