阅读说明：本技术 一种自动光刻机 (Automatic photoetching machine ) 是由 张圆圆 周超 于 2020-04-24 设计创作，主要内容包括：本发明涉及光刻领域,具体涉及一种自动光刻机,包括台架、支架、显微放大镜、曝光机、转盘、电机、真空发生装置和工装台；所述支架位于台架的上方,所述台架上方设有滑杆,所述滑杆的上端滑动连接着支架；所述支架的另一端设置有曝光机；所述曝光机两侧对称设有显微放大镜；所述曝光机和显微放大镜的正下方设有工装台；所述工装台包括大O型圈、小O型圈、基座、弹力绳和橡胶球；本发明通过工装台连接在四周的橡胶球与凸台内部的锥形孔和真空发生装置相配合来固定工装台,使得工作人员可以快速进行工装台拆取,并且可以适应不同工装台的大小,从而可以放置不同大小的硅片,进而提高了工作效率。(The invention relates to the field of photoetching, in particular to an automatic photoetching machine, which comprises a rack, a bracket, a micro magnifier, an exposure machine, a turntable, a motor, a vacuum generating device and a tooling table, wherein the rack is provided with a support; the support is positioned above the rack, a sliding rod is arranged above the rack, and the upper end of the sliding rod is connected with the support in a sliding manner; the other end of the bracket is provided with an exposure machine; microscopic magnifiers are symmetrically arranged on two sides of the exposure machine; a tooling table is arranged right below the exposure machine and the microscope magnifier; the tooling table comprises a large O-shaped ring, a small O-shaped ring, a base, an elastic rope and a rubber ball; according to the invention, the rubber balls connected to the periphery of the tool table are matched with the tapered holes in the bosses and the vacuum generating devices to fix the tool table, so that a worker can quickly detach the tool table and adapt to the sizes of different tool tables, thereby placing silicon wafers of different sizes and further improving the working efficiency.)

1. An automatic photoetching machine comprises a rack (1), and is characterized by further comprising a support (2), a micro magnifier (3), an exposure machine (4), a turntable (5), a motor (6), a vacuum generating device (7) and a tooling table (8), wherein a slide rod (11) is arranged above the rack (1), the upper end of the slide rod (11) is connected with the support (2) in a sliding manner, the other end of the support is provided with the exposure machine (4), the micro magnifier (3) is symmetrically arranged on two sides of the exposure machine (4), the tooling table (8) is arranged under the exposure machine (4) and the micro magnifier (3), the tooling table (8) comprises a large O-shaped ring (81), a small O-shaped ring (82), a base (83), an elastic rope (84) and a rubber ball (85), the upper end of the base (83) is a concave pit (831), the side edge of the concave pit (831) is provided with a step, the step is arranged on the step, the step is provided with the small O-shaped ring (82), the bottom surface of the concave pit (831) is provided with a flange (83), the bottom of the concave pit (511) is provided with a convex flange (511), the concave lug boss (511) which is arranged on the bottom of the concave lug boss (51), the concave lug boss (85) is arranged on the bottom of the concave lug boss (511) and the concave lug boss (85), the concave lug boss (51), the concave lug boss (85) is arranged on the bottom of the concave lug boss (511) and the concave lug boss (51), the concave lug boss (85), the concave lug boss (5), the concave lug boss (85), the concave lug boss (511) is arranged on the concave lug boss (511) and the convex boss (85), the concave lug boss (85), the convex boss (511) and the concave lug boss (85), the concave lug boss (5), the concave lug boss (511) is arranged on the concave lug boss (85), the concave lug boss (5), the bottom of the concave lug boss (511) on the bottom of the concave lug boss (511) and the concave lug boss (5), the concave lug boss (85), the concave lug boss (511) and the concave lug boss (85), the concave lug boss (511) are uniformly arranged on the concave lug boss (.

