阅读说明：本技术 片状放大器洁净控制结构和方法 (Chip amplifier cleaning control structure and method ) 是由 李养帅 朱健强 马伟新 周申蕾 张艳丽 王冰艳 于 2020-04-08 设计创作，主要内容包括：一种片状激光放大器洁净控制结构和方法,包括进气装置和吸气装置,采用“主动吸气+被动进气+主动进气”相结合的方式,实现放大器腔体内的洁净控制。本发明具有构思巧妙,简单易行,相对于片状放大器传统洁净控制方法降低了片状放大器腔体的密封性,减少了耗气量。(A cleaning control structure and method for a sheet laser amplifier comprises an air inlet device and an air suction device, and the cleaning control in an amplifier cavity is realized by adopting a mode of combining active air suction, passive air suction and active air suction. The invention has the advantages of ingenious conception, simplicity and feasibility, reduces the sealing property of the cavity of the chip amplifier and reduces the gas consumption compared with the traditional clean control method of the chip amplifier.)

1. A chip amplifier cleaning control structure is characterized by comprising an air inlet device (3) and an air suction device (10):

the air inlet device (3) comprises an air source (1), a switch A (2), an air inlet pipe (4) and an air inlet chamber (5), wherein the air source (1) is connected with the air inlet chamber (5) through the air inlet pipe (4), the switch A (2) is arranged on the air inlet pipe (4), and air inlets are distributed on a triangular bottom plate of the air inlet chamber along side lines;

the air suction device (10) comprises an air suction chamber (6), an air suction pipe (7), a switch B (9) and an air pump (8), wherein the air pump (8) is connected with the air suction chamber (6) through the air suction pipe (7), the air suction pipe (7) is provided with the switch B (9), air suction ports are distributed on a triangular bottom plate of the air suction chamber (6) along a side line, and the size, the shape and the position of the air suction ports are the same as those of the air suction ports on the triangular bottom plate of the air suction chamber; the air inlet device (3) is connected with the top of the cavity of the chip amplifier to be cleaned through the triangular bottom plate of the air inlet chamber (5), and the bottom of the cavity of the chip amplifier to be cleaned is connected with the air suction device (10) through the triangular bottom plate of the air suction chamber (6).

2. The chip amplifier cleaning control structure as claimed in claim 1, wherein the air inlet or outlet is a uniform circular hole (5 mm. ltoreq. D.ltoreq.15 mm) with a diameter φ D, the distance between the center line and the corresponding side line is D1 (D1. ltoreq.10 mm), or a strip-shaped air inlet with a strip width W (5 mm. ltoreq. W.ltoreq.10 mm), the distance between the center line and the corresponding side line is D2(5 mm. ltoreq. D2. ltoreq.10 mm).

3. The chip amplifier cleaning control structure according to claim 1, wherein the gas source (1) is clean nitrogen or clean air with a purity of 99.99% or more.

4. A method of cleaning using the chip amplifier cleaning control structure of claim 1, comprising the steps of:

1) the air inlet device (3) and the air suction device (10) are respectively connected with the top and the bottom of the cavity of the chip amplifier to be cleaned;

2) the air suction device (10) is opened, the air flow rate of air at the air suction port is adjusted to be V (m/s) through the air pump (8), air suction is actively carried out, the air suction device (3) carries out passive normal pressure (20 ℃, 1 standard atmospheric pressure) air suction, a turbulence-free flow field structure is formed in the to-be-cleaned slice amplifier cavity, after the air suction T (T is more than or equal to 5min and less than or equal to 10min) is carried out for minutes, cleaning is achieved in the amplifier cavity, and the air suction device (10) is closed;

3) adjusting the air pressure of the air inlet device (3) to rise to △ P, actively feeding air, then closing the air inlet device (3), and maintaining the positive pressure environment (relative ambient pressure) of the cavity of the chip amplifier, thereby realizing the clean maintenance of the chip amplifier.

5. The method as claimed in claim 4, wherein the flow velocity V of the gas at the suction port is within the range of: v is more than or equal to 40m/s and less than or equal to 100 m/s.

Technical Field

The invention relates to a high-power amplifier, in particular to a chip laser amplifier cleaning control structure and a method.

Background

The chip amplifier is used as a key link of energy amplification of the high-power laser device, provides more than 99% of energy, and with the continuous improvement of the energy of the high-power laser device, extremely strict requirements are provided for the working conditions of the high-power laser device, and the cavity of the amplifier needs to be kept in a working environment with the cleanliness of hundreds of levels. At present, the cleanness control of a sheet amplifier mostly adopts cavity high-pressure inflation and exhaust, and the high-pressure inflation and exhaust method has certain problems: firstly, high-pressure inflation and exhaust are adopted, and high requirements are put forward on the sealing property of the amplifier cavity; secondly, due to the special structural design of the amplifier cavity, turbulence is easily caused in the amplifier sealed cavity in the air charging and exhausting process, and further pollutants in the sealed cavity are difficult to exhaust in a short time and at one time, so that the commonly used means is to increase the air blowing and exhausting time (30 minutes or more) or perform intermittent multiple air blowing and exhausting (more than 25 minutes of total time consumption), and the like, and the commonly used means has the defects of long purging time, high air consumption, high requirement on the sealing performance of the amplifier and the like.

Disclosure of Invention

The present invention is directed to solving the above problems of the prior art, and provides a chip amplifier cleaning control structure and method. The mode of combining 'active air suction + passive air inlet + active air inlet' is adopted to realize the clean control in the amplifier cavity. The structure and the method reduce the sealing requirement of the chip amplifier while ensuring the clean control of the chip amplifier, shorten the clean control time, reduce the gas consumption, have no turbulence, can realize the clean control of the chip amplifier by pumping and exhausting gas once, and have important application in high-power laser devices.

