Digital infrasound sensor with environment perception function

文档序号:132423 发布日期:2021-10-22 浏览:33次 中文

阅读说明:本技术 一种具备环境感知的数字式次声传感器 (Digital infrasound sensor with environment perception function ) 是由 滕鹏晓 吕君 姬培锋 杨军 于 2020-04-17 设计创作,主要内容包括:本发明公开了一种具备环境感知的数字式次声传感器,包括北斗/GPS天线、卫星导航授时模块、大气压检测模块、电容传感器、次声信号转电压C/V模块、模拟信号调理采集模块、温度检测模块和信号处理模块;卫星导航授时模块用于通过北斗/GPS天线获取时间信息;所述大气压检测模块用于检测周围环境的气压;电容传感器,用于采集次声信号,发送至次声信号转电压C/V模块;次声信号转电压C/V模块,用于将所测量的电容传感器的电容转换成线性的电压,输出至模拟信号采集模块;模拟信号调理采集模块,用于接收模拟电压信号并转化为数字电压信号,输出至信号处理模块;温度检测模块,用于检测周围环境的温度;信号处理模块,用于对接收的各类数据进行处理和存储。(The invention discloses a digital infrasound sensor with environment perception, which comprises a Beidou/GPS antenna, a satellite navigation time service module, an atmospheric pressure detection module, a capacitance sensor, an infrasound signal-to-voltage C/V module, an analog signal conditioning and collecting module, a temperature detection module and a signal processing module; the satellite navigation time service module is used for acquiring time information through a Beidou/GPS antenna; the atmospheric pressure detection module is used for detecting the atmospheric pressure of the surrounding environment; the capacitive sensor is used for acquiring infrasound signals and sending the infrasound signals to the infrasound signal voltage conversion C/V module; the infrasound signal-to-voltage C/V module is used for converting the measured capacitance of the capacitance sensor into linear voltage and outputting the linear voltage to the analog signal acquisition module; the analog signal conditioning and collecting module is used for receiving an analog voltage signal, converting the analog voltage signal into a digital voltage signal and outputting the digital voltage signal to the signal processing module; the temperature detection module is used for detecting the temperature of the surrounding environment; and the signal processing module is used for processing and storing various received data.)

1. A digital infrasound sensor with environment perception is characterized by comprising a Beidou/GPS antenna, a satellite navigation time service module, an atmospheric pressure detection module, a capacitance sensor, an infrasound signal conversion voltage C/V module, an analog signal conditioning and acquisition module, a temperature detection module and a signal processing module;

the satellite navigation time service module is used for acquiring time information through a Beidou/GPS antenna and sending the time information to the signal processing module;

the atmospheric pressure detection module is used for detecting the atmospheric pressure of the surrounding environment and sending the atmospheric pressure to the signal processing module;

the capacitive sensor is used for acquiring infrasound signals and sending the infrasound signals to the infrasound signal voltage conversion C/V module;

the infrasound signal-to-voltage C/V module is used for converting the measured capacitance of the capacitance sensor into linear voltage and outputting the linear voltage to the analog signal acquisition module;

the analog signal conditioning and collecting module is used for receiving an analog voltage signal, converting the analog voltage signal into a digital voltage signal and outputting the digital voltage signal to the signal processing module;

the temperature detection module is used for detecting the temperature of the surrounding environment and sending the temperature to the signal processing module;

and the signal processing module is used for processing and storing various received data.

2. The digital infrasound sensor with environmental awareness of claim 1, further comprising a power supply for powering the entire infrasound sensor.

3. The multifunctional infrasound sensor of claim 2, wherein the digital infrasound sensor further comprises: and a serial port communication module adopting an RS232/422 serial port.

4. The digital infrasound sensor with environmental awareness of claim 3, further comprising a communication antenna and a TCP/IP network communication module for connecting the multifunctional infrasound sensor to an Ethernet; the TCP/IP network communication module comprises a 10M/100M Ethernet interface and can simultaneously transmit TCP/UDP packets to a plurality of data receiving devices.

