阅读说明：本技术 散热器 (Heat radiator ) 是由 平田干人 石坂哲 于 2018-01-15 设计创作，主要内容包括：散热器(1)具备基部(3)、间隙确保构件(5)、散热片(7)以及上部金属板(9)。散热片(7)分别在X方向上具有宽度(W),在Z方向上延伸而具有长度(H)。散热片(7)分别具有隔开长度(H)地对置的第1端部(7a)以及第2端部(7b)。散热片(7)的第1端部(7a)被固定于基部(3),第2端部(7b)侧设为开放端侧。以使一个散热片(7)的第2端部(7b)与另一散热片(7)的第2端部(7b)连接的形态将上部金属板(9)连接于散热片(7)的第2端部(7b)。上部金属板(9)在Y方向上延伸。(A heat sink (1) is provided with a base (3), a gap securing member (5), a heat radiating fin (7), and an upper metal plate (9). The fins (7) each have a width (W) in the X direction and a length (H) extending in the Z direction. The heat sink (7) has a 1 st end (7a) and a 2 nd end (7b) that are opposed to each other with a distance (H) therebetween. The heat sink (7) has a 1 st end (7a) fixed to the base (3) and a 2 nd end (7b) side serving as an open end. The upper metal plate (9) is connected to the 2 nd end (7b) of the heat sink (7) in such a manner that the 2 nd end (7b) of one heat sink (7) is connected to the 2 nd end (7b) of the other heat sink (7). The upper metal plate (9) extends in the Y direction.)

1. A heat sink, having:

a base portion mounted on a printed circuit board and electrically connected to any one of a signal ground potential, a frame ground potential, and a ground of the printed circuit board; and

a plurality of heat dissipation fins disposed at the base portion at intervals from each other and electrically connected to the base portion,

in the open end side of the plurality of heat radiating fins on the side opposite to the side attached to the base, a part of one of the plurality of heat radiating fins and a part of the other heat radiating fin are electrically connected by a conductive member.

2. The heat sink of claim 1,

a plurality of the heat dissipating fins each having a width in a 1 st direction and extending in a 2 nd direction intersecting the 1 st direction,

a plurality of the heat dissipation fins are arranged on the base portion at intervals in a 3 rd direction intersecting the 1 st direction and the 2 nd direction,

the plurality of heat dissipation fins each have:

a 1 st end portion attached to the base portion; and

a 2 nd end portion located on the open end side and opposed to the 1 st end portion with a distance therebetween in the 2 nd direction,

the 2 nd end portion of the one heat radiation fin and the 2 nd end portion of the other heat radiation fin are electrically connected through the conductive member.

3. The heat sink of claim 2,

the 2 nd end portion has an end surface extending in the 1 st direction,

the conductive member is connected to the end surface.

4. The heat sink of claim 3,

the conductive member is plate-shaped.

5. The heat sink of claim 2,

the conductive member includes a 1 st member and a 2 nd member arranged at a distance from each other in the 1 st direction.

6. The heat sink of claim 2,

the conductive member is connected to the 2 nd end portion so as to extend from one end to the other end of the 2 nd end portion in the 1 st direction and to close a gap between the one heat radiation fin and the other heat radiation fin located on the open end side.

7. The heat sink of claim 6,

the conductive member is plate-shaped.

8. The heat sink of claim 2,

the conductive member includes:

a 1 st protrusion provided on the 2 nd end of the one heat radiation fin so as to protrude in the 3 rd direction, and engaging with the other heat radiation fin; and

and a 2 nd protrusion provided on the 2 nd end of the other heat radiation fin so as to protrude in the 3 rd direction, and engaging with another heat radiation fin adjacent to the other heat radiation fin.

9. The heat sink of claim 8,

the 1 st projection and the 2 nd projection are provided at the 2 nd end so as to extend from one end to the other end of the 2 nd end in the 1 st direction and close a gap between the one heat radiation fin and the other heat radiation fin located at the open end side.

10. The heat sink of claim 2,

the conductive member includes a connecting member arranged so as to straddle the one heat radiation fin and the other heat radiation fin.

11. The heat sink of claim 1,

a plurality of the heat dissipating fins each having a width in a 1 st direction and extending in a 2 nd direction intersecting the 1 st direction,

a plurality of the heat dissipation fins are arranged on the base portion at intervals in a 3 rd direction intersecting the 1 st direction and the 2 nd direction,

the plurality of heat dissipation fins each have:

a 1 st end portion attached to the base portion; and

a 2 nd end portion located on the open end side and facing the 1 st end portion at a distance in the 2 nd direction; and

a 3 rd end and a 4 th end which are opposed to each other with a distance therebetween in the 1 st direction,

a part of the open end side of the 3 rd end portion of the one heat radiation fin and a part of the open end side of the 3 rd end portion of the other heat radiation fin are electrically connected by the conductive member.

12. The heat sink of claim 11,

the conductive member is plate-shaped.

13. The heat sink of claim 1,

the heat sink includes a space holding member attached to the base portion and holding a space between the base portion and the printed circuit board,

the plurality of heat dissipation fins are electrically connected to any one of the signal ground potential, the frame ground potential, and the ground line of the printed circuit board via the base portion and the spacer.

14. The heat sink of claim 1,

a plurality of the heat dissipation fins are formed of the same material.

15. The heat sink of claim 1,

the plurality of heat dissipation fins are the same size.

Technical Field

The present invention relates to a heat sink, and more particularly, to a heat sink having heat dissipating fins.

Background

In recent years, with the remarkable increase in density and frequency of electronic devices, in electronic components such as Large scale integrated circuits (LSIs) represented by Central Processing Units (CPUs), heat generated from the electronic components is a concern in designing. In order to dissipate heat generated from the electronic component, a heat sink is sufficiently utilized.

