阅读说明：本技术 芯片换热器及变频空调器 (Chip heat exchanger and variable frequency air conditioner ) 是由 董旭 王飞 罗荣邦 王晓春 于 2019-01-11 设计创作，主要内容包括：本发明公开了一种芯片换热器及变频空调器,属于芯片散热领域,芯片换热器包括；热管、毛细管、室外换热器、室内换热器和压缩机；所述热管的蒸发段设置在空调器电脑板的芯片下方,所述热管的冷凝段上缠绕所述毛细管,且所述毛细管的第一端与所述室内换热器相连接,所述毛细管的第二端与所述室外换热器相连接,所述室内换热器和所述室外换热器分别与所述压缩机相连接。本方案中,热管的蒸发段吸收热量,冷凝段释放热量,通过连接毛细管,让热管冷媒充分放热冷凝,降低芯片温度,解决夏季高温环境下,变频空调器电脑板的芯片散热不良,导致制冷升频慢、难,控制逻辑易报错,制冷量不足,运行耗电量大,引发用户抱怨的问题。(The invention discloses a chip heat exchanger and a variable frequency air conditioner, belonging to the field of chip heat dissipation, wherein the chip heat exchanger comprises a heat sink; the heat pipe, the capillary tube, the outdoor heat exchanger, the indoor heat exchanger and the compressor; the evaporation section of the heat pipe is arranged below a chip of a computer board of an air conditioner, the condensation section of the heat pipe is wound with the capillary tube, the first end of the capillary tube is connected with the indoor heat exchanger, the second end of the capillary tube is connected with the outdoor heat exchanger, and the indoor heat exchanger and the outdoor heat exchanger are respectively connected with the compressor. In this scheme, the evaporation zone absorption heat of heat pipe, condensation segment release heat, through connecting the capillary, let the heat pipe refrigerant fully exothermic condensation, reduce chip temperature, solve under the high temperature environment in summer, the chip heat dissipation of frequency conversion air conditioner computer board is bad, leads to the refrigeration to rise frequently slow, difficult, and control logic easily reports the mistake, and the refrigerating output is not enough, and operation power consumption is big, causes the problem of user complain.)

1. A chip heat exchanger, comprising; the heat pipe, the capillary tube, the outdoor heat exchanger, the indoor heat exchanger and the compressor;

the evaporation section of the heat pipe is arranged below a chip of a computer board of an air conditioner, the condensation section of the heat pipe is wound with the capillary tube, the first end of the capillary tube is connected with the indoor heat exchanger, the second end of the capillary tube is connected with the outdoor heat exchanger, and the indoor heat exchanger and the outdoor heat exchanger are respectively connected with the compressor.

2. The chip heat exchanger according to claim 1,

the capillary tube is spirally wound on the condensation section.

3. The chip heat exchanger according to claim 2,

the condensation section is a straight pipe section.

4. The chip heat exchanger according to claim 2,

the condensation section is a U-shaped pipe section.

5. The chip heat exchanger according to claim 1,

the evaporation section is arranged along the length direction of the chip.

6. The chip heat exchanger according to claim 5,

the area of the evaporation section is 3/4 of the area of the chip.

7. The chip heat exchanger according to claim 1,

the pipe diameter of the capillary pipe can be thickened to a preset value, so that the capillary pipe can achieve a refrigerant throttling effect.

8. The chip heat exchanger according to any one of claims 1 to 7,

the capillary is close to the connecting end of the indoor heat exchanger and is arranged spirally.

9. The chip heat exchanger according to claim 8,

the device also comprises a four-way valve; the first port of the four-way valve is connected with one port of the compressor, the second port of the four-way valve is communicated with the indoor heat exchanger, the third port of the four-way valve is communicated with the other port of the compressor, and the fourth port of the four-way valve is communicated with the outdoor heat exchanger.

10. An inverter air conditioner, characterized in that it comprises a chip heat exchanger according to any one of claims 1 to 9.