5. The digital infrasound sensor with environmental awareness of claim 1, wherein the satellite navigation time service module employs a navigation positioning time service receiver, and the receiver has functions of position measurement and single satellite time service.

6. The digital infrasound sensor with environmental perception according to claim 1, wherein the infrasound signal to voltage C/V module is a chip; a plurality of resistors externally connected with the chip can adjust the zero point and the amplification coefficient of the output voltage; the output voltage of the chip to the ground is as follows:

Vout=GN*V2.25*(T2-T1)/Cf+Vref

wherein: vout is the output voltage; GN is the gain factor; is 2 or 4V/V; v2.25 is a reference voltage and is 2.25 VDC; t2 ═ CS2IN + CS2, T1 ═ CS1IN + CS 1; CS1IN and CS2IN are external input capacitors, and CS1 and CS2 are programmable balance capacitors built in a chip; cf is the integrating capacitance of the charge integrating circuit; vref is set to 0.5VDC or 2.25VDC, 0.5VDC in single variable inputs and 2.25VDC in differential variable inputs.

7. The digital infrasound sensor with environmental awareness of claim 1, wherein the temperature detection module comprises 32 digital temperature sensors connected in a daisy chain manner, each sensor having a unique 5-bit address, stored in an electrically erasable programmable read-only memory, capable of reading temperature with a resolution of 0.02 ℃.

8. The digital infrasound sensor with environmental perception of claim 7, wherein the digital temperature sensor has a rated operating temperature range of-55 ℃ to +125 ℃.

9. The digital infrasound sensor with environmental perception of claim 4, wherein the signal processing module includes a main control chip, a DSP + FPGA processor and a DDR; the power end of the main control chip is connected with a power supply; the input end of the main control chip is respectively connected with a satellite navigation time service module, a temperature detection module, an atmospheric pressure detection module and an analog signal conditioning and collecting module;

the main control chip is used for acquiring time service information, infrasound digital signals, atmospheric pressure data and temperature data and sending the data to the DSP + FPGA processor;

the DSP + FPGA processor is used for processing the received data;

and the DDR is used for storing the data processed by the DSP + FPGA processor.

10. The digital infrasound sensor with environmental awareness of claim 9, wherein the output end of the main control chip is connected to the TCP/IP network communication module and the serial port communication module, respectively.

Technical Field

The invention relates to the field of infrasound sensors and infrasound source detection, in particular to a digital infrasound sensor with environment perception.

Background

Infrasound sensors and infrasound array monitoring networks are widely applied to natural disaster monitoring such as events like volcanic eruptions, hurricanes, avalanches, meteor rains, tsunamis and the like. The acoustics and electromagnetism laboratory of the switzerland Federal institute of technology monitors natural events such as avalanches, sparks and the like by establishing an infrasonic sensor array network. An infrasound sensor array network is established by the university of western-ampere university in canada, and the spark star locus is successfully monitored. Infrasound laboratory (ISLA) of Hawaii university in America establishes wide-area infrasound array monitoring networks in Hawaii, the Digogajia Xiyama island and the Western Palao island respectively, and is used for monitoring volcanoes, fire meteor and typhoons. In 2003, a wide area Infrasound Sensor Network (ISNET) is established by combining a Colorado national marine atmosphere and environmental science laboratory and a Colorado university environmental laboratory in the United states, the ISNET is mainly used for monitoring hurricanes, obvious infrasound waves are received one and a half hours before the hurricanes arrive, the correlation of signals received by each monitoring point is obviously enhanced, the relationship between the infrasound wave frequency and the hurricane diameter is established, and hurricane early warning is realized. The Scripple institute of university of California (IGPP) in the United states establishes an infrasonic sensor array network to study infrasonic signals generated by san Hainans volcano, and data shows that obvious infrasonic signals are received before volcano eruption and can be used for monitoring the volcano. Units such as a domestic Chinese academy of sciences acoustic research institute, a Chengdu mountain area institute, a Chongqing green intelligent research institute and a Chengdu university adopt infrasonic sensors to monitor and early warn natural disasters such as debris flow and landslide. Infrasound monitoring networks are distributed in the Sichuan Yunnan area of the earthquake local crustal stress research institute and are used for monitoring natural disasters of earthquakes.