2. The automatic lithography machine according to claim 1, wherein the L-shaped hole (511) is provided with a groove (514) at the upper end and the lower end at the inlet, a spring (5141) and a steel ball (5142) are respectively arranged in the groove (514), the steel ball (5142) is positioned inside the notch of the groove (514), the spring (5141) is positioned inside the groove (514), and the spring (5141) pushes a part of the steel ball (5142) at the inlet of the L-shaped hole (511).

3. The automatic photoetching machine according to claim 2, wherein a locking plate (9) is arranged below the steel ball (5142) at the lower end, one end of the locking plate (9) is positioned at the corner of the L-shaped hole (511), a positioning pin is arranged at the center of the locking plate (9), a torsion spring (12) is sleeved on the positioning pin, the locking plate (9) is in a stressed state under the action of the torsion spring (12), and the other end of the locking plate (9) is positioned below the steel ball (5142).

4. An automatic lithography machine according to claim 3, characterized in that: the swing angle of lock plate (9) is 15 degrees, be equipped with flat bearing (13) between rack (1) and carousel (5).

5. An automatic lithography machine according to claim 1, characterized in that: be equipped with two trachea heads (14) on exposure machine (4), the center of frock platform (8) is aimed at to the gas outlet of trachea head (14), two the afterbody of trachea head (14) all links breather pipe (15), two breather pipe (15) link to have an air compressor machine altogether.

6. An automatic lithography machine according to claim 5, characterized in that: the two air pipes (15) are wound on the side surface of the exposure machine (4) in a spiral shape, and the air pipes (15) are made of copper alloy.

Technical Field

The invention relates to the field of photoetching, in particular to an automatic photoetching machine.

Background

In the production of integrated circuit chips, the exposure transfer printing (photolithography) of the design pattern of the chip on the photoresist on the surface of a silicon wafer is one of the most important processes, and the equipment used in the process is called a photoetching machine, and the photoetching machine is the most critical equipment in the integrated circuit processing process.

At present, in the photoetching process, a silicon wafer is manually fixed on a tool, then the tool and the silicon wafer are placed in a photoetching machine for exposure, along with the step-by-step improvement, an automatic conveying device is formed at present, a worker only needs to place the silicon wafer on the tool or disassemble and assemble the silicon wafer from the tool, however, in the actual production process of the device, the waiting exposure and tool transferring process wastes time, and approximately occupies half of the time of the whole production takt; therefore, a photoetching device which is simple in equipment composition, automatic, free of waiting of workers and capable of effectively improving production efficiency is lacking at present.

Disclosure of Invention

In order to make up for the defects of the prior art, the automatic photoetching machine provided by the invention fixes the tool table through the matching of the rubber balls connected to the periphery of the tool table, the tapered holes in the bosses and the vacuum generating devices, so that a worker can quickly detach the tool table and adapt to the sizes of different tool tables, and therefore silicon wafers with different sizes can be placed, and the working efficiency is further improved.

The automatic photoetching machine comprises a rack, a support, a micro-magnifier, an exposure machine, a rotary table, a motor, a vacuum generating device and a tool table, wherein a slide rod is arranged above the rack, the upper end of the slide rod is connected with the support in a sliding manner and can be used for adjusting the distance from the support to the rack, the exposure machine is arranged at the other end of the support, the micro-magnifiers are symmetrically arranged at two sides of the exposure machine and are convenient to observe during exposure through the micro-magnifier, the tool table is arranged right below the exposure machine and the micro-magnifier, the tool table comprises a large O-shaped ring, a small O-shaped ring, a base, an elastic rope and a rubber ball, the upper end of the base is provided with a pit, the side edge of the pit is provided with a small O-shaped ring, the silicon wafer is not in direct contact with the base when the silicon wafer is arranged on the step, so that the silicon wafer is in soft connection with the rubber through the small O-shaped ring, the small O-shaped ring can be sealed with the bottom surface of the pit, the pit is arranged on the bottom of the pit, the silicon wafer, the bottom surface of the silicon wafer is tightly sealed with the bottom surface of the base, the concave ring is arranged on the concave ring, the concave ring is arranged on the concave ring, the convex ring is arranged on the convex ring, the convex ring is arranged on the convex ring, the convex ring is arranged on the convex ring, the convex ring is arranged on the convex ring, the convex.

