阅读说明：本技术 散热装置和投影设备 (Heat dissipation device and projection equipment ) 是由 张括 张相雄 陈晨 胡飞 于 2020-04-17 设计创作，主要内容包括：本申请提供一种散热装置和投影设备。散热装置用于空间光调制器。空间光调制器包括相连接的空间光调制器本体和控制板,空间光调制器本体具有前侧面和后侧面,控制板位于后侧面的后面。散热装置包括第一导热组件、散热组件以及第二导热组件,第一导热组件设置于前侧面上。散热组件设置于控制板的后面。第二导热组件连接于第一导热组件和散热组件之间,并绕过空间光调制器的控制板。空间光调制器的热量由第一导热组件传递至第二导热组件,再传递至散热组件,第二导热组件绕过控制板而不是在控制板开孔并直接穿过控制板使得空间光调制器及其散热装置易于安装、结构紧凑,同时也可以避免因对控制板开孔而破坏控制板的走线的风险。(The application provides a heat dissipation device and projection equipment. The heat sink is used for the spatial light modulator. The spatial light modulator comprises a spatial light modulator body and a control board which are connected, wherein the spatial light modulator body is provided with a front side face and a back side face, and the control board is positioned behind the back side face. The heat dissipation device comprises a first heat conduction assembly, a heat dissipation assembly and a second heat conduction assembly, wherein the first heat conduction assembly is arranged on the front side face. The heat dissipation assembly is arranged behind the control panel. The second heat conducting assembly is connected between the first heat conducting assembly and the heat dissipation assembly and bypasses the control board of the spatial light modulator. The heat of the spatial light modulator is transmitted to the second heat-conducting assembly through the first heat-conducting assembly and then transmitted to the heat-radiating assembly, the second heat-conducting assembly bypasses the control board instead of opening the hole in the control board and directly penetrates through the control board, so that the spatial light modulator and the heat-radiating device thereof are easy to install and compact in structure, and meanwhile, the risk of damaging wiring of the control board due to the opening of the control board can be avoided.)

1. A heat sink for a spatial light modulator, the spatial light modulator comprising a spatial light modulator body having a front side and a back side and a control board located behind the back side, the heat sink comprising:

a first heat conducting assembly disposed on the front side of the spatial light modulator body;

the heat dissipation assembly is positioned behind the control board; and

a second heat conducting assembly connected between the first heat conducting assembly and the heat dissipating assembly and bypassing the control board of the spatial light modulator;

the heat of the spatial light modulator is transferred to the second heat conducting assembly from the first heat conducting assembly and then transferred to the heat dissipation assembly.

2. The heat dissipating device of claim 1, wherein said second thermally conductive assembly comprises a flexible thermally conductive portion made of a flexible material.

3. The heat dissipating device of claim 2, wherein the flexible heat conducting portion comprises at least one of:

one or more metal sheets;

one or more flexible heat pipes.

4. The heat dissipating device of claim 3, wherein there is a gap between the plurality of metal sheets or between the plurality of flexible heat pipes.

5. The heat dissipating device of claim 2, further comprising a first connecting portion and a second connecting portion, the second heat conducting assembly being connected to the first heat conducting assembly by the first connecting portion and to the heat dissipating assembly by the second connecting portion.

6. The heat dissipating device of claim 5, wherein the second heat conducting assembly further comprises a first clip and a second clip respectively disposed at two ends of the flexible heat conducting portion, wherein the first connecting portion attaches the first clip to the first heat conducting assembly, and the second connecting portion attaches the second clip to the heat dissipating assembly.

7. The heat dissipating device of claim 6, wherein said first connecting portion comprises a pressure plate and a first fastener, wherein said first fastener secures said pressure plate to said first heat conducting assembly and causes said first clip to be clamped between said pressure plate and said first heat conducting assembly.

8. The heat dissipating device of claim 7, wherein the width of said first latch is less than the width of said pressure plate such that said first fastener passes only through said pressure plate.

9. The heat dissipating device of claim 6, wherein the second connecting portion comprises a second fastener, wherein the second clip has at least one hole disposed thereon, and the second fastener cooperates with the at least one hole to attach the second clip to the heat dissipating component.

10. The heat dissipating device of any of claims 1-9, wherein the first thermally conductive assembly is a temperature homogenizing sheet extending along the front side for homogenizing heat from the front side.

11. The heat dissipating device of any of claims 1-9, wherein the front side of the spatial light modulator body is a side facing light rays incident to the spatial light modulator body.

12. The heat dissipating device of any of claims 1-9, further comprising an auxiliary air-cooling component for auxiliary heat dissipation of the second heat conducting assembly, the auxiliary air-cooling component being arranged such that wind output from the auxiliary air-cooling component is delivered in a direction parallel to a width of the second heat conducting assembly.

