阅读说明：本技术 一种精密在位修整树脂基v型金刚石砂轮的装置及方法 (Device and method for precisely trimming resin-based V-shaped diamond grinding wheel in situ ) 是由 陈冰 焦浩文 罗良 赵清亮 于 2020-05-28 设计创作，主要内容包括：本发明公开了一种精密在位修整树脂基V型金刚石砂轮的装置及方法,它涉及采用一定粒度的、旋转的绿碳化硅磨棒对细粒度树脂基V型金刚石砂轮的尖角在位修整加工方法。本发明要解决目前砂V型金刚石砂轮修整设备复杂、精度和效率低、成本高的问题。本发明借助于具有工件主轴和磨削主轴的三直线轴联动机床,采用适宜的修整工艺参数,通过旋转绿碳化硅磨棒对树脂基V型金刚石砂轮在位精密修整,修整后砂轮尖角达到期望的角度和尖角圆弧半径,提高其形状精度和修整率。修整后的树脂基V型金刚石砂轮适用于陶瓷、玻璃等脆性材料的金字塔、V槽、菲涅尔透镜等微结构的精密磨削加工。(The invention discloses a device and a method for precisely trimming a resin-based V-shaped diamond grinding wheel in situ, and relates to a method for trimming the sharp angle of a fine-grained resin-based V-shaped diamond grinding wheel in situ by adopting a rotary green silicon carbide grinding rod with a certain granularity. The invention aims to solve the problems of complex dressing equipment, low precision and efficiency and high cost of the existing sand V-shaped diamond grinding wheel. The invention precisely trims the resin-based V-shaped diamond grinding wheel in place by rotating the green silicon carbide grinding rod by means of the three-linear-axis linkage machine tool with the workpiece main shaft and the grinding main shaft and adopting proper trimming process parameters, and the sharp angle of the trimmed grinding wheel reaches the expected angle and the arc radius of the sharp angle, thereby improving the shape precision and the trimming rate. The trimmed resin-based V-shaped diamond grinding wheel is suitable for precision grinding processing of microstructures such as pyramids, V-shaped grooves, Fresnel lenses and the like of brittle materials such as ceramics, glass and the like.)

1. The utility model provides a device of accurate on-position trimming resin base V type diamond grinding wheel, its characterized in that, is including three sharp spool (1,3,9) linkage lathe, anchor clamps (5), green carborundum stick (6), V type diamond grinding wheel (7) that have work piece main shaft (2) and grinding main shaft (8), install on vacuum chuck (4) of lathe work piece main shaft (2) through anchor clamps (5) green carborundum stick (6), the tip is installed under grinding main shaft (8) of arranging perpendicularly in V type diamond grinding wheel (7), green carborundum stick (6) cylinder end contacts with the upper and lower inclined plane of emery wheel (7).

2. The device for precisely in-situ dressing a resin-based V-shaped diamond grinding wheel according to claim 1, wherein the granularity of the green silicon carbide grinding rod is 400# to 1500 #.

3. The apparatus of claim 1, wherein the resin-based V-diamond grinding wheel has a grit size of D3-D15.

4. A method for precisely trimming a resin-based V-shaped diamond grinding wheel in place is characterized by comprising the following steps:

the method comprises the following steps: mounting a green silicon carbide grinding rod (6) and a V-shaped diamond grinding wheel (7); installing a clamp (5) which clamps a green silicon carbide grinding rod (6) with the diameter of 20mm on a vacuum chuck (4) of a machine tool workpiece spindle (2), and driving the green silicon carbide grinding rod (6) to rotate through the workpiece spindle (2); the V-shaped diamond grinding wheel (7) is arranged at the lower end part of a grinding main shaft (8) which is vertically arranged, and the grinding main shaft (8) drives the V-shaped diamond grinding wheel (7) to rotate;

step two: determining the position relation between the green silicon carbide grinding rod (6) and the inclined plane on the V-shaped diamond grinding wheel (7); firstly, determining the position relation in the X direction, wherein the high-precision in-place dressing requires that the rotating center line of a green silicon carbide grinding rod (6) is vertically intersected with the rotating center line of a V-shaped diamond grinding wheel (7), the X-direction position of a workpiece is determined to be X0 through calibration after a machine tool is installed, and the green silicon carbide grinding rod is directly moved to the X0 position before dressing; secondly, determining Y, Z position relation towards a starting point, on the premise that the X-direction position is X0, manually moving a Y-axis (3) and a Z-axis (9) of a machine tool to enable the lower edge of the cylindrical end of a green silicon carbide grinding rod 6 to be in contact with the upper inclined plane of the abrasive layer of the V-shaped diamond grinding wheel (7), recording Y, Z position coordinates (Y1, Z1) at the moment, converting Y, Z initial position coordinates (Y0, Z0) according to the triangular relation between the current position and the oblique line angle, requiring the initial position coordinates (Y0, Z0) to be out of the vertex of the grinding wheel, and manually moving the Y-axis (3) and the Z-axis (9) of the machine tool to enable the green silicon carbide grinding rod 6 to exit to the initial position coordinates (Y0, Z0) to be in contact with the grinding wheel;