Preferably, the upper end and the lower end of an inlet of the L-shaped hole are respectively provided with a groove, a spring and a steel ball are mounted in each groove, the steel balls are located inside notches of the grooves, the springs are located inside the grooves, and the springs push a part of the steel balls to the inlet of the L-shaped hole, when the vacuum photoetching machine works, when gas in a pipeline of the vacuum generating device leaks, the rubber balls are not affected by adsorption force, the rubber balls are directly pulled out of the L-shaped hole under the influence of elastic ropes, the tool table shakes at the moment, the tool table shakes to drive a silicon wafer to deflect to cause exposure deflection and further scrap the silicon wafer, therefore, a worker puts four rubber balls on the tool table into corresponding L-shaped holes respectively, the rubber balls extrude the steel balls through the rubber balls to open the inlets of the L-shaped holes, the steel balls are reset to block the inlet under the influence of the elastic force of the springs at the moment, the vacuum generating device is started, the rubber balls are affected by the air pressure to be brought to the conical holes to be tightly attached to the inner walls of the conical holes, the silicon wafers are clamped on the inner walls of the conical holes, the silicon wafer under the influence of the adsorption force of the air pressure, the air is fixed on the upper end of the inlet of the tool table, the air inlet of the rubber ball, the rubber ball is locked, the rubber ball inlet of the rubber ball is not affected by the air pressure, the rubber ball, the air pressure of the air inlet of the rubber ball.

Preferably, a locking plate is arranged below the steel ball at the lower end, one end of the locking plate is arranged at the corner of the L-shaped hole, a positioning pin is arranged at the center of the locking plate, a torsion spring is sleeved on the positioning pin, the locking plate is in a stressed state under the action of the torsion spring, the other end of the locking plate is arranged at the lower end of the steel ball, when the vacuum generating device fails, the spring is sunk in the groove, the L0-shaped inlet cannot be sealed in time, when the vacuum generating device fails, the rubber ball is directly pulled out of the L-shaped hole under the influence of the elastic rope, the stability of the tool table is influenced, the silicon wafer shakes and scraps the silicon wafer, therefore, a worker puts four rubber balls on the tool table into corresponding L-shaped holes respectively, the inlet of the L-shaped hole is opened under the extrusion of the rubber ball, the locking plate is influenced by the torsion force of the torsion spring to push the steel ball, the steel ball is blocked at the inlet under the influence of the thrust of the locking plate and the spring, the locking plate is pressed, the locking plate is further, the locking plate is pressed to be clamped at the position of the groove inlet of the conical rubber ball, the conical rubber belt, the conical groove inlet of the steel ball, the locking plate, the conical groove inlet of the conical rubber belt, the conical groove inlet of the positioning pin is pressed, the conical rubber belt, the conical groove inlet of the positioning ball is pressed, the positioning pin, the conical groove inlet of the conical groove, the conical groove inlet of the conical rubber ball is tightly-shaped hole, the conical groove inlet of the conical groove is tightly-shaped groove, the conical groove inlet of the conical groove, the conical rubber ball is tightly-shaped groove, the conical spring is tightly.