13. The heat sink of any of claims 1-9, wherein the second thermally conductive assembly also bypasses one or more of the other devices between the spatial light modulator body and the heat sink assembly.

14. A projection device, comprising:

one or more spatial light modulators; and

one or more heat sinks, wherein each heat sink is for a respective one of the one or more spatial light modulators, wherein each of the one or more heat sinks is a heat sink as recited in any of claims 1-13.

15. The projection apparatus of claim 14, further comprising a heat exchanger configured to perform a heat exchange process on heat dissipated by the heat dissipation assembly of the heat dissipation device of the one or more spatial light modulators.

16. A projection device according to claim 14 or 15, wherein the heat sinks of said one or more spatial light modulators share a secondary air cooling component.

Technical Field

The application relates to the technical field of projection, in particular to a heat dissipation device and projection equipment.

Background

A spatial light modulator such as a DMD (Digital Micromirror Device) is an important Device of a projection apparatus, the light power that can be borne by the spatial light modulator often limits the brightness of the projection apparatus, and the maximum light power that can be borne by the spatial light modulator is limited by the upper temperature limit that can be borne by the spatial light modulator, so it is important to reasonably provide heat dissipation for the spatial light modulator.

Disclosure of Invention

The embodiment of the application provides a heat dissipation device for a spatial light modulator. The spatial light modulator comprises a spatial light modulator body and a control board which are connected, wherein the spatial light modulator body is provided with a front side surface and a back side surface, and the control board is positioned behind the back side surface. The heat dissipation device comprises a first heat conduction assembly, a heat dissipation assembly and a second heat conduction assembly, wherein the first heat conduction assembly is arranged on the front side face of the spatial light modulator body. The heat dissipation assembly is located behind the control panel. The second heat conducting assembly is connected between the first heat conducting assembly and the heat dissipation assembly and bypasses the control board of the spatial light modulator. The heat of the spatial light modulator is transferred to the second heat conducting assembly from the first heat conducting assembly and then transferred to the heat dissipation assembly.

In some embodiments, the second thermally conductive assembly includes a flexible thermally conductive portion made of a flexible material.

In some embodiments, the flexible thermal conductor comprises at least one of the following: one or more metal sheets; one or more flexible heat pipes.

In some embodiments, there is a gap between multiple metal sheets or between multiple flexible heat pipes.

In some embodiments, the heat sink further comprises a first connecting portion and a second connecting portion, and the second heat conducting assembly is connected to the first heat conducting assembly through the first connecting portion and connected to the heat dissipating assembly through the second connecting portion.

In some embodiments, the second heat conducting assembly further includes a first fixture block and a second fixture block respectively disposed at two ends of the flexible heat conducting portion, wherein the first connecting portion attaches the first fixture block to the first heat conducting assembly, and the second connecting portion attaches the second fixture block to the heat dissipating assembly.

In some embodiments, the first connection portion includes a pressure plate and a first fastener, wherein the first fastener secures the pressure plate to the first heat-conducting component and causes the first clip to be clamped between the pressure plate and the first heat-conducting component.

In some embodiments, the width of the first latch is less than the width of the platen such that the first fastener passes only through the platen.

In some embodiments, the second connecting portion includes a second fastener, wherein the second latch has at least one hole, and the second fastener is engaged with the at least one hole to attach the second latch to the heat sink assembly.

In some embodiments, the first heat conducting component is a temperature homogenizing sheet extending along the front side for homogenizing heat of the front side.

In some embodiments, the front side of the spatial light modulator body is the side facing the light rays incident on the spatial light modulator body.

In some embodiments, the heat dissipating device further comprises an auxiliary air-cooling component for auxiliary heat dissipation of the second heat conducting assembly, the auxiliary air-cooling component being arranged such that wind output from the auxiliary air-cooling component is conveyed in a direction parallel to the width of the second heat conducting assembly.

In some embodiments, the second thermally conductive assembly also bypasses one or more of the other devices between the spatial light modulator body and the heat sink assembly.

The embodiment of the application also provides projection equipment. The projection device comprises one or more spatial light modulators, and one or more heat dissipation devices, wherein each heat dissipation device is respectively used for one spatial light modulator in the one or more spatial light modulators, and each of the one or more heat dissipation devices is the heat dissipation device of any of the above embodiments.

In some embodiments, the projection apparatus further comprises a heat exchanger for performing a heat exchange process on heat dissipated by the heat dissipation assembly of the heat dissipation device of the one or more spatial light modulators.

In some embodiments, the heat sinks of one or more spatial light modulator assemblies share a secondary air-cooled component.

