阅读说明：本技术 密封组合物和半导体装置 (Sealing composition and semiconductor device ) 是由 石桥健太 山浦格 儿玉拓也 田中实佳 堀慧地 姜东哲 于 2018-12-25 设计创作，主要内容包括：密封组合物含有环氧树脂、固化剂和无机填充材料,上述无机填充材料的粒度分布具有至少3个峰,上述无机填充材料包含粒径为1μm以下的氧化铝。(The sealing composition contains an epoxy resin, a curing agent, and an inorganic filler, wherein the inorganic filler has a particle size distribution having at least 3 peaks, and the inorganic filler contains alumina having a particle size of 1 [ mu ] m or less.)

1. A sealing composition comprising an epoxy resin, a curing agent and an inorganic filler,

the inorganic filler material has a particle size distribution with at least 3 peaks,

the inorganic filler contains alumina having a particle diameter of 1 μm or less.

2. The sealing composition of claim 1, wherein the particle size distribution of the inorganic filler material has peaks in a range of 0.3 μ ι η to 0.7 μ ι η, a range of 7 μ ι η to 20 μ ι η, and a range of 30 μ ι η to 70 μ ι η.

3. The sealing composition according to claim 1 or 2, wherein the inorganic filler contains inorganic particles having a particle diameter of 1 μm or less, and the proportion of alumina is 1 to 40 vol%.

4. The sealing composition of any of claims 1-3, wherein the inorganic filler material has an average circularity of 0.80 or greater.

5. A semiconductor device comprising a semiconductor element and a cured product of the sealing composition according to any one of claims 1 to 4 sealing the semiconductor element.

Technical Field

The invention relates to a sealing composition and a semiconductor device.

Background

In recent years, with miniaturization and high integration, heat generation inside a semiconductor package is concerned. Since there is a fear that the performance of an electric component or an electronic component having a semiconductor package is degraded by heat generation, high thermal conductivity is required for a member used in the semiconductor package. Therefore, the sealing material of the semiconductor package needs to have high thermal conductivity.

As one of methods for increasing the thermal conductivity of the sealing material, there is a method of using alumina, which is a high thermal conductivity filler, as an inorganic filler contained in the sealing material (for example, see patent document 1).

Disclosure of Invention

Problems to be solved by the invention

However, the method described in patent document 1 may deteriorate the flowability of the sealing material. For example, a semiconductor package using a method called a wire bonding structure in which a semiconductor element and a substrate are connected by a metal wire is formed by sealing the semiconductor element, the substrate, and the metal wire electrically connecting these with a resin composition. In this case, the flowing of the sealing material may cause stress on the metal wire, which may cause positional displacement of the metal wire (wire movement) or insufficient protection of the semiconductor element.

Therefore, it is sometimes difficult to achieve both of the fluidity of the sealing material and the high thermal conductivity.

An aspect of the present invention has been made in view of the above conventional circumstances, and an object thereof is to provide a sealing composition having excellent fluidity and high thermal conductivity, and a semiconductor device using the same.

Means for solving the problems

Specific means for solving the above problems are as follows.

< 1 > a sealing composition comprising an epoxy resin, a curing agent and an inorganic filler having a particle size distribution with at least 3 peaks,

the inorganic filler contains alumina having a particle diameter of 1 μm or less.

< 2 > the sealing composition according to < 1 >, wherein the particle size distribution of the inorganic filler has peaks in the range of 0.3 to 0.7 μm, the range of 7 to 20 μm, and the range of 30 to 70 μm.

< 3 > the sealing composition according to < 1 > or < 2 >, wherein the inorganic filler contains inorganic particles having a particle size of 1 μm or less, and the alumina accounts for 1 to 40 vol%.

< 4 > the sealing composition according to any one of < 1 > to < 3 >, wherein the inorganic filler has an average circularity of 0.80 or more.

< 5 > a semiconductor device comprising a semiconductor element and a cured product of the sealing composition described in any one of < 1 > -4 > sealing the semiconductor element.

Effects of the invention

According to one embodiment of the present invention, a sealing composition having excellent fluidity and high thermal conductivity, and a semiconductor device using the same can be provided.

