阅读说明：本技术 一种紧凑增强耦合型三维发夹滤波器 (Compact enhanced coupling type three-dimensional hairpin filter ) 是由 王凤娟 柯磊 余宁梅 于 2020-03-31 设计创作，主要内容包括：本发明公开了一种紧凑增强耦合型三维发夹滤波器,包括铜层RDL制作滤波器电路结构,每层RDL采用交叉U型谐振腔的平面结构,相邻两层滤波器电路结构之间采用TSV进行信号传输。每层滤波器电路结构相互对应,每层RDL包括若干部分耦合。若干部分耦合中第一部分耦合为输入抽头耦合,最后一部分耦合为输出抽头耦合,中间部分的耦合均为的谐振腔间耦合。采用TSV技术的三维发夹滤波器的耦合系数得到了倍增,进而优化了滤波器的性能。综上所述,本发明采用TSV技术的紧凑增强耦合型三维发夹滤波器较传统发夹滤波器的优点在于紧凑的物理尺寸实现了滤波器的小型化,倍增的耦合系数提高了滤波器的性能。(The invention discloses a compact reinforced coupling type three-dimensional hairpin filter, which comprises a filter circuit structure made of a copper layer RD L, wherein each layer RD L adopts a plane structure of a crossed U-shaped resonant cavity, signal transmission is carried out between two adjacent layers of filter circuit structures by TSV, the filter circuit structures of each layer correspond to each other, each layer RD L comprises a plurality of parts of coupling, the first part of the coupling of the parts of coupling is input tap coupling, the last part of coupling is output tap coupling, the coupling of the middle part is resonance cavity coupling, the coupling coefficient of the three-dimensional hairpin filter adopting the TSV technology is multiplied, and the performance of the filter is further optimized.)

1. The compact enhanced coupling type three-dimensional hairpin filter is characterized in that a filter circuit structure is manufactured by a copper layer RD L, each layer RD L adopts a planar structure of a crossed U-shaped resonant cavity, and signal transmission is carried out between two adjacent layers of filter circuit structures by TSV.

2. The compact enhanced coupling three-dimensional hairpin filter according to claim 1, wherein the filter circuit structures of each layer correspond to each other, and each layer of RD L includes several partial couplings.

3. The compact enhanced coupling type three-dimensional hairpin filter according to claim 2, wherein a first part of the couplings is an input tap coupling, a last part of the couplings is an output tap coupling, and the couplings in the middle part are all resonator-to-resonator couplings.

4. The hairpin filter of claim 3 wherein each of the resonators includes three microstrip lines connected to each other, each of the lines having a plurality of through-silicon vias, and each of the lines is connected to the three lines of the resonator through the through-silicon vias.

5. The compact enhanced coupling type three-dimensional hairpin filter according to claim 1, wherein the RD L fabrication filter coupling structure has an input tap feed line at one end and an output tap feed line at the other end.

6. The compact enhanced coupling three-dimensional hairpin filter according to claim 2, wherein the plurality of sections are coupled in six sections.

Technical Field

The invention belongs to the technical field of filter manufacturing, and particularly relates to a compact enhanced coupling type three-dimensional hairpin filter.

Background

Due to the rapid development of modern wireless communication technology, low-loss, small-size, light-weight and low-cost filters form an important market, which creates a good opportunity for the development of microwave filters. The microstrip line type filter is a filter form widely adopted in the microwave filter due to the advantages of small size, easy photoetching processing, high precision, low cost, easy integration, large working frequency range and the like. The microstrip filter is usually in the form of hairpin-type, parallel coupled line, comb line, interdigital and microstrip elliptic function filter.

Compared with a parallel coupling line filter structure, the hairpin type band-pass filter has a compact circuit structure and is widely applied to occasions with strict size requirements; compared with a comb line and interdigital filter, the hairpin type band-pass filter does not need via hole grounding, and eliminates errors introduced by via holes; compared with a microstrip elliptic function filter, the hairpin type band-pass filter has a simpler design process. Therefore, the hairpin type band-pass filter has better electrical property, thereby having good application prospect in the design of a microwave planar circuit.

Today, the shrinking of physical dimensions in planar circuit processes has reached a bottleneck, creating an irreparable conflict with the development of moore's law. Three-dimensional integration technology is a technology that has emerged in order to go beyond moore's law. The silicon through hole is used as a key technology in a three-dimensional integrated circuit, the whole interconnection length can be shortened, and the integration level of a system is improved.

Disclosure of Invention

The invention provides a compact enhanced coupling type three-dimensional hairpin filter, which is used for realizing the compactness of the traditional hairpin filter and the enhancement of the coupling coefficient, thereby realizing the reduction of the physical size and the optimization of the filtering effect.

The technical problem to be solved by the invention is realized by the following technical scheme:

a compact enhanced coupling type three-dimensional hairpin filter comprises a filter circuit structure made of a copper layer RD L, wherein each layer of RD L is of a planar structure with a crossed U-shaped resonant cavity, and signal transmission is carried out between two adjacent layers of filter circuit structures by TSV.

The present invention is also characterized in that,

each layer of filter circuit structures corresponds to each other, and each layer RD L comprises a plurality of partial couplings.

The first part of the coupling of the plurality of parts is input tap coupling, the last part of the coupling is output tap coupling, and the coupling of the middle part is resonance cavity coupling.

Each resonant cavity comprises three communicated microstrip lines, each line is provided with a plurality of silicon through holes, and each line is communicated with the three lines of the corresponding resonant cavity through the silicon through holes.

One end of the RD L manufactured filter coupling structure is provided with an input tap feeder line, and the other end is provided with an output tap feeder line.

Several sections are coupled into six sections.