In heat abstractor and projection equipment that this application embodiment provided, first heat conduction subassembly sets up in the leading flank of spatial light modulator body, heat dissipation component sets up in the trailing flank of spatial light modulator body, second heat conduction subassembly is connected between first heat conduction subassembly and heat dissipation component, the heat that produces the spatial light modulator body transmits the second heat conduction subassembly through the first heat conduction subassembly of leading flank department, and conduct the heat dissipation component who is located the back of spatial light modulator body via the second heat conduction subassembly and dispel the heat, wherein, the control panel between spatial light modulator body and the heat dissipation component is walked around to the second heat conduction subassembly. The second heat conduction assembly bypasses the control board instead of opening the hole in the control board and directly penetrates through the control board, so that the spatial light modulator and the heat dissipation device thereof are easy to install and compact in structure, and meanwhile, the risk of damaging the wiring of the control board due to the opening of the control board can be avoided.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation device and a spatial light modulator according to an embodiment of the present application.

Fig. 2 is a schematic diagram of another perspective of the heat sink and spatial light modulator according to fig. 1.

Fig. 3 is a schematic cross-sectional view of the heat dissipation device according to fig. 1 and according to a light modulator structure.

Fig. 4 is a schematic structural diagram of a heat dissipation device and a spatial light modulator according to another embodiment of the present application.

Fig. 5 is a schematic structural diagram of a second heat conducting assembly of a heat dissipation device according to another embodiment of the present application.

Fig. 6 is a schematic structural diagram of a second heat conducting assembly of a heat dissipation device according to another embodiment of the present application.

Fig. 7 is a schematic structural diagram of a heat dissipation device and a spatial light modulator according to another embodiment of the present application.

Fig. 8 is a schematic structural diagram of a heat dissipation device and a spatial light modulator according to another embodiment of the present application.

Fig. 9 is a schematic structural diagram of a heat dissipation device and a spatial light modulator according to still another embodiment of the present application.

FIG. 10 is a schematic cross-sectional view of a projection device according to an embodiment of the present application.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Spatial light modulators are widely used in projection devices. For example, taking a DMD as an example, the light power that the DMD can bear often limits the brightness of a projection device, and the maximum light power that the DMD can bear is limited by the upper limit of the temperature that the DMD can bear. For a DMD to have good long-term reliability, according to the specifications provided by TI (Texas Instruments), it is necessary to ensure that the temperature of the front window of the DMD package and the temperature of the micromirror array inside the DMD package are within a certain range, and the absolute value of the temperature difference between them is within a certain range.

The increase in temperature of the front window of the DMD results from the light energy that it packages to directly absorb, including stray light and the spot size tolerance (overfilll) of the incident DMD in the optical design; although the internal micromirror array of the DMD emits most of the light, a small portion of the light leaks through the internal micromirror array due to the gap between the micromirror arrays, so that the light is irradiated onto the substrate of the micromirror array, resulting in an increase in the temperature of the back surface of the DMD. Since the temperature of the DMD package internal micromirror array cannot be directly measured, the temperature of the DMD package internal micromirror array is usually expressed in terms of the temperature of the back side of the DMD.

How to maximally improve the optical power that the spatial light modulator can bear without increasing the number of the spatial light modulators so as to improve the brightness of the projection device is important for controlling the temperature of the front window surface of the spatial light modulator, the temperature of the back surface of the spatial light modulator, and the temperature difference between the two temperatures.

In terms of optical design, the distance between the front window surface of the spatial light modulator and the optical machine prism of the projection equipment is generally small, and in order to control the temperature of the front window surface of the spatial light modulator in a narrow space, the heat dissipation design should be as simple and reliable as possible. For a projection device with general brightness, the heat dissipation design of the projection device only needs to consider the back heat dissipation measure of the spatial light modulator. When the brightness of the projector is high, that is, the optical power received by the spatial light modulator is high, because the thermal conductivity of the material (for example, Kovar alloy) used for packaging the spatial light modulator itself is not high (about 17W/m × K), the heat absorbed by the front window surface of the spatial light modulator is not as high as the heat dissipation device conducted to the back surface of the spatial light modulator, so that the temperature of the front window surface of the spatial light modulator is too high, or the temperature difference between the front surface and the back surface of the spatial light modulator exceeds the usage specification of the spatial light modulator, the reliability and the service life of the spatial light modulator will be significantly affected.

In the related art, a thin heat dissipation plate with high thermal conductivity is used on the front window surface of the spatial light modulator, and the thin heat dissipation plate is clamped by a clamp to be in contact with the front window surface, so that the heat dissipation area of the front window surface is increased by the thin heat dissipation plate. However, when the brightness of the whole machine is high, the thin heat dissipation plate can bear limited heat, resulting in poor heat dissipation effect. In addition, the heat dissipation device in the related art contains flowing refrigerants and is arranged on the front window surface of the spatial light modulator, the cooling effect of the refrigerant mode is good, but the manufacturing difficulty of the heat dissipation device is high due to the narrow space between the front window surface of the spatial light modulator and the prism, the heat dissipation device is not easy to manufacture a device with small size and complex structure, and the cost is increased.