Detailed Description

Hereinafter, embodiments for carrying out the sealing composition and the semiconductor device of the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps) are not necessarily required unless otherwise explicitly stated. The present invention is not limited to the numerical values and ranges thereof.

In the present disclosure, the numerical range shown by the term "to" includes the numerical values before and after the term "to" as the minimum value and the maximum value, respectively.

In the present disclosure, in the numerical ranges described in stages, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value described in another numerical range described in stages. In the numerical ranges disclosed in the present disclosure, the upper limit or the lower limit of the numerical range may be replaced with the values shown in the examples.

In the present disclosure, each component may contain a plurality of the same substances. When a plurality of substances corresponding to each component are present in the composition, the content or content of each component represents the total content or content of the plurality of substances present in the composition unless otherwise specified.

In the present disclosure, a plurality of particles corresponding to each component may be contained. When a plurality of particles corresponding to each component are present in the composition, the particle diameter of each component refers to the value of a mixture of the plurality of particles present in the composition unless otherwise specified.

Sealing composition

The sealing composition of the present disclosure contains an epoxy resin, a curing agent, and an inorganic filler, the inorganic filler having a particle size distribution with at least 3 peaks, the inorganic filler containing alumina having a particle size of 1 μm or less.

The sealing composition of the present disclosure has excellent fluidity and high thermal conductivity. The reason is not clear, and is presumed as follows.

The inorganic filler material contained in the sealing composition exhibits a particle size distribution having at least 3 peaks. That is, the inorganic filler is composed of at least large-particle inorganic particles, medium-particle inorganic particles, and small-particle inorganic particles. It is considered that the sealing composition of the present disclosure is excellent in fluidity because the inorganic filler contains inorganic particles having a large particle size, inorganic particles having a medium particle size, and inorganic particles having a small particle size.

In addition, the inorganic filler contains alumina having a particle size of 1 μm or less, so that the alumina exhibits high thermal conductivity as described above. In addition, the inorganic filler contained in the sealing composition contains alumina having a particle size of 1 μm or less as inorganic particles having a small particle size. By containing alumina as the inorganic particles having a small particle diameter, it becomes easy to cause alumina as the inorganic particles having a small particle diameter to exist between the inorganic particles having a large particle diameter and the inorganic particles having a medium particle diameter. By interposing alumina exhibiting high thermal conductivity between the large-particle-diameter inorganic particles and the medium-particle-diameter inorganic particles, thermal conduction between the large-particle-diameter inorganic particles and the medium-particle-diameter inorganic particles can be promoted. It is speculated that the sealing composition of the present disclosure has high thermal conductivity.

The components constituting the sealing composition will be described below. The sealing composition of the present disclosure contains an epoxy resin, a curing agent, and an inorganic filler, and may contain other components as necessary.

-epoxy resins-

The sealing composition contains an epoxy resin. The type of the epoxy resin is not particularly limited, and a known epoxy resin can be used.

Specific examples thereof include: epoxy resins (for example, phenol novolac type epoxy resins and o-cresol novolac type epoxy resins) obtained by condensing or co-condensing at least 1 selected from phenol compounds (for example, phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, and bisphenol F) and naphthol compounds (for example, α -naphthol, β -naphthol, and dihydroxynaphthalene) with aldehyde compounds (for example, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde) in the presence of an acidic catalyst to obtain a phenol resin and epoxidizing the phenol resin; diglycidyl ethers of at least 1 member selected from the group consisting of bisphenols (e.g., bisphenol a, bisphenol AD, bisphenol F, and bisphenol S) and biphenols (e.g., alkyl-substituted and unsubstituted biphenols); epoxides of phenol aralkyl resins; an epoxide of an adduct or addition polymer of a phenol compound and at least 1 selected from dicyclopentadiene and a terpene compound; glycidyl ester type epoxy resins obtained by the reaction of polybasic acids (such as phthalic acid and dimer acid) with epichlorohydrin; glycidylamine-type epoxy resins obtained by the reaction of polyamines (such as diaminodiphenylmethane and isocyanuric acid) with epichlorohydrin; linear aliphatic epoxy resins obtained by oxidizing olefinic bonds with a peracid (e.g., peracetic acid); and cycloaliphatic epoxy resins. The epoxy resin may be used alone or in combination of two or more.

