阅读说明：本技术 形成有可流动流体的流道的粘合陶瓷及其制备方法 (Bonded ceramic having flow channel formed therein for flowable fluid and method for preparing the same ) 是由 薛昶煜 于 2018-11-23 设计创作，主要内容包括：本发明涉及一种形成有可流动流体的流道的粘合陶瓷及其制备方法,更具体地,涉及一种形成有可流动流体的流道的粘合陶瓷及其制备方法,其中,所述形成有可流动流体的流道的粘合陶瓷包括：第一陶瓷基板；以及第二陶瓷基板,所述第一陶瓷基板及所述第二陶瓷基板彼此粘合而不需要粘附层,在与所述第二陶瓷基板接触的所述第一陶瓷基板的粘合面、与所述第一陶瓷基板接触的所述第二陶瓷基板的粘合面或所述两个面上都形成有图案,并且,包括沿所述第一陶瓷基板和所述第二陶瓷基板的粘合面形成的尺寸为0.01μm至50μm的气孔。(The present invention relates to a bonded ceramic formed with a flow channel of a flowable fluid and a method for preparing the same, and more particularly, to a bonded ceramic formed with a flow channel of a flowable fluid and a method for preparing the same, wherein the bonded ceramic formed with a flow channel of a flowable fluid includes: a first ceramic substrate; and a second ceramic substrate bonded to each other without an adhesive layer, patterned on an adhesive surface of the first ceramic substrate contacting the second ceramic substrate, an adhesive surface of the second ceramic substrate contacting the first ceramic substrate, or both surfaces, and including pores having a size of 0.01 to 50 μm formed along the adhesive surface of the first and second ceramic substrates.)

1. A bonded ceramic defining a flow channel for a flowable fluid, comprising:

a first ceramic substrate; and

a second ceramic substrate having a first surface and a second surface,

the first ceramic substrate and the second ceramic substrate are bonded to each other without an adhesion layer,

a pattern is formed on the bonding surface of the first ceramic substrate in contact with the second ceramic substrate, the bonding surface of the second ceramic substrate in contact with the first ceramic substrate, or both of the bonding surfaces,

comprises pores having a size of 0.01 to 50 μm formed along the bonding surface of the first and second ceramic substrates.

2. The bonded ceramic with flowable fluid flow channels formed as in claim 1,

the patterns of the first and second ceramic substrates each include at least one selected from a hole shape, a line shape, a gravure-pattern shape, and a composite shape of the patterns.

3. The bonded ceramic with flowable fluid flow channels formed as in claim 1,

the pattern forms a flow channel for the flowable fluid.

4. The bonded ceramic formed with flow channels for flowable fluids as claimed in claim 1, comprising:

a grain spanning the first ceramic substrate and the second ceramic substrate.

5. The bonded ceramic with flowable fluid flow channels formed as in claim 1,

the size of the grains across the first and second ceramic substrates is 0.1 to 100 μm.

6. The bonded ceramic with flowable fluid flow channels formed as in claim 1,

the first ceramic substrate and the second ceramic substrate respectively comprise at least one selected from silicon carbide, silicon nitride, alumina, aluminum nitride, zirconia, silica, zirconia toughened alumina, magnesia, cordierite, mullite and cordierite.

7. The bonded ceramic with flowable fluid flow channels formed as in claim 1,

the first ceramic substrate and the second ceramic substrate are the same material and do not include a different material.

8. The bonded ceramic formed with flow channels for flowable fluids of claim 1, further comprising:

a plurality of ceramic substrates, each of which is made of a ceramic,

the plurality of ceramic substrates are laminated and bonded on the first ceramic substrate or the second ceramic substrate without an adhesion layer.

9. The bonded ceramic with flowable fluid flow channels formed as in claim 1,

the thicknesses of the first ceramic substrate and the second ceramic substrate are respectively 1mm to 100 mm.

10. The bonded ceramic with flowable fluid flow channels formed as in claim 1,

the total thickness of the bonded ceramic is 2mm to 200 mm.

11. The bonded ceramic with flowable fluid flow channels formed as in claim 1,

has a strength of 70% or more of that of the single ceramic substrate.

