阅读说明：本技术 一种用于光伏领域的散热背板 (A heat dissipation backplate for photovoltaic field ) 是由 李志彬 于 2020-06-30 设计创作，主要内容包括：本发明于光伏领域,涉及光伏背板领域,具体涉及一种用于光伏领域的散热背板,所述散热背板包括背板上层和背板下层,且背板上层和背板下层间设置有散热均匀的过滤式散热机构,所述背板上层和背板下层采用聚氟乙烯材料,分别固定在散热机构的上下表面。本发明解决了现有背板散热效果不佳的问题,利用过滤式散热机构作为保水过滤换热效果,大大提升了换热效率。(The invention belongs to the photovoltaic field, relates to the field of photovoltaic back plates, and particularly relates to a heat dissipation back plate used in the photovoltaic field. The invention solves the problem of poor heat dissipation effect of the existing back plate, and greatly improves the heat exchange efficiency by utilizing the filtering type heat dissipation mechanism as the water-retaining filtering heat exchange effect.)

1. A heat dissipation backplate for photovoltaic field which characterized in that: the heat dissipation backboard comprises a backboard upper layer and a backboard lower layer, a filtering type heat dissipation mechanism with uniform heat dissipation is arranged between the backboard upper layer and the backboard lower layer, and the backboard upper layer and the backboard lower layer are made of polyvinyl fluoride materials and are respectively fixed on the upper surface and the lower surface of the heat dissipation mechanism.

2. The heat-dissipating backsheet for photovoltaic applications as claimed in claim 1, wherein: filtration formula heat dissipation mechanism is provided with preliminary heat-conducting layer, heat transfer layer and secondary heat-conducting layer from top to bottom, preliminary heat-conducting layer one end is provided with the buffer block to be provided with the drain pipe on the buffer block, the one end that the drain pipe was kept away from to the secondary heat-conducting layer is provided with the buffer block, and is provided with the inlet tube on this buffer block.

3. The heat-dissipating backsheet for photovoltaic applications as claimed in claim 2, wherein: and the primary heat conduction layer and the secondary heat conduction layer are both made of metal mesh layers.

4. The heat-dissipating backsheet for photovoltaic applications as claimed in claim 3, wherein: the metal mesh layer is a copper mesh, and the surface of the copper mesh is plated with a nano titanium dioxide film to obtain the coated copper mesh.

5. The heat-dissipating backsheet for photovoltaic applications as claimed in claim 4, wherein: the preparation method of the coated copper mesh comprises the following steps:

step 1, putting a copper mesh into an ethanol water solution for ultrasonic cleaning to obtain a clean copper mesh;

step 2, adding polyvinyl alcohol into distilled water, uniformly stirring, then adding polyvinylpyrrolidone, and stirring for the second time to form a first coating liquid;

and 3, coating the first coating liquid on the copper mesh, drying at a constant temperature to form a first film, spraying titanium alcohol liquid on the surface, and sintering at a high temperature to form the coated copper mesh.

6. The heat-dissipating backsheet for photovoltaic applications as claimed in claim 1, wherein: the heat exchange layer takes a hollow porous material as a frame, takes water absorption particles as a built-in buffering agent, the hollow porous material is a metal frame, and the water absorption particles are polyacrylate particles.

7. The heat-dissipating backsheet for photovoltaic applications as claimed in claim 6, wherein: the water absorption particles take polyvinyl alcohol as a frame and polyacrylate as porous particles of a water absorbent.

8. The heat-dissipating backsheet for photovoltaic applications as claimed in claim 7, wherein: the preparation method of the water-absorbing particles comprises the following steps:

step 1, adding polyvinyl alcohol into distilled water, uniformly stirring to form a dissolved solution, and then adding the dissolved solution into polyvinylpyrrolidone to form a first mixed solution through low-temperature ultrasonic treatment;

step 2, adding sodium polyacrylate into the first mixed solution, uniformly stirring, adding into a mold, drying by distillation at constant temperature, and extruding to form solid particles;

and 3, sealing the mold with the solid particles, putting the mold into a reaction kettle for constant-temperature reaction for 2-4 hours, and slowly cooling the mold after pressure relief while the mold is hot to obtain the water-absorbing particles.

Technical Field

The invention belongs to the photovoltaic field, relates to the photovoltaic backboard field, and particularly relates to a heat dissipation backboard used in the photovoltaic field.

Background

The conventional solar cell back plate is mainly a TPT back plate, which is relatively high in price on one hand, and in addition, a large amount of high polymer resin with very poor heat conductivity is adopted, so that heat generated by a solar cell cannot be effectively led out, and the limitation of application in a photovoltaic module is more and more prominent. In order to effectively and timely guide out heat in the solar cell module, a metal material with high heat conductivity is selected as a solar cell back plate at present. However, the metal material has a strong absorption capacity for the near infrared spectrum, and the temperature rise is fast after the metal material with low specific heat absorbs heat, so that the metal back plate has no great advantage in heat dissipation compared with a TPT back plate.