From the viewpoint of preventing corrosion of aluminum wiring or copper wiring on an element such as an Integrated Circuit (IC), the purity of the epoxy resin is preferably high, and the amount of hydrolyzable chlorine is preferably small. The amount of hydrolyzable chlorine is preferably 500ppm or less by mass from the viewpoint of improving the moisture resistance of the sealing composition.

The amount of hydrolyzable chlorine is a value obtained by dissolving 1g of an epoxy resin as a sample in 30mL of dioxane, adding 5mL of a 1N-KOH methanol solution, refluxing for 30 minutes, and then titrating by potential difference.

The content of the epoxy resin in the sealing composition is preferably 1.5 to 20% by mass, more preferably 2.0 to 15% by mass, and still more preferably 3.0 to 10% by mass.

The content of the epoxy resin in the sealing composition excluding the inorganic filler is preferably 30 to 65 mass%, more preferably 35 to 60 mass%, and still more preferably 40 to 55 mass%.

Curing agents

The sealing composition contains a curing agent. The type of the curing agent is not particularly limited, and a known curing agent can be used.

Specific examples thereof include: phenol resins obtained by condensing or co-condensing at least 1 selected from the group consisting of phenol compounds (e.g., phenol, cresol, resorcinol, catechol, bisphenol a, and bisphenol F) and naphthol compounds (e.g., α -naphthol, β -naphthol, and dihydroxynaphthalene) with aldehyde compounds (e.g., formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde) in the presence of an acidic catalyst; phenol aralkyl resin; biphenyl aralkyl resin; and naphthol aralkyl resins. One curing agent may be used alone, or two or more curing agents may be used in combination. Among them, phenol aralkyl resins are preferable as the curing agent from the viewpoint of improving the reflow resistance. One curing agent may be used alone, or two or more curing agents may be used in combination.

The curing agent is preferably blended so that the equivalent of the functional group of the curing agent (for example, phenolic hydroxyl group in the case of a phenol resin) is 0.5 to 1.5 equivalents relative to 1 equivalent of the epoxy group of the epoxy resin, and particularly preferably 0.7 to 1.2 equivalents.

Inorganic filler materials

The sealing composition comprises an inorganic filler material. By including the inorganic filler, the sealing composition tends to have a reduced hygroscopicity and an improved strength in a cured state.

The inorganic filler may be used alone or in combination of two or more.

Examples of the case where two or more inorganic fillers are used in combination include: in the case where two or more kinds of inorganic fillers having different components, average particle diameters, shapes, and the like are used.

The shape of the inorganic filler is not particularly limited, and examples thereof include: powder, spherical, fibrous, etc. From the viewpoint of fluidity and mold wear during molding of the sealing composition, the sealing composition is preferably spherical.

The average circularity of the inorganic filler is preferably 0.80 or more, more preferably 0.85 or more, still more preferably 0.90 or more, and particularly preferably 0.93 or more. The average circularity of the inorganic filler may be 1.0 or less.

The circularity of the inorganic filler material means: the value obtained by dividing the circumference of the circle calculated from the circle equivalent diameter, which is the diameter of the circle having the same area as the projected area of the inorganic filler, by the circumference (the length of the contour line) measured from the projected image of the inorganic filler can be obtained by the following equation. In the case of a perfect circle, the circularity is 1.00.

Circularity (circumference of equivalent circle)/(circumference of particle section image)

Specifically, the average circularity is the following value: the image magnified 1000 times was observed with a scanning electron microscope, 10 inorganic fillers were arbitrarily selected, the circularity of each inorganic filler was measured by the above method, and the arithmetic average value was calculated. The circularity, the perimeter of the equivalent circle, and the perimeter of the projected image of the particle can be obtained by commercially available image analysis software.

In the case where two or more inorganic filler materials are used in combination, the average circularity of the inorganic filler material means a value of a mixture of two or more inorganic filler materials.

The inorganic filler is not particularly limited in material, particle size, and the like, as long as it has at least 3 peaks in particle size distribution and contains alumina having a particle size of 1 μm or less.

Examples of the inorganic filler include: silica such as spherical silica and crystalline silica, alumina, zircon, magnesia, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, boron nitride, aluminum nitride, beryllium oxide, zirconia, and the like. Further, as the inorganic filler having a flame retardant effect, aluminum hydroxide, zinc borate, and the like can be cited. Among these, alumina is preferred from the viewpoint of high thermal conductivity.