The infrasound sensor can also be used for monitoring an explosion source, and an infrasound monitoring network is established in the world by the international banning test organization CTBTO to monitor infrasound events. In infrasound event monitoring, the most important is the infrasound sensor sensitive device. At present, the capacitive infrasound sensor is greatly influenced by the environment, including temperature and air pressure, influences the stability of the sensor, and generally outputs an analog signal, so that data acquisition cannot be independently carried out.

Disclosure of Invention

The invention aims to overcome the technical defects and provides a capacitance type infrasound sensor which can measure temperature and air pressure and output in a digital mode, so that the monitoring capability of infrasound events is improved.

In order to achieve the purpose, the invention provides a digital infrasound sensor with environment perception, which comprises a Beidou/GPS antenna, a satellite navigation time service module, an atmospheric pressure detection module, a capacitance sensor, an infrasound signal-to-voltage C/V module, an analog signal conditioning and collecting module, a temperature detection module and a signal processing module;

the satellite navigation time service module is used for acquiring time information through a Beidou/GPS antenna and sending the time information to the signal processing module;

the atmospheric pressure detection module is used for detecting the atmospheric pressure of the surrounding environment and sending the atmospheric pressure to the signal processing module;

the capacitive sensor is used for acquiring infrasound signals and sending the infrasound signals to the infrasound signal voltage conversion C/V module;

the infrasound signal-to-voltage C/V module is used for converting the measured capacitance of the capacitance sensor into linear voltage and outputting the linear voltage to the analog signal acquisition module;

the analog signal conditioning and collecting module is used for receiving an analog voltage signal, converting the analog voltage signal into a digital voltage signal and outputting the digital voltage signal to the signal processing module;

the temperature detection module is used for detecting the temperature of the surrounding environment and sending the temperature to the signal processing module;

and the signal processing module is used for processing and storing various received data.

As an improvement of the above device, the digital infrasound sensor further comprises a power supply for supplying power to the entire infrasound sensor.

As an improvement of the above apparatus, the digital infrasound sensor further includes: and a serial port communication module adopting an RS232/422 serial port.

As an improvement of the above device, the digital infrasound sensor further comprises a communication antenna and a TCP/IP network communication module, for connecting the multifunctional infrasound sensor to an ethernet; the TCP/IP network communication module comprises a 10M/100M Ethernet interface and can simultaneously transmit TCP/UDP packets to a plurality of data receiving devices.

As an improvement of the device, the satellite navigation time service module adopts a navigation positioning time service receiver which has the functions of position measurement and single satellite time service.

As an improvement of the device, the infrasound signal to voltage conversion C/V module is a chip; a plurality of resistors externally connected with the chip can adjust the zero point and the amplification coefficient of the output voltage; the output voltage of the chip to the ground is as follows:

Vout=GN*V2.25*(T2-T1)/Cf+Vref

wherein: vout is the output voltage; GN is the gain factor; is 2 or 4V/V; v2.25 is a reference voltage and is 2.25 VDC; t2 ═ CS2IN + CS2, T1 ═ CS1IN + CS 1; CS1IN and CS2IN are external input capacitors, and CS1 and CS2 are programmable balance capacitors built in a chip; cf is the integrating capacitance of the charge integrating circuit; vref is set to 0.5VDC or 2.25VDC, 0.5VDC in single variable inputs and 2.25VDC in differential variable inputs.

As an improvement of the device, the temperature detection module comprises 32 digital temperature sensors connected in a daisy chain manner, each sensor has a unique 5-bit address, is stored in an electrically erasable programmable read only memory and can read the temperature with the resolution of 0.02 ℃.

As an improvement of the device, the rated working temperature range of the digital temperature sensor is-55 ℃ to +125 ℃.