In order to solve the problem, a cooling medium is generally arranged at the bottom of the back plate, and the heat dissipation effect is realized through heat exchange of the cooling medium, however, the method can only be used for the metal back plate generally, and in the actual use process, the metal back plate is obviously reduced based on the problems of corrosion and the like, and is gradually replaced.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a heat dissipation back plate used in the photovoltaic field, which solves the problem of poor heat dissipation effect of the existing back plate, and greatly improves the heat exchange efficiency by using a filtering type heat dissipation mechanism as a water-retaining filtering heat exchange effect.

In order to achieve the technical purpose, the technical scheme of the invention is as follows:

the utility model provides a heat dissipation backplate for photovoltaic field, the heat dissipation backplate includes backplate upper strata and backplate lower floor, and is provided with the even filtration formula heat dissipation mechanism of heat dissipation between backplate upper strata and backplate lower floor, backplate upper strata and backplate lower floor adopt the polyvinyl fluoride material, fix respectively on the upper and lower surface of heat dissipation mechanism.

Filtration formula heat dissipation mechanism is provided with preliminary heat-conducting layer, heat transfer layer and secondary heat-conducting layer from top to bottom, preliminary heat-conducting layer one end is provided with the buffer block to be provided with the drain pipe on the buffer block, the one end that the drain pipe was kept away from to the secondary heat-conducting layer is provided with the buffer block, and is provided with the inlet tube on this buffer block.

Furthermore, the primary heat conduction layer and the secondary heat conduction layer are both metal mesh layers, further the metal mesh layers are copper mesh layers, and the surfaces of the copper mesh layers are plated with nanometer titanium dioxide films, so that the coated copper mesh is obtained.

The preparation method of the coated copper mesh comprises the following steps:

step 1, putting the copper mesh into an ethanol water solution for ultrasonic cleaning to obtain a clean copper mesh, wherein the volume concentration of ethanol in the ethanol water solution is 50-70%, the temperature of low-temperature ultrasonic is 10-20 ℃, and the ultrasonic frequency is 40-60 kHz;

step 2, adding polyvinyl alcohol into distilled water, uniformly stirring, then adding polyvinylpyrrolidone, and stirring for the second time to form a first coating liquid; the concentration of the polyvinyl alcohol in the absolute ethyl alcohol is 20-60g/L, the addition amount of the polyvinylpyrrolidone is 50-90% of the mass of the polyvinyl alcohol, and the stirring speed is 1000-2000 r/min;

step 3, coating the first coating liquid on a copper net, drying at a constant temperature to form a first film, then spraying titanium alcohol liquid on the surface, and sintering at a high temperature to form a coated copper net; the coating amount of the first coating liquid is 0.2-0.5g/cm²The constant temperature drying temperature is 120-150 ℃, the concentration of the n-butyl titanate of the titanium alcohol solution in the absolute ethyl alcohol is 100-120g/L, and the spraying amount is 2-8g/cm²The temperature of the high-temperature sintering is 280-300 ℃.

Furthermore, the heat exchange layer 3-5 takes a hollow porous material as a framework, takes water-absorbing particles as a built-in buffer, takes the hollow porous material as a metal framework, and takes the water-absorbing particles as polyacrylate particles.

The water absorption particles take polyvinyl alcohol as a frame and polyacrylate as porous particles of a water absorbent.

The preparation method of the water-absorbing particles comprises the following steps:

step 1, adding polyvinyl alcohol into distilled water, uniformly stirring to form a dissolved solution, and then adding the dissolved solution into polyvinylpyrrolidone to form a first mixed solution through low-temperature ultrasonic treatment; the concentration of the polyvinyl alcohol in the distilled water is 100-200g/L, the addition amount of the polyvinyl pyrrolidone is 20-40% of the mass of the polyvinyl alcohol, the ultrasonic efficiency of low-temperature ultrasonic is 100-130kHz, and the temperature is 10-20 ℃;

step 2, adding sodium polyacrylate into the first mixed solution, uniformly stirring, adding into a mold, drying by distillation at constant temperature, and extruding to form solid particles; the adding amount of the sodium polyacrylate is 80-90% of the mass of the polyvinyl alcohol, the temperature for constant-temperature evaporation to dryness is 130-150 ℃, and the extrusion pressure is 0.4-0.6 MPa;

and 3, sealing the mold with the solid particles, placing the mold into a reaction kettle for constant temperature reaction for 2-4h, releasing pressure while the mold is hot, slowly cooling the mold to obtain the water-absorbing particles, wherein the temperature of the constant temperature reaction is 250-260 ℃, the temperature of the slow cooling is changed to 3-6 ℃/min, and the mold is slowly turned over in the cooling process.