step three: programming an oblique line interpolation program for slope finishing on the V-shaped diamond grinding wheel; determining an oblique line interpolation program and a path plan of an upper oblique plane according to the position relation of the green silicon carbide grinding rod 6 and the grinding wheel 7, the angle of the oblique plane of the V-shaped diamond grinding wheel (7) to be modified and the radius of the green silicon carbide grinding rod 6;

step four: carrying out in-place trimming on the upper inclined surface of the V-shaped diamond grinding wheel (7) by using a green silicon carbide grinding rod (6); processing parameters are as follows: the tool spindle has the rotating speed of 350-500 rpm, the grinding wheel has the rotating speed of 4000-5000 rpm, the grinding depth is 2-20 mu m, the feeding speed is 50-300 mm/min, and the grinding fluid is water-based emulsion;

step five: determining the position relation between the green silicon carbide grinding rod (6) and the lower inclined plane of the V-shaped diamond grinding wheel (7); firstly, determining the position relation in the X direction, requiring the rotation central line of a green silicon carbide grinding rod (6) to be vertically intersected with the rotation central line of a V-shaped diamond grinding wheel (7) in high-precision in-place dressing, determining the X-direction position of a workpiece to be X0 after a machine tool is installed, directly moving the green silicon carbide grinding rod to the X0 position before dressing, then determining Y, Z to be in the position relation of a starting point, manually moving a Y axis (3) and a Z axis (9) of a straight line axis of the machine tool under the premise that the X0 position is set to enable the upper edge of the cylindrical end part of the green silicon carbide grinding rod (6) to be in contact with the lower inclined surface of the abrasive layer of the V-shaped diamond grinding wheel (7) to record Y, Z-direction position coordinates (Y1 ', Z1'), converting Y, Z-direction starting position coordinates (Y0 ', Z0') according to the triangular relation of the current position and the inclined line angle, requiring the starting position coordinates (Y829, z0') is outside the vertex of the grinding wheel, and the green silicon carbide grinding rod (6) is withdrawn to the initial position coordinates (Y0, Z0) by manually moving the linear motion axes Y (3) and Z (9) of the machine tool to contact with the grinding wheel;

step six: programming a slash interpolation program for trimming the lower bevel of the V-shaped diamond grinding wheel; determining a lower inclined line interpolation program and a path plan according to the position relation of the green silicon carbide grinding rod (6) and the grinding wheel (7), the inclined angle of the V-shaped diamond grinding wheel (7) to be modified and the radius of the green silicon carbide grinding rod (6);

step seven: the lower inclined surface of the V-shaped diamond grinding wheel (7) is subjected to in-situ trimming by a green silicon carbide grinding rod (6); the processing parameters are that the rotating speed of a tool spindle is 350-500 rpm, the rotating speed of a grinding wheel is 4000-5000 rpm, the grinding depth is 2-20 mu m, the feeding speed is 50-300 mm/min, and the grinding fluid is water-based emulsion.

5. The method of claim 4, wherein the green silicon carbide grinding rod has a particle size of 400# to 1500 #.

6. The method of claim 4, wherein the V-diamond wheel has a grit size of D3-D15.

7. The method for precisely in-situ dressing of the resin-based V-shaped diamond grinding wheel according to claim 4, wherein the rotation speed of the workpiece spindle is 350-500 rpm.

8. The method for precisely in-situ dressing of the resin-based V-shaped diamond grinding wheel according to claim 4, wherein the rotation speed of the grinding wheel is 4000-5000 rpm.

9. The method for precisely in-situ dressing of the resin-based V-shaped diamond grinding wheel according to claim 4, wherein the grinding depth is 2-20 μm.

10. The method for precisely in-situ dressing of the resin-based V-shaped diamond grinding wheel according to claim 4, wherein the feeding speed is 50-300 mm/min.

Technical Field

The invention belongs to the technical field of diamond grinding wheels, and particularly relates to a device and a method for precisely trimming a resin-based V-shaped diamond grinding wheel in situ.