When the photoetching machine works, a worker puts four rubber balls on a tool table into corresponding L-shaped holes respectively, the rubber balls extrude the locking plate below the steel balls through the rubber balls, so that the locking plate rotates through the positioning pins, the positioning pins are clamped at the inlet of a L-shaped hole, the rubber balls cannot enter L-shaped holes, and the tool table cannot be fixed, therefore, the worker puts the four rubber balls on the tool table into corresponding L-shaped holes respectively, the locking plate below the steel balls is extruded through the rubber balls, the locking plate rotates through the positioning pins, the rubber balls can pass through the locking plate smoothly because the swinging angle of the locking plate is 15 degrees, the locking plate generates thrust to prop against the steel balls under the influence of torsion of a torsion spring, the steel balls are reset to block the inlet under the influence of the thrust of the locking plate and the elasticity of the spring, the locking plate returns to the initial state, a vacuum generating device is started, the rubber balls are brought to the conical holes under the influence of the tension of the torsion spring, the tool table is controlled by the tension of the locking plate, and the swinging angle of the locking plate is controlled to be matched with the torsion spring, so that the tool table is fixed, and the normal operation of the photoetching machine is ensured, and the working table is L;

a plane bearing is arranged between the rack and the turntable; when the electric power tool works, the motor drives the rotary table to rotate, the rotary table is in contact with the rack to form friction force, and the rotary table is influenced by the friction force, so that the load of the motor is increased, and the power loss is increased; therefore, when the motor drives the turntable to rotate, the planar bearing between the turntable and the rack is driven to rotate; according to the invention, through the matching of the motor and the plane bearing, the sliding friction between the turntable and the rack is changed into rolling friction, the load of the motor is reduced, the loss of electric energy is further reduced, and the sustainability of the automatic photoetching machine is realized.

Preferably, two air pipes are arranged on the exposure machine, air outlets of the air pipes are aligned to the center of the tooling table, the tails of the two air pipes are both connected with an air pipe, and the two air pipes are both connected with an air compressor; when the silicon wafer exposure device works, when the photoetching machine carries out exposure, if dust exists on the silicon wafer, the accuracy of the exposure can be influenced, so that the quality of the silicon wafer is influenced; therefore, when the photoetching machine works, the motor can drive the plane bearing to enable the turntable to rotate, when the center of the boss rotates to a position right below the exposure machine, the microscope magnifier observes the boss, at the moment, the air compressor works to enable the air pipe head to give out air to clean the silicon wafer of the tool table on the boss, so that dust on the silicon wafer leaves the surface of the silicon wafer under the action of impact force, and the microscope magnifier is used for confirming that the silicon wafer is blown clean, and then the exposure machine is used for exposing the silicon wafer; the invention effectively cleans the silicon wafer before exposure by the cooperation of the impact force generated by blowing of the air pipe head and the microscope magnifier, thereby improving the quality of the silicon wafer.

Preferably, the two vent pipes are spirally wound on the side surface of the exposure machine, the contact between the vent pipes and the exposure machine is larger due to the spiral winding, the vent pipes are made of copper alloy, the copper alloy has the advantages of good heat conductivity, good chemical resistance and the like, the performance of the copper alloy meets the requirements of the vent pipes on the performance of the invention, and the copper alloy can ensure the long-term use of the invention; when the exposure machine works, a large amount of heat is generated when the exposure machine performs exposure work, so that the service life of the exposure machine is shortened; therefore, when the exposure machine is used for exposure, the vent pipe made of copper alloy material is wound on the side surface of the exposure machine in a spiral shape, so that the contact area is increased, and when the air pipe head discharges air and the surface of a silicon wafer is cleaned, the air flow of the vent pipe flows to take away heat, so that the heat of the exposure machine is absorbed by the vent pipe, and the heat generated by the exposure machine during exposure can be effectively dissipated; according to the invention, the exposure machine can effectively dissipate heat through the gas flow of the vent pipe, so that the service life of the exposure machine is prolonged, and the use cost of the photoetching machine is reduced.

The invention has the following beneficial effects:

1. according to the invention, the rubber balls connected to the periphery of the tool table are matched with the tapered holes in the bosses and the vacuum generating devices to fix the tool table, so that a worker can quickly detach the tool table and adapt to the sizes of different tool tables, thereby placing silicon wafers of different sizes and further improving the working efficiency.