The proportion of alumina in the inorganic filler is preferably 60 to 95% by mass, more preferably 60 to 92% by mass, and still more preferably 60 to 90% by mass.

As the inorganic filler, alumina and silica may be used in combination. When alumina and silica are used in combination as the inorganic filler, the proportion of alumina in the inorganic filler is preferably 80 to 95% by mass. The proportion of silica is 5 to 20 mass%, more preferably 82 to 92 mass% of alumina and 8 to 18 mass% of silica, still more preferably 85 to 90 mass% of alumina and 10 to 15 mass% of silica.

The particle size distribution of the inorganic filler material has at least 3 peaks, preferably 3 peaks. The position of the peak in the particle size distribution of the inorganic filler is not particularly limited, and for example, the inorganic filler preferably has peaks in the range of 0.3 to 0.7. mu.m, the range of 7 to 20 μm, and the range of 30 to 70 μm, and more preferably has peaks in the range of 0.3 to 0.6. mu.m, the range of 7 to 15 μm, and the range of 40 to 70 μm.

The particle size distribution of the inorganic filler can be determined by the following method.

The inorganic filler to be measured was added to a solvent (pure water) in a range of 0.02 to 0.08% by mass, and the mixture was vibrated for 1 to 10 minutes by a 110W water bath ultrasonic cleaner to disperse the inorganic filler. About 40mL of the dispersion was injected into the cell and measured at 25 ℃. The measurement apparatus measures the volume-based particle size distribution using a laser diffraction/scattering particle size distribution measurement apparatus (for example, LA920 (trade name) manufactured by horiba ltd.). The refractive index used herein is that of alumina. When the inorganic filler is a mixture of alumina and an inorganic filler other than alumina, the refractive index of alumina is also used as the refractive index.

The proportion of alumina in the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler is preferably 1 to 40 vol%, more preferably 10 to 35 vol%, and still more preferably 15 to 30 vol%.

The proportion of alumina in the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler can be measured by the following method.

The material of each inorganic particle was determined by identifying the constituent elements by Energy dispersive X-ray analysis (Energy dispersive X-ray spectrometry) for each inorganic particle having a particle size of 1 μm or less confirmed by a scanning electron microscope. The proportion of alumina in 50 inorganic particles having a particle diameter of 1 μm or less can be determined on a volume basis, and the proportion of alumina in the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler can be determined. The particle diameter of each inorganic particle is a circle equivalent diameter, that is, a diameter of a circle having the same area as the projected area.

The proportion of alumina in the inorganic particles having a particle diameter of 10 μm or more contained in the inorganic filler is preferably 20 to 60 vol%, more preferably 25 to 55 vol%, and still more preferably 30 to 50 vol%.

The proportion of alumina in the inorganic particles having a particle diameter of 10 μm or more contained in the inorganic filler can be determined in the same manner as the proportion of alumina in the inorganic particles having a particle diameter of 1 μm or less contained in the inorganic filler.

The amount of the inorganic filler is preferably 75 to 97 mass%, more preferably 80 to 95 mass% of the entire sealing composition, from the viewpoints of moisture absorption, reduction in linear expansion coefficient, improvement in strength, and solder heat resistance.

In order to make the inorganic filler have a particle size distribution having at least 3 peaks, for example, a method of blending 3 kinds of inorganic fillers having different average particle diameters is exemplified, but not limited to this method. For example, an inorganic filler having an average particle diameter of 0.3 to 0.7 μm, an inorganic filler having an average particle diameter of 7 to 20 μm, and an inorganic filler having an average particle diameter of 30 to 70 μm may be used in combination.

The average particle diameter of the entire inorganic filler is preferably 4 to 30 μm, more preferably 5 to 25 μm, and still more preferably 6 to 20 μm.

The average particle diameter of the inorganic filler is determined as a particle diameter (D50%) when the particle diameter is accumulated to 50% from the small particle diameter side in a volume-based particle size distribution measured by a laser diffraction/scattering particle size distribution measuring apparatus (for example, horiba ltd., LA920 (trade name)) using a dispersion of the inorganic filler prepared in the same manner as in the measurement of the particle size distribution of the inorganic filler.