Background

In recent years, an optical functional element with a microstructure surface is a key element for manufacturing a micro-miniature optoelectronic system, has the advantages of facilitating an optical designer to optimize the optical system, reducing weight, reducing volume, realizing integration and the like, and can realize new functions of micro, array, integration, wave surface conversion and the like which are difficult to achieve by a common optical element. For example, the microlens array backlight module is applied to liquid crystal display screens of electronic equipment such as mobile phones and digital cameras, so that the display screens can obtain brighter and more uniform display effects with smaller light source energy. The reflecting lens array in the novel LED lamp light source system greatly increases the illumination brightness, thereby enabling the application of the LED lamp in the fields of automobile headlamps and public lighting to be possible. The array waveguide grating applied to the optical fiber communication wavelength division multiplexer greatly improves the transmission capacity of optical fiber communication. The application of optical parts with microstructures such as pyramids, V-shaped grooves, Fresnel lenses and the like in military and civil products is more and more extensive, and for the optical parts which are mostly made of hard and brittle materials such as ceramics, optical glass, hard alloy and the like, the ultra-precision grinding technology based on the V-shaped diamond grinding wheel is an effective solution for preparation.

The currently effective V-shaped diamond grinding wheel dressing methods include an electric spark dressing method, an online electrolytic dressing method, a GC grindstone numerical control opposite grinding method and the like. However, the electric spark dressing method and the on-line electrolytic dressing method are only applicable to a grinding wheel with conductive performance, and an additional high-frequency pulse power supply is required; the GC grindstone numerical control grinding method is simple to operate and is particularly suitable for a surface grinding machine, but the GC grindstone is fixed, the loss is high, and the finishing time is long. Compared with the V-shaped diamond grinding wheel dressing method, the rotary green silicon carbide grinding rod in-situ dressing method has the advantages that the operation is simple by using the workpiece spindle as the dressing driving unit, no complex additional equipment is needed, the dressing cost is low, the processing efficiency is high, the dressing precision is high, the dressing method has unique advantages for dressing the fine-grained V-shaped resin matrix diamond grinding wheel, and the precise in-situ dressing of any sharp-angled V-shaped grinding wheel can be realized according to different angle requirements.

The present invention has been made in view of this situation.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a device and a method for precisely trimming a resin-based V-shaped diamond grinding wheel in situ.

In order to solve the technical problems, the invention adopts the technical scheme that:

the utility model provides a device of accurate on-position trimming resin base V type diamond emery wheel, mainly by three straight line axle linkage lathe, anchor clamps, green carborundum stick, the emery wheel that have work piece main shaft and grinding main shaft constitute, green carborundum stick passes through anchor clamps to be installed on the vacuum chuck of lathe work piece main shaft, the emery wheel is installed at the lower tip of the grinding main shaft of arranging perpendicularly, green carborundum stick cylinder end and the upper and lower inclined plane contact of emery wheel. The granularity of the green silicon carbide grinding rod is 400-1500, and the granularity of the V-shaped resin-based diamond grinding wheel is D3-D15.

A method for precisely dressing a resin-based V-shaped diamond grinding wheel in place comprises the following steps:

the method comprises the following steps: and (5) mounting a green silicon carbide grinding rod and a grinding wheel. Mounting a clamp with a green silicon carbide grinding rod with the diameter of 20mm on a vacuum chuck of a machine tool workpiece spindle, and driving the green silicon carbide grinding rod to rotate through the workpiece spindle; the V-shaped diamond grinding wheel is arranged at the lower end part of a grinding main shaft which is vertically arranged, and the grinding main shaft drives the grinding wheel to rotate.

Step two: and determining the position relation between the green silicon carbide grinding rod and the inclined plane on the V-shaped diamond grinding wheel. Firstly, the position relation in the X direction is determined, the high-precision in-place dressing requires that the rotating center line of a green silicon carbide grinding rod is perpendicularly intersected with the rotating center line of a V-shaped diamond grinding wheel, the X-direction position of a workpiece is determined to be X0 through calibration after a machine tool is installed, and the green silicon carbide grinding rod is directly moved to the X0 position before dressing. Secondly, determining Y, Z position relation towards the starting point, on the premise that the X-direction position is X0, manually moving the Y axis and the Z axis of the machine tool to enable the lower edge of the cylindrical end of the green silicon carbide grinding rod to be in contact with the upper inclined plane of the abrasive layer of the V-shaped diamond grinding wheel, recording Y, Z position coordinates (Y1, Z1) at the moment, converting Y, Z initial position coordinates (Y0, Z0) according to the triangular relation between the current position and the oblique line angle, requiring the initial position coordinates (Y0, Z0) to be out of the vertex of the grinding wheel, and manually moving the Y axis and the Z axis of the linear motion axis of the machine tool to enable the green silicon carbide grinding rod to be withdrawn to the initial position coordinates (Y0, Z0) and to be in contact with the grinding wheel.