Compared with the prior art, the invention has the beneficial effects that:

the invention discloses a compact enhanced coupling type hairpin filter. The coupling coefficient of the three-dimensional hairpin filter adopting the TSV technology is multiplied, and the performance of the filter is optimized. In summary, the compact enhanced coupling type three-dimensional hairpin filter adopting the TSV technology has the advantages that the compact physical size realizes the miniaturization of the filter, and the multiplied coupling coefficient improves the performance of the filter compared with the traditional hairpin filter.

Drawings

Fig. 1 is a top view of a compact enhanced coupled three-dimensional hairpin filter of the invention.

Fig. 2 is a front view of a compact enhanced coupled three-dimensional hairpin filter of the invention.

Fig. 3 is a left side view of the compact enhanced coupled three-dimensional hairpin filter of the invention.

In the figure, 1, an upper RD L input tap feeder, 2, an upper RD L first resonant cavity, 3, an upper RD L0 second resonant cavity, 4, an upper RD L1 third resonant cavity, 5, an upper RD L fourth resonant cavity, 6, an upper RD L fifth resonant cavity, 7, an upper RD L output tap feeder, 8, a first pair of TSVs connected with two arms of the upper RD L and lower RD 635 first resonant cavity, 9, a first pair of TSVs connected with two arms of the upper RD L and lower RD L second resonant cavity, 10, a first pair of TSVs connected with two arms of the upper RD L and lower RD L third resonant cavity, 11, a first pair of TSVs connected with two arms of the upper RD L and lower RD 358 fourth resonant cavity, 12, a first pair of TSVs connected with two arms of the upper RD L and fifth resonant cavity, 13, a lower RD L input tap feeder, 14, RD L output tap feeder, 15, a first pair of TSVs connected with the upper RD L and lower RD 4616, a first arm of the upper RD 4619, a sixth TSV 4617 and a sixth arm of the upper RD 4617 and lower RD 4617 are connected with the upper RD L first resonant cavity and the upper RD 4618 through hole of the upper silicon resonant cavity and the upper silicon through 4617.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

A compact enhanced coupling type three-dimensional hairpin filter comprises a filter circuit structure made of a copper layer RD L, wherein each layer of RD L is of a planar structure with a crossed U-shaped resonant cavity, and signal transmission is carried out between two adjacent layers of filter circuit structures by TSV.

Each layer of filter circuit structures corresponds to each other, and each layer RD L comprises a plurality of partial couplings.

The first part of the coupling of the plurality of parts is input tap coupling, the last part of the coupling is output tap coupling, and the coupling of the middle part is resonance cavity coupling.

Each resonant cavity comprises three communicated microstrip lines, each line is provided with a plurality of silicon through holes, and each line is communicated with the three lines of the corresponding resonant cavity through the silicon through holes.

One end of the RD L manufactured filter coupling structure is provided with an input tap feeder line, and the other end is provided with an output tap feeder line.

Several sections are coupled into six sections.

A compact reinforced coupling type three-dimensional hairpin filter is characterized in that a filter circuit structure is manufactured by adopting an upper copper layer RD L and a lower copper layer RD L, signal transmission is carried out between the upper layer RD L and the lower layer RD L by adopting a TSV, multiplication of a coupling coefficient is realized, the upper copper layer RD L and the lower copper layer RD L are completely the same, each layer RD L comprises six parts of coupling, as shown in FIGS. 1-3, the first part of coupling is input tap coupling and consists of an input tap feeder and a first resonant cavity, the second part of coupling is coupling between resonant cavities, the first resonant cavity and the second resonant cavity, the third part of coupling is coupling between resonant cavities, the second resonant cavity and the third resonant cavity, the fourth part of coupling is coupling between resonant cavities, the third resonant cavity and the fourth resonant cavity, the fifth part of coupling between microstrip lines, the fourth resonant cavity and the fifth resonant cavity consists of a fourth resonant cavity and a fifth resonant cavity, the sixth part of coupling between microstrip line and the fifth resonant cavity, the sixth part of coupling between the fifth resonant cavity and the fifth resonant cavity is output tap coupler, the fifth resonant cavity is composed of a microstrip line, the fifth resonant cavity comprises a microstrip line, the fifth resonant cavity, the microstrip line.

The conventional hairpin filter is implemented by cascading "U" type resonant cavities to form a planar structure, the "U" type resonant cavities and the inverted "U" type resonant cavities represent microstrip lines of a serial L C circuit part and a parallel L C circuit part, the invention is a compact enhanced coupling type hairpin filter adopting a TSV technology, firstly, the compact structure is implemented by adopting a planar structure of crossed "U" type resonant cavities in each layer RD L, the coupling coefficient matrix and the arm length of the compact structure are not changed, the transverse size of the compact structure is reduced, and the area of the compact structure is greatly reduced, namely, the size of the compact structure is reduced, secondly, the enhanced coupling body is multiplied by the coupling coefficient of six parts, the coupling coefficient of each layer RD L comprises that the coupling coefficient of a first part is 7.56, the coupling coefficient of a second part is 0.10, the coupling coefficient of a third part is 0.07, the coupling coefficient of a fourth part is 0.07, the coupling coefficient of a fifth part is 0.10, the coupling coefficient of a sixth part is 7.56, the coupling coefficient of the third part is 0.07, the coupling coefficient of the fourth part is 0.07, the coupling coefficient of the fifth part is 0.82, the coupling coefficient of the third part is 0.14, the third part of the compact structure is improved, the coupling coefficient of the compact structure of the hairpin filter, the compact structure is improved by adopting a coupling coefficient of the compact structure, the compact structure of the hairpin filter, the compact structure of the hairpin filter, the compact structure of the hairpin filter, the compact structure of the compact structure, the.