As an improvement of the device, the signal processing module comprises a main control chip, a DSP + FPGA processor and a DDR; the power end of the main control chip is connected with a power supply; the input end of the main control chip is respectively connected with a satellite navigation time service module, a temperature detection module, an atmospheric pressure detection module and an analog signal conditioning and collecting module;

the main control chip is used for acquiring time service information, infrasound digital signals, atmospheric pressure data and temperature data and sending the data to the DSP + FPGA processor;

the DSP + FPGA processor is used for processing the received data;

and the DDR is used for storing the data processed by the DSP + FPGA processor.

As an improvement of the device, the output end of the main control chip is respectively connected with the TCP/IP network communication module and the serial port communication module.

The invention has the advantages that:

1. the infrasound sensor can measure temperature and air pressure, detect infrasound signals in the atmosphere, directly acquire, process and store the signals, and improve the monitoring capability of infrasound events;

2. the invention adopts the design of a plurality of independent interface modules, thereby greatly improving the anti-interference capability during data communication and further improving the integral stability and reliability of the infrasound sensor.

Drawings

FIG. 1 is a block diagram of the digital infrasound sensor with environmental sensing of the present invention;

FIG. 2 is a circuit diagram of the RM8T satellite navigation time service module according to the present invention;

FIG. 3 is a circuit diagram of an analog signal conditioning acquisition module of the present invention;

FIG. 4 is a circuit diagram of a temperature sensing module of the present invention;

FIG. 5 is a circuit diagram of an atmospheric pressure detection module of the present invention;

FIG. 6 is a circuit diagram of a TCP/IP network communication module according to the present invention.

Detailed Description

The technical solution of the present invention will be described in detail with reference to the drawings.

As shown in fig. 1, the digital infrasound sensor with environmental sensing of the present invention includes a big dipper/GPS antenna, a satellite navigation time service module, an atmospheric pressure detection module, a serial communication module, a capacitance sensor, an infrasound signal-to-voltage C/V module, an analog signal conditioning and collecting module, a communication antenna, a TCP/IP network communication module, a temperature detection module, a signal processing module, and a power supply module;

as shown in fig. 2, the satellite navigation time service module adopts a precision navigation positioning time service receiver of model RM8T, and supports the Beidou, GPS and GLONASS global navigation satellite systems through the Beidou/GPS antenna. The receiver has high sensitivity, is matched with an auxiliary GNSS function, can provide signal acquisition of-157 dBm, and can be quickly started even in buildings with limited vision. The receiver has the characteristics of position measurement (Survey-in) and single satellite time service, and can increase the time service accuracy and the time service availability under the condition that only one satellite provides signals. The satellite navigation time service module provides time information for the signal processing module.

The capacitive sensor is used for acquiring infrasound signals and sending the infrasound signals to the infrasound signal voltage conversion C/V module;

the infrasound signal-to-voltage C/V module can convert the measured capacitance of the capacitance sensor into linear voltage output, and can be used independently or used as a preceding stage capacitance signal acquisition module, so that the system can be subjected to digital processing. The module is applied to capacitance type signal processing in a capacitance type sensor testing system, and the output voltage of the module is in a linear relation with the measured capacitance CM and in a proportional output relation with the working voltage. The module is a fully analog circuit and therefore has a faster test response time and higher resolution determined by the signal-to-noise ratio of the analog circuit. Several resistors connected with the chip can adjust the zero point and amplification factor of the output voltage, so that the system can carry out digital processing.

Wherein the voltage output of the chip to ground follows the following equation:

Vout=GN*V2.25*(T2-T1)/Cf+Vref

wherein: vout output voltage; GN is the gain factor, typically 2 or 4V/V; v2.25 is a reference voltage and is 2.25 VDC; t2 ═ CS2IN + CS2, T1 ═ CS1IN + CS1(CS1IN, CS2IN are external input capacitances, CS1, CS2 are programmable balance capacitors built IN the chip); cf is an integral capacitor of the charge integrating circuit, and the size of Cf determines the size of a chip measuring range; vref may be set to 0.5VDC or 2.25VDC, typically 0.5VDC for single variable inputs and 2.25VDC for differential variable inputs.

