Temperature sensor

文档序号:1285262 发布日期:2020-08-28 浏览:15次 中文

阅读说明:本技术 一种温度传感器 (Temperature sensor ) 是由 阴卫华 于 2019-02-20 设计创作,主要内容包括:本发明涉及一种温度传感器,包括导热板,在导热板上固定连接SMD热敏电阻芯片,在SMD电阻芯片上连接第一电极接头和第二电极接头,在第一电极接头和第二电极接头之间设有绝缘板,第一电极接头和第二电极接头均连接一个柔性线路板,在每个柔性线路板的端部均连接一个转接头。本发明的优点:本温度传感器采用SMD贴片电阻或贴片电容式传感器,本传感器采用柔性线路板,其长度根据实际应用情况预先设置,且柔性线路板的厚度较薄,SMD自带封装,无需在进行封装处理,整体厚度小于0.8mm,体积小,有效的解决了温度传感器在狭小空间使用的技术问题,且本传感器耐压为AC3000V,耐热为260<Sup>0</Sup>C,应用领域广泛。(The invention relates to a temperature sensor, which comprises a heat conducting plate, wherein an SMD (surface mounted device) thermistor chip is fixedly connected on the heat conducting plate, a first electrode connector and a second electrode connector are connected on the SMD thermistor chip, an insulating plate is arranged between the first electrode connector and the second electrode connector, the first electrode connector and the second electrode connector are both connected with a flexible circuit board, and the end part of each flexible circuit board is connected with an adapter. The invention has the advantages that: this temperature sensor adopts SMD chip resistor or paster capacitanc sensor, and this sensor adopts the flexible line way board, and its length sets up in advance according to the actual application condition, and the thickness of flexible line way board is thinner, and SMD is from taking the encapsulation, need not to encapsulate the processing, and whole thickness is less than 0.8mm, and is small, the effectual technical problem who solves temperature sensor and use in narrow and small space, and this sensor is withstand voltage for AC3000V, and is heat-resisting for 260 0 And C, the application field is wide.)

1. A temperature sensor, characterized by: including heat-conducting plate (1), fixed connection SMD thermistor chip (2) on heat-conducting plate (1), connect first electrode joint (3.1) and second electrode joint (3.2) on SMD resistor chip (2), be equipped with insulation board (8) between first electrode joint (3.1) and second electrode joint (3.2), a flexible line way board (4) is all connected in first electrode joint (3.1) and second electrode joint (3.2), adapter (5) is all connected at the tip of every flexible line way board (4).

2. A temperature sensor according to claim 1, wherein: still include first insulating cover (6), first insulating cover (6) parcel heat-conducting plate (1), SMD thermistor chip (2) first electrode joint (3.1), second electrode joint (3.2) be equipped with insulation board (8 flexible line way board (4) with adapter (5).

3. A temperature sensor according to claim 2, wherein: the first insulating sleeve (6) is of a long strip-shaped cylindrical structure.

4. A temperature sensor according to claim 2, wherein: still include second insulating cover (7), second insulating cover (7) parcel heat-conducting plate (1), SMD thermistor chip (2), first electrode joint (3.1), second electrode joint (3.2) be equipped with insulation board (8) with the corresponding end of first insulating cover (6).

Technical Field

The invention relates to the technical field of ice making, in particular to a temperature sensor.

Background

Thermistors are a class of sensitive elements, which are classified into positive temperature coefficient thermistors (PTC) and negative temperature coefficient thermistors (NTC) according to their temperature coefficients. Thermistors are typically temperature sensitive and exhibit different resistance values at different temperatures. A positive temperature coefficient thermistor (PTC) has a higher resistance value at a higher temperature, and a negative temperature coefficient thermistor (NTC) has a lower resistance value at a higher temperature, which are both semiconductor devices.