Technical Field

The invention relates to the technical field of air conditioners, in particular to a chip heat exchanger and a frequency converter air conditioner.

Background

At present, in a high-temperature environment in summer, the chip of the computer board of the variable-frequency air conditioner has poor heat dissipation, so that the frequency rise of refrigeration is slow and difficult, the control logic is easy to report errors, the refrigerating capacity is insufficient, the running power consumption is large, and the complaint of users is caused. The environment temperature is T3 under the working condition (53 ℃) or higher, the ambient air temperature of the frequency conversion chip is plus 10 ℃ (63 ℃), the difference value between the heat source temperature (68-120 ℃) of the computer board and the environment temperature (5-57 ℃) is reduced, the heat dissipation power is reduced, even the computer board is burnt, the system is down, and hardware faults are caused.

Disclosure of Invention

The embodiment of the invention provides a chip heat exchanger and a frequency converter air conditioner, which at least solve one of the technical problems in the prior art. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.

According to a first aspect of embodiments of the present invention, there is provided a chip heat exchanger;

in some alternative embodiments, the chip heat exchanger comprises; the heat pipe, the capillary tube, the outdoor heat exchanger, the indoor heat exchanger and the compressor;

the evaporation section of the heat pipe is arranged below a chip of a computer board of an air conditioner, the condensation section of the heat pipe is wound with the capillary tube, the first end of the capillary tube is connected with the indoor heat exchanger, the second end of the capillary tube is connected with the outdoor heat exchanger, and the indoor heat exchanger and the outdoor heat exchanger are respectively connected with the compressor.

In some alternative embodiments, further, the capillary tube is helically wound around the condenser section.

In some optional embodiments, further, the condensation section is a straight pipe section.

In some alternative embodiments, further, the condensation section is a U-shaped section.

In some optional embodiments, further, the evaporation section is disposed along a length direction of the chip.

In some optional embodiments, further, the area of the evaporation section is 3/4 of the area of the chip.

In some optional embodiments, further, the diameter of the capillary tube can be thickened to a preset value, so that the capillary tube can achieve a refrigerant throttling effect.

In some optional embodiments, further, the capillary tube is spirally disposed near the connection end of the indoor heat exchanger.

In some optional embodiments, further, the chip heat exchanger further comprises a four-way valve; the first port of the four-way valve is connected with one port of the compressor, the second port of the four-way valve is communicated with the indoor heat exchanger, the third port of the four-way valve is communicated with the other port of the compressor, and the fourth port of the four-way valve is communicated with the outdoor heat exchanger.

According to a second aspect of the embodiments of the present invention, there is provided an inverter air conditioner;

in some optional embodiments, the inverter air conditioner comprises the chip heat exchanger in any one of the optional embodiments.

The technical scheme provided by the embodiment of the invention has the following beneficial effects:

the evaporation zone of heat pipe absorbs the heat, arranges the below of chip in the computer board in, and the condensation zone releases the heat, through connecting the capillary, lets the heat pipe refrigerant fully release heat condensation, and the intraductal system refrigerant heat absorption inflation of capillary simultaneously realizes the throttle effect, and in addition, because the radiating thermal current density of heat pipe is great, the pipe diameter of capillary can be thickened, has both reached refrigerant throttle effect, can reduce the production degree of difficulty of capillary again, and then reduction in production cost. In the refrigeration and heating circulation, the capillary tube plays a throttling role, can be combined with absorbed heat through increasing the tube diameter, equivalently realizes the throttling expansion effect of the system refrigerant, so that a check valve is not needed to control the heat dissipation of the refrigeration and heating conditions to the condensation section of the heat pipe, the production cost is reduced, and meanwhile, the heat pipe does not need to be driven by electric power, and the self-circulation of the density difference of the refrigerant can be realized.