The heat sink can dissipate the generated heat, and on the other hand, the heat sink may generate electrical resonance at a frequency of a wavelength due to the length of the heat sink that dissipates the heat. Conventionally, there is a limit to the electrical influence of the frequency of the clock signal of the system on the heat sink.

However, in recent systems, a high frequency has been developed with a large number of clock signals, and the heat sink operates as a radiation source of electromagnetic noise. That is, noise of the printed circuit board may be transmitted to the heat sink, or noise may be superimposed on the heat sink due to, for example, coupling between a component or a wiring on the printed circuit board and the heat sink, and the heat sink may operate as an antenna to secondarily radiate the noise, thereby causing malfunction of the system.

In addition, the radiator may operate not only as a radiation source of noise but also as a reception antenna of good noise. Therefore, the standard value of various EMC (Electro-Magnetic Compatibility) certification tests may not be satisfied. Therefore, in designing a heat sink, it is required to secure heat radiation which is an original purpose, and design in consideration of electromagnetic noise is also required, and various proposals have been made.

For example, patent document 1 proposes a heat sink in which the length of a heat sink is set so as not to coincide with the length of 1/2 wavelengths of a signal frequency of a system or a harmonic frequency of the signal frequency. Further, patent document 2 proposes a heat sink including fins for dispersing a resonance frequency.

Disclosure of Invention

As described above, in recent systems, operation is performed using a large number of clock signals. Data transmission and reception are performed based on the fundamental frequencies of various digital I/F (interface). Therefore, it is difficult to design the length of the heat sink so as not to match the frequency of the reference signal such as the clock signal or the harmonic thereof.

Specifically, if the length of the heat sink is short, the heat dissipation performance, which is an original purpose of the heat sink, may be impaired. On the other hand, when the length of the heat sink is long, it is sometimes necessary to redesign the housing, for example. Therefore, in the radiator proposed in patent document 1, when both securing heat radiation performance and reducing electromagnetic noise are intended to be achieved, it is expected that restrictions on design increase, and it is difficult to design with a high degree of freedom.

On the other hand, in the heat sink proposed in patent document 2, since it is necessary to design the heat sink having different lengths and metal materials, it is expected that the design and manufacturing of the heat sink become complicated.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a heat sink which achieves a degree of freedom in design and a reduction in electromagnetic noise.

The heat sink of the present invention has a base and a plurality of fins. The base is mounted on the printed circuit board and electrically connected to any one of a signal ground potential, a frame ground potential, and a ground of the printed circuit board. The plurality of heat sinks are arranged at intervals on the base and electrically connected with the base. At an open end side of the plurality of heat radiating fins on a side opposite to a side attached to the base, a part of one of the plurality of heat radiating fins and a part of the other heat radiating fin are electrically connected by a conductive member.

According to the heat sink of the present invention, a part of one of the plurality of fins and a part of the other fin are electrically connected to each other through the conductive member on the open end side of the plurality of fins. Thus, in the heat sink, the impedance of the open end sides of the plurality of fins can be reduced, and electromagnetic noise can be returned to any one of the signal ground potential, the frame ground potential, and the ground of the printed circuit board. As a result, the heat sink can be designed with freedom without being restricted by the wavelength of the electromagnetic wave and the material of the heat sink, and the intensity of the electromagnetic noise can be reduced.

Drawings

Fig. 1 is a perspective view showing an example of a state in which a heat sink according to embodiment 1 of the present invention is mounted on a printed circuit board.

Fig. 2 is a side view showing an example of a state where the heat sink is mounted on the printed board in this embodiment.

Fig. 3 is a partially enlarged perspective view showing a connection form of the heat sink and the upper metal plate in the embodiment.

Fig. 4 is a perspective view showing a state in which the heat sink of the comparative example is mounted on a printed circuit board.

Fig. 5 is a perspective view showing an example of a state in which the heat sink according to embodiment 2 of the present invention is mounted on a printed circuit board.

Fig. 6 is a perspective view showing an example of a state in which a heat sink of embodiment 1 of embodiment 3 of the present invention is mounted on a printed circuit board.

Fig. 7 is a partially enlarged perspective view of the heat sink in this embodiment.

Fig. 8 is a partially enlarged perspective view showing a connection form of the heat sink and the protrusion in the embodiment.

Fig. 9 is a perspective view showing an example of a state in which a heat sink of example 2 of embodiment 3 of the present invention is mounted on a printed circuit board.

Fig. 10 is a partially enlarged perspective view showing a connection form of the heat sink and the protrusion in the embodiment.

Fig. 11 is a perspective view showing an example of a state in which a heat sink according to embodiment 4 of the present invention is mounted on a printed circuit board.

Fig. 12 is an enlarged perspective view showing an example of the connecting member in this embodiment.

Fig. 13 is an enlarged perspective view showing another example of the connecting member in this embodiment.

Fig. 14 is a perspective view showing an example of a state in which the heat sink according to embodiment 5 of the present invention is mounted on a printed circuit board.

(description of reference numerals)

1: a heat sink; 3: a base; 5: a gap ensuring member; 7: a heat sink; 7 a: 1 st end part; 7 b: a 2 nd end portion; 7 bb: an upper end surface; 7 c: a 3 rd end portion; 7 d: a 4 th end portion; 9; 11: an upper metal plate; 13. 15: a protrusion portion; 13a, 15 a: a bridge portion; 13b, 15 b: an opening part; 13c, 15 c: a fastening part; 17: a connecting member; 17 a: a bridge portion; 17 b: a fastening part; 19: a side metal plate; 51: a printed substrate; 53: a heat-radiating member; 55: and a ground wiring.

Detailed Description