阅读说明：本技术 银包覆树脂粒子 (Silver-coated resin particle ) 是由 赤池宽人 山崎和彦 影山谦介 塚田博一 于 2019-01-28 设计创作，主要内容包括：一种银包覆树脂粒子(10),其具有树脂粒子(11)及设置于所述树脂粒子(11)的表面的银包覆层(12),其中,10％压缩弹性模量的平均值在500MPa以上且15000MPa以下的范围内,且10％压缩弹性模量的变异系数为30％以下。(A silver-coated resin particle (10) having a resin particle (11) and a silver coating layer (12) provided on the surface of the resin particle (11), wherein the average value of the 10% compressive modulus of elasticity is in the range of 500MPa or more and 15000MPa or less, and the coefficient of variation of the 10% compressive modulus of elasticity is 30% or less.)

1. A silver-coated resin particle comprising a resin particle and a silver coating layer provided on the surface of the resin particle, characterized in that,

the average value of the 10% compressive modulus of elasticity is in the range of 500MPa to 15000MPa, and the coefficient of variation of the 10% compressive modulus of elasticity is 30% or less.

2. The silver-coated resin particle according to claim 1,

the resin particles are any one of silicone resin particles, aramid resin particles, fluororesin particles, polysulfone resin particles, polyether resin particles, polyimide resin particles, polyamideimide resin particles, epoxy resin particles, phenolic resin particles, acrylic-styrene copolymer particles, polyurethane particles, and resin particles having a core-shell structure.

3. The silver-coated resin particle according to claim 1 or 2,

the average particle diameter of the resin particles is in the range of 0.1-30 [ mu ] m.

Technical Field

The present invention relates to a silver-coated resin particle having a resin particle and a silver-coated layer provided on the surface of the resin particle.

The present application claims priority based on patent application No. 2018-019519 of japanese application No. 2/6/2018, and the contents thereof are incorporated herein.

Background

The silver-coated resin particles have the same conductivity as the silver particles, and the resin particles as the mother particles are flexible as compared with the silver particles, and therefore have the property of being easily deformed. Therefore, the silver-coated resin particles can be used as a conductive filler for a conductive Material such as a TIM (thermal interface Material) Material or a conductive spacer. The silver-coated resin particles used as the conductive filler preferably have a high stress relaxation ability so that the conductive material does not break when stress is applied to the conductive material containing the silver-coated resin particles.

Patent document 1 discloses a silver-coated resin particle having a high stress relaxation ability, which is a resin particle using a resin particle having an average particle diameter of 0.1 to 10 μm as a matrix particle, wherein the amount of silver contained in the silver-coated layer is 60 to 90 parts by mass per 100 parts by mass of the silver-coated resin particle, and the heat generation peak temperature of the silver-coated resin particle when subjected to differential thermal analysis is 265 ℃.

Patent document 1: japanese patent laid-open publication No. 2016-

The silver-coated resin particles described in patent document 1 have a heat generation peak temperature of 265 ℃ or higher in differential thermal analysis, and are resistant to temperature changes, but may have insufficient relaxation ability against physical impact such as stretching and compression, or stress such as thermal stress.

Disclosure of Invention

The present invention has been made in view of the above circumstances, and an object thereof is to provide silver-coated resin particles having a high stress relaxation ability.

[1] In order to solve the above problems, the silver-coated resin particles of the present invention are silver-coated resin particles having resin particles and a silver coating layer provided on the surface of the resin particles, and are characterized in that the average value of the 10% compressive modulus of elasticity is in the range of 500MPa to 15000MPa, and the coefficient of variation of the 10% compressive modulus of elasticity is 30% or less.

The silver-coated resin particles of the present invention having such a structure have an average value of 10% compressive modulus of elasticity in the range of 500MPa to 15000MPa, a coefficient of variation of 10% compressive modulus of elasticity as low as 30% or less, and a small variation in 10% compressive modulus, and therefore, when stress is applied, the particles deform uniformly and exhibit a high relaxation ability. Therefore, in the conductive material containing the silver-coated resin particles of the present invention, the silver-coated resin particles are uniformly deformed when stress is applied, and the stress is relaxed, so that the stress is hard to concentrate on a specific portion, and thus the conductive material is hard to break.

[2] In the above [1], the resin particles may be any of silicone resin particles, aramid resin particles, fluororesin particles, polysulfone resin particles, polyether resin particles, polyimide resin particles, polyamideimide resin particles, epoxy resin particles, phenol resin particles, acrylic-styrene copolymer particles, polyurethane particles, and resin particles having a core-shell structure.

[3] In the above-mentioned items [1] to [2], the resin particles may have an average particle diameter in a range of 0.1 μm or more and 30 μm or less. When the average particle diameter of the resin particles is within this range, the resin particles are difficult to agglomerate and the surface area of the resin particles is small, the amount of silver for obtaining conductivity required as a conductive filler can be suppressed, and it becomes easy to form a good silver coating layer. When the silver-coated resin particles of the present invention are used as a conductive filler for a conductive material, reliability can be improved if the average particle diameter is within this range.

According to the present invention, silver-coated resin particles having a high stress relaxation ability can be provided.

Drawings

Fig. 1 is a cross-sectional view of silver-coated resin particles according to an embodiment of the present invention.

Fig. 2 is a flowchart showing a method for producing silver-coated resin particles according to an embodiment of the present invention.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[ silver-coated resin particles ]

Fig. 1 is a cross-sectional view of silver-coated resin particles according to an embodiment of the present invention.

In fig. 1, silver-coated resin particles 10 have resin particles 11 and silver-coated layers 12 provided on the surfaces of the resin particles 11. The silver-coated resin particles 10 have an average value of 10% compressive modulus of elasticity in the range of 500MPa to 15000MPa, and a coefficient of variation of 10% compressive modulus of elasticity of 30% or less.

(resin particles)

Examples of the resin particles 11 include silicone resin particles, aramid resin particles, fluororesin particles, polysulfone resin particles, polyether resin particles, polyimide resin particles, polyamideimide resin particles, epoxy resin particles, phenol resin particles, acrylic-styrene copolymer particles, polyurethane particles, and resin particles having a core-shell structure. Examples of the silicone resin particles include Polysilsesquioxane (PSQ) resin particles and Polymethylsilsesquioxane (PMSQ) resin particles. Examples of the aramid resin particles include poly (m-phenylene isophthalamide) (MPIA) resin particles and poly (p-phenylene terephthalamide) (PPTA) resin particles. Examples of the fluororesin particles include Polytetrafluoroethylene (PTFE) resin particles, tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride (THV) resin particles, polyvinylidene fluoride (PVDF) resin particles, Polychlorotrifluoroethylene (PCTFE) resin particles, chlorotrifluoroethylene-ethylene (ECTFE) resin particles, tetrafluoroethylene-ethylene (ETFE) resin particles, tetrafluoroethylene-hexafluoropropylene (FEP) resin particles, tetrafluoroethylene-perfluoroalkyl vinyl ether (PFA) resin particles, and the like. Examples of the polysulfone resin particles include polyphenylene sulfide (PPS) resin and polyether sulfone (PES) resin. Examples of the polyether resin particles include polyether ether ketone (PEEK) resin Particles and Polyphenylene Ether (PPE) resin particles. Examples of the phenol resin particles include a novolak phenol resin, a resol phenol resin, and a phenol resin obtained by partially modifying these resins. Examples of the polyurethane particles include polyester polyurethane particles and polyol polyurethane particles. Examples of the resin particles having a core-shell structure include resin particles having an acrylic resin core and a silicone resin shell. The resin particle of the acrylic resin core-silicone resin shell is produced by coating a silicone resin film on an acrylic resin particle.

The resin particles 11 preferably have a 5% mass reduction temperature of 265 ℃ or higher as measured by thermogravimetric analysis. In the present embodiment, the 5% mass reduction temperature is a temperature at which the initial weight at 25 ℃ is reduced by 5% by mass when thermogravimetric analysis is performed in an inert atmosphere on resin particles obtained by drying moisture that has been physically adsorbed in advance at 120 ℃. The heat resistance of a conductive film formed from a conductive paste containing silver-coated resin particles 10, in which the 5% mass reduction temperature of resin particles 11 in silver-coated resin particles 10 is less than 265 ℃, as a conductive filler may be lowered.

That is, for example, when an electronic component is soldered to a substrate common to the conductive film, the conductive film is also heated to the soldering temperature, and when the 5% mass reduction temperature of the resin particles 11 is lower than 265 ℃, the resin particles 11 may thermally decompose and it becomes difficult to maintain the shape of the conductive film.

The shape of the resin particles 11 is not particularly limited. The resin particles 11 may be spherical particles, or may be in other shapes than spherical, such as flat, plate-like, or needle-like shapes.

The average particle diameter of the resin particles 11 is preferably in the range of 0.1 μm to 30 μm, more preferably 0.5 μm to 10 μm. When the average particle diameter of the resin particles 11 is less than 0.1 μm, the resin particles 11 are easily aggregated, and the surface area of the resin particles 11 becomes large, and in order to obtain conductivity required as a conductive filler, it is necessary to increase the amount of silver, and it may be difficult to form a good silver coating layer 12. On the other hand, if the average particle diameter of the resin particles 11 exceeds 30 μm, when the silver-coated resin particles 10 are used as a conductive filler of a conductive material, stress concentration tends to occur in particles having a large particle diameter, and there is a possibility that reliability is lowered. In the present specification, the average particle diameter of the resin particles 11 is an average value calculated by measuring the diameters (particle diameters) of 300 resin particles at a magnification of 5000 times by software (product name: PC SEM) using a scanning electron microscope (model name: SU-1500, manufactured by hitachi high and new technology, ltd., hitachi ハイテクノロジーズ). When the resin particles 11 have a shape other than a spherical shape, the average value of the long sides of the resin particles 11 is referred to as an average particle diameter.

The coefficient of variation (unit:%) of the particle diameter of the resin particles 11 is a value obtained from the standard deviation and the average particle diameter of the 300 resin particles 11 described above by the formula: [ (standard deviation of particle diameter/average particle diameter) × 100] and the coefficient of variation (unit:%) of the particle diameter of the resin particles 11 is a value.

(silver coating layer)

The content of the silver coating layer 12 in the silver-coated resin particles 10, that is, the content of silver in the silver-coated resin particles 10 is preferably in the range of 25 mass% to 90 mass%, more preferably in the range of 40 mass% to 85 mass%, where the mass of the silver-coated resin particles 10 is 100. If the silver content is less than 25 mass%, the silver-coated layer 12 may be defective. On the other hand, if the silver content exceeds 90 parts by mass, the specific gravity of the silver-coated resin particles becomes too large, and it may be difficult to uniformly disperse the silver-coated resin particles in a conductive material such as a TIM material or a conductive spacer. Further, if the content of silver exceeds 90 parts by mass, the conductivity of the silver coating layer 12 is saturated, and therefore, there is a possibility that the content of silver exceeding 90 parts by mass is industrially disadvantageous.

The average particle diameter of the silver-coated resin particles 10 is preferably in the range of 0.2 to 30.5. mu.m, and more preferably in the range of 0.6 to 10.5. mu.m. The average particle diameter can be measured and calculated by the same method as the average particle diameter of the resin particles 11.

The thickness of the silver coating layer 12 is preferably in the range of 0.1 μm to 0.5 μm. If the thickness of the silver-coated layer 12 is less than 0.1 μm, when the silver-coated resin particles 10 are used as the conductive filler, it is difficult to obtain a contact between the silver-coated resin particles 10, and sufficient conductivity may not be imparted. On the other hand, if the thickness of the silver-coated layer 12 exceeds 0.5 μm, the silver-coated resin particles 10 may become difficult to deform.

(modulus of elasticity under compression 10%)

If the 10% compressive modulus of elasticity of the silver-coated resin particles 10 is less than 500MPa, the silver-coated resin particles 10 are too easily deformed, and the strength of a conductive film, a composite material, or the like formed of a conductive material containing the silver-coated resin particles 10 as a conductive filler is reduced. On the other hand, if the 10% compressive modulus of elasticity exceeds 15000MPa, the silver-coated resin particles 10 become less likely to deform, and the stress relaxation ability is lowered.

For the above reasons, in the present embodiment, the 10% compressive modulus of elasticity of the silver-coated resin particles 10 is set to be in the range of 500MPa to 15000 MPa. The average value of the 10% compressive modulus of elasticity is particularly preferably in the range of 1000MPa or more and 15000MPa or less, and particularly preferably in the range of 5000MPa or more and 12000MPa or less.

Further, when the silver-coated resin particles 10 having a coefficient of variation of the 10% compressive modulus of elasticity of the silver-coated resin particles 10 of more than 30% are used as a conductive filler for a conductive film, stress is likely to concentrate on a specific portion of the conductive film when stress is applied to the conductive film, and the conductive film is likely to be broken.

Therefore, in the present embodiment, the coefficient of variation of the 10% compressive modulus of elasticity of the silver-coated resin particles 10 is set to 30% or less. Further, it is preferably 25% or less. The lower limit is not particularly limited, but may be 0%.

Here, in the present embodiment, the average value of the 10% compressive elastic modulus of the silver-coated resin particles 10 is the arithmetic average value of the 10% compressive elastic modulus measured for 100 silver-coated resin particles 10, and the coefficient of variation (unit:%) of the 10% compressive elastic modulus of the silver-coated resin particles 10 is a value obtained from the arithmetic average value and the standard deviation of the 10% compressive elastic modulus of the 100 silver-coated resin particles 10 and by the formula: [ (standard deviation of the 10% compressive elastic modulus/arithmetic average value of the 10% compressive elastic modulus) × 100], and the 10% compressive elastic modulus of the silver-coated resin particles 10 is the compressive elastic modulus obtained by compressing the silver-coated resin particles 10 by 10% in one direction.

[ method for producing silver-coated resin particles ]

Next, a method for producing the silver-coated resin particles of the present embodiment will be described.

Fig. 2 is a flowchart showing a method for producing silver-coated resin particles according to an embodiment of the present invention. As shown in fig. 2, the method for producing silver-coated resin particles according to the present embodiment includes the steps of: a pretreatment step S01 of performing a treatment for making silver easily precipitate by electroless plating on the surface of the resin particles as the mother particles; and an electroless silver plating process S02 for forming a silver coating layer on the resin particles by electroless silver plating.

The resin particles as the matrix particles preferably have an average value of 10% compressive modulus of elasticity in the range of 450MPa to 14000MPa, and a coefficient of variation of 10% compressive modulus of elasticity of 30% or less. Since the average value of the 10% compressive modulus of elasticity of the resin particles and the rate of change are within the above ranges, the average value of the 10% compressive modulus of elasticity of the silver-coated resin particles and the rate of change can be easily adjusted to the above values.

In the resin particles, the rate of change of the 10% compressive modulus may be increased due to variations in the degree of crosslinking or polymerization degree of the resin constituting the particles or the amount of monomers or oligomers remaining in the resin. When the variation in the 10% compressive modulus of elasticity of the resin particles is large, it is preferable to reduce the variation in the 10% compressive modulus of elasticity by reducing the variation in the polymerization degree of the resin constituting the particles and the amount of the monomer or oligomer remaining in the resin by a treatment such as heating the resin particles.

(pretreatment step)

In the pretreatment step S01, it is preferable that the catalyst is adsorbed on the surface of the resin particle to obtain a catalyst-adsorbed resin particle, or the substitution layer is adsorbed to obtain a substitution layer-adsorbed resin particle. As the catalyst, palladium or silver nanoparticles can be used. As a material of the substitution layer, a metal such as tin, which is inferior to silver, or a compound thereof can be used.

The palladium catalyst-adsorbing resin particles can be obtained by, for example, adding a palladium compound, hydrochloric acid, and a reducing agent to a slurry in which resin particles are dispersed, thereby precipitating palladium on the surface of the resin particles, and the palladium compound can be a complex salt such as palladium chloride, palladium sulfate, palladium nitrate, and palladium ammine complex salt, and the reducing agent can be, for example, a stannous ion-containing salt such as stannous chloride and stannous sulfate, formalin, glucose, imidazole, rochelle salt (sodium potassium tartrate), hydrazine and a derivative thereof, hydroquinone, L-ascorbic acid, or formic acid.

The tin-substituted layer adsorption resin particles can be obtained by, for example, adding a tin compound and hydrochloric acid to a slurry in which resin particles are dispersed, thereby depositing tin hydroxide or the like on the surfaces of the resin particles. As the tin compound, stannous chloride, stannous fluoride, stannous bromide, stannous iodide, or the like can be used.

Before the pretreatment step S01, the resin particles may be subjected to surface modification by plasma treatment, ozone treatment, acid treatment, alkali treatment, oxidizing agent treatment, silane treatment, or the like, as necessary. By these surface modifications, the surface of the resin particle is activated, and the adhesion between the catalyst or the substitution layer and the silver coating layer and the resin particle is improved.

(electroless silver plating Process)

In the electroless silver plating step S02, a silver coating layer is formed by electroless silver plating on the catalyst-adsorbing resin particles or the substitute-layer-adsorbing resin particles obtained in the pretreatment step S01. The method of forming the silver coating layer by electroless silver plating may be exemplified by the following methods: (1) a method of preparing a slurry by adding catalyst-adsorbing resin particles or substitution layer-adsorbing resin particles to an aqueous solution containing a complexing agent, a reducing agent, etc., dropping a silver salt aqueous solution containing an additive metal (Sn, Cu, Bi, Sb) or a salt thereof for raising the recrystallization temperature to the slurry, (2) a method of preparing a slurry by adding catalyst-adsorbing resin particles or substitution layer-adsorbing resin particles to an aqueous silver solution containing an additive metal or a salt thereof for raising the recrystallization temperature and a complexing agent, dropping a reducing agent aqueous solution to the slurry, and (3) a method of preparing a slurry by adding metal-catalyst-adsorbing resin particles to an aqueous silver solution containing an additive metal or a salt thereof for raising the recrystallization temperature, a complexing agent, and a reducing agent, dropping a caustic alkali aqueous solution to the slurry.

The reducing agent may be formaldehyde, glucose, imidazole, rochelle salt (sodium potassium tartrate), hydrazine and its derivatives, hydroquinone, L-ascorbic acid, or formic acid, and the reducing agent is preferably formaldehyde, more preferably a mixture of two or more reducing agents containing at least formaldehyde, and most preferably a mixture of reducing agents containing formaldehyde and glucose.

The obtained silver-coated resin particles may be subjected to surface treatment as needed. Examples of the surface treatment include fatty acids such as stearic acid, isostearic acid, palmitic acid, and oleic acid, dicarboxylic acids such as maleic acid and succinic acid, carboxylic acid polymers such as polyacrylic acid, amine compounds such as dodecylamine and octadecylamine, amine polymers such as polyetheramine, sulfides such as octadecyl disulfide, thiol compounds such as dodecylmercaptan, and silane coupling agents. When the silver-coated resin particles are subjected to surface treatment, affinity with a binder can be improved when the particles are used as a conductive filler in the use described later.

[ use ]

The silver-coated resin particles 10 of the present embodiment are excellent as a conductive filler, and can be used most suitably as a conductive filler for conductive materials such as a conductive adhesive, a conductive film (sheet), a conductive rubber (elastomer), a conductive adhesive, a TIM (Thermal Interface Material) Material for a heat sink, a heat-dissipating grease, and the like, and a conductive spacer.

(conductive adhesive)

The conductive adhesives are classified into Isotropic Conductive Adhesives (ICA) and Anisotropic Conductive Adhesives (ACA). The adhesive has a paste, film, or ink form depending on the form of the adhesive. With respect to an isotropic conductive adhesive, by shrinkage of the adhesive when the adhesive is cured, fillers are brought into contact with each other in the longitudinal direction, the lateral direction, and the oblique direction, whereby a conductive object to be connected and the fillers are brought into contact to obtain conductivity. The sheet can also be formed by an isotropic conductive adhesive. Anisotropic conductive adhesives are those in which a filler is dispersed in an adhesive and an anisotropic conductive adhesive is interposed between conductive objects to be connected. By pressing it in the longitudinal direction, the filler between the conductive objects to be connected is brought into contact with the conductive objects to be connected in the longitudinal direction, and conductivity is obtained. On the other hand, since the non-pressurized portions are arranged in the lateral direction with the filler by the adhesive as an insulator and do not contact each other, conductivity cannot be obtained.

Examples of the conductive adhesive include anisotropic or isotropic conductive paste, anisotropic or isotropic conductive ink, and the like. The conductive adhesive can be prepared by uniformly mixing the silver-coated resin particles 10 and the insulating binder resin using a kneader such as a planetary mixer or a three-roll mill. In the conductive adhesive, the silver-coated resin particles 10 are uniformly dispersed in the insulating binder resin. The content of the silver-coated resin particles 10 is not particularly limited and may be appropriately determined depending on the application, etc., but is preferably in the range of 0.5 to 90 parts by mass with respect to 100 parts by mass of the binder resin.

The insulating binder resin in the conductive adhesive is not particularly limited, and examples thereof include a thermoplastic resin, a curable resin composition, and the like that are cured by heat or light. Examples of the thermoplastic resin include a styrene-butadiene block copolymer, an acrylic resin, and an ethylene-vinyl acetate resin. Examples of the curable resin composition include resin compositions containing epoxy monomers or oligomers having a glycidyl group and a curing agent such as isocyanate.

(conductive film (sheet))

As the conductive film, there is an anisotropic or isotropic conductive film formed into a film shape. The conductive film is produced by first preparing a resin composition in which silver-coated resin particles 10 are dispersed in an insulating binder resin, and then coating the resin composition on the surface of a support film such as PET (polyethylene terephthalate). The resin composition is prepared by uniformly mixing the silver-coated resin particles 10 and the insulating binder resin using a kneader such as a planetary mixer or a three-roll mill. In the conductive film, the silver-coated resin particles 10 are uniformly dispersed in the insulating binder resin on the support film. Examples of the insulating binder resin in the conductive film include the following resin compositions: it contains a resin such as an acrylic resin, a silicone resin, an epoxy resin, a phenoxy resin, or a mixture thereof as a main component. The content of the silver-coated resin particles 10 in the resin composition in the conductive film is not particularly limited and may be appropriately determined depending on the application, but is preferably in the range of 0.5 to 90 parts by mass with respect to 100 parts by mass of the binder resin.