As shown in fig. 3, the analog signal conditioning and collecting module employs an ultra-high performance single-chip analog-to-digital converter ADC8C24B (ADC), and other integrated low-noise Programmable Gain Amplifiers (PGA) which are suitable for harsh environments in applications such as energy exploration and seismic monitoring. High resolution ADCs for low frequency applications can provide greater available bandwidth, with offset and drift specifications much lower than industrial ADCs, enabling high precision industrial measurements of optimal DC and AC specifications.

During operation, the modulator samples input signals at high speed (64 times of typical output data rate), quantization noise generated by the modulator is shifted into a high frequency band and filtered by a digital filter in the modulator, the oversampling rate of the modulator is related to the operation mode, and can be respectively 64 (high speed, low speed and low power consumption mode) or 128 (high precision mode), the digital filter can attenuate signals outside cut-off frequency by 100dB, and when the signal conduction bandwidth is 90% of Nyquist frequency, ripple waves are lower than 0.005 dB.

As shown in fig. 4, the temperature sensing module, the digital output temperature sensor, supports a total of 32 devices connected in a daisy chain fashion. Each sensor has a unique 5-bit address, is stored in an Electrically Erasable Programmable Read Only Memory (EEPROM), is capable of reading temperatures at a resolution of 0.015625 ℃, and the 5-bit unique address stored in the EEPROM is determined during an automatic address assignment operation and is based on the position of each sensor relative to the SMAART line master. The module part has multiple optional working modes, improves the flexibility to the maximum extent, can reduce the power consumption aiming at the operation of the battery, and can provide high updating rate for real-time control application. Is suitable for extended temperature measurement in various industrial, instrumentation, communication and environmental applications. The rated working temperature range is-55 ℃ to +125 ℃.

As shown in fig. 5, the atmospheric pressure detection module has the characteristics of high precision, high sampling frequency, low power consumption, strong anti-interference capability, and the like, and can output data in units of pascal (Pa) for detection of atmospheric pressure. The atmospheric pressure detection module has strong anti-jamming capability, the compensation operation can give out the maximum and minimum measured values and set a measurement threshold value and a window, the internal FIFO data cache region allows the DSP to be in a low-power-consumption sleep mode, and the DSP is awakened until the FIFO data is full.

The signal processing module comprises a main control chip, a DSP + FPGA processor and a DDR; the power supply end of the main control chip is connected with the power supply module; the input end of the big dipper satellite navigation time service module is connected with the big dipper satellite navigation time service storage module, the temperature detection module, the atmospheric pressure detection module and the analog signal conditioning and acquisition module; the output end is connected with the TCP/IP network communication module and the serial port communication module.

The main control chip is used for acquiring time service information, infrasound digital signals, atmospheric pressure data and temperature data and sending the data to the DSP + FPGA processor;

the DSP + FPGA processor is used for processing the received data; the processing is conventional processing of the data, such as filtering and normalization, using prior art algorithms.

And the DDR is used for storing the data processed by the DSP + FPGA processor.

The module is a floating-point DSP + FPGA processing module with TMS320C6747+ EP2C5T144 as a core, and has the characteristics of high performance, low power consumption and the like. The module adopts military standard design and eight-layer lead-free gold immersion process. The composite material has good vibration resistance, shock resistance and high and low temperature characteristics, and has good performance in EMC performance and stability.

As shown in fig. 6, the TCP/IP network communication module uses a high-performance RJ45 product of the embedded device networking server, which provides a compact, high-performance and low-cost network connection for the product of the client, and can easily connect to the ethernet. The TCP/IP network communication module has a 10M/100M Ethernet interface and can simultaneously transmit TCP/UDP packets to a plurality of data receiving devices.

The serial port communication module adopts an RS232/422 serial port.

And the power supply module is used for supplying power to the whole infrasound sensor.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.

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