(curing accelerators)

The sealing composition may further contain a curing accelerator. The kind of the curing accelerator is not particularly limited, and a known curing accelerator can be used.

Specifically, there may be mentioned: cyclic amidine compounds such as 1, 8-diaza-bicyclo [5.4.0] undecene-7, 1, 5-diaza-bicyclo [4.3.0] nonene, 5, 6-dibutylamino-1, 8-diaza-bicyclo [5.4.0] undecene-7 and the like; compounds having intramolecular polarization, which are obtained by adding a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluenequinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, or phenyl-1, 4-benzoquinone, or a compound having a pi bond such as diazophenylmethane or phenol resin to a cyclic amidine compound; tertiary amine compounds and derivatives of tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, and the like; imidazole compounds such as 2-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methylimidazole, and derivatives of imidazole compounds; organic phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, diphenylphosphine, and phenylphosphine; a phosphorus compound having intramolecular polarization, which is obtained by adding a compound having a pi bond such as maleic anhydride, the quinone compound, diazophenylmethane, or a phenol resin to an organic phosphorus compound; tetraphenylboron salts such as tetraphenylphosphonium tetraphenylboron ate, triphenylphosphine tetraphenylboron ate, 2-ethyl-4-methylimidazolium tetraphenylboron ate and N-methylmorpholine tetraphenylboron ate, and derivatives of tetraphenylboron salts; and adducts of phosphine compounds such as triphenylphosphonium-triphenylborane and N-methylmorpholintetraphenylphosphonium-tetraphenylborate with tetraphenylborate. The curing accelerator may be used singly or in combination of two or more.

The content of the curing accelerator is preferably 0.1 to 8% by mass based on the total amount of the epoxy resin and the curing agent.

(ion scavenger)

The sealing composition may further comprise an ion trap.

The ion scavenger that can be used in the present disclosure is not particularly limited as long as it is an ion scavenger that is generally used for a sealing material used in the production of a semiconductor device, and examples thereof include hydrotalcite. As the ion scavenger, a compound represented by the following general formula (II-1) or the following general formula (II-2) can be used.

Mg_1－aAl_a(OH)₂(CO₃)_a/2·uH₂O(II－1)

(in the general formula (II-1), a is 0 < a.ltoreq.0.5, and u is a positive number.)

BiO_b(OH)_c(NO₃)_d(II－2)

(in the general formula (II-2), b is 0.9. ltoreq. b.ltoreq.1.1, c is 0.6. ltoreq. c.ltoreq.0.8, and d is 0.2. ltoreq. d.ltoreq.0.4.)

The ion scavenger is available in the form of a commercially available product. As the compound represented by the general formula (II-1), "DHT-4A" (product name, Kyowa Kagaku K.K.) is available as a commercial product. Further, as the compound represented by the general formula (II-2), "IXE 500" (trade name, manufactured by Toyo Seisaku-sho Co., Ltd.) is available in the form of a commercially available product.

Examples of the ion scavenger other than the above include hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium, antimony, and the like.

One kind of ion scavenger may be used alone, or two or more kinds may be used in combination.

When the sealing composition contains an ion scavenger, the content of the ion scavenger is preferably 1 part by mass or more per 100 parts by mass of the epoxy resin in the sealing composition from the viewpoint of achieving sufficient moisture resistance reliability. The content of the ion scavenger is preferably 15 parts by mass or less with respect to 100 parts by mass of the epoxy resin in the sealing composition from the viewpoint of sufficiently exerting the effects of other components.

The average particle diameter of the ion scavenger is preferably 0.1 to 3.0 μm, and the maximum particle diameter is preferably 10 μm or less. The average particle diameter of the ion scavenger can be measured in the same manner as in the case of the inorganic filler.

(coupling agent)

The sealing composition may further comprise a coupling agent. The kind of the coupling agent is not particularly limited, and a known coupling agent can be used. Examples of the coupling agent include a silane coupling agent and a titanium coupling agent. One kind of coupling agent may be used alone, or two or more kinds may be used in combination.