2. According to the invention, the rubber ball is locked by arranging the pair of steel balls at the inlet of the L-shaped hole, and under the action of torsion force applied to the locking plate and the tension force of the elastic rope, part of the steel ball of the groove at the lower end is propped against the inlet of the L-shaped hole, so that the inlet of the L-shaped hole is sealed, an interlocking structure is further realized, the tool table is not influenced by gas leakage, the stability of the tool table is ensured, the reject ratio is reduced, and the photoetching machine can work safely.

3. The automatic photoetching machine has the advantages that the swinging angle of the locking plate is controlled to be matched with the torsion spring, so that the rubber ball smoothly passes through the L-shaped hole, the tool table is fixed, the normal operation of the automatic photoetching machine is further ensured, the sliding friction between the turntable and the rack is changed into the rolling friction through the matching of the motor and the plane bearing, the load of the motor is reduced, the loss of electric energy is further reduced, and the sustainability of the automatic photoetching machine is realized.

Drawings

The invention will be further explained with reference to the drawings.

FIG. 1 is an elevational, three-axis view of the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is a cross-sectional view A-A of FIG. 2;

FIG. 4 is an enlarged view at B in FIG. 3;

FIG. 5 is a structural cross-sectional view of a tooling table of the present invention;

in the figure, a rack 1, a sliding rod 11, a bracket 2, a microscope magnifier 3, an exposure machine 4, a turntable 5, a boss 51, an L-shaped hole 511, a taper hole 512, a concave edge 513, a groove 514, a spring 5141, a steel ball 5142, a motor 6, a vacuum generating device 7, a tooling table 8, a large O-shaped ring 81, a small O-shaped ring 82, a base 83, a pit 831, a flange 832, an elastic rope 84, a rubber ball 85, a locking plate 9, a torsion spring 12, a plane bearing 13, an air pipe head 14 and an air pipe 15.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

When the silicon wafer exposing device is used for carrying out a step of the step of carrying out a step of carrying out on the step of carrying out a step of the step of carrying out on the step of carrying out the step of carrying out the step of carrying out the step of the silicon wafer by the step of carrying out the step of the silicon wafer by the step of carrying out the step of carrying out the step of carrying out the step of carrying out the step of carrying out the step of carrying out the step of.

As an embodiment of the invention, the upper end and the lower end of the inlet of the L-shaped hole 511 are respectively provided with a groove 514, a spring 5141 and a steel ball 5142 are respectively arranged in the grooves 514, the steel ball 5142 is positioned in the notch of the groove 514, the spring 5141 is positioned in the groove 514, the spring 5141 pushes a part of the steel ball 5142 to the inlet of the L-shaped hole 511, when the vacuum generator 7 works, when gas in a pipeline leaks, the rubber ball 85 is not influenced by adsorption force, the rubber ball 85 is influenced by the elastic rope 84 and can be directly pulled out of the L-shaped hole 511, the tool table 8 shakes to drive the silicon wafer to deflect, exposure deflection is caused, and the silicon wafer is scrapped, therefore, the working personnel respectively place four rubber balls 85 on the tool table 8 into corresponding L-shaped holes 511, the steel ball 5142 is extruded by the rubber balls 5142 to open the inlet of the L-shaped hole 511, the steel ball 42 is clamped at the position influenced by the elastic force of the spring 5141, the air pressure of the air ball 517 starts, the air ball 5185, the air pressure of the air pressure regulator is enabled, the air pressure regulator is enabled to ensure that the air pressure of the air ball 5185 is not to be tightly pressed on the conical air inlet of the tool table 512, the conical rubber ball 5185, the conical rubber ball 518, the conical rubber ball 5185, the conical rubber table 512, the conical rubber ball 5185 is enabled to enable the air pressure of the conical rubber ball 5185 to be tightly pressed, the conical rubber table to be tightly pressed, the conical rubber ball 518, the conical rubber ball 5185 to enable the conical rubber table to be tightly pressed, the conical rubber ball 518 to be tightly pressed, the conical rubber ball 51.