Various electronic devices can generate a large amount of heat after long-time operation, a thermistor is often used as a temperature measuring element, and then a cooling system is adjusted according to the measured temperature, so that intelligent temperature control is realized. A commonly used resistor in the prior art is an NTC thermistor. The conventional NTC thermistor comprises an epoxy-packaged NTC thermistor and a glass-packaged NTC thermistor, the lead wire is thick, the thickness of the packaged epoxy head is more than 1.5mm, the temporary space is large, the temperature measurement cannot be carried out on a narrow gap with the width less than 1.5mm, the application range of the thermistor is limited, and the resistance value is greatly changed after the thermistor is used for a long time. The corresponding electronic equipment cannot be subjected to comprehensive temperature measurement, and the temperature regulation of the equipment is influenced.

Disclosure of Invention

The invention aims to provide a temperature sensor to solve the problem of difficulty in current fish sorting in the background art.

In order to achieve the purpose, the invention provides the following technical scheme:

a temperature sensor, characterized by: the heat-conducting plate is fixedly connected with an SMD thermistor chip, a first electrode connector and a second electrode connector are connected on the SMD thermistor chip, an insulating plate is arranged between the first electrode connector and the second electrode connector, the first electrode connector and the second electrode connector are both connected with a flexible circuit board, and an adapter is connected to the end part of each flexible circuit board.

Preferably, the heat conducting plate further comprises a first insulating sleeve, and the first insulating sleeve wraps the heat conducting plate, the SMD thermistor chip, the first electrode connector, the second electrode connector, the insulating plate, the flexible circuit board and the adapter.

Preferably, the first insulating sleeve is an elongated cylindrical structure.

Preferably, the heat conducting plate further comprises a second insulating sleeve, and the second insulating sleeve wraps the heat conducting plate, the SMD thermistor chip, the first electrode terminal, the second electrode terminal, and the corresponding ends provided with the insulating plate and the first insulating sleeve.

Compared with the prior art, the invention has the beneficial effects that: the temperature sensor adopts SMD chip resistor or chip capacitor type sensor, the sensor adopts flexible circuit board, the length of the flexible circuit board is preset according to practical application condition, and the thickness of the flexible circuit boardThe degree is thinner, and SMD is from taking the encapsulation, need not to encapsulate the processing, and whole thickness is less than 0.8mm, and is small, the effectual technical problem who solves temperature sensor and use in narrow and small space, and this sensor is withstand voltage for AC3000V, and is heat-resisting for 2600And C, the application field is wide.

Drawings

FIG. 1 is a schematic diagram of the basic structure of the present invention;

fig. 2 is a schematic diagram of SMD thermistor chip connection.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

As shown in fig. 1 and 2, the present invention relates to a temperature sensor, including a heat conducting plate 1, the heat conducting plate 1 is a square plate, an SMD thermistor chip 2 is bonded on the heat conducting plate 1 by a heat conducting adhesive, the SMD thermistor chip 2 is a prior art, a lower surface of the SMD thermistor chip 2 is an electrode-free surface, and an upper surface thereof is an electrode surface. The upper surface of the SMD resistor chip 2 is connected with a first electrode joint 3.1 and a second electrode joint 3.2, an insulating plate 8 is arranged between the first electrode joint 3.1 and the second electrode joint 3.2, the first electrode joint 3.1 and the second electrode joint 3.2 are both connected with a flexible circuit board 4, the flexible circuit board 4 is also the prior art, and the end part of each flexible circuit board 4 is connected with an adapter 5.

Still include first insulating cover 6, first insulating cover 6 is the rectangular shape tube-shape insulating cover that two insulating pieces compound becomes, and first insulating cover 6 parcel heat-conducting plate 1, SMD thermistor chip 2, first electrode joint 3.1, second electrode joint 3.2 are equipped with insulation board 8, flexible line way board 4 and adapter 5.

Still include second insulating cover 7, second insulating cover 7 is the square tube-shape insulating cover that two insulating pieces compound becomes, and second insulating cover 7 parcel heat-conducting plate 1, SMD thermistor chip 2, first electrode joint 3.1 second electrode joint 3.2, be equipped with the corresponding end of insulation board 8 and first insulating cover 6.

The thickest dimension of the temperature sensor is 0.6mm, and the flexible circuit board 4 can be bent at will due to the characteristics, so that the temperature sensor is suitable for electronic devices in narrow ranges.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

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