Referring to fig. 1 and fig. 2, a heat dissipation device 140 is provided, and the heat dissipation device 140 is used for the spatial light modulator 120. The spatial light modulator 120 includes a spatial light modulator body 126 and a control board 128 connected. The spatial light modulator body 126 has a front side 122 and a back side 124, the front side 122 being opposite the back side 124. The front side 122 of the spatial light modulator body 126 may be a front window side, i.e., a side facing light rays incident to the spatial light modulator body 126. The back side 124 may be the other side of the spatial light modulator body 126 opposite the front side. The control Board 128 may be a Printed Circuit Board (PCB), the control Board 128 is located on the back side 124 of the spatial light modulator body 126, and the control Board 128 may be electrically connected with the spatial light modulator body 126 for controlling the operation of the spatial light modulator body 126.

In the embodiments of the present application, the terms of orientation such as "front" and "back" are compared with the relative positions of the elements in the examples, for example, in fig. 1, the spatial light modulator body 126 is located in front of the control board 128, the control board 128 is located behind the spatial light modulator body 126, and so on.

The heat dissipation device 140 includes a first heat conducting assembly 142, a heat dissipation assembly 144, and a second heat conducting assembly 146. The first heat conducting assembly 142 is disposed on the front side 122 of the spatial light modulator body 126, the heat sink assembly 144 is located behind the control board 128, and the second heat conducting assembly 146 is connected between the first heat conducting assembly 142 and the heat sink assembly 144 and bypasses the control board 128 of the spatial light modulator 120. With this structure, the heat of the spatial light modulator 120, especially the heat at the front side 122 of the spatial light modulator body 126, is transferred from the first heat conducting assembly 142 to the second heat conducting assembly 146, then to the heat dissipating assembly 144, and is dissipated by the heat dissipating assembly 144 or transferred elsewhere.

The present application is illustrated in the embodiments of fig. 1-10 with spatial light modulator 120 being a digital micromirror device as an example. It is understood that embodiments of the present disclosure are applicable to other types of spatial light modulators as well, and in other embodiments, spatial light modulator 120 may be other types of spatial light modulators.

In the above-described embodiment, when the second thermal conductive assembly 146 connects the first thermal conductive assembly 142 and the heat dissipation assembly 144, instead of opening a hole on the control board 128 between the first thermal conductive assembly 142 and the heat dissipation assembly 144 and directly passing through the control board 128, the second thermal conductive assembly 146 bypasses the control board 128, so that stress on the spatial light modulator body 126 can be reduced, and meanwhile, the problem that the wiring of the control board 128 is damaged due to the opening of the hole can be avoided, and the wiring risk of the control board 128 is reduced. In another embodiment, the second thermally conductive assembly 146, in addition to bypassing the control board 128, also bypasses one or more of the other components between the first thermally conductive assembly and the heat sink assembly.

The control board 128 is densely populated with components and does not require holes to be punched in the control board 128 because the second thermally conductive assembly 146 bypasses the control board 128, i.e., the second thermally conductive assembly 146 does not pass directly through the control board 128, thereby not affecting the routing on the control board 128, and does not risk failure thereof by passing through the wiring on the control board 128 when holes are punched in the control board 128. In addition, since the second heat conducting assembly 146 does not pass through the control board 128, it generates less stress to the spatial light modulator body 126 than the case of passing through the control board 128, so that the spatial light modulator body 126 is easier to mount and adjust and more stable in performance.

In some embodiments, the first heat conducting component 142 may be a temperature homogenizing sheet extending along the front side 122 for homogenizing heat of the front side 122, which helps avoid a local over-temperature condition of the front side 122. The first heat conducting member 142 may be made of a material having a large thermal conductivity, for example, the first heat conducting member 142 may be made of metal. In one embodiment, the first heat conducting component 142 is made of pure copper, and since the thermal conductivity of pure copper is about 381W/mK, the heat of the front side 122 of the spatial light modulator body 126 can be well homogenized and dissipated, and the heat generated by the spatial light modulator body 126 on the front side 122 can also be well conducted to the second heat conducting component 146. The first heat conducting component 142 may be a sheet structure with a simple structure, which is helpful for the first heat conducting component 142 to dissipate and conduct heat to the spatial light modulator body 126 in a narrow space.

The second heat conducting assembly 146 is respectively in contact with the first heat conducting assembly 142 and the heat dissipating assembly 144, so that heat generated by the front side surface 122 of the spatial light modulator 120 can be conducted to the heat dissipating assembly 144 through the first heat conducting assembly 142 and the second heat conducting assembly 146 to dissipate heat, the temperature of the front side surface 122 and the temperature difference between the front side surface 122 and the rear side surface 124 can be reduced, the stability of the work of the spatial light modulator body 126 is facilitated, the service life of the spatial light modulator body 126 is prolonged, and the brightness of the projection device can be well improved without excessively increasing the number of the spatial light modulator bodies 126. The contact between the second heat conducting assembly 146 and the first heat conducting assembly 142 and the contact between the second heat conducting assembly 146 and the heat dissipating assembly 144 may be coated or added with an interface material for reducing interface thermal resistance, such as a heat conducting paste, a heat conducting pad, a graphite sheet, or graphene, so as to reduce the thermal resistance between the second heat conducting assembly 146 and the first heat conducting assembly 142 or the heat dissipating assembly 144, and improve the heat conduction effect between the second heat conducting assembly 146 and the first heat conducting assembly 142 or the heat dissipating assembly 144. In addition, in addition to the interface material coated or added at the contact position of the second heat conducting assembly 146 with the first heat conducting assembly 142 and the contact position of the heat dissipating assembly 144, the interface material for reducing the interface thermal resistance may also be coated or added at other positions of the second heat conducting assembly 146, for example, the interface material as described above is coated or added on the two side surfaces of the second heat conducting assembly 146, so that the rate of dissipating the heat of the second heat conducting assembly 146 into the air environment may be increased, and the heat dissipating effect of the heat dissipating device 140 may be further improved.

The number of the second heat-conducting assemblies 146 may be one or more, for example, as in the embodiment shown in fig. 1, the number of the second heat-conducting assemblies 146 is one, and the first heat-conducting assembly 142 and the heat dissipation assembly 144 conduct heat through one second heat-conducting assembly 146. For example, in the embodiment shown in fig. 3 and 4, the number of the second heat-conducting assemblies 146 is two, and the two second heat-conducting assemblies 146 are respectively connected to the opposite sides of the heat dissipation assembly 144 from the opposite sides of the first heat-conducting assembly 142 bypassing the control board 128 (not shown in fig. 4). In other embodiments, the number of the second heat-conducting assemblies 146 may also be three or four, etc.

The heat dissipation assembly 144 is used to directly conduct and dissipate heat from the back side 124 of the spatial light modulator body 126, on the one hand, and conduct and dissipate heat from the front side 122 of the spatial light modulator body 126 through the second heat conduction assembly 146 and the first heat conduction assembly 142, on the other hand, and dissipate the heat into, for example, an air environment or other medium or to other locations. The term "dissipating heat" as used herein includes heat exchange treatment of heat.

For example, heat dissipation assembly 144 may include a heat sink element 1442, a cooling element 1444, and a heat sink element 1446, with the heat sink element 1442, the cooling element 1444, and the heat sink element 1446 being stacked in series. A heat sink element 1442 may be coupled to the second thermally conductive assembly 146 and may also be in contact with the spatial light modulator body 126, such as heat sink element 1442 being in contact with the back side 124, such that the heat sink element 1442 may dissipate and conduct heat from the front side 122 of the spatial light modulator body 126 and the back side 124 of the spatial light modulator body 126, as well as conduct heat to the cooling elements 1444. Since the front side 122 and the back side 124 of the spatial light modulator body 126 are connected by the first heat conducting assembly 142, the second heat conducting assembly 146, and the heat dissipating assembly 144 (the heat sink element 1442), the temperature difference therebetween can be eliminated or reduced.

The cooling element 1444 is disposed between the heat sink element 1442 and the heat sink element 1446. The cooling element 1444 is used to dissipate and conduct heat from the heat sink element 1442 to the heat dissipating element 1446. The cooling element 1444 may be a Peltier (Peltier) element, such as a semiconductor cooling chip (TEC). The heat dissipating element 1446 is used to dissipate heat from the cooling element 1444. The heat dissipating element 1446 may have a heat dissipating fin structure, so as to increase a contact area between the heat dissipating element 1446 and air, and improve a heat dissipating effect of the heat dissipating element 1446.

The first heat conducting assembly 142 of the heat dissipation device 140 provided in the embodiment of the present application is disposed on the front side surface 122 of the spatial light modulator 120, the heat dissipation assembly 144 is disposed on the rear side surface 124 of the spatial light modulator 120, and the second heat conducting assembly 146 is connected between the first heat conducting assembly 142 and the heat dissipation assembly 144, so that heat generated by the spatial light modulator 120 is transferred to the second heat conducting assembly 146 through the first heat conducting assembly 142 on the front side surface 122, and is conducted to the heat dissipation assembly 144 behind the spatial light modulator body 126 via the second heat conducting assembly 146 for heat dissipation, wherein the second heat conducting assembly 146 bypasses the control board 128 between the spatial light modulator body 126 and the heat dissipation assembly 144. The second thermally conductive assembly 146 bypasses the control board 128 rather than opening a hole in the control board 128 and passing directly through the control board 128 allows the spatial light modulator 120 and its heat sink 140 to be easily mounted and compact while avoiding damage to the traces of the control board 128 due to opening a hole in the control board 128.

The second thermally conductive assembly 146 may be made of a material having a relatively high thermal conductivity to increase the rate and efficiency of heat transfer from the front side 122 to the rear side 124.

In some embodiments, referring to fig. 5 and 8, the second heat conducting assembly 146 may include a flexible heat conducting portion 1464 as a main body of the second heat conducting assembly 146, and the flexible heat conducting portion 1464 may be made of a flexible material, so as to facilitate the bending deformation of the flexible heat conducting portion 1464. The main body of the second heat-conducting assembly 146 is made of a flexible material and can be deformed adaptively according to the installation space, so that the space can be saved and the structure of the apparatus can be more compact. In addition, due to the use of the flexible material, the stress generated by the second thermal conductive assembly 146 on the spatial light modulator 120 is greatly reduced, so that the performance stability of the spatial light modulator 120 can be improved.

In some embodiments, referring to fig. 6, the flexible thermal conductor 1464 comprises at least one of the following: one or more metal sheets 1464a, one or more flexible heat pipes 1464 a. In some embodiments, gaps are provided between the plurality of metal sheets and between the plurality of flexible heat pipes for better heat dissipation and conduction.

For example, as shown in fig. 5, the flexible heat conducting portion 1464 may be composed of a metal sheet 1464a, for example, the metal sheet 1464a may be a copper sheet or other metal sheet with high thermal conductivity and good flexibility, so that the flexible heat conducting portion 1464 has good heat dissipation and heat conduction functions. In other embodiments, the flexible heat-conducting portion 1464 may comprise a plurality of metal sheets. For example, as shown in fig. 6 and 7, the flexible heat conducting portion 1464 includes a plurality of metal sheets 1464a stacked in a stack, wherein the plurality of metal sheets 1464a are spaced apart by a distance to ensure sufficient heat dissipation of each metal sheet 1464 a. The "plurality" herein means two or more, and may be, for example, two or three or four or more. The plurality of metal sheets 1464a contribute to enhancement of heat dissipation and heat conduction effects of the flexible heat conduction portion 1464. The voids provided between the multiple layers of sheet metal 1464a help sheet metal 1464a dissipate heat into the air environment of the voids.

As another example, the flexible heat conduction portion 1464 may also be a flexible heat pipe that can change its shape according to the shape of the space. For example, by using a super-hydrophilic copper oxide mesh as a capillary structure for a flexible heat pipe, the horizontal thermal conductivity can reach 1000W/m K, and the vertical effective thermal conductivity can reach 3000W/m K. In another example, the flexible heat pipe may use a copper corrugated pipe as the heat pipe and a copper mesh as the capillary structure inside, so as to have good heat dissipation and heat conduction functions and good flexibility. Similarly, the flexible heat conducting portion 1464 may comprise a plurality of flexible heat pipes spaced apart to ensure adequate heat dissipation from each flexible heat pipe. The plurality of flexible heat pipes spaced apart by the gap helps to enhance the heat dissipation and conduction effects of the flexible heat conduction portion 1464. The gaps between the plurality of flexible heat pipes help the flexible heat pipes to dissipate heat into the air environment of the gaps. By using one or more flexible heat pipes as the flexible heat conducting portion 1464, the first heat conducting assembly 146 on the front side 122 and the heat dissipating assembly 144 on the rear side 124 can be connected to bypass the control board 128 of the spatial light modulator 120 and other components located between the front side 122 and the heat dissipating assembly 144 on the rear side 124 of the spatial light modulator body 126, and at the same time, the spatial light modulator 120 has good stability and is suitable for the case of multi-angle installation of the projector.

In some embodiments, referring to fig. 8, the heat dissipation device 140 further includes a first connection portion 145 and a second connection portion 147, and the second heat conduction element 146 is connected to the first heat conduction element 142 through the first connection portion 145 and connected to the heat dissipation element 144 through the second connection portion 147. The first connection portion 145 may fix the second heat conduction assembly 146 and the first heat conduction assembly 142 to help enhance the stability of the connection of the second heat conduction assembly 146 and the first heat conduction assembly 142, and the second connection portion 147 may fix the second heat conduction assembly 146 and the heat dissipation assembly 144 to help enhance the stability of the connection of the second heat conduction assembly 146 and the heat dissipation assembly 144.

The second heat conducting assembly 146 may be connected to the first heat conducting assembly 142 and the heat dissipation assembly 144 in a variety of ways. For example, welding may be used, or fixing may be performed using a connecting member.

In some embodiments, referring to fig. 5, 6 and 8, the second heat-conducting assembly 146 includes a first latch 1462 and a second latch 1466 respectively disposed at two ends of the flexible heat-conducting portion 1464 as connecting members. Wherein the first connection portion 145 attaches the first latch 1462 to the first heat-conducting assembly 142, and the second connection portion 147 attaches the second latch 1466 to the heat sink assembly 144. Thus, the first and second latches 1462 and 1466 cooperate with the first and second connection portions 145 and 147 of the heat sink 140, respectively, to connect the second heat-conducting assembly 146 to the first heat-conducting assembly 142 and the heat sink assembly 144.

In some embodiments, the first connection portion 145 includes a pressure plate 1452 and first fasteners 1454, wherein the first fasteners 1454 secure the pressure plate 1452 to the first heat-conducting assembly 142 and such that the first clip 1462 is clamped between the pressure plate 1452 and the first heat-conducting assembly 142. The pressure plate 1452 may be in the form of a long plate or other shape, and may be rigid or have some flexibility. The first fasteners 1454 may be any fixing device capable of fixing the pressure plate 1452 to the first heat-conducting assembly 142. For example, the first fasteners 1454 may be nails, studs, etc., having threads or not, fastened by being inserted into and fixed to holes, having threads or not, on the pressure plate 1452 and the first heat-conducting assembly 142. The number of the first fasteners 1454 may be one or more, for example, the number of the first fasteners 1454 is two, and two first fasteners 1454 are respectively mounted to both ends of the pressure plate 1452.

In one example, the pressure plate 1452, the first latch 1462, and the first heat-conducting assembly 142 may each be provided with holes corresponding to the first fasteners 1454, such that the first fasteners 1454 may sequentially pass through the holes of the pressure plate 1452 and the first latch 1462 and be fixed within the holes of the first heat-conducting assembly 142, thereby allowing the pressure plate 1452 to fix the first latch 1462 to the first heat-conducting assembly 142.

In other examples, the width of the first latch 1462 is less than the width of the pressure plate 1452, such that the first fastener 1454 passes through only a hole in the pressure plate 1452 to a hole in the first heat-conducting assembly 142, thereby compressively securing the first latch 1462 therebetween to the first heat-conducting assembly 142 by securing the pressure plate 1452 to the first heat-conducting assembly 142. Therefore, the first heat conducting assembly 142 can be prevented from being provided with corresponding holes, and the structure of the first heat conducting assembly 142 can be simplified. The width of the first latch 1462 refers to the width of the first latch 1462 in the X direction in fig. 8, and similarly, the width of the pressure plate 1452 refers to the width of the pressure plate 1452 in the X direction in fig. 8. That is, if a direction in which the second heat conductive member 146 connects the first heat conductive member 142 and the heat dissipation member 144 is referred to as a length direction of the second heat conductive member 146, the X direction is a width direction of the second heat conductive member 146.

In some embodiments, second coupling portion 147 includes a second fastener 1472. The second fastener 1472 may be any fastening device that can fasten the second latch 1466 to the heat sink assembly 144. For example, the second fastener 1472 may be a threaded or unthreaded nail, stud, or like fastener that is inserted into and secured to the second fixture 1466 and the heat sink assembly 144 in a threaded or unthreaded hole. In one example, the second cartridge 1466 is provided with at least one hole 1467, and the second fastener 1472 cooperates with the at least one hole 1467 to attach the second cartridge 1466 to the heatsink assembly 144.

For example, the second fasteners 1472 may be countersunk screws, with the number of second fasteners 1472 corresponding to the number of holes 1467, e.g., with three holes 1467, and then three second fasteners 1472. The heat sink assembly 144 may be provided with holes (not shown) corresponding to the holes 1467 that may be provided in the heat sink element 1442 such that the second fastener 1472 may pass through the hole 1467 of the second cartridge 1466 to and be secured within the holes of the heat sink assembly 144 such that the second attachment portion 147 secures the second cartridge 1466 to the heat sink assembly 144.

Interface materials for reducing interface thermal resistance, such as thermal paste, thermal pads, graphite sheets, or graphene, may be coated or added at the contact between the first fixture 1462 and the first thermal conductive assembly 142 and the contact between the second fixture 1466 and the heat dissipation assembly 144, so as to reduce the thermal resistance between the second thermal conductive assembly 146 and the first thermal conductive assembly 142 or the heat dissipation assembly 144, and improve the thermal conduction effect between the second thermal conductive assembly 146 and the first thermal conductive assembly 142 or the heat dissipation assembly 144.