According to an embodiment of the invention, a locking plate 9 is arranged below a steel ball 5142 at the lower end, one end of the locking plate 9 is positioned at a corner of a L-shaped hole 511, a positioning pin is arranged at the center of the locking plate 9, a torsion spring 12 is sleeved on the positioning pin, the locking plate 9 is in a stressed state under the action of the torsion spring 12, the other end of the locking plate 9 is positioned at the lower end of the steel ball 5142, when the vacuum generator 7 fails, the spring 5141 is sunk in the groove 514 due to the failure of the spring 5141 below the steel ball 5142 at the lower end of the inlet of the L-shaped hole 511, the inlet of a L-shaped ball cannot be sealed in time, when the vacuum generator 7 fails, the rubber ball 85 is directly pulled out of the L-shaped hole 511 due to the influence of the elastic rope 84, the stability of the fixture table 8 is influenced, the silicon wafer is shaken to cause the scrap, because the four rubber balls 85 on the fixture table 8 are respectively placed into the corresponding L-shaped holes 511, the steel ball 42 is extruded by the rubber ball 85 to open the inlet of the L-shaped hole, the locking plate is pressed by the elastic rope, the elastic rope of the locking plate 5142, the elastic rope, the locking plate is pressed by the groove 5142, the groove 512, the groove 21, the groove 21, the groove 21, the groove, the.

When the photoetching machine works, a worker puts four rubber balls 85 on a tooling platform 8 into corresponding L-shaped holes 511 respectively, the rubber balls 85 extrude a locking plate 9 below a steel ball 5142 through the rubber balls 85, so that the locking plate 9 rotates through a positioning pin, the positioning pin is clamped at an inlet of the L-shaped holes 511, the rubber balls 85 cannot enter L-shaped holes 511, and the tooling platform 8 cannot be fixed, therefore, the worker puts the four rubber balls 85 on the tooling platform 8 into corresponding L-shaped holes 511 respectively, the rubber balls 85 extrude the locking plate 9 below the steel ball 5142 through the rubber balls 85, so that the locking plate 9 rotates through the positioning pin, the rubber balls 85 can pass through the locking plate 9 smoothly because the swinging angle of the locking plate 9 is 15 degrees, the rubber balls 9 can generate thrust to prop against the steel ball 5142 when being influenced by torsion force of a torsion spring 12, the steel ball 5142 is reset to a blocking position under the influence of the thrust of the locking plate 9 and the elasticity of a spring 41, the locking plate 9 returns to an initial locking state, and the swinging angle of the tapered rubber ball 5185 is controlled to be matched with a photoetching machine, so that the tapered rubber ball inlet of the tooling platform is controlled by a tensile force of a photoetching machine 512, so that the tapered roller 512, the tapered roller 511 is controlled by a tensile force of a fixing rope, and a vacuum, and a pneumatic fixing rope, so that the tapered rubber;

a plane bearing 13 is arranged between the rack 1 and the rotary table 5; when the electric power tool works, the motor 6 drives the rotary table 5 to rotate, the rotary table 5 is in contact with the rack 1 to form friction force, and the rotary table 5 is influenced by the friction force, so that the load of the motor 6 is increased, and the power loss is increased; therefore, when the motor 6 of the invention drives the rotary table 5 to rotate, the plane bearing 13 between the rotary table 5 and the rack 1 is driven to rotate; according to the invention, through the matching of the motor 6 and the plane bearing 13, the sliding friction between the turntable 5 and the rack 1 is changed into rolling friction, the load of the motor 6 is reduced, the loss of electric energy is further reduced, and the sustainability of the automatic photoetching machine is realized.