12. A method of preparing a bonded ceramic having a channel formed therein for a flowable fluid, comprising the steps of:

polishing one surface of the first ceramic substrate and one surface of the second ceramic substrate;

forming a pattern on one side of the polished first ceramic substrate, one side of the polished second ceramic substrate, or both sides; and

one surface of the first ceramic substrate on which the pattern is formed and one surface of the second ceramic substrate on which the pattern is formed are bonded to each other to make contact.

13. The method of claim 12, wherein the ceramic material is a ceramic material having a flow path for a flowable fluid formed therein,

in the step of the bonding,

and forming a flow channel of the flowable fluid according to the pattern of the first ceramic substrate and the pattern of the second ceramic substrate.

14. The method of claim 12, wherein the ceramic material is a ceramic material having a flow path for a flowable fluid formed therein,

in the step of the bonding,

forming a grain across the first ceramic substrate and the second ceramic substrate.

15. The method of claim 13, wherein the ceramic material is a ceramic material having a flow path for a flowable fluid formed therein,

a size of a crystal grain formed across the first ceramic substrate and the second ceramic substrate is 0.1 μm to 100 μm.

16. The method of claim 12, wherein the ceramic material is a ceramic material having a flow path for a flowable fluid formed therein,

in the step of bonding,

is performed within an overlapping temperature range of a temperature range of 60% to 90% of the melting temperature of the first ceramic substrate and a temperature range of 60% to 90% of the melting temperature of the second ceramic substrate,

at 0.1kg/cm²To 100kg/cm²Under the pressure conditions of (1).

17. Use of a bonded ceramic comprising flow channels formed with a flowable fluid,

the bonded ceramic according to claim 1 or the bonded ceramic produced by the production method of the bonded ceramic according to claim 12,

the vacuum chuck is suitable for at least one selected from a reflector, an observation window and a vacuum chuck for fixing a wafer in the aerospace industry.

Technical Field

The present invention relates to a bonded ceramic in which a flow channel of a flowable fluid is formed and a method for preparing the same, and more particularly, to a bonded ceramic in which a flow channel of a flowable fluid is formed, which can be bonded without an adhesive layer, and a method for preparing the same.

Background

Various ceramic materials are widely used in the fields of electronic parts, biomaterials, heat-resistant and wear-resistant structural parts, and the like. When a ceramic material is used, the ceramic material is used alone only in a special case, and generally used by adhesion between ceramic materials, adhesion between a ceramic material and a metal material, and the like. The adhesion between ceramic materials and the adhesion between a ceramic material and a metal material are generally achieved by an adhesive made of epoxy resin or the like.

In addition, the adhesive strength of the epoxy resin is reduced to less than half at a temperature of 80 ℃ as compared to a temperature of 25 ℃. Therefore, it is difficult to use the conventional ceramic bonding under a high temperature environment, and it is difficult to apply to a field requiring high strength under a high temperature environment due to low bonding strength.

Disclosure of Invention

Technical problem to be solved

The present invention has been made to solve the above problems, and an object of the present invention is to provide a bonded ceramic having a high strength in a high temperature environment in which a flow channel of a flowable fluid is formed without an additional adhesive layer, and a method for preparing the same.

In addition, heat generated in the ceramic substrate can be cooled by forming a flow channel of a flowable fluid in the bonded ceramic, and therefore, the bonded ceramic of the present invention is suitable for use in a high-temperature environment.

However, the problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

Means for solving the problems

A bonded ceramic formed with a flow channel of a flowable fluid according to an embodiment of the present invention includes: a first ceramic substrate; and a second ceramic substrate bonded to each other without an adhesive layer, patterned on an adhesive surface of the first ceramic substrate contacting the second ceramic substrate, an adhesive surface of the second ceramic substrate contacting the first ceramic substrate, or both surfaces, and including pores having a size of 0.01 to 50 μm formed along the adhesive surface of the first and second ceramic substrates.

The patterns of the first and second ceramic substrates may respectively include at least one selected from a hole shape, a line shape, a gravure-circuit shape, and a composite shape of the patterns according to one side surface.

According to one aspect, the pattern can form a flow path for the flowable fluid.

According to one aspect, a die can be included across the first ceramic substrate and the second ceramic substrate.

According to one aspect, the size of the crystal grains across the first ceramic substrate and the second ceramic substrate may be 0.1 μm to 100 μm.

According to one aspect, the first and second ceramic substrates may include at least one selected from silicon carbide, silicon nitride, alumina, aluminum nitride, zirconia, silica, zirconia toughened alumina, magnesia, cordierite, mullite, and cordierite, respectively.

According to one aspect, the first ceramic substrate and the second ceramic substrate may be the same material and may not include a different material.

According to one aspect, a plurality of ceramic substrates may be further included, and the plurality of ceramic substrates may be laminated and bonded on the first ceramic substrate or the second ceramic substrate without an adhesion layer.

According to one aspect, the first and second ceramic substrates may have a thickness of 1mm to 100mm, respectively.

The total thickness of the bonded ceramic may be 2mm to 200mm according to one side.

According to one aspect, the strength of the monolithic ceramic substrate may be 70% or more.

A method of preparing a bonded ceramic having a flow channel formed with a flowable fluid according to an embodiment of the present invention includes the steps of: polishing (polising) one side of the first ceramic substrate and one side of the second ceramic substrate; forming a pattern on one side of the polished first ceramic substrate, one side of the polished second ceramic substrate, or both sides; and bonding one surface of the first ceramic substrate on which the pattern is formed and one surface of the second ceramic substrate on which the pattern is formed to realize contact.

According to one aspect, in the bonding step, a flow path of a flowable fluid may be formed according to a pattern of the first ceramic substrate and a pattern of the second ceramic substrate.

According to one aspect, in the bonding step, crystal grains may be formed across the first ceramic substrate and the second ceramic substrate.

According to one aspect, the size of the crystal grains formed across the first and second ceramic substrates may be 0.1 μm to 100 μm.

According to one aspect, the bonding step, which may be performed in an overlapping temperature range of a temperature range of 60% to 90% of the melting temperature of the first ceramic substrate and a temperature range of 60% to 90% of the melting temperature of the second ceramic substrate, may be performed at 0.1kg/cm²To 100kg/cm²Under the pressure conditions of (1).

According to an embodiment of the present invention, the bonded ceramic according to claim 1 or the bonded ceramic prepared by the method of claim 12 is suitable for at least one selected from a mirror in the aerospace industry, a viewing window, and a vacuum chuck for fixing a wafer in the semiconductor industry.

ADVANTAGEOUS EFFECTS OF INVENTION

The bonded ceramic according to the present invention is bonded by grain growth of the material itself without using a bonding material, and thus has excellent strength and can be used in a high temperature environment, and can be suitably used for at least one selected from a mirror for the aerospace industry, an observation window, and a vacuum chuck for fixing a wafer in the semiconductor industry.

In addition, heat generated in the ceramic substrate can be cooled by forming a flow channel of a flowable fluid in the bonded ceramic, and therefore, the bonded ceramic of the present invention is suitable for use in a high-temperature environment.

Drawings

Fig. 1 is a conceptual diagram illustrating a bonded ceramic formed with a flow channel of a flowable fluid according to the present invention.

Fig. 2 is an SEM image (left) and an enlarged SEM image (right) of the bonding face of the bonded ceramic according to the embodiment of the present invention.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, when it is judged that a detailed description of related well-known functions or configurations unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted. The terms used in the present specification are used to accurately express preferred embodiments of the present invention, and may be different according to the intention of a user or the convention of the art to which the present invention pertains. Thus, the definitions of the terms should be defined based on the overall contents of the specification. Like reference symbols in the various drawings indicate like elements.

In the entire specification, when a certain component is referred to as being "on" another component, the component does not contact the other component, and includes a case where the other component is present between the two components.

In the entire specification, when a part is described as "including" a certain component, it is not meant to exclude other components, and other components may be included.

Hereinafter, a bonded ceramic having a flow channel for a flowable fluid formed therein and a method for manufacturing the same according to the present invention will be described in detail with reference to examples and drawings. However, the present invention is not limited to the above-described embodiments and the drawings.

A bonded ceramic formed with a flow channel of a flowable fluid according to an embodiment of the present invention includes: a first ceramic substrate; and a second ceramic substrate bonded to each other without an adhesive layer, patterned on an adhesive surface of the first ceramic substrate contacting the second ceramic substrate, an adhesive surface of the second ceramic substrate contacting the first ceramic substrate, or both surfaces, and including pores having a size of 0.01 to 50 μm formed along the adhesive surface of the first and second ceramic substrates.

According to the bonded ceramic of an embodiment of the present invention, no bonding boundary line (boundary layer) is observed at the bonding face, and only pores formed along the bonding face are included.

According to one aspect, the pattern can form a flow path for the flowable fluid.

Fig. 1 is a conceptual diagram illustrating a bonded ceramic formed with a flow channel of a flowable fluid according to the present invention.

Referring to fig. 1, the first and second ceramic substrates 100 and 200 include only pores formed along the bonding surface without a bonding boundary line (boundary layer). In addition, a flow channel 500 for flowable fluid is formed on the bonding surface according to the pattern of the first ceramic substrate and the second ceramic substrate. The heat generated in the ceramic substrate can be cooled by forming the flow channel 500 of the flowable fluid in the bonded ceramic, and thus, the bonded ceramic of the present invention is suitable for use in a high temperature environment.

The patterns of the first and second ceramic substrates may respectively include at least one selected from a hole shape, a line shape, a gravure-circuit shape, and a composite shape of the patterns according to one side surface. However, the present invention is not limited thereto, and the shape of the flow path formed on the adhesive surface varies according to the shape of the pattern. Accordingly, by forming various patterns on the first ceramic substrate and the second ceramic substrate, a flow channel having a desired size and shape can be formed.

According to one aspect, a die can be included across the first ceramic substrate and the second ceramic substrate.

The bonded ceramic according to the present invention is a bonded ceramic without an adhesive layer using no adhesive, and crystal grains spanning two ceramic substrates are formed by grain growth of a ceramic material itself. Therefore, the bonded ceramic according to the present invention has excellent strength, and it can be used in a high temperature environment.

According to one aspect, the size of the crystal grains across the first ceramic substrate and the second ceramic substrate may be 0.1 μm to 100 μm.

Crystal grains are formed on the bonding surfaces of the first ceramic substrate and the second ceramic substrate before bonding. When the grain size of the respective adhesion faces is too small or too large, a problem may arise in that grains across the two ceramic substrates cannot be formed. Therefore, preferably, the grain size across the first and second ceramic substrates that is ultimately produced is 0.1 μm to 100 μm.

According to one aspect, the first and second ceramic substrates may include silicon carbide (SiC) and silicon nitride (SiN), respectively₄) Alumina (Al)₂O₃) Aluminum nitride (AlN), zirconium oxide (ZrO)₂) Silicon oxide (SiO)₂) At least one selected from Zirconia Toughened Alumina (ZTA), magnesia (MgO), cordierite, mullite and cordierite. However, it is not limited thereto.

According to one aspect, the first ceramic substrate and the second ceramic substrate may be the same material, and may not include a different material. That is, when the ceramic material according to an embodiment of the present invention, in which the dissimilar material is not used, is analyzed, the dissimilar material is not detected.

According to one aspect, the ceramic substrate further includes a plurality of ceramic substrates that are bonded to the first ceramic substrate or the second ceramic substrate without an adhesive layer. As described above, the lamination is realized by grain growth, and the crystal grains of the plurality of ceramic substrates are bonded by the crystal grains across the respective boundary surfaces.

According to one side, the thicknesses of the first ceramic substrate and the second ceramic substrate may be 1mm to 100mm, respectively.

The total thickness of the bonded ceramic may be 2mm to 200mm according to one side.

According to one aspect, the strength may be more than 70% of that of a monolithic (bulk) ceramic substrate.

The ceramic substrate has an optimum thickness according to its type, and when the thickness is too thin or too thick, the strength of the ceramic substrate is greatly reduced, resulting in a problem of easy breakage. However, the bonded ceramics according to the present invention can be bonded to each other without an adhesion layer, so that the entire thickness of the bonded ceramics can be freely controlled, and have a strength of 70% or more of that of the monolithic (bulk) ceramic substrate.

A method of preparing a bonded ceramic having a flow channel formed with a flowable fluid according to an embodiment of the present invention includes the steps of: polishing (polising) one side of the first ceramic substrate and one side of the second ceramic substrate; forming a pattern on one side of the polished first ceramic substrate, one side of the polished second ceramic substrate, or both sides; and bonding one surface of the first ceramic substrate on which the pattern is formed and one surface of the second ceramic substrate on which the pattern is formed to realize contact.

According to one aspect, in the bonding step, a flow path of a flowable fluid may be formed according to a pattern of the first ceramic substrate and a pattern of the second ceramic substrate. Flow channels for flowable fluids are formed according to the patterns of the first and second ceramic substrates, and the size and shape of the flow channels are determined according to the size and shape of the patterns.

According to one aspect, in the bonding step, crystal grains may be formed across the first ceramic substrate and the second ceramic substrate.

According to one aspect, the size of the grains formed across the first and second ceramic substrates may be 0.1 μm to 100 μm.

The method for producing a bonded ceramic according to the present invention is a method for producing a bonded ceramic without an adhesive layer without using a bonding material. In more detail, after polishing the crystal grains located on each side of the ceramic material so as to become as free from warpage as possible, the polished sides are bonded so that the crystal grains across the two ceramic substrates are formed by the growth of the polished crystal grains of the two ceramic substrates. Thereby, a bonded ceramic having excellent strength and usable in a high-temperature environment can be realized.

According to one side, the bonding step may be performed in an overlapping temperature range of a temperature range of 60% to 90% of the melting temperature of the first ceramic substrate and a temperature range of 60% to 90% of the melting temperature of the second ceramic substrate, and may be at 0.1kg/cm²To 100kg/cm²Under the pressure conditions of (1).

The temperature is chosen in proportion to the melting temperature of the respective material, suitably from 60% to 90% of the melting temperature. When the bonding step is performed under a temperature condition exceeding 90% of the melting temperature, problems such as extreme deformation or melting of the material may occur; when the reaction is carried out at a temperature lower than 60% of the melting temperature, there is a possibility that the problem of adhesion failure may occur because sufficient diffusion cannot be achieved.

For example, when the melting temperature of the first ceramic substrate is 100 ℃ and the melting temperature of the second ceramic substrate is 120 ℃, the bonding step may be performed at a temperature range of 72 ℃ to 90 ℃.

For another example, when the first and second ceramic substrates are silicon carbide, the bonding step may be performed at a temperature ranging from 700 ℃ to 2500 ℃, more preferably, from 1700 ℃ to 2300 ℃.

In addition, when the concentration exceeds 100kg/cm²When the bonding step is performed under a load condition, the material may be extremely deformed; when the concentration is less than 0.1kg/cm²Under the load condition of (3), since sufficient diffusion cannot be achieved, there is a possibility that a problem of failure in adhesion may occur.

The bonded ceramic according to an embodiment of the present invention or the method for manufacturing the bonded ceramic according to an embodiment of the present invention may be applied to at least one selected from a mirror in the aerospace industry, a viewing window, and a vacuum chuck for fixing a wafer in the semiconductor industry.

In particular, the bonded ceramics of the present invention can be used as mirrors in the aerospace industry. Ceramic substrates used in the aerospace industry must maintain their strength under harsh environmental conditions. As described above, since the bonded ceramic according to the present invention is bonded by grain growth of the material itself without using a bonding material, it has excellent strength and can be used in a high temperature environment. Further, the cooling water may be flowed through a flow channel formed inside the ceramic substrate, thereby cooling heat on the ceramic substrate. That is, the bonded ceramic of the present invention is very suitable for use as a mirror in the aerospace industry.

Hereinafter, the present invention will be described in detail with reference to the following examples and comparative examples.

However, the following examples are only for illustrating the present invention, and the contents of the present invention are not limited to the following examples.