In addition, in addition to the interface material coated or added at the contact position of the second heat conducting assembly 146 with the first heat conducting assembly 142 and the contact position of the heat dissipating assembly 144, the interface material for reducing the interface thermal resistance may also be coated or added at other positions of the second heat conducting assembly 146, for example, the interface material as described above is coated or added on the two side surfaces of the second heat conducting assembly 146, so that the rate of dissipating the heat of the second heat conducting assembly 146 into the air environment may be increased, and the heat dissipating effect of the heat dissipating device 140 may be further improved.

In some embodiments, the heat sink 140 further includes an auxiliary air-cooling component 141 for auxiliary heat dissipation of the second heat conducting assembly 146, and the auxiliary air-cooling component 141 is disposed such that the wind output from the auxiliary air-cooling component 141 is conveyed in a direction parallel to the width (i.e., width direction) of the second heat conducting assembly 146. The auxiliary air cooling part 141 may be a fan or other air circulation device. The auxiliary air-cooling member 141 is used to dissipate heat from the second heat-conducting assembly 146, so that the heat of the second heat-conducting assembly 146 can be dissipated to the external environment at a higher rate. The width of the second heat-conducting assembly 146 refers to the width of the second heat-conducting assembly 146 along the X-direction in fig. 9.

Referring to fig. 10, a projection apparatus 10 is further provided in the embodiment of the present application. Projection apparatus 10 includes one or more spatial light modulators 120, and one or more heat sinks 100, one heat sink 100 for each spatial light modulator 120 of the one or more spatial light modulators 120, respectively, each of the one or more heat sinks 100 being a heat sink 100 of any of the embodiments described above.

For example, there is one spatial light modulator 120, one heat sink 100, and the one heat sink 100 dissipates heat for the spatial light modulator 120. For another example, there are two spatial light modulators 120 and two heat sinks 100, and each heat sink 100 dissipates heat to a corresponding one of the spatial light modulators 120. In this embodiment, there are three spatial light modulators 120 and three heat sinks 100, and each heat sink 100 dissipates heat to a corresponding one of the spatial light modulators 120. It will be appreciated that the projection device 10 may also comprise more spatial light modulators and corresponding heat sinks.

In the embodiment shown in fig. 10, each spatial light modulator 120 has a corresponding heat dissipation device 100, and each heat dissipation device 100 includes the first heat conducting element 142, the second heat conducting element 144 and the heat dissipation element 146 as described above, which will not be described herein again.

In some embodiments, referring to fig. 10, the projection apparatus 10 further includes a heat exchanger 1482, where the heat exchanger 1482 may be shared by the heat sinks 100 of the plurality of spatial light modulators 120 for performing a heat exchange process on heat dissipated by the plurality of heat sinks 140. In one example, the heat exchanger 1482 and each heat sink 140 can be connected by a water pump 1484, a conduit 1486, and the like, such as the conduit 1486 connecting and looping through the heat sink assembly 144, the heat exchanger 1482, and the water pump 1484 of the heat sink 140. Conduit 1486 may be connected with heat dissipating elements 1446 of heat dissipating assembly 144. The pipeline 1486 can be filled with cooling liquid, and the temperature of the cooling liquid rises after flowing through the heat dissipation element 1446; the coolant with higher temperature near the heat dissipation element 1446 can be conveyed to the heat exchanger 1482 by being pumped by the water pump 1484, the coolant with higher temperature releases heat in the heat exchanger 1482, and the heat is conducted to the external environment through the heat exchanger 1482, so that the temperature of the coolant with higher temperature is reduced; in addition, under the suction of the water pump 1484, the coolant with a low temperature in the heat exchanger 1482 may be re-delivered to the vicinity of the heat dissipation element 1446 and dissipate heat for the heat dissipation element 1446, so as to form a water circulation, thereby improving the heat dissipation effect of the heat dissipation assembly 144.

In some embodiments, for example, referring to fig. 10, the heat sinks 140 of a plurality of light modulator modules 100 may also share one auxiliary air-cooling component 143, that is, one auxiliary air-cooling component 143 dissipates heat for all the heat sinks 140, so that the number of auxiliary air-cooling components 143 can be reduced, and the space of the apparatus can be saved.

Referring to fig. 10, the projection apparatus 10 may further include a positioning member 110 for positioning and adjusting the spatial light modulator 100. The positioning member 110 has a positioning boss 1100 for positioning the light modulator body 126. The first heat-conducting assembly 142 may be provided with an avoiding through hole 1420 such that the positioning post 1100 may be connected with the light modulator body 126 through the avoiding through hole 1420.

In this application, the terms "mounted," "connected," "secured," and the like are to be construed broadly unless otherwise specifically stated or limited. For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through the inside of two elements, or they may be connected only through surface contact or through surface contact of an intermediate member. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "first," "second," and the like are used merely for distinguishing between descriptions and not intended to imply or imply a particular structure. The description of the terms "some embodiments," "other embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this application, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this application can be combined and combined by those skilled in the art without contradiction.

The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.