1. The temperature of the chip is reduced, and the problems that in a high-temperature environment in summer, the chip of the computer board of the variable-frequency air conditioner has poor heat dissipation, so that the frequency rising of refrigeration is slow and difficult, the control logic is easy to report errors, the refrigerating capacity is insufficient, the running power consumption is high, and the complaint of users is caused are solved;

2. because the heat-dissipating heat flow density of the heat pipe is larger, the pipe diameter of the capillary can be thickened, thereby not only achieving the throttling effect of the refrigerant, but also reducing the production difficulty of the capillary, further reducing the production cost and shortening the length of the capillary;

3. in the refrigeration and heating circulation, the capillary tube plays a throttling role, and can equivalently realize the throttling expansion effect of the system refrigerant by increasing the pipe diameter and combining to absorb heat, so that a check valve is not needed to control the heat dissipation of the refrigeration and heating conditions on the condensation section of the heat pipe, and the production cost is reduced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic diagram illustrating a chip heat exchanger according to an exemplary embodiment.

Reference numerals:

1-computer board; 2-a heat pipe; 21-an evaporation section; 22-a condensation section; 3-indoor heat exchanger; 4-a capillary tube; 5-outdoor heat exchanger; 6-a compressor; 7-four-way valve.

Detailed Description

The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed. Herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. As for the methods, products and the like disclosed by the embodiments, the description is simple because the methods correspond to the method parts disclosed by the embodiments, and the related parts can be referred to the method parts for description.

According to a first aspect of embodiments of the present invention, there is provided a chip heat exchanger;

as shown in fig. 1, in some alternative embodiments, the chip heat exchanger includes; the heat pipe 2, the capillary tube 4, the outdoor heat exchanger 5, the indoor heat exchanger 3 and the compressor 6;

the evaporation section 21 of the heat pipe 2 is arranged below a chip of the computer board 1 of the air conditioner, the condensation section 22 of the heat pipe 2 is wound with the capillary tube 4, the first end of the capillary tube 4 is connected with the indoor heat exchanger 3, the second end of the capillary tube 4 is connected with the outdoor heat exchanger 5, and the indoor heat exchanger 3 and the outdoor heat exchanger 5 are respectively connected with the compressor 6.

In this embodiment, the evaporation zone 21 of the heat pipe 2 absorbs heat and is arranged below the chip in the computer board 1, the condensation zone 22 releases heat, and by connecting the capillary tube 4, the refrigerant of the heat pipe 2 fully releases heat for condensation, and meanwhile, the refrigerant of the system in the capillary tube 4 absorbs heat for expansion, so that the throttling effect is realized, the temperature of the chip is reduced, and under the high-temperature environment in summer, the heat dissipation of the chip of the computer board of the variable-frequency air conditioner is poor, so that the frequency rise of refrigeration is slow and difficult, the control logic is easy to report errors, the refrigeration capacity is insufficient, the operation power consumption is large, and the problem.

In some alternative embodiments, further, as shown in fig. 1, the capillary tube 4 is spirally wound around the condensing section 22.

In this embodiment, the condensation section 22 of the heat pipe 2 releases heat to the capillary 4 wound around the condensation section 22 of the heat pipe 2, so that the refrigerant in the heat pipe 2 is fully cooled and condensed, and the condensation section 22 releases heat better, thereby improving the heat dissipation efficiency.

In some alternative embodiments, further, as shown in fig. 1, the condenser section 22 is a straight pipe section.

In this embodiment, the condensation section 22 may be a straight pipe section, but alternatively, the condensation section 22 may also be a U-shaped pipe section.

In some optional embodiments, further, the evaporation section 21 is disposed along the length direction of the chip.

In this embodiment, the evaporation section 21 is arranged along the length direction of the chip, so that the contact area between the evaporation section 21 and the chip is larger, and the effect of evaporation heat absorption of the evaporation section 21 is improved.

In some optional embodiments, further, the area of the evaporation section 21 is 3/4 of the area of the chip.

In this embodiment, the area of the evaporation section 21 is close to the area of the chip, so that the contact area between the evaporation section 21 and the chip is larger, and the effect of evaporation heat absorption of the evaporation section 21 is improved.