Examples of the silane coupling agent include: vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (beta-methoxyethoxy) silane, gamma-methacryloxypropyltrimethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, gamma-mercaptopropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma- [ bis (beta-hydroxyethyl) ] aminopropyltriethoxysilane, N-beta- (aminoethyl) -gamma-aminopropyltrimethoxysilane, gamma- (beta-aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl) ethylenediamine, N- (dimethoxymethylsilylisopropyl) ethylenediamine, methyltrimethoxysilane, methyltriethoxysilane, N-beta- (N-vinylbenzylaminoethyl) -gamma-aminopropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-glycidyloxypropyltrimethoxysilane, gamma-glycidyloxypropyltriethoxysilane, gamma-beta-glycidyloxypropyltrimethoxysilane, gamma-glycidyloxypropyltrimethoxysilane, gamma-chloropropyltrimethoxysilane, hexamethyldisilane, gamma-anilinopropyltrimethoxysilane, vinyltrimethoxysilane and gamma-mercaptopropylmethyldimethoxysilane.

Examples of the titanium coupling agent include: triisostearoyltitanate isopropyl ester, trioctylphosphatoxy titanium isopropyl ester, isopropyltris (N-aminoethyl) titanate, tetraoctylbis (ditridecylphosphonoxy) titanate, tetrakis (2, 2-diallyloxymethyl-1-butyl) bis (ditridecylphosphonoxy) phosphonoxy titanate, bis (dioctylphosphatoxy) oxyacetate titanate (Japanese: ビス (ジオクチルパイロホスフェート) オキシアセテートチタネート), bis (dioctylphosphatoxy) ethylene titanate, isopropyltrioctyl titanate, isopropyldimethylacryloylstearoyl titanate, isopropyltris (dodecylbenzenesulfonyl) titanate, isopropylisostearoldiglyldigalloyl titanate, isopropyltris (dioctylphosphoxy) titanate, isopropyltris (dioctylphosphonoxy) titanate, isopropyltris (di-octylphosphonoxy) titanate, isopropyltris (di-decylphosphatoxy) titanate, isopropyltris (di-octylphosphonoxy) titanate, and mixtures thereof, Isopropyl tricumylphenyl titanate and tetraisopropyl bis (dioctylphosphatidyloxy) titanate.

When the sealing composition contains a coupling agent, the content of the coupling agent is preferably 3% by mass or less with respect to the entire sealing composition, and from the viewpoint of exerting the effect thereof, is preferably 0.1% by mass or more.

(mold releasing agent)

The sealing composition may further contain a release agent. The kind of the release agent is not particularly limited, and a known release agent can be used. Specific examples thereof include higher fatty acids, higher fatty acid esters, carnauba wax, and polyethylene waxes. The release agent may be used alone or in combination of two or more.

When the sealing composition contains a release agent, the content of the release agent is preferably 10% by mass or less with respect to the total amount of the epoxy resin and the curing agent, and is preferably 0.5% by mass or more from the viewpoint of exerting the effect thereof.

(coloring agent and modifying agent)

The sealing composition may contain a colorant (e.g., carbon black). In addition, the sealing composition may contain a modifier (e.g., silicone and silicone rubber). The colorant and the modifier may be used singly or in combination of two or more.

When conductive particles such as carbon black are used as the colorant, the content of particles having a particle diameter of 10 μm or more in the conductive particles is preferably 1% by mass or less.

When the sealing composition contains conductive particles, the content of the conductive particles is preferably 4% by mass or less with respect to the total amount of the epoxy resin and the curing agent.

< method for producing sealing composition >

The method for producing the sealing composition is not particularly limited, and can be carried out by a known method. For example, a mixture of raw materials in a predetermined blending amount may be prepared by thoroughly mixing the raw materials in a mixer or the like, and then subjecting the mixture to kneading, cooling, pulverization or the like by a hot roll, an extruder or the like. The state of the sealing composition is not particularly limited, and may be in the form of powder, solid, liquid, or the like.

< semiconductor device >

The semiconductor device of the present disclosure includes a semiconductor element, and a cured product of the sealing composition of the present disclosure sealing the semiconductor element.

The method for sealing the semiconductor element with the sealing composition is not particularly limited, and a known method can be applied. For example, transfer molding is generally used, and compression molding, injection molding, and the like may also be used.

The semiconductor device of the present disclosure is preferably an IC, an LSI (Large-Scale Integration), or the like.