Step three: and programming an oblique line interpolation program for the slope finishing on the V-shaped diamond grinding wheel. The oblique line interpolation program and the path planning of the upper inclined plane are determined according to the position relationship between the green silicon carbide grinding rod and the grinding wheel, the angle of the inclined plane of the V-shaped diamond grinding wheel to be modified and the radius of the green silicon carbide grinding rod are shown in figure 2.

Step four: and (4) carrying out in-place trimming on the upper inclined surface of the V-shaped diamond grinding wheel by using a green silicon carbide grinding rod. Processing parameters are as follows: the tool spindle has the rotating speed of 350-500 rpm, the grinding wheel has the rotating speed of 4000-5000 rpm, the grinding depth is 2-20 mu m, the feeding speed is 50-300 mm/min, and the grinding fluid is water-based emulsion.

Step five: and determining the position relationship between the green silicon carbide grinding rod and the lower inclined plane of the V-shaped diamond grinding wheel. Firstly, the position relation in the X direction is determined, the high-precision in-place dressing requires that the rotating center line of a green silicon carbide grinding rod is perpendicularly intersected with the rotating center line of a V-shaped diamond grinding wheel, the X-direction position of a workpiece is determined to be X0 through calibration after a machine tool is installed, and the green silicon carbide grinding rod is directly moved to the X0 position before dressing. Secondly, determining Y, Z position relation towards the starting point, on the premise that the X-position is set as X0, manually moving the Y axis and the Z axis of the machine tool to enable the upper edge of the end part of the cylindrical body of the green silicon carbide grinding rod to be in contact with the lower inclined surface of the abrasive layer of the V-shaped diamond grinding wheel, recording Y, Z position coordinates (Y1 'and Z1') at the moment, converting Y, Z initial position coordinates (Y0 'and Z0') according to the triangular relation between the current position and the inclined angle, requiring the initial position coordinates (Y0 'and Z0') to be out of the vertex of the grinding wheel, and manually moving the Y axis and the Z axis of the linear motion of the machine tool to enable the green silicon carbide grinding rod to be withdrawn to the initial position coordinates (Y0 and Z0) and to be.

Step six: programming the oblique line interpolation program for the bevel finishing of the lower surface of the V-shaped diamond grinding wheel. And determining a lower inclined line interpolation program and a path plan according to the position relationship between the green silicon carbide grinding rod and the grinding wheel, the inclined plane angle of the V-shaped diamond grinding wheel to be modified and the radius of the green silicon carbide grinding rod, wherein the lower inclined line interpolation program and the path plan are shown in figure 3.

Step seven: and (4) carrying out in-place dressing on the lower inclined surface of the V-shaped diamond grinding wheel by using a green silicon carbide grinding rod. The processing parameters are that the rotating speed of a tool spindle is 350-500 rpm, the rotating speed of a grinding wheel is 4000-5000 rpm, the grinding depth is 2-20 mu m, the feeding speed is 50-300 mm/min, and the grinding fluid is water-based emulsion.

The invention provides a precise in-situ forming and trimming method for a resin-based V-shaped diamond grinding wheel for ultra-precise grinding processing of a microstructure optical element made of a hard and brittle material, and aims to solve the problems of complex trimming equipment, low precision and efficiency and high cost of the conventional V-shaped diamond grinding wheel.

After the technical scheme is adopted, compared with the prior art, the invention has the following beneficial effects.

1. The invention realizes the high efficiency and high precision of the fine-grained resin-based V-shaped diamond grinding wheel, ensures the precise finishing and forming, reduces the radius of a sharp-corner arc by about 10 times after finishing compared with that before finishing, and ensures that the grinding particles are protruded and uniformly distributed after finishing;

2. the invention can realize the precise in-place forming and finishing of the V-shaped diamond grinding wheel with any angle according to the angle requirement of the processing sharp corner;

3. the invention has simple equipment, low cost and convenient operation, and does not need additional finishing equipment.

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention to its proper form. It is obvious that the drawings in the following description are only some embodiments, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:

FIG. 1 is a diagram of an apparatus for dressing a diamond wheel in place with a rotating green silicon carbide grinding pin in accordance with the present invention;

FIG. 2 is a plan of the path of the present invention between the green silicon carbide grinding rod and the bevel of the V-shaped diamond wheel;

FIG. 3 is a plan of the path of the butt grinding between the green silicon carbide grinding rod and the lower bevel of the V-shaped diamond grinding wheel.

It should be noted that the drawings and the description are not intended to limit the scope of the inventive concept in any way, but to illustrate it by a person skilled in the art with reference to specific embodiments.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to fig. 1 to 3 in the embodiments of the present invention, and the following embodiments are used for illustrating the present invention and are not intended to limit the scope of the present invention. See figures 1-3 for an illustration: