Mold assembly and equipment for manufacturing foam plastic by adopting wireless radio frequency

文档序号:1319006 发布日期:2020-07-14 浏览:8次 中文

阅读说明:本技术 采用无线射频制作泡沫塑料的模具组件及设备 (Mold assembly and equipment for manufacturing foam plastic by adopting wireless radio frequency ) 是由 维克多罗曼诺夫 何国贤 于 2020-03-30 设计创作,主要内容包括:本发明涉及采用无线射频制作泡沫塑料的模具领域。本发明模具组件生产的泡沫产品可以是鱼箱、汽车零部件、头盔和包装结构等,模具组件包括第一电容板、第二电容板和由至少两个模块组成的模体,模体内具有模腔,模腔由各模块围成;第一电容板与第二电容板沿第一方向间隔分布,模体固定在第一电容板与第二电容板之间;模体的朝向第一电容板一侧的外表面上具有深度沿第一方向的凹槽;凹槽各处的壁厚尺寸正相关于在第一方向上正对的模腔区域的腔厚尺寸。有利于使各模腔区域中泡沫所吸收的热量该模腔区域中泡沫的热需求相匹配,有利于使各泡沫颗粒受热均匀,有利于使各泡沫颗粒膨胀均匀,有利于使泡沫部件各处的材料性能均匀。(The invention relates to the field of a mould for manufacturing foam plastic by adopting wireless radio frequency. The foam product produced by the die assembly can be a fish tank, an automobile part, a helmet, a packaging structure and the like, the die assembly comprises a first capacitor plate, a second capacitor plate and a die body consisting of at least two modules, a die cavity is arranged in the die body, and the die cavity is surrounded by the modules; the first capacitor plate and the second capacitor plate are distributed at intervals along a first direction, and the die body is fixed between the first capacitor plate and the second capacitor plate; the outer surface of one side, facing the first capacitor plate, of the die body is provided with a groove with the depth along a first direction; the wall thickness dimension throughout the recess is positively correlated to the cavity thickness dimension of the mold cavity region facing in the first direction. The foam heat demand in the die cavity area is matched with the heat absorbed by the foam in each die cavity area, the foam particles are heated uniformly, the foam particles expand uniformly, and the material performance of each foam part is uniform.)

1. The mold assembly for manufacturing the foamed plastic by adopting the wireless radio frequency comprises a first capacitor plate, a second capacitor plate and a mold body consisting of at least two modules, wherein a mold cavity is arranged in the mold body and is surrounded by the modules;

the first capacitor plate and the second capacitor plate are distributed at intervals along a first direction, and the die body is fixed between the first capacitor plate and the second capacitor plate;

the method is characterized in that:

the outer surface of one side, facing the first capacitor plate, of the die body is provided with a groove with the depth along the first direction, and/or the outer surface of one side, facing the second capacitor plate, of the die body is provided with a groove with the depth along the first direction;

the distance between the groove bottom of the groove and the inner wall of the die cavity in the first direction is a wall thickness dimension, the dimension of the die cavity in the first direction is a cavity thickness dimension, and the wall thickness dimension at each position of the groove is positively related to the cavity thickness dimension of a die cavity area opposite to the groove bottom in the first direction.

2. The mold assembly of claim 1, wherein:

the die body comprises a first die block and a second die block, the first die block and the second die block are distributed along the first direction, the first capacitor plate is fixed on the outer surface of one side of the first die block, which is back to the second die block, and the second capacitor plate is fixed on the outer surface of one side of the second die block, which is back to the first die block;

the groove is arranged on the outer surface of the first module, which faces away from the second module, and/or the groove is arranged on the outer surface of the second module, which faces away from the first module.

3. The mold assembly of claim 1, wherein:

the outer surface of the die body facing to the first capacitor plate is provided with a plurality of grooves, and/or the outer surface of the die body facing to the second capacitor plate is provided with a plurality of grooves;

the wall thickness dimension corresponding to each recess is positively correlated to the cavity thickness dimension of the cavity region where the recess faces in the first direction.

4. The mold assembly of any one of claims 1 to 3, wherein:

the first capacitor plate is a flat plate with a main surface normal direction along the first direction, and the second capacitor plate is a flat plate with a main surface normal direction along the first direction.

5. Adopt the equipment of wireless radio frequency preparation foamed plastic, including the RF radiation source, its characterized in that:

the mold assembly of any of claims 1-4 further comprising a RF powered foam mold assembly, wherein the first and second capacitive plates are each coupled to a source of RF radiation.

6. The apparatus of claim 5, wherein:

the die body is characterized by also comprising a material container and a pipeline, wherein the pipeline is connected with the material container and the die body.

Technical Field

The invention relates to the field of foaming and forming molds, in particular to a mold assembly and equipment for manufacturing foam plastic by adopting wireless radio frequency.

Background

Chinese patent application publication No. CN108472843A provides a method and apparatus for manufacturing a foam part in pellet form, in which capacitive plates are respectively disposed on opposite sides of a mold and electrically connected to the capacitive plates through an RF emission source, heat is supplied to the foam pellets in the mold cavity by electromagnetic RF radiation, and the foam can directly absorb the RF radiation for heating, thereby achieving welding between the foam pellets and forming a foam part having the same shape as the mold cavity.

However, due to the varying thickness of the mold cavity, RF electromagnetic heating may cause uneven heating of the foam particles throughout the mold cavity, resulting in uneven density throughout the produced foam part, affecting the performance of the foam part.

Disclosure of Invention

One of the objectives of the present invention is to provide a mold assembly for manufacturing foam plastic by using radio frequency, which is beneficial to uniform heating of foam.

In order to achieve the above object, the present invention provides a mold assembly including a first capacitor plate, a second capacitor plate, and a mold body formed by at least two mold blocks, wherein the mold body has a mold cavity therein, and the mold cavity is defined by the mold blocks; the first capacitor plate and the second capacitor plate are distributed at intervals along a first direction, and the die body is fixed between the first capacitor plate and the second capacitor plate; the outer surface of one side, facing the first capacitor plate, of the die body is provided with a groove with the depth along the first direction, and/or the outer surface of one side, facing the second capacitor plate, of the die body is provided with a groove with the depth along the first direction; the distance between the groove bottom of the groove and the inner wall of the mold cavity in the first direction is a wall thickness dimension, the dimension of the mold cavity in the first direction is a cavity thickness dimension, and the wall thickness dimension of each part of the groove is positively related to the cavity thickness dimension of the mold cavity area which is just opposite to the first direction.

Therefore, through the structural design of the die assembly, when the die assembly is used for producing plastic products, electromagnetic waves are formed between the first capacitor plate and the second capacitor plate, and the die body and the foam particles absorb the electromagnetic waves to generate heat; similarly, for a mold cavity region with a smaller dimension in the first direction, the thickness of the mold block wall corresponding to the first direction is relatively thinner, so that the dielectric constant is lower and heat generation to the mold body corresponding to the mold cavity region is less; therefore, as the heat generated by the die body is transferred to the foam particles in the die cavity, more heat is obtained in the die cavity area with larger size in the first direction, and less heat is obtained in the die cavity area with smaller size in the first direction, so that the heat requirements of the foam particles in the die cavity area for the heat absorbed by the foam particles in each die cavity area are matched, the foam particles are uniformly heated, the foam particles are uniformly expanded, the density of the produced foam part is uniform, and the material performance of the foam part is uniform; in addition, the wall thickness of the die body is changed by arranging the groove on the die body, so that the fluctuation of the groove bottom of the groove in the first direction cannot influence the arrangement of the first capacitor plate and the second capacitor plate, and the first capacitor plate and the second capacitor plate can adopt common flat capacitor plates, thereby being beneficial to the conciseness of the structure of the die assembly and being beneficial to the improvement of the economy of the die assembly.

In a preferred embodiment, the die body includes a first die block and a second die block, the first die block and the second die block are distributed along a first direction, the first capacitor plate is fixed on an outer surface of the first die block on a side facing away from the second die block, and the second capacitor plate is fixed on an outer surface of the second die block on a side facing away from the first die block; the outer surface of the first module, which faces away from the second module, is provided with a groove, and/or the outer surface of the second module, which faces away from the first module, is provided with a groove.

In another preferred embodiment, the die body has a plurality of grooves on an outer surface of a side facing the first capacitor plate, and/or the die body has a plurality of grooves on an outer surface of a side facing the second capacitor plate; the wall thickness dimension corresponding to each groove is positively correlated to the cavity thickness dimension of the cavity region where the groove faces in the first direction.

In a further preferred embodiment, the first capacitor plate is a plate having a main surface normal to the first direction, and the second capacitor plate is a plate having a main surface normal to the first direction.

The invention also aims to provide equipment for manufacturing the foam plastic by adopting the radio frequency, which is beneficial to uniformly heating the foam.

In order to achieve the above object, the present invention provides an apparatus for manufacturing a foam using radio frequency, comprising an RF radiation source and the mold assembly, wherein the first capacitor plate and the second capacitor plate are both connected to the RF radiation source.

Therefore, the mold assembly is beneficial to matching heat absorbed by foam in each mold cavity area with the heat demand of the foam in the mold cavity area, is beneficial to enabling each foam particle to be heated uniformly, is beneficial to enabling each foam particle to expand uniformly, is beneficial to enabling the density of each part of a produced foam part to be uniform, and is beneficial to enabling the material performance of each part of the foam part to be uniform.

The mould also comprises a material container and a pipeline, wherein the pipeline is connected with the material container and the mould body.

Drawings

FIG. 1 is a schematic structural diagram of a first embodiment of an apparatus for manufacturing foamed plastic by using radio frequency according to the present invention;

FIG. 2 is a schematic cross-sectional view of a first embodiment of a mold assembly for producing foam using RF in accordance with the present invention;

FIG. 3 is a perspective view of a first mold block of a first embodiment of a mold assembly for making foam using radio frequency in accordance with the present invention;

FIG. 4 is a schematic cross-sectional view of a second embodiment of the mold assembly for manufacturing foam using RF in accordance with the present invention.

Detailed Description

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