(conductive rubber (elastomer))

As the conductive rubber, there is a conductive rubber formed in a sheet shape or a rectangular parallelepiped shape, and it can be used as a heat sink or a conductive connector. The conductive rubber is produced by the following method: the resin particles 10 are first coated with a binder rubber, a vulcanizing agent, and silver by kneading them using a twin roll or the like, and then vulcanized and molded by applying heat and pressure using a heated press or a dryer. Examples of the binder rubber in the conductive rubber include nitrile rubber, acrylic rubber, styrene butadiene rubber, silicone rubber, fluororubber, and the like. The content of the silver-coated resin particles 10 in the composition of the conductive rubber is not particularly limited and may be appropriately determined depending on the application, but is preferably in the range of 0.5 to 90 parts by mass with respect to 100 parts by mass of the binder rubber.

(conductive adhesive)

The conductive adhesive is formed in a sheet or rectangular parallelepiped shape or a conductive gel, and can be used as an electrical contact material, a heat sink, and an electrode. The conductive adhesive is produced by: first, an adhesive composition in which silver-coated resin particles 10 are dispersed in a binder serving as an insulating adhesive is prepared, and then the adhesive composition is applied to the surface of a support film such as PET. Examples of the binder in the conductive binder include acrylic binders, urethane binders, and silicone binders. The content of the silver-coated resin particles 10 in the composition in the conductive binder is not particularly limited and may be appropriately determined depending on the application, but is preferably in the range of 0.5 to 90 parts by mass with respect to 100 parts by mass of the binder.

(Heat-dissipating lubricating grease)

The heat-dissipating grease may be a mixture of a nonvolatile base oil and silver-coated resin particles 10, and may be used as a heat-dissipating material. The heat-dissipating grease is prepared by uniformly mixing the base oil and the silver-coated resin particles 10 using a mixer such as a planetary mixer or a three-roll mill. Examples of the base oil used for the heat-dissipating grease include silicone oil base oils, mineral oil base oils, synthetic hydrocarbon base oils, ester base oils, ether base oils, glycol base oils, and combinations thereof. The content of the silver-coated resin particles 10 in the composition of the heat-dissipating grease is not particularly limited, and may be suitably determined depending on the application, etc., but is preferably in the range of 0.5 to 90 parts by mass with respect to 100 parts by mass of the base oil.

(conductive spacer)

The conductive spacer is used in the liquid crystal display device in the following manner: the wiring portions of the upper and lower substrates sandwiching the liquid crystal material are electrically connected up and down, and the gap between the substrates is maintained at a predetermined size. The conductive spacer is produced by: first, the silver-coated resin particles 10 are added to an insulating binder resin such as a thermosetting resin or an ultraviolet-curable adhesive, and then the silver-coated resin particles 10 and the binder resin are uniformly mixed by a kneader such as a planetary mixer or a three-roll mill to prepare a resin composition. The content of the silver-coated resin particles 10 is not particularly limited and may be appropriately determined depending on the application, etc., but is preferably within a range of 2 to 10 parts by mass with respect to 100 parts by mass of the binder resin.

With regard to the TIM material or the conductive spacer containing the silver-coated resin particles 10 of the present embodiment, when a mixture of the silver-coated resin particles 10 and the insulating binder resin is kneaded, even if a large shearing force is applied, cracks or fractures are less likely to occur in the silver-coated layer 12 or the silver-coated layer 12 is less likely to peel off from the resin particles 11, and the conductivity is further improved. Thus, when the silver-coated resin particles 10 of the present embodiment are used, for example, in an anisotropic conductive adhesive, it is possible to avoid a short circuit in anisotropic conduction (lateral direction) and improve reliability.

According to the silver-coated resin particles 10 of the present embodiment configured as described above, the average value of the 10% compressive modulus of elasticity is in the range of 500MPa to 15000MPa, the coefficient of variation of the 10% compressive modulus of elasticity is as low as 30% or less, and the variation of the 10% compressive modulus of elasticity is small, so that the stress relaxation ability is high. Therefore, the conductive material such as the TIM material and the conductive spacer containing the silver-coated resin particles 10 of the present embodiment has high stress resistance.

The embodiments of the present invention have been described above, but the present invention is not limited to these embodiments, and can be modified as appropriate within a range not departing from the technical spirit of the present invention.