The solution of the invention is as follows:

the utility model provides a clean control structure of slice amplifier which characterized in that, includes air inlet unit and getter device:

the air inlet device comprises an air source, a switch A, an air inlet pipe and an air inlet chamber, wherein the air source is connected with the air inlet chamber through the air inlet pipe;

the air suction device comprises an air suction chamber, an air suction pipe, a switch B and an air pump, wherein the air pump is connected with the air suction chamber through the air suction pipe, the air suction pipe is provided with the switch B9, an air suction port is distributed on a triangular bottom plate of the air suction chamber along a side line, and the size, the shape and the position of the air suction port are the same as those of an air inlet on the triangular bottom plate of the air inlet chamber; the air inlet device is connected with the top of the cavity of the chip amplifier to be cleaned through the triangular bottom plate of the air inlet chamber, and the bottom of the cavity of the chip amplifier to be cleaned is connected with the air suction device through the triangular bottom plate of the air suction chamber.

The air inlet or the air outlet can be round holes (D is more than or equal to 5mm and less than or equal to 15mm) which are phi D in diameter and are uniformly distributed, the distance between the central line and the corresponding side line is D1(D1 is more than or equal to 10mm), the air inlet can also be a strip-shaped air inlet, the width of the strip is W (W is more than or equal to 5mm and less than or equal to 10mm), and the distance between the central line and the corresponding side line is D2 (D2 is more than or equal to 5mm and less than.

The gas source is clean nitrogen or clean air, and the purity is more than or equal to 99.99 percent.

The method for cleaning by using the chip amplifier cleaning control structure comprises the following steps:

1) the air inlet device and the air suction device are respectively connected with the top and the bottom of the to-be-cleaned slice amplifier cavity;

2) opening the air suction device, adjusting the flow velocity of gas at the air suction port to be V (m/s) through the air pump, actively sucking air, performing passive normal-pressure (20 ℃, 1 standard atmospheric pressure) air suction by the air suction device, forming a non-turbulent flow field structure in the to-be-cleaned slice amplifier cavity, and after the air suction T (T is more than or equal to 5min and less than or equal to 10min) minutes, realizing cleaning in the amplifier cavity and closing the air suction device;

3) the air pressure of the air inlet device is adjusted to be increased to △ P, air is actively fed, then the air inlet device is closed, and the cavity of the chip amplifier maintains a positive pressure environment (relative to the ambient pressure), so that the chip amplifier is maintained clean.

The application range of the flow velocity V of the gas at the air suction port is as follows: v is more than or equal to 40m/s and less than or equal to 100 m/s.

The invention has the technical effects that:

the invention has ingenious conception, is simple and feasible, can realize the clean control of the cavity of the chip amplifier by one-time pumping, shortens the clean control time, reduces the air consumption and simultaneously reduces the sealing requirement of the sealed cavity of the chip amplifier.

Drawings

Fig. 1 is a schematic view of a chip amplifier cleaning control structure in accordance with an embodiment 1 of the present invention, wherein (a) is a schematic view of a chip amplifier cleaning control structure, (b) is a schematic view of a triangular bottom plate of an air inlet chamber or an air suction chamber, i.e., the air inlet or the air outlet is a circular hole, and (c) the air inlet or the air outlet is a strip.

Fig. 2 is a vector diagram of a chip amplifier clean control flow field according to an embodiment of the present invention.

Detailed Description

The present invention is illustrated by the following examples, which should not be construed as limiting the scope of the invention.

Referring to fig. 1, fig. 1 is a schematic view of a chip amplifier cleaning control structure according to an embodiment 1 of the present invention, wherein (a) is a schematic view of the chip amplifier cleaning control structure, and (b) is a schematic view of a triangular bottom plate of an air intake chamber or an air suction chamber. As can be seen from the figure, the chip amplifier cleaning control structure of the invention comprises an air inlet device 3 and an air suction device 10:

the air inlet device 3 comprises an air source 1, a switch A2, an air inlet pipe 4 and an air inlet chamber 5, wherein the air source 1 is connected with the air inlet chamber 5 through the air inlet pipe 4, the air inlet pipe 4 is provided with the switch A2, and air inlets are distributed on a triangular bottom plate of the air inlet chamber along a side line;

the air suction device 10 comprises an air suction chamber 6, an air suction pipe 7, a switch B9 and an air pump 8, wherein the air pump 8 is connected with the air suction chamber 6 through the air suction pipe 7, the air suction pipe 7 is provided with the switch B9, the triangular bottom plate of the air suction chamber 6 is distributed with air suction ports along a side line, and the size, the shape and the position of the air suction ports are the same as those of the air inlet ports on the triangular bottom plate of the air inlet chamber; the air inlet device 3 is connected with the top of the cavity of the chip amplifier to be cleaned through the triangular bottom plate of the air inlet chamber 5, and the bottom of the cavity of the chip amplifier to be cleaned is connected with the air suction device 10 through the triangular bottom plate of the air suction chamber 6.

The gas source 1 is clean nitrogen or clean air, and the purity is more than or equal to 99.99 percent.

The air inlet or the air outlet can be round holes (D is more than or equal to 5mm and less than or equal to 15mm) which are phi D in diameter and are uniformly distributed, the distance between the central line and the corresponding side line is D1(D1 is more than or equal to 10mm), the air inlet can also be a strip-shaped air inlet, the width of the strip is W (W is more than or equal to 5mm and less than or equal to 10mm), and the distance between the central line and the corresponding side line is D2 (D2 is more than or equal to 5mm and less than.