As an embodiment of the present invention, two air pipes 14 are arranged on the exposure machine 4, an air outlet of the air pipe 14 is aligned with the center of the tooling table 8, air pipes 15 are connected to the tails of the two air pipes 14, and an air compressor is connected to both the two air pipes 15; when the silicon wafer exposure device works, when the photoetching machine carries out exposure, if dust exists on the silicon wafer, the accuracy of the exposure can be influenced, so that the quality of the silicon wafer is influenced; therefore, when the photoetching machine works, the motor 6 can drive the plane bearing 13 to enable the rotary table 5 to rotate, when the center of the boss 51 rotates to be under the exposure machine 4, the microscopic magnifier 3 is used for observing the boss, at the moment, the air compressor works, the air pipe head 14 discharges air to clean the silicon wafer of the tool table 8 on the boss 51, so that dust on the silicon wafer leaves the surface of the silicon wafer under the action of impact force, and after the microscopic magnifier 3 is used for confirming the blowing-off, the exposure machine 4 is used for exposing the silicon wafer; according to the invention, under the matching of the impact force generated by blowing of the air pipe head 14 and the microscope magnifier 3, the silicon wafer before exposure is effectively cleaned, so that the quality of the silicon wafer is improved.

As an embodiment of the present invention, two of the vent pipes 15 are spirally wound on the side surface of the exposure machine 4, the spiral winding makes the contact between the vent pipe 15 and the exposure machine 4 larger, the material of the vent pipe 15 is copper alloy, which has the advantages of good thermal conductivity, good chemical resistance, etc., the performance of the copper alloy meets the requirements of the vent pipe 15 in the performance of the present invention, and the material can ensure the long-term use of the present invention; when the exposure machine 4 works, a large amount of heat is generated when the exposure machine 4 performs exposure work, and the service life of the exposure machine 4 is shortened; therefore, when the exposure machine 4 is exposed, the air pipe 15 made of copper alloy material is wound on the side surface of the exposure machine 4 in a spiral shape, so that the contact area is increased, and when the air pipe head 14 discharges air and the surface of a silicon wafer is cleaned, the air flow of the air pipe 15 flows to take away heat, so that the heat of the exposure machine 4 is absorbed by the air pipe 15, and the heat generated when the exposure machine 4 is exposed can be effectively dissipated; according to the invention, the exposure machine 4 can effectively dissipate heat through the gas flow of the vent pipe 15, so that the service life of the exposure machine 4 is prolonged, and the use cost of the photoetching machine is reduced.

When the silicon wafer exposure device works, a worker places a silicon wafer in a pit 831 of a base 83, a small O-ring 82 on a step in the pit 831 seals the bottom end of the silicon wafer and realizes soft connection, the base 83 is placed above a boss 51, a flange 832 is positioned in a concave edge 513, the lower end face of the flange 832 and the upper end face of the concave edge 513 can be sealed through a large O-ring 81, the worker quickly places four rubber balls 85 on a tool table 8 into corresponding L type holes 511, the rubber balls 5142 are extruded through the rubber balls 85 to open inlets of L type holes 511, the locking plate 9 is pushed by torsion of a torsion spring 12 to prop against the steel ball 5142, the steel ball 5142 is reset to the inlet of a spring 5141 under the influence of the locking plate 9, the vacuum generating device 7 is started, the rubber balls 85 are influenced by air pressure and are positioned in a conical hole 512, the air outlet 85 is tightly attached to the inner wall of the conical hole 512, the elastic rope 84 is in a tensioned state, the locking plate 9 is blocked, the locking plate 9 is influenced by the tension of the elastic rope 84, the locking plate 84, the air pressure is influenced by the air pressure, the air pressure is influenced by the conical hole 512, the air pressure of the air compressor, the air compressor is driven by the air compressor to be driven by the conical hole 512, the air compressor to be driven by the air compressor to carry out of the air compressor to carry out a conical hole 511, the air compressor to carry out a rotary air compressor, the air inlet of the air compressor, the air compressor impeller 7, the air compressor impeller 7, the air impeller 7, the impeller 7.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.