In some optional embodiments, further, the diameter of the capillary tube 4 can be thickened to a preset value, so that the capillary tube 4 can achieve a refrigerant throttling effect.

In this embodiment, since the heat dissipation of the heat pipe 2 has a large heat flux density, the diameter of the capillary tube 4 can be increased, which not only achieves the refrigerant throttling effect, but also reduces the production difficulty of the capillary tube 4, thereby reducing the production cost and shortening the length of the capillary tube 4.

In some alternative embodiments, further, as shown in fig. 1, the capillary tube 4 is spirally disposed near the connection end of the indoor heat exchanger 3.

In the embodiment, in the refrigeration and heating cycle, the capillary tube 4 plays a throttling role, and can equivalently realize the throttling expansion effect of the system refrigerant by increasing the tube diameter and combining with absorbed heat, so that a check valve is not needed to control the heat dissipation of the refrigeration and heating condition on the condensation section 22 of the heat pipe 2, and the production cost is reduced.

In some optional embodiments, further, the chip heat exchanger further comprises a four-way valve 7; the first port of the four-way valve 7 is connected with one port of the compressor 6, the second port of the four-way valve 7 is communicated with the indoor heat exchanger 3, the third port of the four-way valve 7 is communicated with the other port of the compressor 6, and the fourth port of the four-way valve 7 is communicated with the outdoor heat exchanger 5, so that the flowing trend of cold flow is better realized.

In a specific embodiment, as shown in fig. 1, an evaporation section 21 of the heat pipe 2 is disposed below a chip of a computer board 1 of an air conditioner, a condensation section 22 of the heat pipe 2 is wound with the capillary tube 4, a first end of the capillary tube 4 is connected with the indoor heat exchanger 3, a second end of the capillary tube 4 is connected with the outdoor heat exchanger 5, the indoor heat exchanger 3 and the outdoor heat exchanger 5 are respectively connected with the compressor 6, a first port of the four-way valve 7 is connected with one port of the compressor 6, a second port of the four-way valve 7 is communicated with the indoor heat exchanger 3, a third port of the four-way valve 7 is communicated with the other port of the compressor 6, a fourth port of the four-way valve 7 is communicated with the outdoor heat exchanger 5, the condensation section 22 is a straight pipe section, and the capillary tube 4 is spirally wound on the condensation section 22, the pipe diameter of capillary 4 can be thickened to the default, so that capillary 4 can reach the refrigerant throttle effect, capillary 4 is close to indoor heat exchanger 3's link is the heliciform setting, the evaporation zone 21 of heat pipe 2 absorbs the heat, arrange the below of chip in computer board 1 in, condensation segment 22 releases the heat, through connecting capillary 4, let 2 refrigerants of heat pipe fully release heat condensation, the internal system refrigerant heat absorption expansion of capillary 4 simultaneously realizes the throttle effect, in addition, because heat pipe 2 radiating heat flux density is great, capillary 4's pipe diameter can be thickened, both reached refrigerant throttle effect, can reduce capillary 4's the production degree of difficulty again, and then reduction in production cost. In the refrigeration and heating circulation, the capillary tube 4 plays a throttling role, can be combined with absorbed heat through increasing the tube diameter, equivalently realizes the throttling expansion effect of the system refrigerant, so that a check valve is not needed to control the heat dissipation of the refrigeration and heating conditions on the condensation section 22 of the heat pipe 2, the production cost is reduced, and meanwhile, the heat pipe 2 is not needed to be driven by electric power, and the self-circulation of the refrigerant density difference can be realized.

According to a second aspect of the embodiments of the present invention, there is provided an inverter air conditioner;

in some optional embodiments, the inverter air conditioner comprises the chip heat exchanger in any one of the optional embodiments.

The inverter air conditioner that the second aspect provided has the chip heat exchanger that the first aspect provided, consequently has the whole beneficial effect of the chip heat exchanger that the first aspect provided, and it is not repeated here.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.