From the above description, it can be seen that the present invention has the following advantages:

1. the invention solves the problem of poor heat dissipation effect of the existing back plate, and greatly improves the heat exchange efficiency by utilizing the filtering type heat dissipation mechanism as the water-retaining filtering heat exchange effect.

2. The invention utilizes the expansion of sodium polyacrylate after absorbing water to fill the whole filtering type heat dissipation mechanism, thereby achieving good effect.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the present invention.

Detailed Description

With reference to fig. 1, a specific embodiment of the present invention is described in detail, but the present invention is not limited in any way by the claims.

As shown in figure 1, the heat dissipation backboard for the photovoltaic field comprises a backboard upper layer 1 and a backboard lower layer 2, a filtering type heat dissipation mechanism 3 with uniform heat dissipation is arranged between the backboard upper layer 1 and the backboard lower layer 2, the backboard upper layer 1 and the backboard lower layer 2 are made of polyvinyl fluoride materials and are respectively fixed on the upper surface and the lower surface of the heat dissipation mechanism 3

The filtering type heat dissipation mechanism 3 is provided with a primary heat conduction layer 3-4, a heat exchange layer 3-5 and a secondary heat conduction layer 3-6 from top to bottom, one end of the primary heat conduction layer 3-4 is provided with a buffer block 3-3, a drain pipe 3-1 is arranged on the buffer block 3-3, one end of the secondary heat conduction layer 3-6, far away from the drain pipe 3-1, is provided with the buffer block 3-3, and a water inlet pipe 3-2 is arranged on the buffer block 3-3.

Further, the primary heat conduction layer 3-4 and the secondary heat conduction layer 3-6 are both metal mesh layers, further the metal mesh layers are copper meshes, and the surfaces of the copper meshes are plated with nanometer titanium dioxide films to obtain the plated copper meshes.

The preparation method of the coated copper mesh comprises the following steps:

step 1, putting the copper mesh into an ethanol water solution for ultrasonic cleaning to obtain a clean copper mesh, wherein the volume concentration of ethanol in the ethanol water solution is 50-70%, the temperature of low-temperature ultrasonic is 10-20 ℃, and the ultrasonic frequency is 40-60 kHz;

step 2, adding polyvinyl alcohol into distilled water, uniformly stirring, then adding polyvinylpyrrolidone, and stirring for the second time to form a first coating liquid; the concentration of the polyvinyl alcohol in the absolute ethyl alcohol is 20-60g/L, the addition amount of the polyvinylpyrrolidone is 50-90% of the mass of the polyvinyl alcohol, and the stirring speed is 1000-2000 r/min;

step 3, coating the first coating liquid on a copper net, drying at a constant temperature to form a first film, then spraying titanium alcohol liquid on the surface, and sintering at a high temperature to form a coated copper net; the coating amount of the first coating liquid is 0.2-0.5g/cm²The constant temperature drying temperature is 120-150 ℃, the concentration of the n-butyl titanate of the titanium alcohol solution in the absolute ethyl alcohol is 100-120g/L, and the spraying amount is 2-8g/cm²The temperature of the high-temperature sintering is 280-300 ℃.

Furthermore, the heat exchange layer 3-5 takes a hollow porous material as a framework, takes water-absorbing particles as a built-in buffer, takes the hollow porous material as a metal framework, and takes the water-absorbing particles as polyacrylate particles.

The water absorption particles take polyvinyl alcohol as a frame and polyacrylate as porous particles of a water absorbent.

The preparation method of the water-absorbing particles comprises the following steps:

step 1, adding polyvinyl alcohol into distilled water, uniformly stirring to form a dissolved solution, and then adding the dissolved solution into polyvinylpyrrolidone to form a first mixed solution through low-temperature ultrasonic treatment; the concentration of the polyvinyl alcohol in the distilled water is 100-200g/L, the addition amount of the polyvinyl pyrrolidone is 20-40% of the mass of the polyvinyl alcohol, the ultrasonic efficiency of low-temperature ultrasonic is 100-130kHz, and the temperature is 10-20 ℃;

step 2, adding sodium polyacrylate into the first mixed solution, uniformly stirring, adding into a mold, drying by distillation at constant temperature, and extruding to form solid particles; the adding amount of the sodium polyacrylate is 80-90% of the mass of the polyvinyl alcohol, the temperature for constant-temperature evaporation to dryness is 130-150 ℃, and the extrusion pressure is 0.4-0.6 MPa;

and 3, sealing the mold with the solid particles, placing the mold into a reaction kettle for constant temperature reaction for 2-4h, releasing pressure while the mold is hot, slowly cooling the mold to obtain the water-absorbing particles, wherein the temperature of the constant temperature reaction is 250-260 ℃, the temperature of the slow cooling is changed to 3-6 ℃/min, and the mold is slowly turned over in the cooling process.